CN1987503A - Computer module detecting method and detecting system - Google Patents
Computer module detecting method and detecting system Download PDFInfo
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- CN1987503A CN1987503A CN 200510132711 CN200510132711A CN1987503A CN 1987503 A CN1987503 A CN 1987503A CN 200510132711 CN200510132711 CN 200510132711 CN 200510132711 A CN200510132711 A CN 200510132711A CN 1987503 A CN1987503 A CN 1987503A
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Abstract
Controlling temperature of CPU inside computer, the method increases test pressure for computer modules on periphery of CPU, and carries out testing computer modules. Setting up variation range of testing temperature for computer modules the method sets up test temperature for computer modules. When real time temperature is equal to the test temperature, through the test program, the method carries out test for computer modules. The disclosed test system can be loaded to rudiment machine in advance. Test can be carried out for modules to be tested under specific temperature so as to create condition to know performance of computer module to be tested at different temperature. The method is in high automaticity, and suitable to test in large scale.
Description
Technical field
The present invention relates to a kind of computer module detecting method and test macro, relate in particular to a kind of computer module detecting method and the test macro that in the computer module test process, can adjust the test environment temperature.
Background technology
Computing machine is the instrument of the indispensable working and learning of current social, in order to guarantee to calculate the reliable and stable work of function, need test the various assemblies in the computing machine embryo machine of designing, this test is not only to find out problematic assembly, also finds that for research and development manufacturer the embryo machine designs irrational part reference is provided.
To save as example in the key component one in the computing machine, it is one of important technology factor of decision computer system stability and reliability, therefore, the factor that complete discovery, analysis and checking influence the internal memory operate as normal is the necessary technology basis of exploitation high-performance computer, also is the target place of memory test.
The method of test memory mostly is by embryo machine operation testing software, with the problem of finding that internal memory exists, the pointer of test mainly be internal memory stability and with the compatibility of embryo machine, embody these characteristics and mainly be clock frequency and running parameter by internal memory, wherein the software of test memory has multiplely, is not enumerating one by one herein.
For the manufacturer that produces internal memory, above-mentioned test is nowhere near, in order to improve complete machine stability, and can provide the internal memory of corresponding configuration for the type of different size, need internally deposit into the stricter test of row, therefore, test also need be carried out under the situation that strengthens test environment pressure.Usually, external environment condition comprises probe temperature and voltage.
For notebook computer, the temperature of test environment is even more important to memory test, because the modular construction compactness of mobile computer, heat is concentrated easily, and the memory test of therefore carrying out notebook computer under the high temperature test environment is highly significant to the framework of internal memory itself and notebook computer inside.Usually, when internally depositing into the row test, the test environment of high temperature (more than 65 ℃) down internal memory report an error frequency ratio low temperature the time want high, this is after uprising because of temperature, the transmission of frequency variation signal produces to be disturbed, and temperature is high more crosstalks greatly more, and the decay of signal is also big more, and the low temperature fault that not have down to occur has all occurred at this moment originally; Therefore, provide a kind of test platform that can change probe temperature to have very much practical significance.
The method that strengthens the memory test environmental pressure at present is to use high low temperature ageing oven, can be by its temperature of adjusting test environment to reach the purpose of under the different temperatures environment, carrying out memory test, but the high low temperature ageing oven cost height that this method is used, and need every packaged circuit board that is provided with internal memory is put into respectively wherein, adjusting the temperature of high low temperature ageing oven tests again, very inconvenient, reduced testing efficiency.
Therefore, key issue is the environmental pressure when strengthening test memory as method how convenient, effective and with low cost, and this also is that industry is endeavoured the technical bottleneck that solves always.
Summary of the invention
The object of the present invention is to provide a kind of computer module detecting method and test macro of being convenient to adjust test environment pressure.
To achieve these goals, the disclosed a kind of computer module detecting method of the present invention, central processor temperature by control computer inside, test with the test pressure of increase central processing unit periphery computer module and then to computer module, method of testing of the present invention comprises the probe temperature fluctuation range that computer module is set; The probe temperature of computer module is set, and makes probe temperature be in the probe temperature fluctuation range; Read the real time temperature of central processing unit; Judge whether real time temperature equals probe temperature, if not, then adjust the real time temperature of central processing unit, if computer module is tested by test procedure.
Disclosed a kind of computer module test macro, it comprises the Range of measuring temp setup unit, is used for the fluctuation range and the storage of the probe temperature of set-up and calculated thermomechanical components; The probe temperature setup unit is used for the probe temperature of computer module is controlled in the Range of measuring temp; The temperature reading unit is used to read the real time temperature of central processing unit; The temperature judging unit judges whether real time temperature equals probe temperature; The temperature adjustment unit is adjusted real time temperature until equaling probe temperature when real time temperature is not equal to probe temperature; And the hardware testing unit, when real time temperature equaled probe temperature, the operation test procedure was tested computer module.
The method of testing of computer module of the present invention and test macro can be adjusted probe temperature automatically, use high low temperature ageing oven to compare with prior art, and its automaticity is higher and saved cost; In addition, the present invention also can create conditions for the tester understands the performance of tested computer module under different temperatures pressure according to the temperature that needs the changed test environment; And the present invention can be widely used in the process of various computer modules such as test memory, hard disk or CD-ROM drive.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the method flow diagram of the computer module detecting method of the embodiment of the invention;
Fig. 2 is the method flow diagram of automatic adjustment probe temperature of the present invention;
Fig. 3 is a method flow diagram of monitoring the central processing unit real time temperature constantly of the present invention;
Fig. 4 is the method flow diagram of automatic adjustment real time temperature of the present invention; And
Fig. 5 is the system block diagrams of the computer module test macro of the embodiment of the invention.
Step 305 operation CPU makes its temperature suitable with environment temperature
Step 319 judges whether test finishes
The probe temperature TmpL of step 3031 initialization CPU
Step 3032 judges that whether probe temperature TmpL is less than minimum temperature
Step 3033 makes probe temperature TmpL equal minimum temperature
Step 3034 judges that whether probe temperature TmpL is greater than maximum temperature
Step 501 reads the real time temperature Tmp of CPU
Step 503 judges whether the real time temperature Tmp of CPU equals probe temperature TmpL
Step 505 is adjusted the real time temperature Tmp of CPU
The probe temperature TmpL of step 801 initialization CPU
Step 819 judges that whether difference is less than positive two grades
Step 825 is carried out the intensification scheme of a positive grade
Step 833 is carried out the cooling profiles of negative two grades
Step 835 judges that whether difference is less than negative three grades
Step 837 is carried out the cooling profiles of negative three grades
100 computer module test macros
101 temperature range setup units
103 probe temperature setup units
105 cpu temperature control modules
107 hardware testing unit
109 cpu temperature monitoring units
111 probe temperatures change judging unit
Judging unit is finished in 113 tests
201 cpu temperature reading units
203 cpu temperature judging units
205 cpu temperature adjustment units
Embodiment
Below, will elaborate to better embodiment of the present invention in conjunction with the accompanying drawings.
Computer module detecting method of the present invention comprises the temperature of the whole test environment of circulation rising and moves existing testing software and test, therefore can under the situation that constantly increases ambient pressure environment, test computer module, therefore the temperature that focuses on how adjusting test environment of the present invention has omitted how computer module is moved giving unnecessary details of existing testing software.
Because computing machine is the inner structure compactness of notebook computer especially, the temperature of internal environment is equivalent to central processing unit (Centeral Processing Unit, CPU) temperature of this main heat generating component, therefore, the temperature of adjusting CPU promptly is equivalent to environment temperature is adjusted.Figure 1 shows that the method flow diagram of the computer module detecting method of the embodiment of the invention.As shown in Figure 1, to save as example in the test notebook computer, method of testing of the present invention comprises following step:
The fluctuation range of cpu temperature in the test process at first is set, and stores these settings (step 301), the maximum of T of cpu temperature fluctuation is set
HighWith minimum value T
LowThe time; maximal value can not be too high; minimum value should not be low excessively; because maximal value is to be determined by the maximum temperature that CPU can bear; if CPU operation at high temperature for a long time can shorten its serviceable life; common Basic Input or Output System (BIOS) (Basic Input OutputSystem; BIOS) design has function that high temperature restarts automatically this reason just; if minimum value is crossed the low effect that can't reach the increase test pressure; because the temperature problem of high discovery more is many more; therefore, the setting of fluctuation range is an empirical value, according to system architecture; the heat radiation situation; tested internal memory and the difference that adopts the CPU model; the temperature range that is provided with is also with difference; for example, certain type cpu temperature situation that memory test is made mistakes in the time of 65 ℃ is more, therefore when test memory with lowest temperature T
LowBe made as 65 ℃, the resistant to elevated temperatures upper limit of CPU that this type adopts is generally 90 ℃ (can find) in the CPU instructions, so with the maximum of T of fluctuation range
HighBe made as 90 ℃;
Probe temperature TmpL (step 303) is set, and this probe temperature is the probe temperature of external environment, also is equivalent to the probe temperature of CPU according to the above, therefore calls the probe temperature TmpL of CPU in the following text;
The purpose that probe temperature TmpL is set is when the probe temperature that is provided with is not in the temperature fluctuation range that step 301 is provided with, and adjusts probe temperature automatically it is in the temperature fluctuation range, and as shown in Figure 2, it also comprises following step:
The probe temperature TmpL (step 3031) of initialization CPU, the probe temperature TmpL of CPU can be imported by the tester herein;
Judge that probe temperature TmpL is whether less than the minimum value T of temperature fluctuation range
Low(step 3032), if, execution in step 3033, if not, execution in step 3034;
Make probe temperature TmpL equal the minimum value T of temperature fluctuation range
Low, just making TmpL=65 ℃ (step 3033), execution in step 305 then;
Judge that probe temperature TmpL is whether greater than the maximum of T of temperature fluctuation range
High(step 3034), if, execution in step 3035, if not, execution in step 305;
Make probe temperature TmpL equal the maximum of T of temperature fluctuation range
High, just making TmpL=90 ℃ (step 3035), execution in step 305 then;
Circuit board operation a period of time of the internal memory that need test will be equiped with, make cpu temperature and computer-internal test environment temperature (step 305) very nearly the same, the time of CPU operation just can reach very high 1 second left and right sides temperature usually, and computer-internal environment compactness, need not just can make for a long time the temperature of CPU suitable with environment temperature;
Read the real time temperature Tmp (step 307) of CPU, real time temperature Tmp is also referred to as the surface temperature of CPU, as long as BIOS support into the rank group can with power interface ACPI (Advanced Configuration andPower Interface), just can normally obtain the real time temperature of CPU, at present, ACPI is extensively carried out as standard by industry, therefore each operating system all provides complete programmatic interface (ApplicationProgramming Interface, API) access method, so this paper no longer describes in detail;
Whether the real time temperature Tmp that judges CPU equals probe temperature TmpL (step 309), if be not equal to, and execution in step 311, if equal, execution in step 313;
Adjust the real time temperature Tmp (step 311) of CPU, the real time temperature of adjusting CPU makes it to equal probe temperature TmpL, and adjustment process hereinafter will be described in detail;
Carry out memory test and monitoring CPU real time temperature Tmp (step 313) constantly, in this step, test and monitoring are two parallel processes, part for memory test, i.e. Yun Hang test procedure can be one or more according to tester's needs operation, do not elaborate herein;
Monitoring CPU real time temperature Tmp and memory test are two independent processes constantly, but carry out simultaneously, because other hardware also can dispel the heat in the internal memory body examination examination process, thereby for the rising environment temperature contributes, and environment temperature should be constant in test process, so in test time, is monitoring temperature constantly also, in case could react rapidly when real time temperature is higher than probe temperature like this, guarantee that real time temperature is stabilized in probe temperature, these two parts are walked abreast on program could guarantee the stable of test environment, for the step of monitoring CPU real time temperature Tmp constantly, as shown in Figure 3, it also comprises:
Read the real time temperature Tmp (step 501) of CPU, the method that reads please refer to step 307; Whether the real time temperature Tmp that judges CPU equals probe temperature TmpL (step 503), if equal, continues execution in step 501, to continue to read the real time temperature Tmp of CPU, if be not equal to, and execution in step 505; Adjust the real time temperature Tmp (step 505) of CPU, the real time temperature of adjusting CPU makes it to equal probe temperature TmpL, and the method for adjustment is identical with step 311, hereinafter will be described in detail, continue execution in step 501 then, to continue to read the real time temperature Tmp of CPU;
Can't realize above-mentioned test and the parallel system of monitoring but limit by condition, as the DOS system, the frequency that can increase monitoring temperature maintains in the rational fluctuation range with the real time temperature that guarantees CPU;
Judging whether to change the probe temperature TmpL (step 315) of CPU, is execution in step 317 then, otherwise execution in step 319; The probe temperature TmpL that judges whether to change CPU carries out after can moving at the test procedure of an internal memory and finishing, and perhaps all moves at the test procedure of all internal memories and carries out after finishing, and can set according to tester's needs herein;
The purpose that judges whether to change the probe temperature TmpL of CPU is the temperature that constantly increases test environment, the circular flow test procedure, there to be the test result under the different temperatures in obtaining, if do not reach the upper limit of temperature fluctuation range, the probe temperature TmpL that can strengthen CPU is to carry out memory test under this temperature, if and arrived the upper limit, that one just can finish the adjustment of probe temperature TmpL, so judges whether that changed test temperature T mpL is very necessary;
Adjust probe temperature TmpL (step 317), increase or reduce probe temperature TmpL, the amplitude of its increase or minimizing can be according to tester's the setting that needs, and as 1 ℃ or more, execution in step 303 then;
Judge whether test finishes (step 319), if, then finish whole temperature adjustment and test process, if not, then execution in step 313, proceed test.
Wherein, in step 311 and the step 505, the approach of adjusting the real time temperature Tmp of CPU has two kinds, is respectively the rotating speed of control cpu fan and/or the power that increases CPU.The cpu fan stall cpu temperature that can raise, along with the temperature of the increase CPU of rotation speed of the fan can reduce gradually, the power of CPU is directly proportional with temperature, and power increases temperature and also can rise.Therefore these two kinds of methods all can realize promoting/reducing the effect of cpu temperature.
The increase of the rotating speed of fan, air flow in the cabinet has played the effect of equalizer set the temperature inside the box (environment temperature of hardware testing process just), the control method of cpu fan is included among the ACPI, but seldom there is operating system to provide access interface for the user, but can get access to the method that different type of machines is controlled cpu fan by the information of resolving among the ACPI, can see the books of relevant calculation machine fan test generation method for details, not repeat them here.But in test process as no specific (special) requirements do not make the fan stall but keep the fan high speed rotating as far as possible.
And the method for adjusting cpu power also has two kinds: a kind of is to calculate circular constant; Another kind is directly to drive cpu instruction to carry out computing.The common ground of this dual mode is to increase CPU floating-point operation amount in the unit interval to improve the power of CPU, just the mode difference.Discussed with regard to these two kinds of methods below.
Computerese realizes that the algorithm of calculating circular constant is a lot, calculates as the formula of admiring by plum.Plum is admired and has used two arc tangent formula in the formula, is respectively arctg (1/5) and arctg (1/239), can use the totalizer in the algorithm routine design to calculate, and the formula calculation method is a prior art because plum is admired, so locate not to be described in more detail.
Utilization makes CPU calculate the method for circular constant because calculated amount is constant, can be within the specific limits with temperature stabilization, but the speed that correspondingly heats up also can't be accelerated.
Improving the effective and efficient manner of cpu power is the number of times that increases floating-point operation in the unit interval, and this is because the floating-point operation complex calculations process that to be CPU inner carries out, and in calculating process, use register, arithmetical unit etc. also maximum.
Below be to adopt the expansion of single-instruction multiple-data stream (SIMD) formula (Streaming SIMD Extensions, SSE) method of technology raising cpu power.The SSE technology aims at and strengthens the design of floating-point operation ability, and the processor with the support of SSE instruction set has 8 128 register, and each register can be deposited the floating number of 4 (promptly 32) single precisions.SSE provides an instruction set simultaneously, and instruction permission wherein is loaded into floating number among these registers of 128, and these floating numbers just can be carried out arithmetic logical operation in these registers, then the result is put back to internal memory.Single instruction multiple data (single-instructionmultiple-data, SIMD) technology is a kind of CPU execution pattern of using single track instruction process multiple tracks data stream, promptly finishes the operation of handling a plurality of data with instructing together at a cpu instruction in the performance period.SIMD is the specific implementation of SSE technology.
Contrast different instruction test back finds that the multiplying order " MULPS " of assembly language and add instruction " ADDPS " are best to the effect that improves cpu power in the SIMD instruction set.The MULPS instruction is used for four pairs of single precision floating datums of source operand and target operand are carried out multiplication in groups, and deposit the result in target operand, the ADDPS instruction is used for four pairs of single precision floating datums of source operand and target operand are carried out addition in groups, and deposits the result in target operand.
The method that increases the CPU flops in unit interval is very obvious for the effect that improves cpu temperature, can in the time about 1 second, cpu temperature be raised to about 100 ℃ by normal temperature, but this method is not easy to make cpu temperature to keep constant, if temperature constantly changes, then be difficult to guarantee precision of test result.
Therefore, can accelerate temperature again and regulate the speed in order to make cpu temperature keep stable, need a kind of method for regulating temperature, this method can be rapidly heated and more can finely tune temperature.The present invention combines the method for the rotating speed of circular constant algorithm, increase cpu power method and control cpu fan, and the amplitude of temperature adjustment is provided with, when real time temperature Tmp is lower than probe temperature TmpL, according to programming rate from slowly to being divided into five grades soon, be that a positive grade is to positive five grades, when real time temperature Tmp is higher than probe temperature TmpL, according to cooling rate from slowly to being divided into a negative grade soon to negative three grades.Wherein all corresponding temperature of each grade is adjusted scheme (hereinafter will describe in detail).For notebook computer, a positive grade to negative these values of three grades can be set at respectively: 0 ℃, and 2 ℃, 5 ℃, 9 ℃, 15 ℃;-2 ℃ ,-5 ℃ ,-10 ℃.As shown in Figure 5, this concrete grammar comprises following step:
The probe temperature TmpL (step 801) of initialization CPU, its concrete grammar please refer to step 305 above; Obtain the real time temperature Tmp (step 803) of CPU, concrete grammar please refer to step 307 above; Calculate the difference L (step 805) of probe temperature and real time temperature, i.e. L=TmpL-Tmp;
Whether judge difference L less than positive five grades (step 807), if less than, then execution in step 811, if be not less than, and execution in step 809; Carry out the intensification scheme (step 809) of positive five grades, hereinafter state auspicious, execution in step 803 then; Whether judge difference L less than positive fourth class level (step 811), if less than, execution in step 815, if be not less than, execution in step 813; Carry out the intensification scheme (step 813) of positive fourth class level, hereinafter state auspicious, execution in step 803 then; Judge that whether difference L is less than positive three grades (step 815), if less than execution in step 819, if be not less than execution in step 817; Carry out the intensification scheme (step 817) of positive three grades, hereinafter state auspicious, execution in step 803 then; Whether judge difference L less than positive two grades (step 819), if less than, execution in step 823, if be not less than, execution in step 821; Carry out the intensification scheme (step 821) of positive two grades, hereinafter state auspicious, execution in step 803 then; Whether judge difference L less than a positive grade (step 823), if less than, execution in step 827, if be not less than, execution in step 825; Carry out the intensification scheme (step 825) of a positive grade, hereinafter state auspicious, execution in step 803 then;
Whether judge difference L less than a negative grade (step 827), if less than, execution in step 831, if be not less than, execution in step 829; Carry out the cooling profiles (step 829) of a negative grade, the rotating speed that is about to fan increases by 50%, and the method for adjustment of rotation speed of the fan please refer to above, and execution in step 803 then; Whether judge difference L less than negative two grades (step 831), if less than, execution in step 835, if be not less than, execution in step 833; Carry out the cooling profiles (step 833) of negative two grades, the rotating speed that is about to fan increases by 75%, and the method for adjustment of rotation speed of the fan please refer to above, and execution in step 803 then; Whether judge difference L less than negative three grades (step 835), if less than, then finish, if be not less than, execution in step 837; Carry out the cooling profiles (step 837) of negative three grades, the rotating speed that is about to fan increases by 100%, and the method for adjustment of rotation speed of the fan please refer to above, and execution in step 803 then.
Wherein, a positive grade to the intensification scheme of positive five grades is respectively:
A positive grade adopts the circular constant computational algorithm, is used for constant cpu temperature;
Positive two grades to positive five grades all adopt the method that increases cpu power, but in order to change the amplitude of intensification, need distinguish the speed of power ascension by programming, mainly be to utilize in the middle of the floating-point operation instruction to increase surge time, and the simple code of each grade is as follows:
The simple code of positive two grades:
……
Movaps xmm5, oword ptr[esi]; Initialization xmm5 register
Mulps xmm2, xmm5; Multiplying in groups
Nop; Dummy instruction
Nop; Dummy instruction
Nop; Dummy instruction
Nop; Dummy instruction
Nop; Dummy instruction
Nop; Dummy instruction
Nop; Dummy instruction
……
The simple code of positive three grades:
……
Movaps xmm5, oword ptr[esi]; Initialization xmm5 register
Mulps xmm2, xmm5; Multiplying in groups
Nop; Dummy instruction
Nop; Dummy instruction
……
The simple code of positive fourth class level:
……
Movaps xmm5, oword ptr[esi]; Initialization xmm5 register
Mulps xmm2, xmm5; Multiplying in groups
Movaps xmm4, oword ptr[esi+10h]; Initialization xmm4 register
Addps xmm3, xmm4; Additive operation in groups
Nop; Dummy instruction
Nop; Dummy instruction
……
The simple code of positive five grades:
……
Movaps xmm5, oword ptr[esi]; Initialization xmm5 register
Mulps xmm2, xmm5; Multiplying in groups
Movaps xmm4, oword ptr[esi+10h]; Initialization xmm4 register
Addps xmm3, xmm4; Additive operation in groups
……
Can find that from above-mentioned code the difference between each grade mainly is what and the increase of additive operation in groups that dummy instruction is used.Utilize said method can realize not homotactic read/write/compare operation, thereby reach test purpose.
In computer module detecting method process of the present invention, the tester can be behind the each run test procedure, write down the test data of tested computer module, utilizing prior art to understand the performance of tested computer module under the different temperatures pressure condition, and more can be with test data as the follow-up further whether reasonably reference of system architecture of judging.
The method of testing of computer module of the present invention can be adjusted probe temperature automatically, uses high low temperature ageing oven to compare with prior art, and the automaticity height has also been saved cost; In addition, the present invention's raising test environment capable of circulation temperature makes ambient pressure environment constantly increase, and thinks that the tester utilizes prior art to understand the performance performance of tested computer module under different temperatures pressure and creates conditions; And method of the present invention not only can adjust the temperature of test memory test environment,, obviously also can be widely used in the test process of other computer modules such as testing hard disk or CD-ROM drive.
Figure 5 shows that the system block diagrams of the computer module test macro of the embodiment of the invention.As shown in Figure 5, computer module test macro 100 of the present invention comprises:
Temperature range setup unit 101 is used to set maximal value and the minimum value that cpu temperature fluctuates, and the tester can define the fluctuation range of cpu temperature voluntarily and store this setting, is 65 ℃ as the minimum value that can set the cpu temperature fluctuation, and maximal value is 90 ℃;
Probe temperature setup unit 103, be used to set the external environment probe temperature TmpL of CPU just, and store, this pointer is set up on their own by the tester, but, when probe temperature TmpL that the tester is provided with is not in the cpu temperature fluctuation range that temperature range setup unit 101 is set, probe temperature setup unit 103 places probe temperature TmpL in this temperature fluctuation range automatically, as when the tester is arranged on 50 ℃ with probe temperature TmpL, probe temperature setup unit 103 is made as it 65 ℃ automatically, and store 65 ℃ probe temperature TmpL, perhaps when the tester is arranged on 100 ℃ with probe temperature TmpL, probe temperature setup unit 103 is made as it 95 ℃ automatically, and stores 95 ℃ probe temperature TmpL.
Cpu temperature control module 105 is used to read, judge and adjust the real time temperature Tmp of CPU, and it also comprises:
Cpu temperature reading unit 201 is responsible for reading the real time temperature Tmp (being also referred to as the surface temperature of CPU) of CPU, and it can obtain by operation ACPI, and the real time temperature Tmp of the CPU that obtains is sent to cpu temperature judging unit 203;
Cpu temperature judging unit 203, whether the real time temperature Tmp of the CPU that is used to judge that temperature reading unit 201 reads equals the probe temperature TmpL that probe temperature setup unit 103 stores, if equal, notice hardware testing unit 107 and cpu temperature monitoring unit 109, if be not equal to, notice cpu temperature adjustment unit 205;
Cpu temperature adjustment unit 205 is important unit, is used to adjust the real time temperature Tmp of CPU, make it to equal probe temperature TmpL, the method of adjusting has two kinds, is respectively the rotating speed of control cpu fan and/or the power that increases CPU, specifically please refer to above explanation;
Cpu temperature monitoring unit 109, after receiving real time temperature Tmp that cpu temperature control module 105 sends and equaling the notice of probe temperature TmpL, cpu temperature monitoring unit 109 is ordered cpu temperature control module 105 to adjust real time temperature Tmp constantly and is made it to equal consistently probe temperature TmpL, this is because other hardware also can dispel the heat in the test process of hardware such as internal memory, for the rising environment temperature contributes so that real time temperature Tmp changes, and required probe temperature should be constant in test process, makes it to equal consistently the probe temperature TmpL that sets so test the time also will be monitored real time temperature Tmp constantly;
Probe temperature change judging unit 111, be used to judge whether changed test temperature T mpL, the foundation of judging is the instruction that the tester imports, changed test temperature if desired, then notify probe temperature setup unit 103 to reset probe temperature TmpL, herein can be according to needs, notice probe temperature setup unit 103 was once increasing probe temperature TmpL or reducing, or it is more, also can be according to tester's order adjustment, if do not change, then judging unit 113 is finished in the notice test, wherein the tester can assign the order that changes probe temperature TmpL after all memory test are finished, and also can all finish at all hardware of embryo machine to rechange probe temperature after testing;
Judging unit 113 is finished in test, be used to judge whether the test to computer module is finished, if test is not finished, then notify the test of hardware testing unit 107 and cpu temperature monitoring unit 109 and the real time temperature Tmp of monitoring CPU to proceed computer module, if test is finished, then finish test.
Computer module test macro of the present invention, can pack in advance in the embryo machine to be measured, need not all will manually put into high low temperature ageing oven, therefore both provide cost savings as every test of prior art embryo machine, also improve testing efficiency, be applicable to extensiveization test jobs; And, also module testing can be incorporated into environment temperature, and the variation of control and measuring environment temperature constantly, make test result more reliable and more stable; In addition, the temperature of computer module test macro of the present invention adjustment capable of circulation CPU, the order test can be carried out under the various temperature pressure condition, and automaticity is higher.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1, a kind of computer module detecting method, central processor temperature by control computer inside, test with the test pressure of adjusting described central processing unit periphery computer module and then to described computer module, it is characterized in that described method of testing comprises following steps:
Step a, the probe temperature fluctuation range of described computer module is set and stores described probe temperature fluctuation range value;
Step b, setting also store a probe temperature of described computer module, and make described probe temperature be in the described probe temperature fluctuation range;
Step c, read a real time temperature of described central processing unit;
Steps d, judge whether described real time temperature equals described probe temperature, if not, execution in step e then, if, execution in step f then;
The real time temperature of step e, the described central processing unit of adjustment, execution in step c then; And
Step f, described computer module is tested by test procedure.
2, according to the described computer module detecting method of claim, it is characterized in that the real time temperature of the described central processing unit of adjustment described in the described step e is for to adjust described real time temperature by the rotation speed of the fan of controlling described central processing unit and/or the power that increases described central processing unit.
3, computer module detecting method according to claim 2, it is characterized in that, the method of power that increases described central processing unit is in the floating-point operation amount that increases described central processing unit in the unit interval, and it also comprises makes described central processing unit calculate the method for circular constant and/or drive the method that computing is carried out in the instruction of described central processing unit.
4, computer module detecting method according to claim 3, it is characterized in that, the method of described calculating circular constant is the calculation method of two used in the formula of admiring by plum arctan functions calculating circular constants, and described two arctan functions are respectively arctg (1/5) and arctg (1/239).
5, computer module detecting method according to claim 3, it is characterized in that the method for method for adopting single-instruction multiple-data stream (SIMD) formula expansion technique driving compilation multiplying order and add instruction to carry out computing of computing carried out in the instruction that drives described central processing unit.
6, computer module detecting method according to claim 1 is characterized in that, also comprises the step of the real time temperature of monitoring described central processing unit constantly among the described step f, and described step further comprises following steps:
Read the real time temperature of described central processing unit constantly;
Judge whether described real time temperature equals described probe temperature; And
When described real time temperature is not equal to described probe temperature, adjust described real time temperature to described probe temperature.
7, computer module detecting method according to claim 1 is characterized in that, also comprises following steps after the described step f:
Step g, judge whether to change described probe temperature, if, execution in step h then, if not, execution in step i then;
Step h, in described probe temperature fluctuation range, adjust described probe temperature, and execution in step c; And
Whether step I, judgement are finished the test of described computer module, if, then finish test, if not, then continue execution in step f.
8, computer module detecting method according to claim 1 is characterized in that, also comprises the test data that writes down described computer module behind described step f, to obtain its service data under described probe temperature condition.
9, computer module detecting method according to claim 1 is characterized in that, described computer module is the internal memory of computer-internal.
10, a kind of computer module test macro, central processor temperature by control computer inside, test with the test pressure that increases described central processing unit periphery computer module and then to described computer module, it is characterized in that described test macro includes:
One Range of measuring temp setup unit, be used to set described computer module probe temperature fluctuation range and store described probe temperature fluctuation range value;
One probe temperature setup unit is used to be provided with and store a probe temperature of described computer module, and described probe temperature is controlled in the described probe temperature fluctuation range;
One temperature reading unit is used to read a real time temperature of described central processing unit;
One temperature judging unit judges whether described real time temperature equals described probe temperature;
One temperature adjustment unit is adjusted described real time temperature and is equaled described probe temperature until described real time temperature when described real time temperature is not equal to described probe temperature; And
One hardware testing unit, when described real time temperature equaled described probe temperature, the operation test procedure was tested described computer module.
11, computer module test macro according to claim 10 is characterized in that, described temperature adjustment unit is adjusted described real time temperature by the rotation speed of the fan of controlling described central processing unit and/or the power that increases described central processing unit.
12, computer module test macro according to claim 10 is characterized in that, also comprises a monitoring temperature unit, is used for monitoring described real time temperature constantly, and notifies described temperature adjustment unit to adjust described real time temperature to be constantly equal to described probe temperature.
13, computer module test macro according to claim 10, it is characterized in that, also comprise probe temperature change judging unit, be used to judge whether to change described probe temperature, if then described judged result is notified described probe temperature setup unit to change described probe temperature.
14, computer module test macro according to claim 13, it is characterized in that, also comprise a test and finish judging unit, when described probe temperature change judging unit judged result when not changing described probe temperature, whether judgement is finished the test of described computer module, if then finish test, if not, then notify described hardware testing unit to proceed test.
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| CNB2005101327115A CN100458460C (en) | 2005-12-20 | 2005-12-20 | Computer module detecting method and detecting system |
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| JPH10283767A (en) * | 1997-04-03 | 1998-10-23 | Xing:Kk | Temperature information reporting device for storage device, storage device array, and storage device array system |
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