CN201018712Y - Electronic component stack frame, combination of stack frame and circuit board and stack module - Google Patents
Electronic component stack frame, combination of stack frame and circuit board and stack module Download PDFInfo
- Publication number
- CN201018712Y CN201018712Y CNU2007201395742U CN200720139574U CN201018712Y CN 201018712 Y CN201018712 Y CN 201018712Y CN U2007201395742 U CNU2007201395742 U CN U2007201395742U CN 200720139574 U CN200720139574 U CN 200720139574U CN 201018712 Y CN201018712 Y CN 201018712Y
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- China
- Prior art keywords
- electronic component
- circuit board
- frame
- described electronic
- frame plate
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- Expired - Fee Related
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Abstract
The utility model discloses an electronic element piling rack for the circuit board. The utility model can be arranged on a circuit board which can be arranged with a first electronic element. The electronic element piling rack comprises a rack plate and two clamping parts which extents downward from two sides of the rack plate respectively. The rack plate can be arranged with a second electronic element. The electronic element piling rack can be disposed with the circuit board through the two clamping parts, and makes the second electronic element on the rack plate stacked with the first electronic element of the circuit board. The utility model makes the electronic elements stacked on the circuit board through the arrangement of the electronic element piling rack. Moreover, the arrangement has the protection on the electronic elements under the electronic element piling rack.
Description
Technical field
The utility model relates to that a kind of electronic component piles up frame and this piles up the combination of frame and circuit board, relates to particularly that a kind of electronic component that is used for portable electronic devices piles up frame and this piles up the combination of frame and circuit board.
Background technology
Because as the trend of portable electronic devices miniaturization such as mobile phone or PDA(Personal Digital Assistant) and slimming, the electronic component of electronic installation inside is furnished becomes one of key factor that influences sizes of electronic devices and thickness.In addition, if this electronic installation inside is the electronic component that adopts standard size or customized size, then desire the compression set overall volume, what have perfect planning electronic component only is installed with space one on the way.
Therefore, when designing and developing, how to allow the set-up mode of electronic component fully use the limited inner space of electronic installation, just the purpose of desiring to reach for the utility model.
The utility model content
Therefore, the purpose of this utility model is to provide a kind of electronic component that electronic component modularization is piled up be erected on the circuit board and can improve the space effective utilization to pile up frame.
Another purpose of the present utility model is to provide the electronic component of a kind of support and protection electronic component to pile up frame.
The purpose of this utility model is to realize like this, promptly provide a kind of electronic component that is used for circuit board to pile up frame, can be for one second electronic component be set, and be positioned on the circuit board, make second electronic component that piles up on the frame and one first electronic component stacked on top on the circuit board.This electronic component piles up frame and comprises the Access Division that a frame plate and two is down extended by these frame plate both sides separately, can be on the frame plate for this second electronic component is set, electronic component piles up frame can be positioned this circuit board by two Access Division clampings, and frame plate is covered on first electronic component, simultaneously, second electronic component on the frame plate also is stacked in first electronic component top.
The utility model electronic component piles up the combination of frame and circuit board, comprises a first circuit board and an electronic component piles up frame.First circuit board comprises two draw-in grooves that are provided with separately, and can be for one first electronic component is set between this two draw-in groove.This electronic component piles up frame and comprises the Access Division that a frame plate and two is down extended by these frame plate both sides separately, and frame plate can be for one second electronic component is set.Electronic component pile up frame can by its two Access Division respectively with this two draw-in groove mutually clamping be positioned this first circuit board, and make second electronic component on this frame plate and the first electronic component stacked on top on this first circuit board.
Electronic component stack module of the present utility model can be for being arranged at a first circuit board, and this first circuit board is provided with two draw-in grooves separately, and is provided with one first electronic component between this two draw-in groove.This electronic component stack module comprises an electronic component and piles up frame, an electric connector for socket and one second electronic component.Electronic component pile up that frame comprises that a frame plate and two is down extended by these frame plate both sides separately and in order to respectively with this two draw-in groove Access Division of clamping mutually, this electronic component piles up frame by the clamping and be positioned this first circuit board mutually of this two Access Division and this two draw-in groove, and makes second electronic component on this frame plate and the first electronic component stacked on top on this first circuit board.Electric connector for socket is arranged at this first circuit board.Second electronic component is arranged at this frame plate end face, comprises the plug connector that a second circuit board and is arranged at this second circuit board and can supply to peg graft with this electric connector for socket.
This first electronic component can be an electronic card coupler.This second circuit board can be a flexible circuit board, and this second electronic component comprises that more weldering is located at a headset connector and a loudspeaker of this second circuit board.
Advantage of the present utility model is that by the setting that this electronic component piles up frame, the mode that makes electronic component to pile up is arranged at circuit board, improves the space effective utilization, and in addition, the electronic component that piles up the frame below for electronic component also has protective effect.
Description of drawings
Fig. 1 is the assembling exploded view that electronic component that the utility model is used for circuit board piles up the preferred embodiment of frame and a first circuit board, one first electronic component, one second electronic component;
Fig. 2 is the vertical view of this first circuit board;
Fig. 3 is the constitutional diagram that this electronic component piles up the frame and second electronic component;
Fig. 4 is the constitutional diagram that this electronic component piles up frame, first circuit board, first electronic component and second electronic component;
Fig. 5 is the front view that Fig. 4 omits second electronic component; And
Fig. 6 is the vertical view that this circuit board draw-in groove another kind is provided with state.
The main element symbol description:
1 electronic component piles up frame
2 first electronic components
3,3 ' first circuit board
4 second electronic components
10 electronic component stack modules
11 frame plates
110 hole clippings
111 oval depressions portions
12 Access Divisions
121 longitudinal extension parts
122 horizontal expansion portions
123 retainings support sheet
124 projections
13 lean against part
131 plates
31,31 ' draw-in groove
32 grooves
33 electric connector for socket
41 second circuit boards
42 headset connectors
43 loudspeakers
44 plug connectors
Has execution mode
About aforementioned and other technology contents, characteristics and effect of the present utility model, in the following detailed description that cooperates with reference to a graphic preferred embodiment, can clearly present.
Consult Fig. 1 and Fig. 4; it is can supply folded the establishing of an electronic component (to call second electronic component 4 in the following text) and constitute an electronic component stack module 10 that the electronic component that the utility model is used for circuit board piles up frame 1; and as shown in Figure 4; make electronic component stack module 10 and a first circuit board 3 combinations; make one to be arranged on another electronic component (to call first electronic component 2 in the following text) on the first circuit board 3 and to be piled up frame 1 and cover protection, and second electronic component 4 and first electronic component 2 reach the effect of piling up one on the other.
Consult Fig. 1, Fig. 2, in the present embodiment, first, second electronic component 2,4 of indication and first circuit board 3 all are in order to be installed in the electronic component in the mobile phone (also can be personal digital assistant PDA or other portable electronic devices).Wherein, first electronic component 2 is one to be welded on the electronic card coupler on the first circuit board 3, and the place, both sides of corresponding first electronic component 2 (electronic card coupler) of the leading edge of first circuit board 3, be recessed to form a draw-in groove 31 respectively, and in the present embodiment, owing to cooperate the relation of other electronic component arrangements on the first circuit board 3, the draw-in groove 31 on first circuit board 3 left sides is the modes that form breach among Fig. 2, and the draw-in groove 31 on the right is by the direction straight-line extension of first circuit board 3 leading edges towards trailing edge, and place, the inner of two draw-in grooves 31 has been recessed to form a groove 32 more opposite to each other, certainly, in other enforcement state, as shown in Figure 6, the draw-in groove 31 ' on the first circuit board 3 ' left side also can be set as the same with the right draw-in groove 31 ', illustrates after a while as for the effect of two draw-in grooves 31.In addition, also be provided with an electric connector for socket 33 on the first circuit board 3.Second electronic component 4 of present embodiment indication comprises a second circuit board 41 (present embodiment is a flexible circuit board), is arranged on a headset connector 42, a loudspeaker 43 and a plug connector 44 on the second circuit board 41.This first, second novel electronic component 2,4 does not exceed with above-mentioned electronic card coupler, headset connector 42 and loudspeaker 43, can be other electronic components of mobile phone inside yet.
Consult Fig. 1, pile up frame 1 and comprise the Access Division 12 that a frame plate 11, two is down extended to form by frame plate 11 both sides, and a lean against part 13 that up extends to form by frame plate 11, in the present embodiment, piling up frame 1 is to constitute by a sheet metal is integrally formed.Be provided with two circular hole clippings 110 and an oval depressions portion 111 before and after on the frame plate 11.Two Access Divisions 12 are that the difference position is at frame plate 11 biside plate edge front end places, each Access Division 12 comprises that one down bends the longitudinal extension part 121 of extension by frame plate 11 plate edge, and one laterally bend the horizontal expansion portion 122 of extension by vertical kink 121 last edge, two extensions 12 all in the form of sheets, vertical section of each Access Division 12 is L-shaped, in addition, each Access Division 12 comprises that also one up bends the retaining that extends to form by horizontal expansion portion 122 leading edges and supports sheet 123 and by the outstanding projection 124 (cooperation Fig. 5) of the medial surface of longitudinal extension part 121.In the present embodiment, projection 124 is that the outside wall surface punching press by longitudinal extension part 121 makes this sheet metal local toward projecting inward and form.And the lean against part 13 of present embodiment is to comprise up bending the plate 131 that extends to form by frame plate 11 biside plate edge and back side panel edge part respectively, and when second electronic component 4 was arranged on the frame plate 11, plate 131 was around second electronic component, 4 peripheries.
Consult Fig. 1, Fig. 3, Fig. 4, above-mentioned second circuit board 41 bottom surfaces are to be attached to frame plate 11 end faces, make the headset connector 42 that is welded on second circuit board 41 can be positioned on frame plate 11 end faces thus with loudspeaker 43, plug connector 44 then stretches out a side of piling up frame 1, two hole clippings 110 on the frame plate 11 and oval depressions portion 111 can insert the location for the reference column (figure does not show) of headset connector 42 bottoms, and the plate 131 that up extends around the frame plate 11 then can abut against for the outer rim of second circuit board 41.
When piling up frame 1 and will be assembled on the first circuit board 3, be to make the top of frame plate 11 earlier corresponding to first electronic component 2, and the Access Division 12 of frame plate 11 both sides corresponds to the front end of 3 liang of side bayonet slots 31 of first circuit board respectively, then, to pile up frame 1 again with respect to first circuit board 3 past pushers, the longitudinal extension section 121 of two Access Divisions 12 is slipped into respectively in two draw-in grooves 31, abut against respectively up to first circuit board 3 leading edges two places in the retaining of two Access Divisions 12 and support sheet 123 rears, and the projection 124 of two longitudinal extension sections, 121 inboards corresponds to the groove 32 of two draw-in grooves, 31 ends, and can produce position-limiting action, at this moment, two horizontal expansion sections, 122 equal positions are in first circuit board 3 bottom surfaces, therefore, second electronic component 4 just can be stacked on first electronic component, 2 tops through piling up frame 1, and the plug connector 44 on second electronic component 4 also can be plugged on the electric connector for socket 33 of first circuit board 3.
As mentioned above, the utility model piles up frame 1 by second electronic component 4 is arranged on electronic component, to pile up frame 1 again and be connected on the first circuit board 3, the mode that makes electronic component 2,4 to pile up thus is arranged on the circuit board 3, reaches the purpose that space utilization usefulness improves; In addition, to pile up frame 1 below be to belong to when being easier to be subjected to clashing into the electronic component of damage when being positioned at, and piles up the effect that frame 1 also has protection below electronic component; on the other hand; be the one-body molded formation of metal sheet owing to pile up frame 1, thin thickness, the intensity that supports second electronic component 4 is also enough.
Claims (32)
1. an electronic component piles up frame, is used for circuit board and supplies being arranged at a circuit board, and this circuit board is provided with one first electronic component, it is characterized in that, this electronic component piles up frame and comprises: a frame plate, for one second electronic component is set; And two Access Divisions, down extend by these frame plate both sides separately and respectively clamping be positioned this circuit board to should the first electronic component place, and make this frame plate be covered in this first electronic component top.
2. pile up frame according to the described electronic component of claim 1, it is characterized in that, respectively the vertical section in this Access Division is L-shaped, comprises a longitudinal extension section and the horizontal expansion section by this longitudinal extension section bottom horizontal expansion of down being extended by this frame plate; When this electronic component piled up frame and this circuit board clamping, respectively this longitudinal extension section laid respectively at this first electronic component both sides.
3. pile up frame according to the described electronic component of claim 2, it is characterized in that, this two Access Division is formed at this frame plate biside plate edge adjacent front end place respectively.
4. pile up frame according to the described electronic component of claim 2, it is characterized in that, this two Access Division is that this longitudinal extension section is arranged in this circuit board when being configured to this circuit board clamping, and respectively this horizontal expansion section is positioned at this circuit board bottom surface.
5. pile up frame according to the described electronic component of claim 4, it is characterized in that, respectively this Access Division comprises that more one is up extended by this horizontal expansion section leading edge and props up the retaining piece of this circuit board outer rim in order to retaining.
6. pile up frame according to the described electronic component of claim 4, it is characterized in that, respectively this Access Division comprises that more one protrudes the projection of this longitudinal extension section medial surface.
7. pile up frame according to the described electronic component of claim 1, it is characterized in that, this frame plate be with its end face for this second electronic component setting, and this electronic component piles up frame and more comprises one and up extended and around the lean against part of this second electronic component by this frame plate.
8. pile up frame according to the described electronic component of claim 1, it is characterized in that, this electronic component piles up the metal sheet that frame is formed in one.
9. the combination that electronic component piles up frame and circuit board is characterized in that, comprises: a first circuit board, for one first electronic component is set; And one electronic component pile up frame, comprise a frame plate, end face is for one second electronic component is set; And two Access Divisions, down extend by these frame plate both sides separately and respectively clamping be positioned this first circuit board to should the first electronic component place, and this frame plate is covered in this first electronic component top.
10. the combination of piling up frame and circuit board according to the described electronic component of claim 9, it is characterized in that, respectively the vertical section in this Access Division is generally L-shaped, comprises a longitudinal extension section and the horizontal expansion section by this longitudinal extension section bottom horizontal expansion of down being extended by this frame plate; When this electronic component piled up frame and this first circuit board clamping, respectively this longitudinal extension section laid respectively at this first electronic component both sides.
11. the combination according to the described electronic component of claim 10 piles up frame and circuit board is characterized in that, this two Access Division is formed at this frame plate biside plate edge adjacent front end place respectively; This first circuit board is provided with two draw-in grooves that lay respectively at these first electronic component both sides, and this two draw-in groove is to be extended and slipped into and clamping by this first circuit board outer rim for this two Access Division toward sunken inside by this first circuit board one side outer rim.
12. the combination of piling up frame and circuit board according to the described electronic component of claim 10, wherein, this two Access Division is that this longitudinal extension section is arranged in this first circuit board when being configured to this first circuit board clamping, and respectively this horizontal expansion section is positioned at this first circuit board bottom surface.
13. the combination of piling up frame and circuit board according to the described electronic component of claim 12, wherein, respectively this Access Division comprises that more one is up extended by this horizontal expansion section leading edge and props up the retaining piece of this first circuit board outer rim in order to retaining.
14. the combination of piling up frame and circuit board according to the described electronic component of claim 12, wherein, respectively this Access Division comprises that more one protrudes the projection of this longitudinal extension section medial surface, respectively this draw-in groove is to be extended towards the direction depression of trailing edge by this first circuit board leading edge, and this first circuit board more is provided with respectively by the groove of the inner lateral concave of this draw-in groove respectively, when snapping in respectively this draw-in groove for this Access Division respectively, respectively this projection can correspondingly embed in the groove of this draw-in groove respectively spacing.
15. the combination of piling up frame and circuit board according to the described electronic component of claim 9, it is characterized in that, this frame plate be with its end face for this second electronic component setting, and this electronic component piles up frame and comprises that more one is up extended and around the lean against part of this second electronic component by this frame plate.
16. the combination according to the described electronic component of claim 9 piles up frame and circuit board is characterized in that this electronic component piles up the metal sheet that frame is formed in one.
17. the combination of piling up frame and circuit board according to the described electronic component of claim 9, wherein, this second electronic component comprises that one can be attached at the second circuit board of this frame plate end face, and this combination more comprises a plug connector that is arranged at this second circuit board, and one is arranged at this first circuit board and the electric connector for socket that can peg graft for this plug connector.
18. according to the combination that the described electronic component of claim 9 piles up frame and circuit board, wherein, this first electronic component is an electronic card coupler.
19. according to the combination that the described electronic component of claim 17 piles up frame and circuit board, wherein, this second electronic component comprises that more one welds the headset connector of being located at this second circuit board.
20. according to the combination that the described electronic component of claim 17 piles up frame and circuit board, wherein, this second electronic component comprises that more one welds the loudspeaker of being located at this second circuit board.
21. the combination of piling up frame and circuit board according to the described electronic component of claim 9, wherein, this first circuit board is provided with two draw-in grooves that lay respectively at these first electronic component both sides, the two Access Division clampings of piling up frame for this electronic component.
22. electronic component stack module, for being arranged at a first circuit board, this first circuit board is provided with one first electronic component, it is characterized in that this electronic component stack module comprises: an electronic component piles up frame, comprises a frame plate, for one second electronic component is set, and two Access Divisions, down extend by these frame plate both sides separately and respectively clamping be positioned this first circuit board to should the first electronic component place, and make this frame plate be covered in this first electronic component top; One electric connector for socket is arranged at this first circuit board; And one second electronic component, be arranged at this frame plate end face, comprise a second circuit board, and one is arranged at this second circuit board and can be for the plug connector of pegging graft with this electric connector for socket.
23., it is characterized in that this second circuit board is a flexible circuit board according to the described electronic component stack module of claim 22.
24., it is characterized in that this second electronic component comprises that more a weldering is located at the headset connector of this second circuit board according to the described electronic component stack module of claim 23, and this frame plate is provided with at least one hole clipping, snaps in the location for this headset connector bottom.
25., it is characterized in that this second electronic component comprises that more one welds the loudspeaker of being located at this second circuit board according to the described electronic component stack module of claim 23.
26., it is characterized in that respectively the vertical section in this Access Division is generally L-shaped according to the described electronic component stack module of claim 22, comprise a longitudinal extension section and the horizontal expansion section by this longitudinal extension section bottom horizontal expansion of down extending by this frame plate; When this electronic component piled up frame and this first circuit board clamping, respectively this longitudinal extension section laid respectively at this first electronic component both sides.
27., it is characterized in that this two Access Division is formed at this frame plate biside plate edge adjacent front end place respectively according to the described electronic component stack module of claim 26.
28., it is characterized in that this two Access Division is that this longitudinal extension section is arranged in this first circuit board when being configured to this circuit board clamping according to the described electronic component stack module of claim 26, respectively this horizontal expansion section is positioned at this first circuit board bottom surface.
29., it is characterized in that respectively this Access Division comprises that more one is up extended by this horizontal expansion section leading edge and props up the retaining piece of this first circuit board outer rim in order to retaining according to the described electronic component stack module of claim 28.
30., it is characterized in that respectively this Access Division comprises that more one protrudes the projection of this longitudinal extension section medial surface according to the described electronic component stack module of claim 28.
31. according to the described electronic component stack module of claim 22, it is characterized in that, this frame plate be with its end face for this second electronic component setting, and this electronic component piles up frame and more comprises one and up extended and around the lean against part of this second electronic component by this frame plate.
32., it is characterized in that this electronic component piles up the metal sheet that frame is formed in one according to the described electronic component stack module of claim 22.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201395742U CN201018712Y (en) | 2007-03-07 | 2007-03-07 | Electronic component stack frame, combination of stack frame and circuit board and stack module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201395742U CN201018712Y (en) | 2007-03-07 | 2007-03-07 | Electronic component stack frame, combination of stack frame and circuit board and stack module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201018712Y true CN201018712Y (en) | 2008-02-06 |
Family
ID=39059215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201395742U Expired - Fee Related CN201018712Y (en) | 2007-03-07 | 2007-03-07 | Electronic component stack frame, combination of stack frame and circuit board and stack module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201018712Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822226A (en) * | 2015-04-28 | 2015-08-05 | 武汉华星光电技术有限公司 | Circuit board assembly |
-
2007
- 2007-03-07 CN CNU2007201395742U patent/CN201018712Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822226A (en) * | 2015-04-28 | 2015-08-05 | 武汉华星光电技术有限公司 | Circuit board assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080206 Termination date: 20120307 |