CN200962187Y - Photo structure - Google Patents

Photo structure Download PDF

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Publication number
CN200962187Y
CN200962187Y CN 200620052097 CN200620052097U CN200962187Y CN 200962187 Y CN200962187 Y CN 200962187Y CN 200620052097 CN200620052097 CN 200620052097 CN 200620052097 U CN200620052097 U CN 200620052097U CN 200962187 Y CN200962187 Y CN 200962187Y
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China
Prior art keywords
photograph
pattern
image plane
chip architecture
phase chip
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Expired - Fee Related
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CN 200620052097
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Chinese (zh)
Inventor
林清闪
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Individual
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Individual
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Priority to CN 200620052097 priority Critical patent/CN200962187Y/en
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Publication of CN200962187Y publication Critical patent/CN200962187Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a photo structure which comprises a photo comprising an image side and an underside, a protective layer overlaid on the image side, and an image forming device corresponding to the image side of the photo and provided with a bossed pattern area on one side allowing the lines at the pattern area pressed on the image face of the photo. The photo structure can also comprise a photo and an image layer or a photo, a protective layer and an image layer. The photo structure can provide the image face of the photo with matching changes of various patterns, thereby achieving the novel and beautiful effects of the photo.

Description

The phase chip architecture
Technical field
The utility model relates to a kind of phase chip architecture, refers to that especially the collocation that a kind of image plane that makes photograph has different patterns changes, and reaches the phase chip architecture of novel aesthetic.
Background technology
Press, common people go on a tour or when participating in celebrating dinner party occasion, for staying sweet memories, usually all can be with camera or video camera acquisition shade at that time with as souvenir, for view and admire and recall usefulness in the future, because the video camera volume is more portable, and also must utilize many peripherals these images commentaries on classics shelves could be provided after taking views and admires, so practicality is relatively poor, therefore, most people all can select to be easy to carry about with one the camera that uses as the usefulness of shade acquisition, treats after the shade acquisition that then egative film or storage card are washed into the photograph confession to be viewed and admired in the future and recall.
And common people are after using the required image of camera acquisition and washing into photograph, this photograph only can show institute's picked image pattern at that time on simultaneously in it, its surface there is no any can variation with the pattern of photograph collocation, therefore, make photograph itself comparatively dull, and do not have novel variation attractive in appearance.
The utility model content
Technical problem to be solved in the utility model is, at the deficiencies in the prior art, provide a kind of and can form the impression of mechanism or the setting of patterned layer by pattern, the collocation that makes the image plane of photograph have different patterns changes, and reaches the phase chip architecture of novel aesthetic.
For solving the problems of the technologies described above, first kind of technical scheme that the utility model adopts is: a kind of phase chip architecture, and it includes: a photograph, this photograph have an image plane and a bottom surface; One protective seam, this protective seam is stacking on the image plane of above-mentioned photograph; It is characterized in that, this phase chip architecture comprises that also a pattern forms mechanism, it is corresponding with above-mentioned photograph image plane that this pattern forms mechanism, and have the pattern district of a relief on the one side of this pattern formation mechanism, can impress on the image plane of photograph for the lines with the pattern district.
Second kind of technical scheme that the utility model adopts is: a kind of phase chip architecture, and it includes: a photograph, this photograph have an image plane and a bottom surface; It is characterized in that this phase chip architecture also comprises a patterned layer, this patterned layer is stacking on the image plane of above-mentioned photograph, and has a pattern district on this patterned layer.
The third technical scheme that the utility model adopts is: a kind of phase chip architecture, and it includes: a photograph, this photograph have an image plane and a bottom surface; One protective seam, this protective seam is stacking on the image plane of above-mentioned photograph; It is characterized in that this phase chip architecture also comprises a patterned layer, this patterned layer is stacking on the one side of above-mentioned protective seam, and has a pattern district on this patterned layer.
In such scheme: described pattern district can be animal, plant, decorative pattern, literal or geometric figure.Described protective seam is a transparent material.Described patterned layer is a transparent material.
Compared with prior art, the beneficial effects of the utility model are: the utility model can form the impression of mechanism or the setting of patterned layer by pattern, and the collocation that makes the photograph image plane have different patterns changes, thereby reaches novel aesthetic.
Description of drawings
Fig. 1 is the three-dimensional appearance synoptic diagram of the utility model first embodiment.
Fig. 2 is the perspective exploded view of the utility model first embodiment.
Fig. 3 is the shaped state synoptic diagram of the utility model first embodiment.
Fig. 4 is the three-dimensional appearance synoptic diagram of the utility model second embodiment.
Fig. 5 is the perspective exploded view of the utility model second embodiment.
Fig. 6 is the shaped state synoptic diagram of the utility model second embodiment.
Fig. 7 is the three-dimensional appearance synoptic diagram of the utility model the 3rd embodiment.
Fig. 8 is the perspective exploded view of the utility model the 3rd embodiment.
Fig. 9 is the shaped state synoptic diagram of the utility model the 3rd embodiment.
Label declaration:
Photograph 1 image plane 11
Bottom surface 12 patterns form mechanism 2
Pattern district 21,41,61 protective seams 3,5
Patterned layer 4,6 pattern A, B, C
Embodiment
See also Fig. 1,2 and shown in Figure 3, be respectively the three-dimensional appearance synoptic diagram of the utility model first embodiment, the perspective exploded view of the utility model first embodiment and the shaped state synoptic diagram of the utility model first embodiment.As shown in the figure: the utility model is a kind of phase chip architecture, forms mechanism 2 by a photograph 1, a pattern at least and a protective seam 3 is constituted.
The above-mentioned photograph of carrying 1 has an image plane 11 and a bottom surface 12.
It is corresponding with the image plane 11 of above-mentioned photograph 1 that this pattern forms mechanism 2, and the pattern district 21 that has a relief on the one side of this pattern formation mechanism 2, this pattern district 21 can be animal, plant, decorative pattern, literal or geometric figure, the lines in this pattern district 21 can be impressed on the image plane 11 of photograph 1.
This protective seam 3 is a transparent material, can be stacking on the image plane 11 of above-mentioned photograph 1.In this way, constitute a brand-new phase chip architecture by said structure.
When desiring on the image plane 11 of photograph 1, to form required pattern; system forms the image plane 11 of the pattern district 21 of relief in the mechanism 2 corresponding to photograph 1 with pattern; with manual or the machine kind of drive pattern is formed mechanism 2 more afterwards and impose an external force; the pattern district 21 that makes this relief impresses image plane 11 in photograph 1 with its lines; the image plane 11 that makes this photograph 1 is except that image originally; and has the pattern A that pattern district 21 is impressed simultaneously; afterwards again on the image plane 11 of this photograph 1 with hot pressing; bind; drench the stacking protective seam 3 of mode of film or glued membrane; so; the collocation that can make the image plane 11 of photograph 1 have different pattern A changes, and reaches novel aesthetic.
See also Fig. 4,5 and shown in Figure 6, be respectively the three-dimensional appearance synoptic diagram of the utility model second embodiment, the perspective exploded view of the utility model second embodiment and the shaped state synoptic diagram of the utility model second embodiment.As shown in the figure: the utility model phase chip architecture is except that above-mentioned first embodiment, and this phase chip architecture also can be made of a photograph 1 and a patterned layer 4.
The above-mentioned photograph of carrying 1 has an image plane 11 and a bottom surface 12.
This patterned layer 4 can be stacking on the image plane 11 of above-mentioned photograph 1 for transparent material, and have a pattern district 41 on this patterned layer 4, and this pattern district 41 can be animal, plant, decorative pattern, literal or geometric figure.
When desiring on the image plane 11 of photograph 1, to form required pattern, system is stacking on the image plane 11 of photograph 1 with hot pressing or bonding mode with the patterned layer 4 with pattern district 41, the image plane 11 that makes this photograph 1 is except that image originally, and has the pattern B in pattern district 41 simultaneously, so, the collocation that can make the image plane 11 of photograph 1 have different pattern B changes, and reaches novel aesthetic.
See also Fig. 7,8 and shown in Figure 9, be respectively the three-dimensional appearance synoptic diagram of the utility model the 3rd embodiment, the perspective exploded view of the utility model the 3rd embodiment and the shaped state synoptic diagram of the utility model the 3rd embodiment.As shown in the figure: the utility model phase chip architecture is except that above-mentioned first and second embodiment, and this phase chip architecture also can be made of a photograph 1, a protective seam 5 and a patterned layer 6.
The above-mentioned photograph of carrying 1 has an image plane 11 and a bottom surface 12.
This protective seam 5 is a transparent material, can be stacking on the image plane 11 of above-mentioned photograph 1.
This patterned layer 6 is a transparent material, can be stacking on the one side of above-mentioned protective seam 5, and have a pattern district 61 on this patterned layer 6, this pattern district 61 can be animal, plant, decorative pattern, literal or geometric figure.
When desiring on the image plane 11 of photograph 1, to form required pattern; system is stacking on the image plane 11 of photograph 1 with hot pressing or bonding mode with protective seam 5; stacking on protective seam 5 with patterned layer 6 afterwards with hot pressing or bonding mode with pattern district 61; the image plane 11 that makes this photograph 1 is except that image originally; and has the pattern C in pattern district 61 simultaneously; and can this patterned layer 6 be torn according to practice is required; change one again and have the patterned layer 6 in different patterns district 61; so; the collocation that can make the image plane 11 of photograph 1 have different pattern C changes, and reaches novel aesthetic.
In sum, the utility model phase chip architecture can effectively be improved the various shortcoming of usefulness, can form the impression of mechanism or the setting of patterned layer by pattern, the collocation that makes the photograph image plane have different patterns changes, reach novel aesthetic, and then make generation of the present utility model can more progressive, more practical, more meet user institute palpus, and really having met the utility application important document, the whence proposes patented claim in accordance with the law.
Only the above only is preferred embodiment of the present utility model, when not limiting the utility model practical range with this; So all simple equivalent of doing according to the utility model claims and description change and modify, and all should still belong in the utility model patent covering scope.

Claims (10)

1. phase chip architecture, it includes: a photograph, this photograph have an image plane and a bottom surface; One protective seam, this protective seam is stacking on the image plane of above-mentioned photograph; It is characterized in that, this phase chip architecture comprises that also a pattern forms mechanism, it is corresponding with above-mentioned photograph image plane that this pattern forms mechanism, and have the pattern district of a relief on the one side of this pattern formation mechanism, can impress on the image plane of photograph for the lines with the pattern district.
2. phase chip architecture according to claim 1 is characterized in that, described pattern district can be animal, plant, decorative pattern, literal or geometric figure.
3. phase chip architecture according to claim 1 is characterized in that, described protective seam is a transparent material.
4. phase chip architecture, it includes: a photograph, this photograph have an image plane and a bottom surface; It is characterized in that this phase chip architecture also comprises a patterned layer, this patterned layer is stacking on the image plane of above-mentioned photograph, and has a pattern district on this patterned layer.
5. phase chip architecture according to claim 4 is characterized in that, described patterned layer is a transparent material.
6. phase chip architecture according to claim 4 is characterized in that, described pattern district can be animal, plant, decorative pattern, literal or geometric figure.
7. phase chip architecture, it includes: a photograph, this photograph have an image plane and a bottom surface; One protective seam, this protective seam is stacking on the image plane of above-mentioned photograph; It is characterized in that this phase chip architecture also comprises a patterned layer, this patterned layer is stacking on the one side of above-mentioned protective seam, and has a pattern district on this patterned layer.
8. phase chip architecture according to claim 7 is characterized in that, described protective seam is a transparent material.
9. phase chip architecture according to claim 7 is characterized in that, described patterned layer is a transparent material.
10. phase chip architecture according to claim 7 is characterized in that, described pattern district can be animal, plant, decorative pattern, literal or geometric figure.
CN 200620052097 2006-09-01 2006-09-01 Photo structure Expired - Fee Related CN200962187Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200620052097 CN200962187Y (en) 2006-09-01 2006-09-01 Photo structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200620052097 CN200962187Y (en) 2006-09-01 2006-09-01 Photo structure

Publications (1)

Publication Number Publication Date
CN200962187Y true CN200962187Y (en) 2007-10-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200620052097 Expired - Fee Related CN200962187Y (en) 2006-09-01 2006-09-01 Photo structure

Country Status (1)

Country Link
CN (1) CN200962187Y (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071017

Termination date: 20110901