CN1958864A - Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil - Google Patents

Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil Download PDF

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Publication number
CN1958864A
CN1958864A CN 200510003264 CN200510003264A CN1958864A CN 1958864 A CN1958864 A CN 1958864A CN 200510003264 CN200510003264 CN 200510003264 CN 200510003264 A CN200510003264 A CN 200510003264A CN 1958864 A CN1958864 A CN 1958864A
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CN
China
Prior art keywords
copper foil
litre
electrolytic copper
blending additive
organic blending
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Pending
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CN 200510003264
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Chinese (zh)
Inventor
付强
石晨
唐斌
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Susie (china) Copper Foil Co Ltd
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Susie (china) Copper Foil Co Ltd
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Priority to CN 200510003264 priority Critical patent/CN1958864A/en
Publication of CN1958864A publication Critical patent/CN1958864A/en
Pending legal-status Critical Current

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Abstract

This invention discloses an organic composite additive for manufacturing ultra-thin double-side-smooth electrodeposited copper foil. The organic composite additive is composed of (per unit): poly(ethylene glycol) 5-20 g/L, sodium polydithio-dipropyl sulfonate 500-1000 mg/L, thiourea 100-500 mg/L, and sodium 3-[[(dimethylamino)thioxomethyl]thio]propanesulfonate 30-70 mg/L. The electrodeposited copper foil manufactured by using the organic composite additive has surface roughness less than 0.25 mums. The individual grain of the electrodeposited copper foil is lamellar crystal, and the surface is mirror-like. The electrodeposited copper foil has high tensile strength and high elongation percentage, and can be used as a substitute for calendered copper foil for application in soft printed circuit board and polymeric Li-ion battery. The method for manufacturing the electrodeposited copper foil is simple and low cost compared with that for manufacturing calendered copper foil. Besides, the costs for manufacturing soft printed circuit board and polymeric Li-ion battery can be largely reduced.

Description

Produce the organic blending additive that the ultrathin double-face optical electrolytic copper foil is used
Technical field
The present invention relates to the additive of electrolytic copper foil production usefulness, particularly a kind ofly produce the additive that the ultrathin double-face optical electrolytic copper foil is used.
Background technology
At present, the Copper Foil product is divided into two kinds, rolled copper foil and electrolytic copper foil.The two-sided light face that is of rolled copper foil is mainly used in the electro-conductive material and the polymer Li-ion battery of printed wiring soft board.But all be higher than electrolytic copper foil owing to produce the investment and the production cost of rolled copper foil, and, make that rolled copper foil unit price in the market is more than three, four times of electrolytic copper foil at least because the limitation of the production unit of rolled copper foil directly influences its product length and wide cut.Therefore make that also the production cost of printed wiring soft board and polymer Li-ion battery is very high.Existing electrolytic copper foil is that one side is the light face, and one side is a hair side.The crystallization of the single nucleus crystal grain of Copper Foil is a pyramid-shaped, and more than RZ 〉=3 of Copper Foil product hair side micron, the hair side surfaceness is bigger, therefore is mainly used in the electro-conductive material of printed wiring hardboard.In order to improve the technical indicator of electrolytic copper foil hair side, make it can substitute rolled copper foil, people have done many effort, but up to the present, also do not obtain the ideal effect.
Summary of the invention
The objective of the invention is to, a kind of organic blending additive that the ultrathin double-face optical electrolytic copper foil is used of producing is provided.Solve the bigger technical problem of hair side surfaceness of existing electrolytic copper foil.The electrolytic copper foil that utilizes the present invention to produce, hair side surfaceness be less than 0.25 micron, and have better tensile strength and unit elongation, can replace rolled copper foil to be used for the production of printed wiring soft board and polymer Li-ion battery.Use the succinctly practicality of method that the present invention produces electrolytic copper foil, production cost is significantly less than the production cost of rolled copper foil, can reduce the production cost of printed wiring soft board and polymer Li-ion battery greatly.
Technical scheme of the present invention.Produce the organic blending additive that the ultrathin double-face optical electrolytic copper foil is used, it is characterized in that: the organic blending additive of each unit is to make with following proportion raw material; Polyoxyethylene glycol 5-20 grams per liter, sodium polydithio-dipropyl sulfonate 500-1000 mg/litre, thiocarbamide 100-500 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 30-70 mg/litre.
The organic blending additive that above-mentioned production ultrathin double-face optical electrolytic copper foil is used, the organic blending additive of each unit is to make with following proportion raw material better; Polyoxyethylene glycol 5-15 grams per liter, sodium polydithio-dipropyl sulfonate 600-900 mg/litre, thiocarbamide 100-400 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 30-70 mg/litre.
The organic blending additive that aforesaid production ultrathin double-face optical electrolytic copper foil is used, the organic blending additive of each unit is to make with following proportion raw material better; Polyoxyethylene glycol 5-15 grams per liter, sodium polydithio-dipropyl sulfonate 700-800 mg/litre, thiocarbamide 100-300 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 40-60 mg/litre.
Compared with the prior art, the present invention is a kind of organic blending additive that adopts new raw material and proportioning to make.This Application of Additives has solved the bigger technical problem of hair side surfaceness of existing electrolytic copper foil, has obtained extraordinary technique effect.Utilize the electrolytic copper foil of this Additive Production, the hair side surfaceness is less than 0.25 micron, single crystallization crystal grain is laminated crystalline, be that the layer growth thing has the step edge that is parallel to a certain crystallographic axis of matrix, layer itself comprises countless microcosmic steps, and all steps on the crystal face are expanded along same direction.Its hair side is " minute surface " shape (promptly as minute surface) fully.And have better tensile strength and unit elongation, can replace rolled copper foil to be used for the production of printed wiring soft board and polymer Li-ion battery fully.The method of using this Additive Production electrolytic copper foil is succinctly practical, and production cost is significantly less than the production cost of rolled copper foil, can reduce the production cost of printed wiring soft board and polymer Li-ion battery greatly.
Embodiment
Embodiment 1
The organic blending additive of each unit is made with following proportion raw material; Polyoxyethylene glycol 10 grams per liters, sodium polydithio-dipropyl sulfonate 750 mg/litre, thiocarbamide 200 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 50 mg/litre.
The using method of this organic blending additive is exemplified below:
Getting copper content is that 85g/l, acid content are the electrolytic solution adding electrolyzer of 105g/l, every electrolyzer per hour flow of electrolytic solution is the 30-60 cubic meter, used electrolytic solution is identical with the consumption that the conventional electrolysis Copper Foil is produced, before electrolysis, in electrolytic solution, add organic blending additive by the 400ml/ platform, under 50-55 ℃ condition, carry out electrolysis, in the electrolytic process by adding organic blending additive in the 150-250ml/ branch clockwise electrolytic solution.The hair side of the electrolytic copper foil that this example is prepared is mirror-like, and the crystallization of crystal grain is a laminate structure, and the thickness of Copper Foil is no more than 8 μ m.Through test, the hair side surfaceness is no more than 0.25 μ m, tensile strength 45.3kg/ square millimeter, unit elongation 5.5%.

Claims (3)

1, produce the organic blending additive that the ultrathin double-face optical electrolytic copper foil is used, it is characterized in that: the organic blending additive of each unit is to make with following proportion raw material; Polyoxyethylene glycol 5-20 grams per liter, sodium polydithio-dipropyl sulfonate 500-1000 mg/litre, thiocarbamide 100-500 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 30-70 mg/litre.
2, the organic blending additive used of production ultrathin double-face optical electrolytic copper foil according to claim 1, it is characterized in that: the organic blending additive of each unit is to make with following proportion raw material; Polyoxyethylene glycol 5-15 grams per liter, sodium polydithio-dipropyl sulfonate 600-900 mg/litre, thiocarbamide 100-400 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 30-70 mg/litre.
3, the organic blending additive used of production ultrathin double-face optical electrolytic copper foil according to claim 2, it is characterized in that: the organic blending additive of each unit is to make with following proportion raw material; Polyoxyethylene glycol 5-15 grams per liter, sodium polydithio-dipropyl sulfonate 700-800 mg/litre, thiocarbamide 100-300 mg/litre, methyl thiocarbamoyl propane sulfonic acid sodium 40-60 mg/litre.
CN 200510003264 2005-11-04 2005-11-04 Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil Pending CN1958864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510003264 CN1958864A (en) 2005-11-04 2005-11-04 Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510003264 CN1958864A (en) 2005-11-04 2005-11-04 Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil

Publications (1)

Publication Number Publication Date
CN1958864A true CN1958864A (en) 2007-05-09

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Country Status (1)

Country Link
CN (1) CN1958864A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101935854A (en) * 2010-09-20 2011-01-05 东莞华威铜箔科技有限公司 Preparation method of additive for electrolytic copper foil, product and application thereof
CN103074657A (en) * 2013-02-26 2013-05-01 灵宝华鑫铜箔有限责任公司 Additive for electrolytic copper foil and production process of electrolytic copper foil for 7-mu. m double-light lithium ion battery
CN103397342A (en) * 2013-08-19 2013-11-20 湖北中科铜箔科技有限公司 High heat-resisting electrolytic copper foil and preparation method thereof
CN109082688A (en) * 2018-08-24 2018-12-25 浙江永太科技股份有限公司 A kind of lithium battery two-sided optical ultrathin electrolytic copper foil and preparation method thereof
CN110093640A (en) * 2019-05-13 2019-08-06 江西理工大学 A kind of electrolytic copper foil additive and cathode copper process of surface treatment
CN110552027A (en) * 2019-09-30 2019-12-10 安徽华威铜箔科技有限公司 preparation method of 4.5-micron power lithium battery electrolytic copper foil additive, product and application of product
CN111455414A (en) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 Additive for producing gradual change type electrolytic copper foil
WO2022041534A1 (en) * 2020-08-24 2022-03-03 九江德福科技股份有限公司 Additive for electrolytic copper foil suitable for hdi board, and electrolytic copper foil production process

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101935854A (en) * 2010-09-20 2011-01-05 东莞华威铜箔科技有限公司 Preparation method of additive for electrolytic copper foil, product and application thereof
CN101935854B (en) * 2010-09-20 2011-11-30 东莞华威铜箔科技有限公司 Preparation method of additive for electrolytic copper foil, product and application thereof
CN103074657A (en) * 2013-02-26 2013-05-01 灵宝华鑫铜箔有限责任公司 Additive for electrolytic copper foil and production process of electrolytic copper foil for 7-mu. m double-light lithium ion battery
CN103074657B (en) * 2013-02-26 2015-07-29 灵宝华鑫铜箔有限责任公司 A kind of additive for electrolytic copper foil and 7 μm of two light lithium ion battery electrolytic copper foil production technique
CN103397342A (en) * 2013-08-19 2013-11-20 湖北中科铜箔科技有限公司 High heat-resisting electrolytic copper foil and preparation method thereof
CN103397342B (en) * 2013-08-19 2016-03-30 湖北中科铜箔科技有限公司 A kind of high heat-resisting electrolytic copper foil and preparation method thereof
CN109082688A (en) * 2018-08-24 2018-12-25 浙江永太科技股份有限公司 A kind of lithium battery two-sided optical ultrathin electrolytic copper foil and preparation method thereof
CN110093640A (en) * 2019-05-13 2019-08-06 江西理工大学 A kind of electrolytic copper foil additive and cathode copper process of surface treatment
CN110093640B (en) * 2019-05-13 2020-11-06 江西理工大学 Electrolytic copper foil additive and electrolytic copper surface treatment process
CN110552027A (en) * 2019-09-30 2019-12-10 安徽华威铜箔科技有限公司 preparation method of 4.5-micron power lithium battery electrolytic copper foil additive, product and application of product
CN111455414A (en) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 Additive for producing gradual change type electrolytic copper foil
WO2022041534A1 (en) * 2020-08-24 2022-03-03 九江德福科技股份有限公司 Additive for electrolytic copper foil suitable for hdi board, and electrolytic copper foil production process

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20081226

Address after: International new materials Industrial Park, Baiyun Economic Development Zone, Guizhou, Guiyang Province, China: 550014

Applicant after: Guizhou Xin Copper Electronics Co., Ltd.

Address before: International new materials Industrial Park, Baiyun Economic Development Zone, Guizhou, Guiyang Province, China: 550014

Applicant before: Susie (China) copper foil Co., Ltd.

ASS Succession or assignment of patent right

Owner name: GUIZHOU XINTONGBO ELECTRONICS CO., LTD.

Free format text: FORMER OWNER: SUXI( CHINA ) COPPER COIL CO., LTD.

Effective date: 20081226

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20070509