CN1982893A - Method for discriminating welding disc and black disc failure state - Google Patents
Method for discriminating welding disc and black disc failure state Download PDFInfo
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- CN1982893A CN1982893A CN 200610027496 CN200610027496A CN1982893A CN 1982893 A CN1982893 A CN 1982893A CN 200610027496 CN200610027496 CN 200610027496 CN 200610027496 A CN200610027496 A CN 200610027496A CN 1982893 A CN1982893 A CN 1982893A
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Abstract
A method for judging failure state of welding pad utilizes multiple integrated conditions to definitely judge out failure state of welding pad on circuit board welded with electric elements.
Description
Technical field
The present invention relates to circuit assembly technology, particularly the determination methods of the black dish of pad failure state.
Background technology
Along with the development of electronic industrial technology, in order to adapt to the requirement of Highgrade integration, the volume of components and parts and pin-pitch become more and more littler, and the flatness of pad becomes a key factor that influences workmanship already.Characteristics such as chemical nickel and gold (Ni/Au) process of surface treatment is because to have a pad smooth, and weldability is good have adapted to the requirement of highly denseization of electronics industry, and application in the industry cycle more and more widely.Industry began to adopt chemical nickel and gold coating to carry out the surface treatment of circuit board before the more than ten years, and the now chemical nickel and gold has become main surface treatment mode in highly dense encapsulation and the assembling.
It is a kind of golden immersion plating technology of robotization of common chemical nickel gold plate that change nickel soaks gold (Electroless Nickel/Immersion Gold is called for short " ENIG "), and its thickness of coating is limited in 0.075～0.20 μ m (micron) scope.ENIG technology is widely used in electronics industry, for example is used for eliminating the plating leakage room that electroplating technology powered electrode place stays.
ENIG technology is to be undertaken by displacement reaction, and the nickle atom that exposes is replaced into two gold atoms.If this process control is improper, tend to cause the excessive corrosion of gold to nickel dam.And the phosphorus composition of introducing in the Ni-Speed and depositing in nickel dam can play the effect of gold to the excessive corrosion of nickel dam that prevent to a certain extent.But, if control is improper in this technological process, will produce serious problem, for example, unique phenomenon that a kind of quilt is extensively approved, promptly so-called black dish phenomenon.
In fact, the form of " black dish " comprises varied, in its included phenomenon, many all with Ni (P, the phosphorus)/Ni of solder joint
3Sn
4(four tinization, three nickel) rupture relevant at the interface.In most of the cases, black dish phenomenon refers to because of excessive corrosion in the ENIG process causes Ni (P) surface and lacks the phenomenon of weldability, also comprises the existence of the various alloys of near surface or the effect that existence caused that alloy pollutes usually.
But, also have a kind of mechanism relevant with interfacial reaction, promptly one seems intact solder joint and can pass and deterioration in time.This mechanism has confused for many years the researchist of industry.By this mechanism, the solder joint after aging is detected, find to exist weakening strength and to the phenomenon of the tired transition of embrittlement.As if this embrittlement mechanism relate to Ni
3Sn
4Increase, and cause therefrom and the P enrichment form Ni below
3P generates a kind of ternary phase between the two.
Though the chemical nickel and gold surface treatment mode has plurality of advantages, but this distinctive failure mode that itself exists---black dish lost efficacy all the time, this is a kind of defective that is produced by the bond pad surface processing procedure, solder joint strength of joint with this defective is low, solder joint can rupture when being subjected to less stress impact, to the serious threat that the reliability of electronic product is brought, therefore exist the pad that black dish lost efficacy to be applied to again among the manufacturing of electronic product.
In the production of reality, black dish lost efficacy in case property in batches takes place often, and therefore the negative effect that is brought is big, and consequence is serious.Because at present not also effectively prevention and improvement method, therefore, the common way of industry is to pinpoint the problems as soon as possible, orientation problem, and in time take to isolate and recall measure such as inefficacy veneer to reduce the loss.This just needs a kind of efficient ways, can deceive quickly and accurately and coil Failure Analysis and judgement when suspection exist black dish to lose efficacy, to determine whether that belonging to black dish lost efficacy.
At present, there are two kinds for black dish Failure Analysis method:
A kind of is that chemical nickel and gold coating to circuit board tabula rasa (do not carry out device assembling before circuit board) surface takes off gold and handles, and for example adopts the mode of wicking to remove surface gold layer, the nickel dam surface after observing it and taking off gold; Perhaps to welding, exist inefficacy solder joint board pads, the rupture surface of Direct observation inefficacy solder joint.By use metaloscope or scanning electron microscope to above-mentioned both observe, judge whether to exist " be full of cracks " phenomenon, if there is crack performance, as shown in Figure 1, think that then black dish occurring lost efficacy, otherwise think and black dish inefficacy do not occur.
Another kind method is that the inefficacy solder joint of circuit board tabula rasa or pad is taken a sample, and make and cut into slices, observe under metaloscope or scanning electron microscope through behind the grinding and polishing, judge " nickel-teeth space " phenomenon that whether exists in the nickel dam perpendicular to the coating direction, if there is " nickel-teeth space " phenomenon, as shown in Figure 2, think that then black dish occurring lost efficacy, otherwise think that black dish not occurring lost efficacy.
In actual applications, there is following problem in such scheme: to pad or circuit board tabula rasa whether the erroneous judgement of black dish failure phenomenon appears and the probability of failing to judge higher.
Cause the main cause of this situation to be, because in actual conditions, black dish failure phenomenon exist to appear but on the surface of nickel dam or the section of solder joint not have the situation of discovery " be full of cracks " phenomenon, also there is the situation that black dish failure phenomenon occurs but on the nickel dam of section, do not have to occur " nickel-teeth space " phenomenon, therefore there is certain technology prejudice in existing two kinds of black dish Failure Analysis determination methods, and are higher to the black probability that coils the erroneous judgement of failure phenomenon and fail to judge.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide the determination methods of the black dish of a kind of pad failure state, makes to judge accurately whether pad black dish failure phenomenon occurs.
For achieving the above object, the invention provides the determination methods of the black dish of a kind of pad failure state, comprise following steps:
When failure phenomenon appears in pad, this pad is detected, if the discontented foot of testing result is stated condition A, B or C one of them or its combination in any, judge that then this pad black dish do not occur and lost efficacy:
A rises the invalid position solder joint and pulls out test, and this solder joint fracture was a rock-candy structure after quilt was risen and pulls out;
B carries out detin and tinning test to described pad, and the not wetting or tin welding spot that contracts appears in this pad;
C is to the analysis of cutting into slices of invalid position solder joint, and observations that this section is analyzed is for smooth crackle occurring, and crackle is applied between nickel Sn intermetallic compound and the nickel dam.
Wherein, if the testing result that described pad is carried out longitudinal section observation, scanning electron microscope analysis and energy spectrum analysis gained satisfies following condition simultaneously, judge that then this pad black dish do not occur and lost efficacy:
Described longitudinal section is observed not to be had " nickel-teeth space " phenomenon, described scanning electron microscope analysis to get the nickel dam surface not exist " be full of cracks " phenomenon and described energy spectrum analysis to measure phosphorus content to be lower than 15%.
In this external described method,, judge that then this pad black dish occurs and lost efficacy if described testing result satisfies described condition A, B, C and following condition D simultaneously:
D carries out energy spectrum analysis to described invalid position solder joint, and the testing result of gained surpasses 15% for measuring phosphorus content.
In this external described method,, judge that then this pad black dish occurs and lost efficacy if described testing result satisfies described condition A, B, C and following condition E simultaneously:
E carries out to described invalid position solder joint that longitudinal section is observed or scanning electron microscope analysis, the testing result of gained meet the following conditions one of them or its combination:
Described longitudinal section has been observed " nickel-teeth space " phenomenon or described scanning electron microscope analysis and has been got the nickel dam surface and have " be full of cracks " phenomenon.
In this external described method,, judge that then described pad black dish occurs and lost efficacy if described testing result also satisfies following condition F:
There is crackle in the described invalid position solder joint of F.
In this external described method,, judge that then described pad black dish do not occur and lost efficacy if described testing result does not satisfy described condition F.
The present invention also provides the determination methods of the black dish of a kind of circuit board tabula rasa pad failure state, comprises following steps:
The pad that the circuit board tabula rasa is taken off behind the gold carries out detin and tinning test, if the not wetting or tin welding spot that contracts does not appear in this pad, judges that then this tabula rasa black dish do not occur and lost efficacy.
Wherein, if the described pad that takes off behind the gold is carried out longitudinal section observation, scanning electron microscope analysis and energy spectrum analysis, the testing result of gained meets the following conditions simultaneously, judges that then described tabula rasa black dish do not occur and lost efficacy:
Described longitudinal section is observed not to be had " nickel-teeth space " phenomenon, described scanning electron microscope analysis to get the nickel dam surface not exist " be full of cracks " phenomenon and described energy spectrum analysis to measure phosphorus content to be lower than 15%.
In this external described method, if in described detin and tinning test to described pad after taking off gold, the not wetting solder joint or the tin welding spot that contracts appear in this pad, simultaneously, this pad is carried out energy spectrum analysis, the testing result of gained surpasses 15% for measuring phosphorus content, judges that then described tabula rasa black dish occurs and lost efficacy.
In this external described method, if in described detin and tinning test to described pad after taking off gold, the not wetting solder joint or the tin welding spot that contracts appear in this pad, simultaneously, this pad is carried out longitudinal section to be observed or scanning electron microscope analysis, the testing result of gained meet the following conditions one of them or its combination, judge that then described tabula rasa black dish occurs and lost efficacy:
Described longitudinal section has been observed " nickel-teeth space " phenomenon or described scanning electron microscope analysis and has been got the nickel dam surface and have " be full of cracks " phenomenon.
By relatively finding, the key distinction of technical scheme of the present invention and prior art is, if following one or combination in any appear in the testing result to pad, judge that then failure phenomenon does not appear in pad: fracture was not rock-candy structure after the inefficacy solder joint was risen and pulls out; Pad not wetting the or tin welding spot that contracts do not occur in detin and tinning test; The observations that inefficacy solder joint section is analyzed is not for smooth crackle occurring and/or crackle is not applied between nickel Sn intermetallic compound and the nickel dam.Like this, only having corrected in the prior art by inefficacy solder joint longitudinal section observed does not have " nickel-teeth space " phenomenon or scanning electron microscope analysis to get the technology prejudice that there is not " be full of cracks " phenomenon to judge not belong to black dish failure phenomenon in the nickel dam surface, by this negative evaluation, the efficient and the accuracy of analysis can be improved significantly, probability can be significantly reduced the situation erroneous judgement that does not belong to black dish failure phenomenon.
If there is not crackle in the inefficacy solder joint, can judge equally then black dish failure phenomenon not occur that this check and analysis method can filter out rapidly and the pad that black dish lost efficacy not occur.
When failure phenomenon appears in pad, pad is detected, if testing result meets the following conditions simultaneously, judge that then the black dish of pad appearance lost efficacy: the invalid position solder joint is risen pull out test, the solder joint fracture was a rock-candy structure after quilt was risen and pulls out; In detin and tinning test, the not wetting or tin welding spot that contracts appears in pad; The observations that section is analyzed is the smooth crackle of appearance, and crackle is applied between nickel Sn intermetallic compound and the nickel dam; Energy spectrum analysis is measured phosphorus content and is surpassed 15%.And in the prior art, only get the nickel dam surface and have " be full of cracks " phenomenon to judge to belong to black dish failure phenomenon by inefficacy solder joint longitudinal section having been observed " nickel-teeth space " phenomenon or scanning electron microscope analysis, more easily judge by accident or fail to judge.Can carry out rapid and precise analysis and judgement to the situation that belongs to black dish failure phenomenon that pad occurs by the inventive method, the probability that significantly reduces erroneous judgement and fail to judge, because the pad of black dish inefficacy occurring is generally in batches, find early to help following up as soon as possible the generation of reducing risks.Wherein, one of condition that the black dish of judgement lost efficacy can significantly reduce the possibility of failing to judge that black dish was lost efficacy for the mensuration phosphorus content surpasses 15% in practical operation.
If the circuit board tabula rasa is taken off in the detin and tinning test of the pad behind the gold, the not wetting or tin welding spot that contracts does not appear, then black dish failure phenomenon does not appear in this tabula rasa of decidable, decision circuitry plate tabula rasa does not belong to the situation of black dish failure phenomenon easily, has improved the efficient to circuit board tabula rasa Quality Detection.
If the circuit board tabula rasa is taken off in the detin and tinning test of the pad behind the gold, the not wetting or tin welding spot that contracts appears, and observe and do not have " nickel-teeth space " phenomenon and scanning electron microscope analysis to get the nickel dam surface not exist " be full of cracks " phenomenon, energy spectrum analysis simultaneously to measure phosphorus content to be lower than 15% taking off pad longitudinal section behind the gold, can judge also that then black dish failure phenomenon does not appear in this tabula rasa, can significantly reduce the probability that the circuit board tabula rasa is not belonged to the situation erroneous judgement of black dish failure phenomenon, improve correctness circuit board tabula rasa Quality Detection.
The pad that the circuit board tabula rasa is taken off behind the gold carries out detin and tinning test, if the not wetting solder joint or the tin welding spot that contracts, and carries out energy spectrum analysis and measures phosphorus content and surpass 15% taking off pad behind the gold, judges that then tabula rasa black dish occurs and lost efficacy.And in the prior art, after only the circuit board tabula rasa being taken off gold, having observed " nickel-teeth space " phenomenon or scanning electron microscope analysis by longitudinal section gets the nickel dam surface and exists " be full of cracks " phenomenon to judge to belong to black dish failure phenomenon, the probability of error in judgement is bigger, therefore adopt the inventive method to carry out rapid and precise analysis and judgement to the situation that belongs to black dish failure phenomenon that occurs on the circuit board tabula rasa, the chance that significantly reduces erroneous judgement and fail to judge, help following up as soon as possible the generation of reducing risks equally.Wherein, judge and analyze the black inefficacy of coiling whether occurs, in practical operation, can significantly reduce the possibility of failing to judge that black dish was lost efficacy by measuring phosphorus content.
In addition, also comprising pad longitudinal section after pad or circuit board tabula rasa taken off gold in the decision condition that pad or circuit board tabula rasa is not belonged to black dish failure phenomenon has observed " nickel-teeth space " phenomenon or scanning electron microscope analysis and gets the nickel dam surface and have " be full of cracks " phenomenon, make technical solution of the present invention more perfect, provide more fully analytical approach black dish failure phenomenon.
Description of drawings
Fig. 1 is the typical case that pad occurred in the prior art " be full of cracks " phenomenon synoptic diagram;
Fig. 2 is the typical case that pad occurred in the prior art " nickel-teeth space " phenomenon synoptic diagram;
Fig. 3 is the decision method process flow diagram that does not occur black dish failure phenomenon according to the pad of first embodiment of the invention;
Fig. 4 is worked plastic fracture synoptic diagram after pulling out according to the solder joint of first embodiment of the invention;
Fig. 5 is the normal solder joint synoptic diagram according to the pad detin of first embodiment of the invention and tinning test;
Fig. 6 is the decision method process flow diagram that occurs black dish failure phenomenon according to the pad of second embodiment of the invention;
Fig. 7 is worked rock-candy structure synoptic diagram after pulling out according to the solder joint of second embodiment of the invention;
Fig. 8 is the unusual solder joint synoptic diagram according to the pad detin of second embodiment of the invention and tinning test;
Fig. 9 is the seminess synoptic diagram of analyzing according to the pad section of second embodiment of the invention;
Figure 10 is the decision method process flow diagram that occurs black dish failure phenomenon according to the pad of third embodiment of the invention;
Figure 11 is the decision method process flow diagram that does not occur black dish failure phenomenon according to the circuit board tabula rasa of four embodiment of the invention;
Figure 12 is the decision method process flow diagram that occurs black dish failure phenomenon according to the circuit board tabula rasa of fifth embodiment of the invention.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, the present invention is described in further detail below in conjunction with accompanying drawing.
The present invention is by carrying out multinomial detection and deceive the judgement that dish lost efficacy according to testing result pad or circuit board tabula rasa, wherein, the phosphorus content that has increased for the judgment basis, the especially reference pad that do not belong to black dish failure phenomenon comes black dish inefficacy is judged.Be applicable to the black dish Failure Analysis judgement that takes place in the circuit assembly technology, take place under the situation of solder joint failure when being specially adapted in the electronics manufacture process, use the chemical nickel and gold pad analysis judges whether be owing to black dish inefficacy causes.
Specifically, pad or circuit board tabula rasa are not belonged to detection that black dish lost efficacy not only to be comprised the pad longitudinal section observation analysis that pad or circuit board tabula rasa are taken off behind the gold and whether " nickel-teeth space " phenomenon is arranged or carry out scanning electron microscope analysis nickel dam surface whether have " be full of cracks " phenomenon, also comprised the observation of pulling out test, Jia Xi and detin test, section analysis, energy spectrum analysis and whether the invalid position solder joint being had crackle, make technical solution of the present invention more perfect, provide more fully analytical approach black dish failure phenomenon.
The decision method that black dish failure phenomenon does not appear in the pad of first embodiment of the invention as shown in Figure 3.
In step 301, judge at first whether pad failure phenomenon occurs, wherein, failure phenomenon shows as electric signal off and on, has to push or change device temperature with hand temporary transient to recover feature such as normal.Yet failure phenomenon was not necessarily lost efficacy by black dish and caused, can not coil the judgment criterion that lost efficacy as deceiving, therefore, when failure phenomenon occurring, enter step 302, step 303, step 304, step 305 or step 306, judge whether to occur black dish failure phenomenon by further detection.
In step 302, the invalid position solder joint risen pulls out test, if risen pull out after this solder joint fracture be plastic fracture and be not as shown in Figure 4, promptly to satisfy condition 1 by rock-candy structure, then enter step 307.
In step 303, pad is carried out detin and tinning test, normal chemical nickel and gold is handled the solder joint fracture can go up tin again, if the not wetting or tin welding spot that contracts does not appear in this pad, as shown in Figure 5, promptly satisfies condition 2, then enters step 307 equally.
In step 304, the invalid position solder joint is adopted the analysis of cutting into slices of metaloscope or scanning electron microscope, if the observations that this section is analyzed is not for smooth crackle occurring, or crackle appearred, but be not applied between nickel Sn intermetallic compound and the nickel dam, promptly satisfy condition 3, then enter step 307 equally.
In step 305, pad is carried out longitudinal section observation, scanning electron microscope analysis and energy spectrum analysis, if the testing result of gained satisfies following condition simultaneously, promptly satisfy condition 4: phenomenon that longitudinal section is observed not to be had " nickel-teeth space ", scanning electron microscope analysis get the nickel dam surface and do not exist " be full of cracks " phenomenon and energy spectrum analysis mensuration phosphorus content to be lower than 15%, then enter step 307 equally.Wherein, in general, normal phosphorus content should be 8～10% of weight.
In step 306, even the result who is caused was that solder joint is under the situation of bearing less load or stress because black dish loses efficacy, crackle appears in the capital, therefore, can whether have crackle in that the initial stage of black dish failure analysis is promptly observed the invalid position solder joint, this check and analysis method can filter out rapidly and the pad that black dish lost efficacy not occur.If there is no crackle promptly satisfies condition 5, then also enters step 307.
In step 307, can judge that black dish failure phenomenon does not appear in this pad.
In the above-described embodiment, if to one in the testing result of pad eligible 1 to 5 or multinomial, can judge that black dish failure phenomenon does not appear in this pad, only having corrected in the prior art by inefficacy solder joint longitudinal section is observed does not have " nickel-teeth space " phenomenon or scanning electron microscope analysis to get the nickel dam surface not exist " be full of cracks " phenomenon to judge not belong to black technology prejudice of coiling failure phenomenon.In addition, when condition 1 had one to satisfy in 5, promptly black dish inefficacy did not appear in this pad of decidable, by this negative evaluation, can improve the efficient and the accuracy of analysis significantly, can significantly reduce the probability to the situation erroneous judgement that does not belong to black dish failure phenomenon.
When testing result ineligible 1 in 5 or when multinomial, possibility that pad exists black dish to lose efficacy, whether this pad black concrete analysis and result of determination of coiling failure phenomenon occur has detailed explanation in the second and the 3rd embodiment.
The decision method of the black dish of the pad appearance failure phenomenon of second embodiment of the invention as shown in Figure 6.
In step 601, judge at first whether pad failure phenomenon occurs, when failure phenomenon occurring, enters step 602, step 603 and step 604, judge whether to occur black dish failure phenomenon by further detection.
In step 602, the invalid position solder joint risen pulls out test, if risen pull out after this solder joint fracture smooth smooth, land side does not have scolding tin residual or only have fragmentary residually, as shown in Figure 7, then belongs to typical rock-candy structure, promptly satisfies condition 1.
In step 603, pad is carried out detin and tinning test, if the not wetting or tin welding spot that contracts appears in this pad, as shown in Figure 8, then satisfy condition 2.
In step 604, to the analysis of cutting into slices of invalid position solder joint, if the observations of should section analyzing is for smooth crackle occurring, and crackle is applied between nickel Sn intermetallic compound and the nickel dam, as shown in Figure 9, then satisfies condition 3.
When condition 1 to 3 satisfies simultaneously, enter step 605, step 606 or step 607, this pad is done further to detect and judge.
In step 605, pad is carried out longitudinal section observe, if observe " nickel-teeth space " phenomenon, as shown in Figure 2, promptly satisfy condition 4, then enter step 608.
In step 606, pad is carried out scanning electron microscope analysis, if analyze to such an extent that there is " be full of cracks " phenomenon in the nickel dam surface, as shown in Figure 1, promptly satisfy condition 5, then enter step 608 equally.
In step 607, pad is carried out energy spectrum analysis, surpass 15% if measure phosphorus content, promptly satisfy condition 6, then enter step 608 equally.
In step 608, can judge that black dish failure phenomenon appears in this pad.
In the above-described embodiment, if simultaneously eligible 1 to 3 to the testing result of pad, and eligible 4 in 6 any one or when multinomial, promptly this pad of decidable black dish occurred and had lost efficacy.And in the prior art, only get the nickel dam surface and have " be full of cracks " phenomenon to judge to belong to black dish failure phenomenon by inefficacy solder joint longitudinal section having been observed " nickel-teeth space " phenomenon or scanning electron microscope analysis, more easily judge by accident or fail to judge.Can carry out rapid and precise analysis and judgement to the situation that belongs to black dish failure phenomenon that pad occurs by the inventive method, the probability that significantly reduces erroneous judgement and fail to judge, because the pad of black dish inefficacy occurring is generally in batches, find early to help following up as soon as possible the generation of reducing risks.Wherein, one of condition that the black dish of judgement lost efficacy can significantly reduce the possibility of failing to judge that black dish was lost efficacy for the mensuration phosphorus content surpasses 15% in practical operation.
The decision method of the black dish of the pad appearance failure phenomenon of third embodiment of the invention as shown in figure 10.
In step 1005, observe the invalid position solder joint of pad, if there is crackle, promptly satisfy condition 7.
When condition 1 to 3 and condition 7 satisfy simultaneously, enter step 1006, step 1007 or step 1008, this pad is done further to detect and judge.
In step 1009, can judge that equally this pad black dish occurred and lost efficacy.
In the above-described embodiment, if to the testing result of pad simultaneously eligible 1 to 3 and condition 7, and eligible 4 in 6 each or when multinomial, promptly this pad of decidable black dish occurred and had lost efficacy.
The decision method that black dish failure phenomenon does not appear in the circuit board tabula rasa of four embodiment of the invention as shown in figure 11.
In step 1101, the circuit board tabula rasa is taken off gold handle.
In step 1102, the pad that takes off behind the gold is carried out detin and tinning test, if the not wetting or tin welding spot that contracts does not appear in this pad, as shown in Figure 5, promptly satisfy condition 1, then enter step 1104.Like this, decision circuitry plate tabula rasa does not belong to the situation of black dish failure phenomenon easily, has improved the efficient to circuit board tabula rasa Quality Detection.
In step 1103, the pad that takes off behind the gold is carried out longitudinal section observation, scanning electron microscope analysis and energy spectrum analysis, if the testing result of gained meets the following conditions simultaneously, promptly satisfy condition 2: phenomenon that longitudinal section is observed not to be had " nickel-teeth space ", scanning electron microscope analysis get the nickel dam surface and do not exist " be full of cracks " phenomenon and energy spectrum analysis mensuration phosphorus content to be lower than 15%, then enter step 1104 equally.
In step 1104, can judge that this circuit board tabula rasa black dish do not occur and lost efficacy.
In the above-described embodiment, if the result that the circuit board tabula rasa that takes off behind the gold is detected satisfies condition 1 or 2, be that black dish inefficacy does not appear in this tabula rasa of decidable, wherein, in condition 2, increased detection to phosphorus content, can significantly reduce the probability that the circuit board tabula rasa is not belonged to the situation erroneous judgement of black dish failure phenomenon, improve correctness circuit board tabula rasa Quality Detection.
The decision method of the black dish of the circuit board tabula rasa appearance failure phenomenon of fifth embodiment of the invention as shown in figure 12.
In step 1201, the circuit board tabula rasa is taken off gold handle.
In step 1202, the pad that takes off behind the gold is carried out detin and tinning test, if the not wetting or tin welding spot that contracts appears in this pad, as shown in Figure 8, promptly satisfy condition 1, then enter step 1203, step 1204 or step 1205, this pad is done further to detect and judge.
In step 1203, pad is carried out longitudinal section observe, if observe " nickel-teeth space " phenomenon, as shown in Figure 2, promptly satisfy condition 2, then enter step 1206.
In step 1204, pad is carried out scanning electron microscope analysis, if analyze to such an extent that there is " be full of cracks " phenomenon in the nickel dam surface, as shown in Figure 1, promptly satisfy condition 3, then enter step 1206 equally.
In step 1205, pad is carried out energy spectrum analysis, surpass 15% if measure phosphorus content, promptly satisfy condition 4, then enter step 1206 equally.
In step 1206, can judge that black dish failure phenomenon appears in this circuit board tabula rasa.
In the above-described embodiment, if satisfying condition, the result that the circuit board tabula rasa that takes off behind the gold is detected also satisfies condition in 2 to 4 one or multinomial 1 the time, be that black dish inefficacy appears in this tabula rasa of decidable, and in the prior art, after only the circuit board tabula rasa being taken off gold, having observed " nickel-teeth space " phenomenon or scanning electron microscope analysis by longitudinal section gets the nickel dam surface and exists " be full of cracks " phenomenon to judge to belong to black dish failure phenomenon, the probability of error in judgement is bigger, therefore adopt the inventive method to carry out rapid and precise analysis and judgement to the situation that belongs to black dish failure phenomenon that occurs on the circuit board tabula rasa, the chance that significantly reduces erroneous judgement and fail to judge, help following up as soon as possible the generation of reducing risks equally.Wherein, judge and analyze the black inefficacy of coiling whether occurs, in practical operation, can significantly reduce the possibility of failing to judge that black dish was lost efficacy by measuring phosphorus content.
In the respective embodiments described above, carry out various detections according to the pad that pad or circuit board tabula rasa is taken off behind the gold, and deceive judgement and the analysis that dish lost efficacy according to testing result, those of ordinary skills understand easily, each different sequencings that detect step all do not depart from spirit of the present invention to not substantially influence of result of determination in practical operation.
Though pass through with reference to some of the preferred embodiment of the invention, the present invention is illustrated and describes, but those of ordinary skill in the art should be understood that and can do various changes to it in the form and details, and without departing from the spirit and scope of the present invention.
Claims (10)
1. the determination methods of the black dish of a pad failure state is characterized in that, comprises following steps:
When failure phenomenon appears in pad, this pad is detected, if the discontented foot of testing result is stated condition A, B or C one of them or its combination in any, judge that then this pad black dish do not occur and lost efficacy:
A rises the invalid position solder joint and pulls out test, and this solder joint fracture was a rock-candy structure after quilt was risen and pulls out;
B carries out detin and tinning test to described pad, and the not wetting or tin welding spot that contracts appears in this pad;
C is to the analysis of cutting into slices of invalid position solder joint, and observations that this section is analyzed is for smooth crackle occurring, and crackle is applied between nickel Sn intermetallic compound and the nickel dam.
2. the determination methods of the black dish of pad according to claim 1 failure state, it is characterized in that, satisfy following condition simultaneously if described pad is carried out the testing result of longitudinal section observation, scanning electron microscope analysis and energy spectrum analysis gained, judge that then this pad black dish do not occur and lost efficacy:
Described longitudinal section is observed not to be had " nickel-teeth space " phenomenon, described scanning electron microscope analysis to get the nickel dam surface not exist " be full of cracks " phenomenon and described energy spectrum analysis to measure phosphorus content to be lower than 15%.
3. the determination methods of the black dish of pad according to claim 1 failure state is characterized in that, if described testing result satisfies described condition A, B, C and following condition D simultaneously, judges that then this pad black dish occurs and lost efficacy:
D carries out energy spectrum analysis to described invalid position solder joint, and the testing result of gained surpasses 15% for measuring phosphorus content.
4. the determination methods of the black dish of pad according to claim 1 failure state is characterized in that, if described testing result satisfies described condition A, B, C and following condition E simultaneously, judges that then this pad black dish occurs and lost efficacy:
E carries out to described invalid position solder joint that longitudinal section is observed or scanning electron microscope analysis, the testing result of gained meet the following conditions one of them or its combination:
Described longitudinal section has been observed " nickel-teeth space " phenomenon or described scanning electron microscope analysis and has been got the nickel dam surface and have " be full of cracks " phenomenon.
5. according to the determination methods of claim 3 or the black dish of 4 described pads failure state, it is characterized in that,, judge that then described pad black dish occurs and lost efficacy if described testing result also satisfies following condition F:
There is crackle in the described invalid position solder joint of F.
6. the determination methods of the black dish of pad according to claim 1 and 2 failure state is characterized in that, if described testing result does not satisfy described condition F, judges that then described pad black dish do not occur and lost efficacy.
7. the determination methods of the black dish of a circuit board tabula rasa pad failure state is characterized in that, comprises following steps:
The pad that the circuit board tabula rasa is taken off behind the gold carries out detin and tinning test, if the not wetting or tin welding spot that contracts does not appear in this pad, judges that then this tabula rasa black dish do not occur and lost efficacy.
8. the determination methods of the black dish of circuit board tabula rasa pad according to claim 7 failure state, it is characterized in that, if the described pad that takes off behind the gold is carried out longitudinal section observation, scanning electron microscope analysis and energy spectrum analysis, the testing result of gained meets the following conditions simultaneously, judges that then described tabula rasa black dish do not occur and lost efficacy:
Described longitudinal section is observed not to be had " nickel-teeth space " phenomenon, described scanning electron microscope analysis to get the nickel dam surface not exist " be full of cracks " phenomenon and described energy spectrum analysis to measure phosphorus content to be lower than 15%.
9. the determination methods of the black dish of circuit board tabula rasa pad according to claim 7 failure state, it is characterized in that, if in described detin and tinning test to described pad after taking off gold, the not wetting solder joint or the tin welding spot that contracts appear in this pad, simultaneously, this pad is carried out energy spectrum analysis, and the testing result of gained surpasses 15% for measuring phosphorus content, judges that then described tabula rasa black dish occurs and lost efficacy.
10. the determination methods of the black dish of circuit board tabula rasa pad according to claim 7 failure state, it is characterized in that, if in described detin and tinning test to described pad after taking off gold, the not wetting solder joint or the tin welding spot that contracts appear in this pad, simultaneously, this pad carried out longitudinal section is observed or scanning electron microscope analysis, the testing result of gained meet the following conditions one of them or its combination, judge that then described tabula rasa black dish occurs and lost efficacy:
Described longitudinal section has been observed " nickel-teeth space " phenomenon or described scanning electron microscope analysis and has been got the nickel dam surface and have " be full of cracks " phenomenon.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458546A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | Analysis method of weldability of copper substrate surface treatment |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN113329614A (en) * | 2021-06-21 | 2021-08-31 | 西安电子科技大学 | Method for monitoring welding spot form change in reflow soldering process |
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2006
- 2006-06-09 CN CN 200610027496 patent/CN1982893A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458546A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | Analysis method of weldability of copper substrate surface treatment |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN113329614A (en) * | 2021-06-21 | 2021-08-31 | 西安电子科技大学 | Method for monitoring welding spot form change in reflow soldering process |
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