CN200947674Y - Minitype capacitor microphone - Google Patents
Minitype capacitor microphone Download PDFInfo
- Publication number
- CN200947674Y CN200947674Y CN 200620064197 CN200620064197U CN200947674Y CN 200947674 Y CN200947674 Y CN 200947674Y CN 200620064197 CN200620064197 CN 200620064197 CN 200620064197 U CN200620064197 U CN 200620064197U CN 200947674 Y CN200947674 Y CN 200947674Y
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- pole plate
- membrane group
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- shell
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Abstract
The utility model discloses a micro-type capacitance microphone which includes a shell, a high temperature resistance vibration membrane group, a high temperature resistance hollow gasket, a rear plate, a high temperature resistance rear plate seat, a connecting frame and a circuit board. The bottom plate and the rear plate of the shell are separately provided with via-holes; the vibration membrane group, the hollow gasket and the rear plate seat are in turn piled on the bottom plate of the shell; the rear plate and the connecting frame are in turn piled in the rear plate seat; the circuit plate is embedded in the opening of the shell and is electrically connected with the connecting frame; the internal side of the circuit board is provided with a special chip which can provided DC biased voltage. The utility model adopts the rear plate seat, the gasket, the vibration membrane group which are made of high temperature resistance material to make the product have the efficacy of high temperature resistance, adopts the special chip to provide the DC biased voltage for between the rear plate and the vibration membrane group to make volume micromation of the microphone; furthermore, the products do not require the electrifying process and the aging disposal; the sensitivity can be changed with the adjustment of the internal biased voltage; the production efficiency, stability and the qualified ratio of the products are improved; the timbre of the products is insured; the micro-type capacitance microphone arranged on the surface can be implemented.
Description
Technical field
The utility model relates to a kind of micro capacitance microphone, more specifically, relates to a kind of surface-mountable micro capacitance microphone.
Background technology
Capacitance microphone, be to accept the polyester film sheet of the plating metal on surface layer of sound wave, pole plate (oscillating plate) as capacitor, the fixed polar plate (back pole plate) of the fixedly thick sheet metal of round ditch as electric capacity will be arranged facing to of diaphragm, between back pole plate, be provided with the organic material film pad of insulating effect at oscillating plate, form the capacitor element with air dielectric layer thereby make between oscillating plate and the back pole plate.The elastic construction of thin polyester film sheet can produce small axial displacement after the vibration of picking up extraneous sound wave, thus the air gap between change oscillating plate and the back pole plate, the variation of the charge capacity of the capacitor that its result just causes above-mentioned two-plate and constituted.When the distance between two-plate reduced, capacitance increased; When distance increased, capacitance reduced.The electric capacitance change that sound pressure variations causes changes output voltage, thereby obtains the electric current of specific size and Orientation.The advantage of Electret Condencer Microphone is that frequency response is good, noise is low, distortion is little.Shortcoming is that the scope of application is less because the electric charge on two pole plates of capacitor microphone will lean on one to add polarization power supply (dc offset voltage) and keep, and volume is bigger, can't accomplish microminiaturization.
For this reason, people's utility model electret condenser microphone, electret condenser microphone, it is a kind of capacitance microphone that utilizes electret to make, because electret itself is charged, so the polarization power supply that this capacitance microphone need not be outside heavy, the capacitor that two-plate constituted can produce to change with the gap and produce the alternation change in electrical charge, this change in electrical charge just can be converted into the alternating signal voltage output that changes with vibration via the application-specific integrated circuit circuit, simplify the structure of capacitance microphone.The electret microphone electroacoustic performance is better, and the antivibration ability is strong, and price is low, and therefore miniaturization easily is widely used in the circuit such as cassette recorder, wireless microphone and acoustic control.
Along with the technical development of novel electron product, trend towards design of electronic products is got more compact, in order to design the product of this compactness, use surface mounting technology (SMT) widely.Implement SMT, in solder reflow process, need component exposure with mounted on surface under high temperature.Yet common electret condenser microphone is difficult to adopt surface mounting technology, even they are made by resistant to elevated temperatures material, the charge value of this electret also violent decay can take place at high temperature, thereby has reduced product sensitivity.In addition, also there is a problem in electret condenser microphone, promptly because reside permanently electric charge by electric charge being forced to be injected into form in the organic film that is fitted on the metallic plate (as, FEP etc.), the increase of humidity or temperature can make the electric charge that is injected escape easily, thereby reduces the performance of electret product.
In order to solve problems such as high temperature resistant, people's utility model the Si semiconductor microphone, the Si semiconductor microphone is that back pole plate and vibrating diaphragm are built on the silicon wafer panel, and links with suitable circuit.Then utilize chemical etch technique with smooth and simple the placing in the substrate of vibrating diaphragm, make it do free vibration completely with sound.And the electric field change that forms between the vibrating diaphragm of vibration and the back pole plate promptly produces the signal of telecommunication on the circuit.The Si semiconductor microphone has the character of two uniquenesses, that is, and and minimum volume and the high temperature that can bear reflow soldering.But because the vibrating membrane of Si semiconductor microphone is very little, tonequality difficulty reaches original microphone level, has limited the application of product.
The utility model content
The utility model is at the deficiency of above-mentioned known techniques, and purpose is to provide a kind of SMT of satisfying technological requirement, surface-mountable micro capacitance microphone.
For realizing above-mentioned purpose, the utility model is taked following technical scheme:
A kind of micro capacitance microphone comprises the shell with ccontaining cavity, the vibrating membrane group with coat of metal, hollow pad, back pole plate, backplane panel seat, connection box and wiring board; The bottom panel of above-mentioned shell and above-mentioned back pole plate offer the through hole of at least one impenetrating thickness direction respectively, above-mentioned vibrating membrane group, hollow pad and backplane panel seat are stacked and placed on the bottom panel of above-mentioned shell successively, above-mentioned back pole plate and above-mentioned connection box are stacked and placed in the above-mentioned backplane panel seat successively, make above-mentioned back pole plate and above-mentioned vibrating membrane group keep a determining deviation by above-mentioned hollow pad, the opening that above-mentioned wiring board is embedded at above-mentioned shell seals, and the upper and lower end face of above-mentioned connection box electrically connects with above-mentioned back pole plate and above-mentioned wiring board respectively; Above-mentioned hollow pad, vibrating membrane group and backplane panel seat are all made by exotic material, and the medial surface of above-mentioned wiring board is provided with the special chip that dc offset voltage can be provided.
Above-mentioned special chip comprises low input capacitance amplifier, be built-in with the low noise charging pump of constant voltage and oscillator and be used for the low pass filter of filtering charge pump high frequency noise, a pole plate in above-mentioned square vibrating membrane group and the above-mentioned square back pole plate is electrically connected with above-mentioned charging delivery side of pump, another pole plate in above-mentioned square vibrating membrane group and the above-mentioned square back pole plate is electrically connected with above-mentioned amplifier input terminal, and the output of above-mentioned amplifier is the output of microphone.
Above-mentioned shell, vibrating membrane group, hollow pad, back pole plate, backplane panel seat, connection box and wiring board are all corresponding square.
After adopting such scheme, the utility model has technology to compare with habit, has following advantage:
1, backplane panel seat, pad, the vibrating membrane group that adopts exotic material to make, make product have high temperature resistant effect, and adopt special chip for providing dc offset voltage between back pole plate and the vibrating membrane group, make the microphone volume microminiaturization, and product need not electret technology and burin-in process, and sensitivity can change with the adjustment of internal bias voltage, has improved production efficiency of products, stability and qualification rate, guarantee the tonequality of product, can realize the micro capacitance microphone of mounted on surface.
2, squared design is adopted in total spare and accessory parts and combination, its have have good positioning, effect that effective area is big, thereby can improve tonequality.
3, simple in structure, practical.
Description of drawings
Fig. 1 is the utility model surface structure schematic diagram;
Fig. 2 is another visual angle surface structure schematic diagram of the utility model;
Fig. 3 is the utility model decomposition texture schematic diagram;
Fig. 4 is another visual angle structural representation of wiring board in the utility model;
Fig. 5 is the utility model cross-sectional view.
Fig. 6 is the circuit theory diagrams of special-purpose chip in the utility model.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described.
See also Fig. 1 to shown in Figure 5, a kind of micro capacitance microphone of the present utility model, comprise square wiring board 10, square shell 20, square connection box 30, square backplane panel seat 40, square back pole plate 50, hollow square pad 60 and square vibrating membrane group 70, wherein:
Square vibrating membrane group 70 is flat on the bottom panel 21 of square shell 20, and square vibrating membrane group 70 is made by exotic material, and its surface has the coat of metal, and this coating is over against square backboard plate 50; This square vibrating membrane group 70 is formed one by stretch tight zona 71 and mylar 72, and one of electric capacity that formation and square back pole plate 50 are formed utmost point.
The insulator that square washer 60 is made by exotic material is hollow form, is flat on the square vibrating membrane group 70, is used to make square back pole plate 50 and square vibrating membrane group 70 to keep a determining deviation.
Square backplane panel seat 40, make by exotic material, be hollow tube-shape, be flat on the square washer 60, and flat successively folded being embedded in it of square back pole plate 50 and square connection box 30, square backplane panel seat 40 plays the effect with square connection box 30 and back pole plate 50 location.
Square back pole plate 50 is another utmost point of the electric capacity formed with square vibrating membrane group 70, and it is provided with three through holes 51.
The utility model design focal point is the backplane panel seat, pad, the vibrating membrane group that adopt application-specific integrated circuit chip and exotic material to make to make product have high temperature resistant effect, can realize the micro capacitance microphone of mounted on surface.Squared design is all adopted in total spare and accessory parts and combination, its have have good positioning, effect that effective area is big, thereby can improve product tonequality performance and assembling and positioning precision.In addition, use special-purpose chip, this microphone need not electret technology and burin-in process, sensitivity changes with the adjustment of internal bias voltage, thereby the stability and the production efficiency of product have been improved, also reduce the defective products that is produced because of electret technology and burin-in process, improved the qualification rate of product.
The above, it only is a kind of micro capacitance microphone preferred embodiment of the utility model, be not that technical scope of the present utility model is imposed any restrictions, so any trickle modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above case study on implementation all still belong in the scope of technical solutions of the utility model.
Claims (3)
1, a kind of micro capacitance microphone comprises the shell with ccontaining cavity, the vibrating membrane group with coat of metal, hollow pad, back pole plate, backplane panel seat, connection box and wiring board; The bottom panel of above-mentioned shell and above-mentioned back pole plate offer the through hole of at least one impenetrating thickness direction respectively, above-mentioned vibrating membrane group, hollow pad and backplane panel seat are stacked and placed on the bottom panel of above-mentioned shell successively, above-mentioned back pole plate and above-mentioned connection box are stacked and placed in the above-mentioned backplane panel seat successively, make above-mentioned back pole plate and above-mentioned vibrating membrane group keep a determining deviation by above-mentioned hollow pad, the opening that above-mentioned wiring board is embedded at above-mentioned shell seals, and the upper and lower end face of above-mentioned connection box electrically connects with above-mentioned back pole plate and above-mentioned wiring board respectively; It is characterized in that: above-mentioned hollow pad, vibrating membrane group and backplane panel seat are all made by exotic material, and the medial surface of above-mentioned wiring board is provided with the special chip that dc offset voltage can be provided.
2, a kind of micro capacitance microphone according to claim 1, it is characterized in that: above-mentioned special chip comprises low input capacitance amplifier, be built-in with the low noise charging pump of constant voltage and oscillator and be used for the low pass filter of filtering charge pump high frequency noise, a pole plate in above-mentioned square vibrating membrane group and the above-mentioned square back pole plate is electrically connected with above-mentioned charging delivery side of pump, another pole plate in above-mentioned square vibrating membrane group and the above-mentioned square back pole plate is electrically connected with above-mentioned amplifier input terminal, and the output of above-mentioned amplifier is the output of microphone.
3, a kind of micro capacitance microphone according to claim 1 and 2 is characterized in that: above-mentioned shell, vibrating membrane group, hollow pad, back pole plate, backplane panel seat, connection box and wiring board are all corresponding square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620064197 CN200947674Y (en) | 2006-09-14 | 2006-09-14 | Minitype capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620064197 CN200947674Y (en) | 2006-09-14 | 2006-09-14 | Minitype capacitor microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200947674Y true CN200947674Y (en) | 2007-09-12 |
Family
ID=38734733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620064197 Expired - Lifetime CN200947674Y (en) | 2006-09-14 | 2006-09-14 | Minitype capacitor microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200947674Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045629A (en) * | 2009-10-14 | 2011-05-04 | 宝星电子股份有限公司 | Condenser microphone assembly with floating configuration |
| CN101146375B (en) * | 2006-09-14 | 2012-03-28 | 东莞泉声电子有限公司 | A micro capacitance microphone |
| CN104427452A (en) * | 2013-09-10 | 2015-03-18 | Bnc网络株式会社 | Silicon condenser microphone |
| CN107529712A (en) * | 2017-07-27 | 2018-01-02 | 钰太芯微电子科技（上海）有限公司 | A kind of microphone and Bluetooth circuit plate of built-in crystal oscillator |
| CN109195032A (en) * | 2018-08-09 | 2019-01-11 | 东莞市宋光电子有限公司 | A kind of rectangular sound pick-up |
-
2006
- 2006-09-14 CN CN 200620064197 patent/CN200947674Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146375B (en) * | 2006-09-14 | 2012-03-28 | 东莞泉声电子有限公司 | A micro capacitance microphone |
| CN102045629A (en) * | 2009-10-14 | 2011-05-04 | 宝星电子股份有限公司 | Condenser microphone assembly with floating configuration |
| CN104427452A (en) * | 2013-09-10 | 2015-03-18 | Bnc网络株式会社 | Silicon condenser microphone |
| CN107529712A (en) * | 2017-07-27 | 2018-01-02 | 钰太芯微电子科技（上海）有限公司 | A kind of microphone and Bluetooth circuit plate of built-in crystal oscillator |
| CN109195032A (en) * | 2018-08-09 | 2019-01-11 | 东莞市宋光电子有限公司 | A kind of rectangular sound pick-up |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20070912 Effective date of abandoning: 20060914 |