CN1997767A - Metalization method and plant - Google Patents
Metalization method and plant Download PDFInfo
- Publication number
- CN1997767A CN1997767A CNA2005800182973A CN200580018297A CN1997767A CN 1997767 A CN1997767 A CN 1997767A CN A2005800182973 A CNA2005800182973 A CN A2005800182973A CN 200580018297 A CN200580018297 A CN 200580018297A CN 1997767 A CN1997767 A CN 1997767A
- Authority
- CN
- China
- Prior art keywords
- metal
- vacuum
- mitriform
- mitriform body
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Described herein is a method for metalization in high-vacuum conditions for bestowing particular colourings or chromatic effects on the article to be metalized, said method comprising two steps of metalization: sublimation in the vacuum bell in high-vacuum conditions of a first metal; and sublimation in the vacuum bell in high-vacuum conditions of a second metal in the presence of a gas basically constituted by oxygen or ozone. The second metalization bestows upon the article thus treated a particular colouring and/or particular chromatic effects.
Description
Invention field
The present invention relates to the equipment of new method for metallising and the described method of enforcement.Particularly, the present invention relates to method for metallising and relevant device under high vacuum condition, can make and carry out metallized object and have particular color or color effect.
Background technology
Method for metallising under the known road of the prior art vacuum condition, it consists essentially of to introduce and carries out metallized object in vacuum mitriform body, by the matrix of heating with metal refining, makes and will deposit to the metal distillation of body surface.In case reach the temperature of metal distillation, metal enters gaseous state and deposits to and is positioned at the intravital object of mitriform, produce the metal level that generally has reflectivity and do not have color.Color was applied to coating metallized or that have a color on the metallized object by other coated step afterwards, it is generally acknowledged to apply the color of layered coating to obtain wishing.
Summary of the invention
The objective of the invention is to propose a kind of method for metallising, color or specific color effect are applied on the object correlation by the single technology of in vacuum mitriform body, implementing.
According to the present invention, the realization of described purpose is the technical scheme that is particularly related to by claims.
According to of the present invention the object method for metallising being related generally to preparation step, object is set on the satellite-type rotatable support in the vacuum mitriform body, apply the ionic discharge and the degassing thereafter, then is that object is metallized.The metallization of object comprises two steps:
I) first metal in the vacuum mitriform body distils to first conductive support of described first metal by applying voltage under high vacuum condition; With
Ii) second metal in the vacuum mitriform body is under high vacuum condition and exist substantially under the condition of the gas that is made of oxygen or ozone by applying voltage and distil to second conductive support of described second metal.
The step of preparing metalized article is indispensable for method for metallising, because of it can make the metal level of body surface obtain necessary cementability, and the pollutent that described surface must removing may exist.
Have earlier under the vacuum condition in that mitriform is intravital, pressure is approximately 1 * 10
-1To 6 * 10
-2Between the mbar, apply the time length at least one secondary ion discharge between 4 and 6 minutes greatly, the surface is cleaned.
Ionic discharge produces to the intravital negative electrode of mitriform by applying strength of current (as arriving in the 350mA scope about 250), and the object that wherein suitably is installed to the satellite-type rotary support member constitutes anode.
After ionic discharge finished, next step implemented degasification technique, continued about 35 minutes, so that realize carrying out the best cleaning of metallide surface.
Next, first metallization step is under the condition of high vacuum, and promptly pressure is generally 8 * 10
-4To 6 * 10
-5Between the mbar, the time length is approximately 1 to 1.5 minute.
First metallization step is implemented by making first metal distillation that is applied to the object correlation surface, and first metal can be selected from aluminium, chromium, nickel, copper or its alloy.
The distillation of first metal is carried out to its strut member by applying voltage, in case reach the sublimation temperature of the used metal under the vacuum condition, metal becomes gaseous state, and metal deposition is to the intravital body surface of mitriform.
The strut member of described first metal can be made of the tungsten filament with spirane structure easily.
First metal that distils has shaft-like, and it inserts in the space of tungsten filament formation, so that more promptly reach sublimation temperature.
Can or preferably use more than one first metallic rod that is used to distil, 3 or 5 bars that intermesh are preferably arranged, so that have the metal of necessary amount, realize the metallization of object in the mitriform body, all simultaneously metallic rod are distillation at once almost, to obtain the layer of even metal as far as possible on the body surface.At once the realization of distillation of all bars is to conduct better by the bar heat that support wire is sent that intermeshes.
When this first step end, the second metallization beginning, it is designed to make object to have the color effect of color and/or hope.
Second metallization step is also carried out under the condition of high vacuum in the mitriform body, depends on the metal that second step is used, generally 8 * 10
-4To 6 * 10
-5Under the pressure of mbar, the time length is greatly about 2 to 3.5 minutes.
Second metal generally can be selected from magnesium, manganese, cobalt, copper or its alloy.So that object has color, according to employed metal, color gamut from gold to blue or green.
Second metal preferably has sheet structure, is positioned at the second crucible shape strut member, and the material of strut member is the mixture of tungsten and molybdenum preferably.
The sublimation temperature that reaches second metal is by applying voltage to crucible, and it produces heat and heating and makes wherein second metal distillation.
According to special and basic feature of the present invention, during second metallization step, oxygen or ozone are introduced the mitriform body in the dosage mode, the color effect that makes the shade of color that obtains and the depth have hope.The amount of gas of introducing the mitriform body is big more, and the gloss of object is also bright more.The color that this and second metal produce is irrelevant.
After second metallization step finishes, carry out another degasification technique, to realize that fixed metal layer is to the body surface of handling.Sustainable several minutes of described last degasification technique.
Embodiment
Below with reference to the device examples of accompanying drawing introduction according to realization method for metallising of the present invention, accompanying drawing has shown the view of this equipment in the mode of non-limiting example.
In the accompanying drawing, mark 1 has been represented the vacuum mitriform body that has door 2, and door can open and close by sealing means.Mark 3 and 4 is represented tungsten filament strut member that constitutes and the strut member that is used for the similar crucible of shape of second metallization step that is used for first metallization step respectively.The negative electrode integral body of mark 5 common shapes of representative such as rod member, it cooperates with the anode that the satellite-type rotary support member constitutes, and to carrying out metallized object ionic discharge, wherein rotary support member is whole with mark 6 representatives.In fact described strut member is made of the strut member of the multiple shape that is fit to metalized article, can be rotated motion and turning motion, and described strut member is subjected to the carrier (not shown) and supports, and carrier can be put into mitriform body 1 and from wherein taking out.
In order in mitriform body 1, to apply high vacuum, be typically provided with mechanical primary pump 7, it is connected in series to the Roots type lobe pump 8 that is arranged on suction line 9, and pipeline is connected to mitriform body 1 by the magnetic valve 10 of preliminary vacuum.Pipeline 9 is operably connected to magnetic valve 11, and it is used for stablizing vacuum tightness by corresponding Fine adjustment knob 12; Pipeline 9 is also connected to suction line 13 in parallel, is provided with diffusion pump 14 on the pipeline 13, and is provided with discharge solenoid valve 15.Pipeline 13 is connected to vacuum mitriform body 1 by high-vacuum electromagnetic valve 16.
The magnetic valve 11 of stablizing vacuum tightness is designed to and can injects air to mitriform body 1 with small consumption by Fine adjustment knob 12, and is constant with the vacuum values that keeps setting, and needn't reduce flow rate during pump 7,8 is bled.
Mark 17,18 is represented two magnetic valves, previously is used to clean the probe 19 that detects high vacuum state, and back one is used for that input air is to mitriform body 1 when loop ends, and mark 20,21 has been represented the probe of surveying vacuum tightness.
Mark 22 has been represented the magnetic valve that is connected to mitriform body 1, is used at ionic discharge step introducing air, and coupled is Fine adjustment knob 23.
At last, mark 24 has been represented oxygen or ozone pressure-pot, is connected to the matrix of vacuum mitriform body 1 by inlet magnetic valve 25 and fine adjustment assembly 26.
All parts of introducing above are operably connected to the electronic processors of sequencing, according to the circulation that below will introduce, and the method that enforcement is introduced above.
During beginning, the carrier that has object support when introducing is behind vacuum mitriform body 1, and at first actuating primary pump 7 is lobe pump 8 then, opens magnetic valve 10, closes magnetic valve 15,16 simultaneously.When reaching the vacuum tightness of setting, carry out next step ionic discharge, finish up to the preparation step of object, keep magnetic valve 22 to open, introduce the air of mitriform body 1 by Fine adjustment knob 23 controls.If necessary, the magnetic valve 11 that has Fine adjustment knob 12 can be got involved, to keep the vacuum tightness in the mitriform body 1 constant.
Carry out first metallization step, close magnetic valve 10 and open magnetic valve 15,16, connect with pump 7,8 placed in-line diffusion pump 14 and arrive mitriform body 1 to keep condition of high vacuum degree thereafter.Close magnetic valve 22 then,, realize the distillation of first metal, deposit to object surfaces after degassing for some time, making one or more tungsten filament 3 charged to object.
After first metallization step finishes, the introduction of the first metallized time length such as front can be between 1 to 1.5 minute, by carrying out second metallization step to crucible 4 power supplies, in this step, by magnetic valve 25 and fine adjustment assembly 26 oxygen or ozone are introduced vacuum mitriform body 1, change with the colour of the body surface that obtains wishing.This step time length is generally long than the time of first metallization step, for example, and can be at 2 to 3.5 minutes.
At last, close magnetic valve 25 and 16, after carrying out other for some time degassing and stabilization, magnetic valve 18 is opened, and mitriform body 1 is opened, and takes out the strut member that has object.
Certainly, the extensive variation that the structure of equipment and the details of embodiment can relative institute be introduced and shown, this does not break away from of the present invention as the claims restricted portion.
Claims (21)
1. one kind to the metallized method of at least one object, comprises the object prepared in the vacuum mitriform body and to described object metallization, described metallization has two steps:
I) first metal in the described vacuum mitriform body distils to first conductive support of described first metal by applying voltage under high vacuum condition; With
Second metal in the ii) described vacuum mitriform body is under vacuum condition and exist substantially under the condition of the gas that is made of oxygen or ozone by applying voltage and distil to second conductive support of described second metal, and wherein gas is introduced in the described mitriform body in the dosage mode.
2. method according to claim 1 is characterized in that, described preparation comprises and applies at least that primary ions discharges into described at least one object that is arranged in the vacuum mitriform body.
3. method according to claim 2 is characterized in that, the time length of described at least one secondary ion discharge is between 4 and 6 minutes.
4. method according to claim 2 is characterized in that, after the described ionic discharge, to the described object in the described vacuum mitriform body 1 * 10
-1To 6 * 10
-2Outgas under the pressure between the mbar.
5. method according to claim 1 is characterized in that, described first metallization step is 8 * 10
-4To 6 * 10
-5Carry out under the constant pressure between the mbar.
6. method according to claim 1 is characterized in that, the time length of described first metallization step is between 1 to 1.5 minute.
7. method according to claim 1 is characterized in that, first strut member of described first metal comprises the tungsten filament with spirane structure.
8. method according to claim 1 is characterized in that, described first metal can be selected from aluminium, chromium, nickel, copper or its alloy.
9. method according to claim 7 is characterized in that, described first metal has shaft-like and is positioned at the interior volume that described spirane structure tungsten filament limits.
10. method according to claim 9 is characterized in that, described first metal has at least three bars that preferably intermesh.
11. method according to claim 1 is characterized in that, described second metallization step is 8 * 10
-4To 6 * 10
-5Carry out under the constant pressure between the mbar.
12. method according to claim 1 is characterized in that, the time length of described second metallization step is between 2 to 3.5 minutes.
13. method according to claim 1 is characterized in that, the crucible that second strut member of described second metal is made by tungsten and molybdenum constitutes.
14. method according to claim 1 is characterized in that, described second metal can be selected from magnesium, manganese, cobalt, copper or its alloy.
15. method according to claim 1 is characterized in that, described second metal has sheet structure.
16. method according to claim 1 is characterized in that, describedly carries out metallized object and is installed to satellite-type rotatable support in the described vacuum mitriform body.
17. method according to claim 1 is characterized in that, carries out another degasification technique after described metallization.
18. an equipment of implementing the described method for metallising of the one or more claims in front is characterized in that, comprises in the dosage mode applying oxygen or the ozone mechanism (24,25,26) in the described vacuum mitriform body (1).
19. equipment according to claim 18 is characterized in that, described first conductive support of described first metal in the described vacuum mitriform body (1) comprises the tungsten filament mechanism (3) with spirane structure.
20. equipment according to claim 18 is characterized in that, described second conductive support of described second metal in the described vacuum mitriform body (1) comprises the crucible mechanism that tungsten and molybdenum (4) are made.
21. equipment according to claim 18, it is characterized in that, described vacuum mitriform body (1) is provided with the vacuum stabilizing mechanism (11) that has regulating mechanism (12), is used for injecting air in described mitriform body (1) in the dosage mode, to keep the vacuum set(ting)value constant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITTO20040221 ITTO20040221A1 (en) | 2004-04-08 | 2004-04-08 | MOUNTING PROCEDURE |
| ITTO2004A000221 | 2004-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1997767A true CN1997767A (en) | 2007-07-11 |
Family
ID=34967759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005800182973A Pending CN1997767A (en) | 2004-04-08 | 2005-04-08 | Metalization method and plant |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1733068A2 (en) |
| CN (1) | CN1997767A (en) |
| IT (1) | ITTO20040221A1 (en) |
| WO (1) | WO2005098077A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105671513A (en) * | 2016-02-25 | 2016-06-15 | 深圳市众诚达应用材料科技有限公司 | Novel vacuum color coating process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE675731C (en) * | 1935-10-06 | 1939-05-17 | Bernhard Berghaus | Process for the production of homogeneous layers or bodies from metals on a base body by cathode sputtering, thermal evaporation or thermal decomposition of metal compounds |
| US3856647A (en) * | 1973-05-15 | 1974-12-24 | Ibm | Multi-layer control or stress in thin films |
| US4022947A (en) * | 1975-11-06 | 1977-05-10 | Airco, Inc. | Transparent panel having high reflectivity for solar radiation and a method for preparing same |
| JP2840502B2 (en) * | 1992-06-03 | 1998-12-24 | 三洋電機株式会社 | High-functional material film formation method |
| DE19804751C2 (en) * | 1998-01-12 | 2000-08-31 | Fraunhofer Ges Forschung | Process for coating foil made of nickel or a nickel alloy and coated foil made of nickel or a nickel alloy |
-
2004
- 2004-04-08 IT ITTO20040221 patent/ITTO20040221A1/en unknown
-
2005
- 2005-04-08 EP EP05718396A patent/EP1733068A2/en not_active Withdrawn
- 2005-04-08 WO PCT/IB2005/000926 patent/WO2005098077A2/en active Application Filing
- 2005-04-08 CN CNA2005800182973A patent/CN1997767A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105671513A (en) * | 2016-02-25 | 2016-06-15 | 深圳市众诚达应用材料科技有限公司 | Novel vacuum color coating process |
Also Published As
| Publication number | Publication date |
|---|---|
| ITTO20040221A1 (en) | 2004-07-08 |
| WO2005098077A2 (en) | 2005-10-20 |
| WO2005098077A3 (en) | 2006-05-18 |
| EP1733068A2 (en) | 2006-12-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE10018143B4 (en) | DLC layer system and method and apparatus for producing such a layer system | |
| EP2148939B1 (en) | Vacuum treatment unit and vacuum treatment process | |
| CN104046943B (en) | Low-tension arc plasma immersion coat vapor deposits and ion processing | |
| CN109778136B (en) | Method for preparing diamond-like coating by adopting thermionic plasma technology | |
| CN107142463B (en) | A kind of coating method that plasma activated chemical vapour deposition is compound with magnetron sputtering or ion plating | |
| US9863031B2 (en) | Method for preparing a coating of the surface of medical devices made of nickel-titanium alloy | |
| US8273222B2 (en) | Apparatus and method for RF plasma enhanced magnetron sputter deposition | |
| EP0558061B1 (en) | Improvements in physical vapour deposition processes | |
| CN105887159B (en) | One kind has ornamental and functional magnesium alloy preparation method of composite coating concurrently | |
| US9175381B2 (en) | Processing tubular surfaces using double glow discharge | |
| US20110256417A1 (en) | Oxidation Resistant Nanocrystalline MCrAl(Y) Coatings And Methods of Forming Such Coatings | |
| CN106119780A (en) | A kind of coating system | |
| CN103938166A (en) | High-energy pulse-type magnetron sputtering method and magnetron sputtering device | |
| CN100487158C (en) | Hall Ion Source excitation magnetron sputtering enhancement magnetism filtration multi-arc ion composite coating method | |
| CN105671513A (en) | Novel vacuum color coating process | |
| GB2202237A (en) | Cathodic arc plasma deposition of hard coatings | |
| CN1997767A (en) | Metalization method and plant | |
| US4420498A (en) | Method of forming a decorative metallic nitride coating | |
| CN111593303A (en) | Color gradient control method for preparing TiAlN coating by ion plating technology | |
| CN105755429B (en) | A kind of method that the double filter deposition technologies of ion beam prepare mobile phone screen scratch resistance aluminum oxide coating layer | |
| Martins et al. | Contamination due to memory effects in filtered vacuum arc plasma deposition systems | |
| JPH0693469A (en) | Method for depositing wear resisting coating on titanium based substrate | |
| US20010008698A1 (en) | Brass-colored coating with color-imparting nitride layer | |
| CN110438499B (en) | Non-metallic material surface metallization product and metallization method thereof | |
| CN111254401B (en) | Method for improving adhesion strength of hard wear-resistant nano coating of titanium alloy plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |