CN1963709A - Collecting system for parameter of wave-soldering, collecting card and collecting method thereof - Google Patents
Collecting system for parameter of wave-soldering, collecting card and collecting method thereof Download PDFInfo
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- CN1963709A CN1963709A CN 200610157012 CN200610157012A CN1963709A CN 1963709 A CN1963709 A CN 1963709A CN 200610157012 CN200610157012 CN 200610157012 CN 200610157012 A CN200610157012 A CN 200610157012A CN 1963709 A CN1963709 A CN 1963709A
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Abstract
This invention discloses one wave peak weld parameter collection system, collection card and method, wherein, the system comprises one collection card to collect data in weld process; one data interface to connect to remote computer host communication. The said collection card comprises the following parts: one MCU to control whole data collection and transmission process and to control and connect at least thermal couple and at least two sets of detector probes to sense temperature; the said two sets of probes preset distance to sense weld time and tin furnace linkage; one memory unit to store collected data.
Description
Technical field
The present invention relates to a kind of supervising device and method of wave-soldering furnace, in particular a kind of acquisition system of parameter of wave-soldering, capture card and method thereof.
Background technology
At present in the welding processing procedure of each electronic devices and components; in the particularly scale volume production process; the adjustment state of wave-soldering performance and parameter will directly have influence on product quality and reliability thereof; how to reduce welding fault rate; improve welding quality; make Wave soldering apparatus be in best running parameter state for a long time; be to need the problem studied in the wave-soldering welding processing procedure always; and the monitoring technology management and control level that how to improve parameter of wave-soldering is a prerequisite; will be according to monitoring multi-faceted science precise parameters amount as far as possible; and they are carried out real-time analysis, could implement to adjust to wave-soldering furnace with unreasonable.
The wave-soldering technology is a kind of complicated technology that is subjected to many factor affecting, circuit board is wanted coated scaling powder, is preheated and welding technology, many-sided knowledge such as this requirements of process integrated use chemistry, calorifics, physics, sheet material, sheet material design and layout, therefore be that the correct technological parameter of various application choices is very important, because these variablees interact each other.
Current domestic electronic enterprise to the process-monitor management and control present situation of wave-soldering furnace is:
1., at the crest temperature: adopt that the artificial wave-soldering that reaches with the temperature rod melted in the tin and measures every 1.5 hours, the value after the measurement by hand-kept to paper.Its shortcoming clearly will be opened the body of heater protective window during measurement, and (rosin flavor, temperature heat conduction etc.) have certain influence to human body in the operation measurement under this environment; The temperature rod is subjected to manual control, fathoms differently with measured zone all can draw different value; Can't measure preheat temperature and cooling point temperature, promptly can not get preheating temperature rise and cooldown rate, parameter measurement is not comprehensive; Whether require at set intervals survey record can not effectively monitor the employee and test to paper, false data will not reflect the virtual condition of tin stove; Measurement data can not be shared, can not the real-time implementation tracing analysis, also can only accomplish the part to the wave-soldering adjustment.
2., at tin stove chain speed: tin stove chain speed and scolding tin crest height, guide rail inclination angle etc. all can influence the time of welding, just show at present and control by body of heater panel board reading, because operation of tin furnace superintendent phase and amateur maintenance of equipment maintenance can cause panel board can not reflect actual chain speed, metrical information can not Real-Time Sharing be monitored in addition, there is the individual wire body to heighten chain speed production in order to pursue high yield, will cause can not get weld interval guaranteeing that filling in record also is false data.
3., at the immersed solder time: also do not find a kind ofly can science accurately measure the device of weld interval before, owing to be subjected to the influence of the tin furnace parameters of several aspects weld interval, as controlled chain speed well, crest height judges whether to add tin bar only according to artificial naked-eye observation to be increased height or heightens scolding tin spray high altitude, more than all can not accurately reflect actual immersed solder time when actual output is crossed crest.
Therefore, prior art is in the virgin state of technology, has yet to be improved and developed.
Summary of the invention
The object of the present invention is to provide a kind of acquisition system, capture card and acquisition method thereof of parameter of wave-soldering, solve above-mentioned prior art problem, provide a kind of can data sharing, the parameter acquisition system and method for automatic accurate monitoring.
Technical scheme of the present invention comprises:
A kind of acquisition system of parameter of wave-soldering is characterized in that, it comprises a capture card, is used for the welding process image data in the crest solder furnace; And a data-interface, be used for being connected with the remote computer host communication; One parameter of wave-soldering analysis software is used to operate in described remote computer main frame, and the data that collected are processed and displayed; And
Also be provided with on the described capture card: a MCU, be used to control whole data collection and transmission course, and at least one thermopair of control linkage and at least two group probes; Described thermopair is used for sensing temperature; Described two groups of probe separation preset distances are provided with, and are used for sensing immersed solder time and tin stove chain speed; And a storage unit, be used to store the data that collected; One battery is used for system's power supply.
Described system, wherein, described data-interface is a serial line interface, is used for uploading the data that described storage unit is gathered by described MCU control.
A kind of capture card of acquisition system of parameter of wave-soldering is characterized in that, comprises a MCU, is used to control whole data collection and transmission course, and at least one thermopair of control linkage and at least two group probes; Described thermopair is used for sensing temperature; Described two groups of probe separation preset distances are provided with, and are used for sensing immersed solder time and tin stove chain speed; And a storage unit, be used to store the data that collected; One data-interface is used for the data that collected to the transmission of remote computer main frame; And a battery, be used for to this capture card power supply.
Described capture card, wherein, described thermopair and described probe are provided with the face of weld of pin at described capture card; Described MCU and described storage unit and its peripheral circuit are arranged on the non-face of weld of described capture card, and are enclosed in the box body.
Described capture card, wherein, the both sides of described thermopair are provided with guard column, a little more than the pin setting of described thermopair, are used to prevent that touching from damaging described thermopair.
A kind of acquisition method of parameter of wave-soldering, it may further comprise the steps:
A, a capture card is set, includes the thermopair of MCU control linkage and at least two group probes that are provided with at interval according to preset distance on it, and a storage unit, described thermopair and probe are arranged on the face of weld of described capture card;
B, according to the wave soldering flow process, enter the tin stove and carry out welding process, and when predetermined condition, by its each port of described MCU initialization and log-on data collecting flowchart;
C, described MCU carry out sensing with the immersed solder time and the tin stove chain speed data of described thermopair sensed temperature data and described probe sensing according to preset frequency, and write described memory storage;
D, described capture card transmit data by its data-interface to the remote computer main frame after going out the tin stove.
Described method, wherein, the predetermined condition of described step B comprises: when the Temperature numerical that described thermopair senses surpasses 40 degrees centigrade.
Described method, wherein, the detection process of immersed solder time comprises described in the described step C:
C1, described MCU carry out timing to two probes of short circuit first, finish until its short circuit, and this section period is the immersed solder time.
Described method, wherein, the detection process of the chain speed of tin stove described in the described step C comprises:
C2, described MCU carry out timing to two probes of short circuit first, when second group two probe short circuits till, and remove preset distance between these two groups of probes, obtain described tin stove chain speed.
Described method, wherein, described step D also comprises: described remote computer main frame sends the instruction that this image data has been cancelled to described capture card after the data that receive capture card, upload once more to avoid this secondary data.
The acquisition system of a kind of parameter of wave-soldering provided by the present invention, capture card and acquisition method thereof, because having adopted the pcb board that Acquisition Instrument is used as normal product sends in the tin stove, data have promptly been gathered and have been finished behind the ejecting plate, and remote computer can be uploaded in the data scene of Acquisition Instrument shared and handle, its handling safety is simple and convenient, need not to open the body of heater protective window, and parameter is comprehensive, 3 thermometrics in left, center, right, it measures high conformity, degree of accuracy height; And by two groups of probe artificial actual components and parts pins before and after the Acquisition Instrument, instant chain speed of wave-soldering and the measurement of actual immersed solder time have been realized simply, and disclose the moment of monitoring measurement and the number of times of measurement, a kind of effective process duct prosecutor case of parameter of wave-soldering monitoring is provided.
Description of drawings
Fig. 1 is the structured flowchart of the acquisition system of parameter of wave-soldering of the present invention;
Fig. 2 is the schematic flow sheet of the acquisition method of parameter of wave-soldering of the present invention;
Fig. 3 is the acquisition system of parameter of wave-soldering of the present invention and the circuit theory diagrams of method thereof;
Fig. 4 is the capture card synoptic diagram of the acquisition system of parameter of wave-soldering of the present invention.
Embodiment
Below in conjunction with accompanying drawing, will be described in more detail each preferred embodiment of the present invention.
In the acquisition system and method thereof of parameter of wave-soldering of the present invention, described parameter of wave-soldering monitoring analysis system mainly comprises: the parameter of wave-soldering capture card is used for the welding process image data in the crest solder furnace; Remote computer main frame and software; Parameter of wave-soldering analysis software three parts, its operation workflow is: every day, section was gathered related data with the parameter of wave-soldering Acquisition Instrument at the appointed time, the data of Acquisition Instrument are passed back automatically by the manufacturing monitoring system main frame by the other communication network interface of crest welder again, passed back back Acquisition Instrument data and promptly cancel; In manufacturing monitoring system, generate the subsidiary data file that information such as gathering line body, acquisition time, times of collection is arranged, as
*.sky, this data file uploads to intra-company synchronously and shares on the net, and after the remote computer host computer using parameter of wave-soldering analysis software processing by the production monitoring channel, share at the production monitoring channel, mainly key parameter and weld interval, tin stove chain speed and the production of wave-soldering temperature curve are carried out dynamic monitoring and optimum management to the process of wave-soldering welding processing procedure control; In addition can be right by the parameter of wave-soldering analysis software
*.sky file carries out the detailed figures analysis, confirms, prints processing such as file.
The acquisition system structure of parameter of wave-soldering of the present invention as shown in Figure 4, it adopts any general tabula rasa pcb board 110, and be that the wave soldering face is provided with thermopair 120 in the bottom surface of this pcb board 110, its pin 121 is identical with the welding foot of common components and parts to be welded, stretch out in outside the pcb board, this thermopair is set is 90 degree perpendicular to its pin, be used for the detection of welding temperature; Simultaneously a plurality of guard columns 122 can be set, as shown in Figure 4, about each guard column 122, can prevent the damage that thermopair is touched.
Simultaneously, in the acquisition system of parameter of wave-soldering of the present invention, each two probe 130 about also being provided with, its left side two probes can be used for when welding because soldering causes the short circuit of this two probe, the start time of learning immersed solder thus; And when leaving soldering, because the soldering in the tin stove is a liquid condition, when the immersed solder time finished, this two probe just broke away from short-circuit condition, and therefore, detection and timing by MCU just can calculate the immersed solder time.And two probes on its right side also have the action of a short circuit timing after the two probe short circuit timing of left side, so, walk about apart from just calculating its tin stove chain speed according to the mistiming and the pcb board of the present invention of these two probes.
MCU140 of the present invention and peripheral circuit thereof are arranged on the front of described pcb board 110, it is noncontact soldering face, install the box body internal fixation on described pcb board by an integrated circuit block and a sealing, can prevent that so interior being infected with of soldering of tin stove caused fault in the wave-soldering process.
Concrete, the circuit theory of the acquisition system of parameter of wave-soldering of the present invention as shown in Figure 1, described MCU140 is provided with respectively and is connected with at least two group probe switches and one group of K type thermopair; Described thermopair is connected with MCU by thermopair compensation and conditioner circuit and A/D change-over circuit, is used for temperature is carried out sensing; Described probe is used for immersed solder time and tin road chain speed are carried out sensing.Described MCU of the present invention and peripheral circuit thereof are powered by a battery, the concrete rechargeable battery that adopts, and the recovery of regularly charging, and be provided with a led state pilot lamp, be used for the electric power degree of pilot cell.In the peripheral circuit of described MCU, also be provided with a storage unit, carry out control linkage, realize reception and storage data by parallel bus and MCU; Simultaneously, also be provided with a universal serial bus interface, the data upload in the described storage unit can be shared in the remote computer main frame by a RS485 interface.
To describe preferred embodiment of the present invention in detail below, as shown in Figures 2 and 3, the present invention is in the parameter of wave-soldering Acquisition Instrument formed of core by single-chip microcomputer IC1 AT89S52, be embedded in measure gather and with remote computer communication two parts software.When measuring beginning, each port initialization of MCU, and each led state pilot lamp is set lights indication; Read No. 1 path thermocouple of IC6 (A/D chip) (being the middle temperature sensor of pcb board) A/D value by single-chip microcomputer, judge that whether this value is greater than 40 degrees centigrade, run into the probe triggering collection to avoid human body, as gathering 360 times and timing 0.05S greater than then setting, be that every 0.05S gathers left, center, right (0,1, No. 2 passages) sense data of thermopair is 1 time, forming 6 byte datas and storing storage unit into is among the Non SRAM IC4, the SRAM that IC4 preserves for the power down data, its embedded battery, data can reliably be preserved 10 years, and access speed is the same fast with common RAM storer, at 360 continuous 1 pin of test single-chip microcomputer IC1 in totally 180 seconds measuring processes, whether the CONA probe groups ground connection.
Its principle as previously mentioned, CONA, CONB measure 2 probe groups before and after the substrate for being positioned at, every group has 2 pins and between-line spacing setting, when measuring substrate and move in the wave-soldering tin-soldering, probe short circuit, 2 probe short circuits finish when shifting out; As preceding probe groups CONA ground connection, pick up counting, till the CONA disconnection is earth-free, this section period is the immersed solder time, and when behind 2 pin of IC1 during probe groups CONB ground connection, the time interval that rigidly connects when ground with the CONA probe groups goes on record again, can calculate at that time tin stove chain speed by the distance between 2 probe groups divided by this time interval, and with this value record in storage unit IC4 Non SRAM.
As shown in Figure 3, IC2 is for powering on or electric voltage exception reset MCU and battery voltage monitoring chip, when cell voltage is lower than predetermined voltage 6.7V, IC24 pin voltage monitoring, 5 pin output low levels, MCU 12 pin monitor low level, start the low warning LED lamp of cell voltage, can know the electric weight situation of battery thus by the led state pilot lamp.
IC5 shown in Fig. 3 is the reference power supply chip, the stable 4.096V voltage of its 6 pin output is given IC6 A/D chip, IC6 A/D chip 0,1,2 passages are respectively the voltage that 3 thermopairs in Acquisition Instrument left, center, right were nursed one's health through over-compensation, 3, whether disconnected 4,5 passages monitor 3 thermopairs in left, center, right even situation respectively, it is the thermopair malfunction monitoring, KA-KC is 3 K type thermopairs, IC7A-IC7C is the cold junction compensation modulate circuit, the thermopair ultra-weak electronic signal is 10mV/ ℃ a voltage signal through making temperature coefficient of Vo end output after adjusting, and handles through IC6 A/D.Its communication program is: when the P2.5-P2.7 of IC1 pin (address wire), P3.0 (RXD), P3.1 (TXD) connects the on-the-spot communication netting twine that is provided with, Acquisition Instrument is as slave, remote computer is as main frame, the data upload that will collect among the described storage unit IC4 Non SRAM by the RS485 bus arrives computer, the computer expert crosses calculating, parameter value is shown to computer interface, unusual parameter is with heterochromatic warning prompt, vision signal with video card output converts radio television signal to simultaneously, just the result can be shown by existing TV network, test site is provided with a televisor can real-time monitored arrive the parameter of measuring.
The acquisition system of parameter of wave-soldering of the present invention and method thereof are by the substrate P CB plate of simulation actual product, its thermocouple sensor probe is consistent with length at the bottom of the components and parts sole, by obtaining preheat temperature behind the tin oven body, welding temperature, tin road chain speed, information such as immersed solder weld interval, above-mentioned these data upload to remote computer by the field network interface just can carry out real-time temperature rise rate, cooldown rate, line body code name, Measuring Time, measured the electronical record of data such as number of times the same day, and this information is communicated to each line body by TV signal shows, data file is shared on the LAN (Local Area Network) simultaneously, can open the continuous temperature curve of stroke by analysis software.
System and method of the present invention has been realized in the wave-soldering Acquisition Instrument measuring method to tin stove chain speed, immersed solder time and continuously measuring temperature, its handling safety is simple and convenient, equally can enter the tin stove with a common pcb board to be welded handles, need not to open the body of heater protective window, as long as Acquisition Instrument (but the wide free adjustment of plate) is used as the normal product pcb board to be sent in the tin stove, system of the present invention can be triggered under certain condition and carry out observation process; Data have been gathered and have been finished behind the ejecting plate, the data scene of Acquisition Instrument can be uploaded to remote computer by predetermined interface, remote computer is received the instruction of sending this image data on the described capture card that cancels again after the data, avoiding once more this data upload, remote computer in time calculates and publicity goes out measurement parameter simultaneously.
The parameter of its measurement of system and method for the present invention is comprehensive, and 3 thermometrics in left, center, right are measured high conformity, degree of accuracy height; Pin by two groups of probe artificial actual components and parts before and after the Acquisition Instrument, wave-soldering chain speed and the measurement of actual immersed solder time at that time simply and have exactly been realized, and the moment that open monitoring is measured and the number of times of measurement, the effective process duct prosecutor case that provides a kind of parameter of wave-soldering to monitor.
Should be understood that above-mentioned description at specific embodiment is comparatively detailed, can not therefore be interpreted as the restriction to scope of patent protection of the present invention, scope of patent protection of the present invention should be as the criterion with claims.
Claims (10)
1, a kind of acquisition system of parameter of wave-soldering is characterized in that, it comprises a capture card, is used for the welding process image data in the crest solder furnace; And a data-interface, be used for being connected with the remote computer host communication; One parameter of wave-soldering analysis software is used to operate in described remote computer main frame, and the data that collected are processed and displayed; And
Also be provided with on the described capture card: a MCU, be used to control whole data collection and transmission course, and at least one thermopair of control linkage and at least two group probes; Described thermopair is used for sensing temperature; Described two groups of probe separation preset distances are provided with, and are used for sensing immersed solder time and tin stove chain speed; And a storage unit, be used to store the data that collected; One battery is used for system's power supply.
2, system according to claim 1 is characterized in that, described data-interface is a serial line interface, is used for uploading the data that described storage unit is gathered by described MCU control.
3, a kind of capture card of acquisition system of parameter of wave-soldering is characterized in that, comprises a MCU, is used to control whole data collection and transmission course, and at least one thermopair of control linkage and at least two group probes; Described thermopair is used for sensing temperature; Described two groups of probe separation preset distances are provided with, and are used for sensing immersed solder time and tin stove chain speed; And a storage unit, be used to store the data that collected; One data-interface is used for the data that collected to the transmission of remote computer main frame; And a battery, be used for to this capture card power supply.
4, capture card according to claim 3 is characterized in that, described thermopair and described probe are provided with the face of weld of pin at described capture card; Described MCU and described storage unit and its peripheral circuit are arranged on the non-face of weld of described capture card, and are enclosed in the box body.
5, capture card according to claim 4 is characterized in that, the both sides of described thermopair are provided with guard column, a little more than the pin setting of described thermopair, is used to prevent that touching from damaging described thermopair.
6, a kind of acquisition method of parameter of wave-soldering, it may further comprise the steps:
A, a capture card is set, includes the thermopair of MCU control linkage and at least two group probes that are provided with at interval according to preset distance on it, and a storage unit, described thermopair and probe are arranged on the face of weld of described capture card;
B, according to the wave soldering flow process, enter the tin stove and carry out welding process, and when predetermined condition, by its each port of described MCU initialization and log-on data collecting flowchart;
C, described MCU carry out sensing with the immersed solder time and the tin stove chain speed data of described thermopair sensed temperature data and described probe sensing according to preset frequency, and write described memory storage;
D, described capture card transmit data by its data-interface to the remote computer main frame after going out the tin stove.
7, method according to claim 6 is characterized in that, the predetermined condition of described step B comprises: described MCU judges that Temperature numerical that described thermopair senses is above 40 degrees centigrade.
8, method according to claim 7 is characterized in that, the detection process of immersed solder time comprises described in the described step C:
C1, described MCU carry out timing to two probes of short circuit first, finish until its short circuit, and this section period is the immersed solder time.
9, method according to claim 7 is characterized in that, the detection process of the chain speed of tin stove described in the described step C comprises:
C2, described MCU carry out timing to two probes of short circuit first, when second group two probe short circuits till, and remove preset distance between these two groups of probes, obtain described tin stove chain speed.
10, according to Claim 8 or 9 described methods, it is characterized in that, described step D also comprises: described remote computer main frame sends the instruction that this image data has been cancelled to described capture card after the data that receive capture card, upload once more to avoid this secondary data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101570120A CN100426164C (en) | 2006-11-21 | 2006-11-21 | Collecting system for parameter of wave-soldering, collecting card and collecting method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101570120A CN100426164C (en) | 2006-11-21 | 2006-11-21 | Collecting system for parameter of wave-soldering, collecting card and collecting method thereof |
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| CN1963709A true CN1963709A (en) | 2007-05-16 |
| CN100426164C CN100426164C (en) | 2008-10-15 |
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| CNB2006101570120A Expired - Fee Related CN100426164C (en) | 2006-11-21 | 2006-11-21 | Collecting system for parameter of wave-soldering, collecting card and collecting method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101628353B (en) * | 2009-08-07 | 2011-09-07 | 台达电子（东莞）有限公司 | Method for detecting parameters of tinning furnace |
| CN102266996A (en) * | 2010-06-07 | 2011-12-07 | 宇达电脑（上海）有限公司 | Intelligent control type solder pot |
| CN102854845A (en) * | 2011-06-27 | 2013-01-02 | 珠海格力电器股份有限公司 | Wave-soldering comprehensive monitoring system |
| CN109623069A (en) * | 2019-01-22 | 2019-04-16 | 湖南机电职业技术学院 | A kind of robot welding system Internet-based and welding procedure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2639442B1 (en) * | 1988-11-18 | 1990-12-28 | Loire Electronique | DEVICE FOR ADVANCE CONTROL OF A LOAD TRANSPORTED ON A CONVEYOR |
| JP2984659B1 (en) * | 1998-07-31 | 1999-11-29 | 米沢日本電気株式会社 | Soldering equipment and solder supply instruction method |
| JP2002232131A (en) * | 2001-02-02 | 2002-08-16 | Furukawa Electric Co Ltd:The | Heat analyzing apparatus, heating condition arithmetic unit, heat analysis method, heating condition calculation method, and program for executing the methods |
| JP2005308267A (en) * | 2004-04-20 | 2005-11-04 | Matsushita Electric Ind Co Ltd | Heating furnace temperature control method and its device |
-
2006
- 2006-11-21 CN CNB2006101570120A patent/CN100426164C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101628353B (en) * | 2009-08-07 | 2011-09-07 | 台达电子（东莞）有限公司 | Method for detecting parameters of tinning furnace |
| CN102266996A (en) * | 2010-06-07 | 2011-12-07 | 宇达电脑（上海）有限公司 | Intelligent control type solder pot |
| CN102854845A (en) * | 2011-06-27 | 2013-01-02 | 珠海格力电器股份有限公司 | Wave-soldering comprehensive monitoring system |
| CN102854845B (en) * | 2011-06-27 | 2016-01-06 | 珠海格力电器股份有限公司 | wave soldering comprehensive monitoring system |
| CN109623069A (en) * | 2019-01-22 | 2019-04-16 | 湖南机电职业技术学院 | A kind of robot welding system Internet-based and welding procedure |
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| Publication number | Publication date |
|---|---|
| CN100426164C (en) | 2008-10-15 |
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