CN1978388A - Surface protection treatment method for electronic ceramic chip type element - Google Patents
Surface protection treatment method for electronic ceramic chip type element Download PDFInfo
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- CN1978388A CN1978388A CN 200510102139 CN200510102139A CN1978388A CN 1978388 A CN1978388 A CN 1978388A CN 200510102139 CN200510102139 CN 200510102139 CN 200510102139 A CN200510102139 A CN 200510102139A CN 1978388 A CN1978388 A CN 1978388A
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Abstract
The invention relates to a surface protection method of electronic ceramic slice element, including the following steps: making up the protective liquor that is mixed by the solid film protective, alcohol liquor and deionized water, dipping that is to pour some protective liquor into the container, heat it to 60-90 C degree with the thermostat and keep the constant temperature, submerge a certain number of electronic ceramic slice elements into it for more than 5 min, filtering to get the elements, baking that is to put the elements into the oven of 100-150 Cdegree with equal and not overlap arrangement, after a certain time, get them out and cool to the room temperature to bag for use.
Description
[technical field]
The present invention relates to a kind of electronic ceramic chip type element processing and treating method, be meant a kind of surface protection treatment method of electronic ceramic chip type element especially.
[background technology]
Current, various electronic ceramic chip type elements are used more and more widely, for example: chip NTC, chip PTC thermistor, type piezoresistor, chip inductor, magnetic bead, sheet capacitor etc.In the prior art, these slice components are the novel electronic components and parts that adopt the metal oxide powder to form through chip technology manufacturings such as batch mixing, moulding, sintering, end-blocking, plating.Because the metal oxide of the formation matrix that is adopted is after sintering, can not get metal simple-substance or metal oxide itself that oxygen is rendered as conduction when lowering the temperature and be transition group metallic oxide with electronic conductivity or hole conduction performance because of the high-temperature sintering process deoxidation, carrying out occurring climbing plating, metallization point after end electrode is electroplated, make the surface insulation resistance degradation; Because the volume of slice component is little, phenomenons such as arcing, arcing easily take place simultaneously between two end electrodes; The electric property of element and the geometrical dimension of the element particularly stability of size, form and the material property between two end electrodes all have direct relation; The fine and close inadequately matrix of electroplate liquid etch also can cause problems such as electrical property variation, also influences the performance of element body resisting salt fog corrosion, mold corrosion etc. simultaneously.
Tradition is carried out normally glass glaze surface-coated method of method that surface protection handles to electronic ceramic chip type element, it has multiple in the glass-glazed mode of surface-coated, a kind of is the end electrode that needs to use special rubber plate anchor clamps covering element, again to matrix surface coated glass glaze, take off plate after the drying, place 800 ℃～1000 ℃ above sintering of environment 0.5h to form fine and close glass glaze; Another kind is a V-type groove spraying method, need spray glass glaze to element body before carrying out the end-blocking electrode, and 1000 ℃/0.5h sintering; Also have a kind of mode of printing, need to use silk screen at the plain sheet surface printing of slice component glass glaze, 800 ℃～1000 ℃ of sintering are more than the 0.5h, then in upper end electrode, silver ink firing, plating.Yet these traditional methods need be used anchor clamps, and to process quantity few at every turn, and efficient is low, need to carry out the high temperature sintering more than 1000 ℃ simultaneously, consume a large amount of energy.
[summary of the invention]
Technical problem to be solved by this invention is: a kind of surface protection treatment method of electronic ceramic chip type element is provided, and it is simple to operate, protects effective and cost is low.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of surface protection treatment method of electronic ceramic chip type element is provided, comprises the steps:
A, preparation protective material solution are mixed and made into protective material solution with solid film protective material, alcoholic solution, deionized water;
B, dipping are got a certain amount of protective material solution for preparing and are poured in the container, and constant temperature after thermostatic bath is heated to 60 ℃～90 ℃ adds the some amount electronic ceramic chip type element again, are immersed in the protective material solution more than the 5min;
C, filtration, the dipping after-filtration takes out electronic ceramic chip type element;
D, baking are evenly arranged the electronic ceramic chip type element that takes out, and be not overlapping, takes out after putting into 100～150 ℃ of bakings of baking oven certain hour, wait to reduce to room temperature after pack standby.
The invention has the beneficial effects as follows: the present invention by at the slice component sintering, be coated with upper end electrode after; utilize the very easy direct dipping process of operation that slice component directly is soaked in the protection solvent; water bath with thermostatic control (60 ℃～90 ℃) kept several minutes; under 100～150 ℃ of conditions, dry then; make the surface coating layer of chip components and parts; thereby make the slice component surface obtain layer protecting film; and the coated part of this protective membrane is former conductively still can conduct electricity, and insulated part still keeps insulation.The slice component electroplating process is climbed plating, metallization is selected, surface insulation resistance is low, electroplate liquid etch matrix causes problems such as electrical property variation thereby can solve, and improves product percent of pass and surface insulation resistance and erosion resistance (salt fog, mould) etc.And present method does not need to use special frock clamp and sintering more than 1000 ℃, saves multiple working procedures such as frock clamp, high temperature sintering simultaneously, production efficiency height, big, save energy in batches.And remaining recyclable the recycling of protective material solution, economy is environmental protection again.
The present invention is described in further detail below in conjunction with accompanying drawing.
[description of drawings]
Fig. 1 is the process flow sheet of the surface protection treatment method of a kind of electronic ceramic chip type element of the present invention.
[embodiment]
As shown in Figure 1, the invention provides a kind of surface protection treatment method of electronic ceramic chip type element, it comprises following each step:
A, preparation protective material solution, prepare protective material solution according to following composition and ratio:
Solid film protective material 30%～100%
Alcoholic solution (analytical pure) 0%～40%
Deionized water 0%～60%
Wherein, described solid film protective material can adopt DJB-823 solid film protective material, and alcoholic solution can adopt ethanolic soln, butanol solution etc., and deionized water is meant the H of specific conductivity＜13 μ S/cm
2O, the protective material solution for preparing need lucifuge to store.
B, dipping, get a certain amount of protective material solution for preparing and pour (only receptor volume and the thermostatic bath volumetrical restriction of 250ml～2L in the container into, container is enough big, the amount of containing can be more) thermostatic bath be heated to 60 ℃～90 ℃ after constant temperature, add 20000 of electronic ceramic chip type elements or more again, requirement is immersed in the protective material solution more than the 5min, and wherein the protective material solution usage gets final product to flood electronic ceramic chip type element fully;
C, filtration, the dipping after-filtration takes out slice component;
D, baking are evenly arranged the slice component of taking out, and be not overlapping, puts into more than 100 ℃～150 ℃ bakings of the baking oven 12min;
E, cooling, pack after the baking scheduled time are taken out slice component, pack after waiting to reduce to room temperature.
Wherein, the alcoholic solution that is adopted can be various alcoholic solutions, for example: ethanolic soln, aqueous isopropanol, butanol solution etc.And the electronic ceramic chip type element of handling through above-mentioned surface protection can carry out follow-up plating step, electroless nickel layer and tin/lead layer.
The present invention by at the slice component sintering, be coated with upper end electrode after; utilize the very easy direct dipping process of operation that slice component directly is soaked in the protection solvent; water bath with thermostatic control (60 ℃～90 ℃) kept several minutes; under 100 ℃～150 ℃ conditions, dry then; make the surface coating layer of chip components and parts; thereby make slice component surface obtain layer protecting film, and the coated part of this protective membrane is former conductively still can conduct electricity, insulated part still keeps insulation.The slice component electroplating process is climbed plating, metallization is selected, surface insulation resistance is low, electroplate liquid etch matrix causes problems such as electrical property variation thereby can solve, and improves product percent of pass and surface insulation resistance and erosion resistance (salt fog, mould) etc.And present method does not need to use special frock clamp and sintering more than 1000 ℃, saves multiple working procedures such as frock clamp, high temperature sintering simultaneously, production efficiency height, big, save energy in batches.
Below by specific embodiment the present invention is carried out more detailed description:
The surface protection of embodiment 1:1608 matrix formula NTC (negative temperature coefficient) thermistor is handled
(1) prepare: slice component is 300000/time behind the preparation chip NTC (negative temperature coefficient) of elder generation thermistor upper end electrode, the silver ink firing, and is standby; Protective material solution contains about 1500ml with the 2L glass beaker, places the thermostatic bath heating in water bath, is provided with behind 60 ℃～90 ℃ constant temperature of temperature standby;
(2) dipping: slice component is slowly poured in the glass beaker that contains protective material solution solution, be as the criterion, soak 10min to be fully immersed in the protective material solution solution;
(3) filter: the slice component and the beaker that will soak 10min together take out, pour in the beaker of another tapered funnel that is coated with the making of 100 order stainless steel meshs, residue protective material solution flows in the beaker, and the slice component that dipping is finished is stayed in the tapered funnel, and protective material solution is recycled;
(4) baking: the slice component in the funnel is poured in the square container that stainless (steel) wire makes, inserts in 110 ℃ of baking ovens, baking 12min;
(5) cooling, pack: behind the baking 12min, slice component connects container together takes out and is placed on the ventilation, packs after reducing to room temperature;
(6) electroplate: electroless nickel layer, tin (lead) layer.
The surface protection of embodiment 2:3216 matrix formula piezoresistor is handled
(1) prepare: 50000/time of slice components are standby after preparing slice type piezoresistor upper end electrode, silver ink firing earlier; Protective material solution contains about 150ml with the 250ml glass beaker, places the thermostatic bath heating in water bath, and 60 ℃～90 ℃ of temperature are set, and is standby behind the constant temperature;
(2) dipping: slice component is slowly poured in the glass beaker that contains protective material solution, be as the criterion, soak 12min to be fully immersed in the protective material solution;
(3) filter: the slice component and the beaker that will soak 12min together take out, and pour in the beaker of another tapered funnel that is coated with the making of 100 order stainless steel meshs, and residue protective material solution flows in the beaker, and the slice component that dipping is finished is stayed in the tapered funnel; Protective material solution is recycled;
(4) baking: the slice component in the funnel is poured in the square container that stainless (steel) wire makes, inserts in 125 ℃ of baking ovens, baking 20min;
(5) cooling, pack.Behind the baking 20min, slice component connects container together takes out and is placed on the ventilation, packs after reducing to room temperature;
(6) electroless nickel layer, tin (lead) layer.
The protection of embodiment 3:4532 matrix formula magnetic bead surfaces is handled
(1) prepare: 20000/time of slice components are standby after preparing chip magnetic bead upper end electrode, silver ink firing earlier; Protective material solution contains about 300ml with the 500ml glass beaker, places the thermostatic bath heating in water bath, and 60 ℃～90 ℃ of temperature are set, and is standby behind the constant temperature;
(2) dipping: slice component is slowly poured in the glass beaker that contains protective material solution, be as the criterion, soak more than the 5min to be fully immersed in the protective material solution;
(3) filter: will soak 5min above slice component and beaker and together take out, and pour in the beaker of another tapered funnel that is coated with the making of 40 order stainless steel meshs, residue protective material solution flows in the beaker, and the slice component that dipping is finished is stayed in the tapered funnel; Protective material solution is recycled;
(4) baking: the slice component in the funnel is poured in the square container that stainless (steel) wire makes, inserts in 120 ℃ of baking ovens, more than the baking 15min;
(5) cooling, pack.After baking 15min was above, slice component connects container together took out and is placed on the ventilation, packed after reducing to room temperature;
(6) electroless nickel layer, tin (lead) layer.
The protection of embodiment 4:1005 matrix formula inductor surface is handled
(1) prepare: slice component is 100000/time behind elder generation's preparation chip inductor upper end electrode, the silver ink firing, and is standby; Protective material solution contains about 500ml with the 1000ml glass beaker, places the thermostatic bath heating in water bath, and 60 ℃～90 ℃ of temperature are set, and is standby behind the constant temperature;
(2) dipping: slice component is slowly poured in the glass beaker that contains protective material solution, be as the criterion, soak 20min to be fully immersed in the protective material solution;
(3) filter: the slice component and the beaker that will soak 20min together take out, and pour in the beaker of another tapered funnel that is coated with the making of 100 order stainless steel meshs, and residue protective material solution flows in the beaker, and the slice component that dipping is finished is stayed in the tapered funnel; Protective material solution is recycled;
(4) baking: the slice component in the funnel is poured in the square container that stainless (steel) wire makes, inserts in 100 ℃ of baking ovens, more than the baking 15min;
(5) cooling, pack.After baking 15min was above, slice component connects container together took out and is placed on the ventilation, packed after reducing to room temperature;
(6) electroless nickel layer, tin (lead) layer.
The surface protection of embodiment 5:2520 type ceramic core chip wire-wound inductor device is handled
(1) prepare: slice component is 150000/time behind elder generation's preparation chip wire-wound inductor device upper end electrode (silver-colored palladium), the silver ink firing, standby, protective material solution contains about 750ml with the 2L glass beaker, places the thermostatic bath heating in water bath, 60 ℃～90 ℃ of temperature are set, standby behind the constant temperature;
(2) dipping: slice component is slowly poured in the glass beaker that contains protective material solution, be as the criterion, soak 15min to be fully immersed in the protective material solution;
(3) filter: the slice component and the beaker that will soak 15min together take out, and pour in the beaker of another tapered funnel that is coated with the making of 100 order stainless steel meshs, and residue protective material solution flows in the beaker, and the slice component that dipping is finished is stayed in the tapered funnel; Protective material solution is recycled;
(4) baking: the slice component in the funnel is poured in the square container that stainless (steel) wire makes, inserts in 125 ℃ of baking ovens, more than the baking 20min;
(5) cooling, pack.After baking 20min was above, slice component connects container together took out and is placed on the ventilation, packed after reducing to room temperature;
(6) electroless nickel layer, tin (lead) layer.
The surface protection of embodiment 6:1608 type positive temperature coefficient thermistor is handled
(1) prepare: slice component is 25000/time behind elder generation's preparation positive temperature coefficient thermistor upper end electrode, the silver ink firing, standby, protective material solution contains about 150ml with the 250ml glass beaker, places the thermostatic bath heating in water bath, 60 ℃～90 ℃ of temperature are set, standby behind the constant temperature;
(2) dipping: slice component is slowly poured in the glass beaker that contains protective material solution, be as the criterion, soak 15min to be fully immersed in the protective material solution;
(3) filter: the slice component and the beaker that will soak 15min together take out, and pour in the beaker of another tapered funnel that is coated with the making of 100 order stainless steel meshs, and residue protective material solution flows in the beaker, and the slice component that dipping is finished is stayed in the tapered funnel; Protective material solution is recycled;
(4) baking: the slice component in the funnel is poured in the square container that stainless (steel) wire makes, inserts in 140 ℃ of baking ovens, more than the baking 20min;
(5) cooling, pack.After baking 20min was above, slice component connects container together took out and is placed on the ventilation, packed after reducing to room temperature;
(6) electroless nickel layer, tin (lead) layer.
Claims (6)
1, a kind of surface protection treatment method of electronic ceramic chip type element comprises the steps:
A, preparation protective material solution are mixed and made into protective material solution with solid film protective material, alcoholic solution, deionized water;
B, dipping are got a certain amount of protective material solution for preparing and are poured in the container, and constant temperature after thermostatic bath is heated to 60 ℃～90 ℃ adds the some amount electronic ceramic chip type element again, are immersed in the protective material solution more than the 5min;
C, filtration, the dipping after-filtration takes out electronic ceramic chip type element;
D, baking are evenly arranged the electronic ceramic chip type element that takes out, and be not overlapping, takes out after putting into 100～150 ℃ of bakings of baking oven certain hour, wait to reduce to room temperature after pack standby.
2, the surface protection treatment method of a kind of electronic ceramic chip type element as claimed in claim 1 is characterized in that: the composition of described protective material solution comprises according to volume ratio content:
Solid film protective material 30%～100%;
Alcoholic solution (analytical pure) 0%～40%;
Deionized water 0%～60%.
3, the surface protection treatment method of a kind of electronic ceramic chip type element as claimed in claim 1 or 2 is characterized in that: described solid film protective material is a DJB-823 solid film protective material.
4, the surface protection treatment method of a kind of electronic ceramic chip type element as claimed in claim 1 or 2 is characterized in that: described alcoholic solution is ethanolic soln, aqueous isopropanol or butanol solution.
5, the surface protection treatment method of a kind of electronic ceramic chip type element as claimed in claim 1 is characterized in that: in the impregnation steps, the protective material solution usage gets final product can flood the electronic ceramic chip type element quantity that is added fully.
6, the surface protection treatment method of a kind of electronic ceramic chip type element as claimed in claim 1 is characterized in that: storing time is more than the 12min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101021398A CN100469739C (en) | 2005-12-03 | 2005-12-03 | Surface protection treatment method for electronic ceramic chip type element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101021398A CN100469739C (en) | 2005-12-03 | 2005-12-03 | Surface protection treatment method for electronic ceramic chip type element |
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| Publication Number | Publication Date |
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| CN1978388A true CN1978388A (en) | 2007-06-13 |
| CN100469739C CN100469739C (en) | 2009-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005101021398A Expired - Fee Related CN100469739C (en) | 2005-12-03 | 2005-12-03 | Surface protection treatment method for electronic ceramic chip type element |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922852A (en) * | 2011-08-08 | 2013-02-13 | 联想(北京)有限公司 | Water-resisting salt spray-resisting method for workpiece |
| CN104795367A (en) * | 2015-04-28 | 2015-07-22 | 深圳振华富电子有限公司 | Filling agent and surface treatment method for chip components |
| CN104788127A (en) * | 2015-03-31 | 2015-07-22 | 深圳顺络电子股份有限公司 | Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element |
| CN105185431A (en) * | 2015-10-09 | 2015-12-23 | 重庆文理学院 | Superhigh protection silver conductive film preparation method |
| CN105355515A (en) * | 2015-11-12 | 2016-02-24 | 西安铁路信号有限责任公司 | Relay contact protective method |
| CN109378558A (en) * | 2018-08-28 | 2019-02-22 | 张家港保税区灿勤科技有限公司 | A kind of filter and preparation method for improving itself and bearing power |
-
2005
- 2005-12-03 CN CNB2005101021398A patent/CN100469739C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922852A (en) * | 2011-08-08 | 2013-02-13 | 联想(北京)有限公司 | Water-resisting salt spray-resisting method for workpiece |
| CN102922852B (en) * | 2011-08-08 | 2015-06-24 | 联想(北京)有限公司 | Water-resisting salt spray-resisting method for workpiece |
| CN104788127A (en) * | 2015-03-31 | 2015-07-22 | 深圳顺络电子股份有限公司 | Surface treatment method for inhibiting overplating of electronic ceramic element and electronic ceramic element |
| CN104788127B (en) * | 2015-03-31 | 2017-03-29 | 深圳顺络电子股份有限公司 | Electronic ceramic component is suppressed to climb the surface treatment method and electronic ceramic component of plating |
| CN104795367A (en) * | 2015-04-28 | 2015-07-22 | 深圳振华富电子有限公司 | Filling agent and surface treatment method for chip components |
| CN104795367B (en) * | 2015-04-28 | 2018-02-16 | 深圳振华富电子有限公司 | The surface treatment method of filler and slice component |
| CN105185431A (en) * | 2015-10-09 | 2015-12-23 | 重庆文理学院 | Superhigh protection silver conductive film preparation method |
| CN105355515A (en) * | 2015-11-12 | 2016-02-24 | 西安铁路信号有限责任公司 | Relay contact protective method |
| CN109378558A (en) * | 2018-08-28 | 2019-02-22 | 张家港保税区灿勤科技有限公司 | A kind of filter and preparation method for improving itself and bearing power |
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| Publication number | Publication date |
|---|---|
| CN100469739C (en) | 2009-03-18 |
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Granted publication date: 20090318 Termination date: 20171203 |