[background technology]
As everyone knows, electronic component such as central processing unit produces a large amount of heat in running.For preventing that thereby this heat-generating electronic elements from causing its temperature rising to cause its fluctuation of service, this electronic component need install a heat abstractor usually additional with auxiliary its heat radiation because of the accumulation of heat.Usually, be fixed on the electronic component, also need retaining element in addition for this heat abstractor is close to.
At present, industry is used a kind of heat abstractor in the multiple heat abstractor to comprise that a radiator, closes around the fixedly module of electronic component setting and with this fixed die assembly and this radiator is fixed to fastener on the electronic component.This radiator comprises a base and is located at some radiating fins on this base that this base middle part is stayed and established a groove between two fins.This fastener is a strip, the two fastener portions that it has a pressure section and is located at these pressure section two ends, this fixedly the fastener portion of corresponding this fastener of module be provided with buckling parts.The pressure section of this fastener is cross-placed in the groove of this radiator, and fastener portion fastener is the buckling parts of module fixedly, and fastener deforms, and its pressure section compresses foot of radiator downwards, thereby this radiator is fixed on the electronic component.Yet, for the fastener portion that makes fastener and fixedly the buckling parts of module fasten, need overcome the elastic-restoring force of this fastener, operation is effort comparatively, in addition, the fastening process also often needs finish operation inconvenience by instrument.So this heat abstractor needs further to improve.
[summary of the invention]
In view of this, be necessary to provide a kind of dismounting heat abstractor easily.
A kind of heat abstractor, be used for heat-generating electronic elements is dispelled the heat, this heat abstractor comprises a radiator, an one fixedly module and a fastener, this radiator comprises a radiator and the heat carrier that combines with this radiator, this fastener comprises a junction and the operating portion that is extended by this connecting portion, this connecting portion rotatably is installed up to this fixedly on the module, this connecting portion is provided with outstanding pressure section, this heat abstractor also comprises a fixed head that combines with this heat carrier, the relative both sides of this fixed head are provided with first fixed arm and second fixed arm of projection, fixedly module comprises that one compresses the bottom of this first fixed arm, and the pressure section of this fastener can compress this second fixed arm by rotating this fastener.
Compared with prior art, the fixed head of heat abstractor combines with radiator, fixedly module compresses first fixed arm of this fixed head, the fastener of heat abstractor is connected with fixedly module is rotatable, by rotating this fastener, the pressure section that can realize this fastener compresses compressing or removing of second fixed arm of fixed head, and realizes the convenient assembly and disassembly of heat abstractor and electronic component.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[embodiment]
See also Fig. 1, this heat abstractor is used to distribute the heat of an electronic component (figure does not show) generation that is installed on the circuit board (figure does not show).This heat abstractor comprises a radiator, and this radiator comprises a radiator 50 and a heat carrier 40 that combines with this radiator 50.This heat abstractor also comprises a fixed head that cooperates with this heat carrier 40 30, a fastener 20 and a fixedly module 10 that cooperates with this fastener 20, fixed head 30.
Fixedly module 10 is a square framework, is located on the circuit board around this electronic component.Should be fixedly module 10 have the opening 110 of a holding electronic element and center on interconnective first, second, third and fourth limit portion 120,130,140,150 of this opening 110.Should be fixedly four angles of module 10 extend down be provided with this fixedly module 10 be fixed to four fixing feet 160 on the circuit board.The second limit portion 130 extends upward a sidewall 170 in its outer rim, and this sidewall 170 is held the locating piece 171 that is provided with four intervals towards opening 110 directions thereon, is used for fastener 20 is positioned between the second limit portion 130 and this locating piece 171.130 pairs in this second limit portion should sidewall 170 locating piece 171 be provided with some breach 131.Be provided with some blocks 141,151,121 towards opening 110 directions in the junction and the 4th of third and fourth limit portion 140,150, the junction of one side portion 150,120, an end of block 121 outwards stretches out the first limit portion and forms a buckle ear 123.
Fastener 20 is roughly L-shaped, is formed by the wire bending.This fastener 20 comprises a junction 210 and the operating portion 230 that is extended by this connecting portion 210 1 ends bending.Be bent to form two pressure sections 211 between the adjacent positioned piece 171 of this connecting portion 210 corresponding fixedly module 10 sidewalls 170, these two pressure sections, 211 projections are to these fixing opening 110 directions of module 10.The free end back bending of operating portion 230 forms one handle 231, is equipped with a plastic cement body 250 on this handle 231, operates with the handled easily person.
Heat carrier 40 has high-termal conductivity, and it comprises bigger rounded bottom of a diameter 410 and the smaller cylinder 430 of diameter that is extended vertically upward by this bottom 410.One cavity is formed at the top of cylinder 430.Radiator 50 comprises a cylindricality nucleome 510 and the some fins 530 that outwards extended radially by these nucleome 510 peripheries.Be formed centrally the through hole 511 of this nucleome 510 of up/down perforation in this nucleome 510, the cylinder 430 of this heat carrier 40 is bonded in this through hole 511.These some fins 530 circumferentially slightly are crooked along the cylinder of nucleome 510.
Fixed head 30 comprises a circumferential body portion 310 and first fixed arm of being opened in outward extending two minutes by these main part 310 outer rims 330, opened second fixed arm 350 in opposite two minutes with these first fixed arm, 330 bearing of trends.The center of this main part 310 has a round hole 311, passes for heat carrier 40.The end of each first fixed arm 330 outwards is bent to form a catch 331 downwards, and this catch 331 has a ladder drop with main part 310.
See also Fig. 2, assembling fastener 20 and fixedly during module 10, the connecting portion 210 of fastener 20 is rotating to be installed between the locating piece 171 of fixedly module 10 second limit portions 130 and sidewall 170.Each pressure section 211 of connecting portion 210 is between adjacent two locating pieces 171, and is and protruding in the fixing opening 110 of module 10.
See also Fig. 3, when assembling heat conductivity body 40, fixed head 30 and radiator 50, the cylinder 410 of heat carrier 40 passes the perforate 311 of fixed head 30 main bodys 310, cooperates the bottom of the cylinder 430 that is fixed on heat carrier 40, and is fitted in the upper surface of heat carrier 40 bottoms 410.The cylinder 430 of heat carrier 40 is fixed in the through hole 511 of radiator 50 by interference fit.Thereby fixed head 30 is folded between radiator 50 and the heat carrier 40.
See also Fig. 4-6, during use, the bottom 410 of heat carrier 40 is placed on the electronic component, first fixed arm 330 of fixed head 30 places fixedly module 10 the 4th limit portion 150 belows and its catch 331 blocks in the bottom surface of the 4th limit portion 150.2 second fixed arms 350 of fixed head 30 are positioned at the fixedly opening 110 of module 10, and lay respectively at two pressure sections, 211 belows of fastener 20.Block 141,151,121 blocks are in the bottom outside of radiator 50.At this moment, heat abstractor is in state as shown in Figure 4.The operating portion 230 that rotates fastener 20 until operating portion 230 near the position of handles 231 and fixing buckle ear 123 buckles of module 10, at this moment, the pressure section 211 of the connecting portion 210 of fastener 20 compresses second fixed arm 350 of fixed head 30 downwards, and the bottom surface that makes the bottom 410 of heat carrier 40 is close to and is fixed on the electronic component, thereby radiator is closely contacted with electronic component, and it is as Fig. 5, shown in Figure 6.
When with radiator from this electronic component get except that the time, remove the operating portion 230 of fastener 20 and the fixing buckle of the buckle ear 123 of module 10, rotating operation portion 230 makes progress, thereby compressing of second fixed arm 350 of 211 pairs of fixed heads 30 of pressure section of releasing fastener 20 connecting portions 210, it as shown in Figure 4, at this moment, this radiator and fixed head 30 can be from the fixedly opening 110 interior taking-ups of module 10.
Compared with prior art, fastener 20 is rotatable to be connected to fixedly on the module 10, fixed head 30 is bonded on the heat carrier 40 of radiator, first fixed arm 330 of fixed head 30 blocks in fixing the 4th limit portion 150 belows of module 10, operating portion 230 by Rotating fastener 20, the pressure section 211 of fastener 20 compresses second fixed arm 350 of fixed head 30 downwards and realizes fitting tightly of heat abstractor and electronic component, and perhaps the pressure section 211 of fastener 20 is removed the compressing of second fixed arm 350 of fixed head 30 realized from this heat abstractor of electronic component removal.Thereby the mounting or dismounting of this heat abstractor and electronic component are convenient.
See also Fig. 7, it is for another embodiment of heat abstractor of the present invention, this embodiment and the first embodiment difference are among this embodiment fixedly the 4th limit portion 150 ' of module 10 ', the middle part of the root edge of sidewall 170 ' each extend downwards one fixedly module 10 be fixed to fixing feet 160 ' on the circuit board, this sidewall 170 ' is established a breach 173 in this fixing feet 160 ' top, fastener 20 ' between two pressure sections 211 ' to establishing a bend 213 in breach 173 places, this bend 213 and this pressure section 211 ' approximate vertical produce interference when the fixing fixing feet 160 ' to avoid fastener 20 '.Be somebody's turn to do fixedly four jiaos of each downward legs 180 that extend of module 10 '.First, second fixed arm of each of fixed head 30 ' 330 ', 350 ' end are respectively established a catch 331 ', 351.