CN201034395Y - Semiconductor refrigerating heat exchanger - Google Patents
Semiconductor refrigerating heat exchanger Download PDFInfo
- Publication number
- CN201034395Y CN201034395Y CNU2007200491969U CN200720049196U CN201034395Y CN 201034395 Y CN201034395 Y CN 201034395Y CN U2007200491969 U CNU2007200491969 U CN U2007200491969U CN 200720049196 U CN200720049196 U CN 200720049196U CN 201034395 Y CN201034395 Y CN 201034395Y
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- Prior art keywords
- semiconductor
- chilling plate
- semiconductor refrigeration
- refrigeration heat
- heat converter
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Abstract
The utility model discloses a semiconductor refrigeration heat exchanger, comprising a semiconductor-refrigerating chips and a heat exchanger on which a fluid circulation channel is arranged, wherein the semiconductor-refrigerating chips are hidden in the heat exchanger, and the fluid circulation channel and end surfaces on the two sides of the semiconductor-refrigerating chips form a separate cold and a separate warm circulation channels. The utility model has the advantages of reasonable structure, good sealing performance, and high heat exchange efficiency, two-fluid circulation channels are used to realize independent transfer of the hot energy and the cold energy produced by the semiconductor, and using channels to realize heat transfer is good for saving space and improving the flexibility and compact performance of the whole layout of the product.
Description
Technical field
The utility model relates to a kind of heat exchanger, especially a kind of heat exchanger that is applied to the semiconductor refrigerating field.
Background technology
Semiconductor refrigerating technology is to utilize the significant peltier effect of semi-conductor electricity couple to realize refrigeration, and it is little, in light weight that it has a volume, the temperature difference is big, and the efficient height is easy to use, nuisanceless, durable advantage such as reliable is widely used in refrigeration products such as water dispenser, ice chest, automobile ice chest.
People's Republic of China's utility model patent 95236961.3 discloses a kind of TEC heat exchanger, and it comprises the heat exchange body that has the liquid circulation passage on its face.The passage two ends are the liquid inlet and outlet pipe, are the conduit wall radiating ribs between the passage, and the one side that the heat exchange body has passage is composition plane, and this plane engages with the plane that is cooled (as refrigerating sheet) and constitutes closed fluid passage.Though this heat converter structure is simple, heat exchange is direct, yet the structure influence of heated exchanger, the semiconductor chip of heat exchanger must be close to the medium or the container (as the cold courage of water dispenser) that are cooled and be provided with, water dispenser internal structure layout is restricted, the thickness of semiconductor chip and heat exchange body is bigger, is affixed on the width that has increased water dispenser on the cold courage of water dispenser, influences outward appearance; And, cause the radiating efficiency of semiconductor chip lower for fear of the design of the conduit wall radiating ribs of heat exchanger liquid circulation passage; Composition plane is low with the closed liquid channel seal degree that the plane that is cooled constitutes.
The utility model content
In order to overcome above-mentioned shortcoming, the utility model provides a kind of structure closely reasonable, helps smart miscellaneous goods structure, improves the semiconductor refrigeration heat converter of semiconductor chip radiating efficiency.
A kind of semiconductor refrigeration heat converter, comprise semiconductor chilling plate and heat exchange body, the heat exchange body is provided with the fluid circulation passage, and wherein semiconductor chilling plate is built in the heat exchange body, independently cold separately, the warm circulation channel of fluid circulation passage and semiconductor chilling plate both sides end face formation.
In described cold, the warm circulation channel fuisw rib of plurality of rows perpendicular to the semiconductor chilling plate surface is set all, the distance on fuisw rib edge to semiconductor chilling plate surface is successively decreased to other end horizontal linear by an end, and the slope at adjacent fuisw rib edge is opposite number each other.
Described heat exchange body is formed by the box body seal combination of two one end openings, symmetrical configuration, and the cavity volume of two box bodys is common to be formed and the suitable cavity volume of semiconductor chilling plate size.
Described fuisw rib is vertically extended to opening by the internal face of box portion bottom wall.
The joined wall of described two box bodys is provided with inside and outside bipassage ring connected in star, and two annular groove places are equipped with sealing ring.
The angle position of described two box body cavity volumes is provided with groove, and groove is provided with sealing ring.
Two box bodys of described seal combination are spirally connected mutually or weld.
Described cold flow hot switching path is wound in the outside wall surface of medium reservoir vessel, the circuitous condenser that passes of warm current hot switching path.
The utility model is rational in infrastructure, sealing is strong, and the heat exchanger effectiveness height utilizes the two-fluid circulation channel that heat, the cold that semiconductor chip produces carried out independent delivery, use pipeline to carry out heat exchange and help saving the space, improve the flexibility and the compactedness of product integral layout.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is a user mode schematic diagram of the present utility model;
Fig. 2 is the partial enlarged drawing of Fig. 1;
Fig. 3 is the outer side plan view of heat exchange body;
Fig. 4 is the inner side plane view of heat exchange body;
Fig. 5 is the A-A sectional view of Fig. 4;
Fig. 6 is the B-B sectional view of Fig. 4.
The specific embodiment
As shown in Figure 1, the utility model semiconductor refrigeration heat converter, comprise semiconductor chilling plate 1 and heat exchange body 2, heat exchange body 2 is provided with the fluid circulation passage, wherein semiconductor chilling plate 1 is built in heat exchange body 2, fluid circulation passage and semiconductor chilling plate 1 both sides end face constitute independently cold separately, warm circulation channel 31,32, two passage intersections are provided with liquid pump 6, cold flow hot switching path 31 is wound in the outside wall surface of medium reservoir vessel 4 (as the cold courage of water dispenser), warm current hot switching path 32 makes a circulation to pass condenser 5, on the condenser 5 radiator fan is installed.
When the utility model is applied to field of water fountain, the cold courage separate design of semiconductor chilling plate 1 and water dispenser, use pipeline with heat, the cold of semiconductor chilling plate 1 be passed to condenser 5 respectively, cold courage carries out heat exchange, solve semiconductor chilling plate 1 and be close to the limitation that cold courage is installed, improve the flexibility of water dispenser topology layout, helped improving water dispenser inner space utilization rate.
Shown in Fig. 4,5,6, in cold, the warm circulation channel 31,32 fuisw rib 33 of plurality of rows perpendicular to the semiconductor chilling plate surface is set all, fuisw rib 33 is vertically extended to opening by the internal face of box body 21,22 diapires, fuisw rib 33 edges to the distance on semiconductor chilling plate 1 surface is successively decreased to other end horizontal linear by an end, as illustrated in Figures 5 and 6, the slope at adjacent fuisw rib 33 edges opposite number each other.According to the guiding of fuisw rib 33 as can be known, the very first time contacted the heat exchanger effectiveness height after heat transfer medium (as cooling fluid) entered cavity volume with semiconductor chip.
The joined wall of two box bodys 21,22 is provided with inside and outside bipassage ring connected in star 23, two annular grooves 23 places and is equipped with sealing ring.The angle position of two box bodys, 21,22 cavity volumes is provided with groove 24, and groove 24 places are provided with sealing ring.
Claims (8)
1. semiconductor refrigeration heat converter, comprise semiconductor chilling plate and heat exchange body, the heat exchange body is provided with the fluid circulation passage, it is characterized in that: described semiconductor chilling plate is built in the heat exchange body, independently cold separately, the warm circulation channel of fluid circulation passage and semiconductor chilling plate both sides end face formation.
2. semiconductor refrigeration heat converter according to claim 1, it is characterized in that: in described cold, the warm circulation channel fuisw rib of plurality of rows perpendicular to the semiconductor chilling plate surface is set all, the distance on fuisw rib edge to semiconductor chilling plate surface is successively decreased to other end horizontal linear by an end, and the slope at adjacent fuisw rib edge is opposite number each other.
3. semiconductor refrigeration heat converter according to claim 1 is characterized in that: described heat exchange body is formed by the box body seal combination of two one end openings, symmetrical configuration, and the cavity volume of two box bodys is common to be formed and the suitable cavity volume of semiconductor chilling plate size.
4. according to claim 2 or 3 described semiconductor refrigeration heat converters, it is characterized in that: described fuisw rib is vertically extended to opening by the internal face of box portion bottom wall.
5. semiconductor refrigeration heat converter according to claim 3 is characterized in that: the joined wall of described two box bodys is provided with inside and outside bipassage ring connected in star, and two annular groove places are equipped with sealing ring.
6. semiconductor refrigeration heat converter according to claim 3 is characterized in that: the angle position of described two box body cavity volumes is provided with groove, and groove is provided with sealing ring.
7. semiconductor refrigeration heat converter according to claim 3 is characterized in that: two box bodys of described seal combination are spirally connected mutually or weld.
8. semiconductor refrigeration heat converter according to claim 1 is characterized in that: described cold flow hot switching path is wound in the outside wall surface of medium reservoir vessel, the circuitous condenser that passes of warm current hot switching path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200491969U CN201034395Y (en) | 2007-03-06 | 2007-03-06 | Semiconductor refrigerating heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200491969U CN201034395Y (en) | 2007-03-06 | 2007-03-06 | Semiconductor refrigerating heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201034395Y true CN201034395Y (en) | 2008-03-12 |
Family
ID=39195284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200491969U Expired - Fee Related CN201034395Y (en) | 2007-03-06 | 2007-03-06 | Semiconductor refrigerating heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201034395Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106859330A (en) * | 2015-12-14 | 2017-06-20 | 美的集团股份有限公司 | Bubble water machine |
| CN106859329A (en) * | 2015-12-14 | 2017-06-20 | 美的集团股份有限公司 | Bubble water machine |
| CN107504713A (en) * | 2012-05-07 | 2017-12-22 | 弗诺尼克设备公司 | It is related to the system and method for thermoelectric heat exchange system |
| CN109536211A (en) * | 2018-12-25 | 2019-03-29 | 华中科技大学 | Based on the asymmetric tar cooling-collecting device for leading warm runner |
| CN109536212A (en) * | 2018-12-25 | 2019-03-29 | 华中科技大学 | Tar cooling-collecting device based on efficient three-dimensional heat exchange structure |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
-
2007
- 2007-03-06 CN CNU2007200491969U patent/CN201034395Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107504713A (en) * | 2012-05-07 | 2017-12-22 | 弗诺尼克设备公司 | It is related to the system and method for thermoelectric heat exchange system |
| CN107504713B (en) * | 2012-05-07 | 2020-10-16 | 弗诺尼克设备公司 | Systems and methods relating to thermoelectric heat exchange systems |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| CN106859330A (en) * | 2015-12-14 | 2017-06-20 | 美的集团股份有限公司 | Bubble water machine |
| CN106859329A (en) * | 2015-12-14 | 2017-06-20 | 美的集团股份有限公司 | Bubble water machine |
| CN106859330B (en) * | 2015-12-14 | 2019-06-28 | 美的集团股份有限公司 | Bubble water machine |
| CN109536211A (en) * | 2018-12-25 | 2019-03-29 | 华中科技大学 | Based on the asymmetric tar cooling-collecting device for leading warm runner |
| CN109536212A (en) * | 2018-12-25 | 2019-03-29 | 华中科技大学 | Tar cooling-collecting device based on efficient three-dimensional heat exchange structure |
| CN109536211B (en) * | 2018-12-25 | 2021-01-01 | 华中科技大学 | Tar cooling and collecting device based on asymmetric temperature conduction flow channel |
| CN109536212B (en) * | 2018-12-25 | 2021-02-19 | 华中科技大学 | Tar cooling and collecting device based on efficient three-dimensional heat exchange structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080312 |