CN1958209A - 一种激光成形加工装置 - Google Patents
一种激光成形加工装置 Download PDFInfo
- Publication number
- CN1958209A CN1958209A CNA2005101009521A CN200510100952A CN1958209A CN 1958209 A CN1958209 A CN 1958209A CN A2005101009521 A CNA2005101009521 A CN A2005101009521A CN 200510100952 A CN200510100952 A CN 200510100952A CN 1958209 A CN1958209 A CN 1958209A
- Authority
- CN
- China
- Prior art keywords
- laser
- forming device
- control
- produces
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
本发明公开一种激光成形加工装置,其包括:一用于产生激光束的激光发生装置;一用于控制所述激光发生装置产生激光束的控制装置;一用于聚焦所述激光发生装置产生的激光束照射在工件上的聚焦装置;一用于放置工件的工作台,其表面设有至少一热电冷却器,该热电冷却器用于均匀移除加工处产生的热量;及一检测装置,其用于检测工件加工处信息并传输该信息给所述控制装置,构成闭路控制。所述激光图形加工装置可用于电脑、通信、消费性电子与汽车领域的成形加工,其可削除加工面凹凸不平的现象,并使加工处微裂痕减少。
Description
【技术领域】
本发明涉及一种成形加工技术,尤其是关于一种采用激光进行成形加工的装置。
【背景技术】
随着科学技术进步,在电脑、通信、消费性电子与汽车产品及其模具制造中,对各零配件的精细化、精密化的要求越来越高。
零配件的精细化、精密化与切、削、钻孔等成形加工技术密切相关,传统的精细成形加工方法一般有铣削加工、蚀刻加工、放电加工及激光加工等。
铣削加工是利用成形刀具,在电脑的控制下,以旋转接触切削方式对工件进行切削加工。该加工方式受材料及刀具尺寸的影响大,当工件尺寸较小,且为超硬的合金材料时,很难找到合适的刀具来加工工件以获得较好的表面品质。
蚀刻加工是利用化学品腐蚀性能去除材料的加工方法。然而,该方法不适用大量材料去除的场合,且还有加工步骤过于繁琐、尺寸难以控制等不利于加工的因素。
放电加工是利用正、负极逐渐接近产生电弧现象而导致局部高温,使工件表面熔融、蒸发,同时借助加工液与电弧接触、膨胀进而气化所产生的冲击力,将熔融材料去除的加工方法。然而,放电加工的加工速率相对较慢,且容易产生二次放电影响加工工件的品质。
激光加工是利用聚焦装置使激光束聚集成更高功率密度的光束,照射在工件表面,而将工件材料熔融并气化的加工。相对于铣削加工、蚀刻加工及放电加工,激光加工具有加工材料不受限制、加工能量大、速率快等优点。然而,现有的激光加工,光束照射处会有部分未完全蒸发的熔融材料,其会堆积在加工面上,形成重铸层;当熔融材料放热凝固形成重铸层过程中,其放热过程会产生局部热量分散不均,而容易造成加工表面凹凸不平及使加工处产生大量微细裂痕,影响工件的品质及寿命。
因此,有必要提供一种能削除加工表面凹凸不平及使工件加工处微裂痕减少的激光成形加工装置。
【发明内容】
以下将以实施例提供一种激光成形加工装置。
一种激光成形加工装置,其包括:一用于产生激光束的激光发生装置;一用于控制所述激光发生装置产生激光束的控制装置;一用于聚焦所述激光发生装置产生的激光束照射在工件上的聚焦装置;一用于放置工件的工作台,其表面设有至少一热电冷却器,该热电冷却器用于均匀移除加工处过剩的热量;及一检测装置,其用于检测工件加工处信息并传输该信息给所述控制装置,构成闭路控制。
与现有技术相比较,所述激光成形加工装置,采用闭路控制,并在工作台上设置热电冷却器,加工过程中,采用闭路控制可确保成形加工的质量;且由于工作台上的热电冷却器可及时均匀移除成形加工过程中熔融态凝固产生的热量,避免了加工表面凹凸不平,并可使加工处微细裂痕减少。因此,上述的激光成形加工装置,具有可削除工件加工表面凹凸不平及使加工处微裂痕减少的优点。
【附图说明】
图1是本发明实施例成形加工装置示意图。
图2是本发明实施例产品成形加工面粗糙度示意图。
【具体实施方式】
下面将结合附图及实施例对激光成形加工装置作进一步详细说明。
请参阅图1,是本发明实施例的激光成形加工装置示意图,其包括:一用于产生激光束8的激光发生装置1;一用于控制(图中双直线箭头表示控制)所述激光发生装置1产生激光束8的控制装置2;一聚焦装置3,其用于聚焦所述激光发生装置1产生的激光束8照射在工件6上;一用于放置工件6的工作台4,其表面设有至少一热电冷却器4a;及一检测装置5,用于检测(图中虚线箭头表示检测)工件6加工处7表面辐射信息并传输该信息给所述控制装置2,构成闭路控制。
所述激光发生装置1,包括一激光器1a,其由所述控制装置2控制产生激光束8;一带有温度调节的冷却系统1b,其与该激光器1a相连;及一光栏1c,其用于控制激光器1a产生的激光束8射入所述聚焦装置3与否。
该激光器1a为功率较高的固体激光器,例如:波长为1060~1340纳米的Nd:GdVO4激光器(掺钕钒酸钆激光器)、1064纳米的Nd:YAG激光器(钕钇铝石榴石激光器)及波长为1064纳米的Nd:YVO4激光器(掺钕钒酸钇激光器)。优选为二极管泵浦固体激光器。
该控制装置2包括一数据处理器2a,用于接收及处理来自所述检测装置5的信息;及一控制器2b,其接收来自数据处理器2a的控制参数并控制所述激光发生装置1产生激光束8。
该控制参数包括激光脉冲能量、激光脉冲时间及激光脉冲频率。且当所述激光器1a为二极管泵浦固体激光器时,该控制参数也可包括激光光波长。
所述聚焦装置3为多透镜模组,其包括多个透镜,相对于现有技术的单透镜聚焦,可获得更优良的聚焦及变焦性能。而光束聚焦及变焦是成形工艺的重要参数之一,在一定激光功率与加工速度下,处于较佳状态范围的焦点可减少熔融态而不能蒸发的材料,继而降低重铸层形成的厚度,使散热更易均匀,减少微裂痕的产生。
所述工作台4,可在三维空间内任意方向旋转以加工工件6的不同部位。该工作台4表面上设置有至少一热电冷却器4a,根据加工需要,其可设置在该工作台4表面的任意位置。由于工作台4表面上设有热电冷却器4a,该热电冷却器4a具有较快的热反应及散热速度,成形加工时,在加工处7熔融态材料凝固产生过剩的热量可被及时均匀移除,因此避免了加工表面凹凸不平,并可使加工处微细裂痕减少。
所述检测装置5为反应较为灵敏的检测器,可为光电检测器或热电检测器;优选光电检测器。该检测装置5检测加工处7的表面辐射信息,并将信息反馈给所述控制装置2的数据处理器2a,形成闭路控制,以实时控制所述激光器1a产生的激光束8,确保工件成形加工的质量。
进一步,该激光成形加工装置还包括一气体喷吹装置9,用于成形加工时喷吹(图中双直线表示气体喷吹)气体到加工处7,减少所述激光束8的散射及加速被激光束8蒸发后的金属蒸气脱离加工处7。该气体喷吹装置也可与该控制装置2相连,构成闭路控制。
该激光成形加工装置的使用方法包括如下步骤:开启该激光成形加工装置,并在数据处理器2a中设定控制参数,传给控制器2b,控制器2b根据该控制参数控制激光器1a产生激光束8;将待加工工件6置于工作台4上并用夹具4b固定;打开光栏1c,使激光束8进入聚焦装置3并聚焦于工件6的加工处7,由于工作台4上的热电冷却器4a,加工处未蒸发的熔融态材料凝固产生过剩的热量可被及时均匀移除,确保及时均匀散热;检测装置5检测加工后加工处7的表面辐射信息,并反馈给数据处理器2a;数据处理器2a处理该反馈信息,得出控制参数传输给所述控制器2b;控制器2b根据该数据处理器2a所传的控制参数调整激光器1a发光;如此,闭路循环、实时控制成形加工过程,直至工件6加工完成得到产品。
该成形加工工件的材质可为无缝钢、铝合金、锰合金、钛合金、镍合金、锡合金、铜合金、铅合金及各种低碳钢等。
请参阅图2,是本发明实施例成形加工后产品表面粗糙度示意图。通过该成形加工方法所得的产品成形加工表面轮廓算术平均偏差Ra为0.5~2纳米,表面轮廓最大峰高Rp为1.5~6纳米,因此可认为成形加工表面的凹凸不平的现象得以削除。
与现有技术相比较,所述激光成形加工装置,采用闭路控制,并在工作台4上设置热电冷却器4a。加工过程中,采用闭路控制可确保成形加工的质量;且由于工作台4上的热电冷却器4a可及时均匀移除成形加工过程中熔融态凝固产生过剩的热量,避免加工表面凹凸不平,并使加工处微细裂痕减少。因此,上述激光成形加工装置,具有可削除工件加工表面凹凸不平及使加工处微裂痕减少的优点。
Claims (8)
1.一种激光成形加工装置,其特征在于包括:
一用于产生激光束的激光发生装置;
一用于控制所述激光发生装置产生激光束的控制装置;
一聚焦装置,其用于聚焦所述激光发生装置产生的激光束照射在工件上;
一用于放置工件的工作台,其表面设有至少一热电冷却器;及
一检测装置,用于检测工件加工处表面信息并传输该信息给所述控制装置,构成闭路控制。
2.如权利要求1所述激光成形加工装置,其特征在于,该激光发生装置包括一激光器,其由所述控制装置控制产生激光束;一带有温度调节的冷却系统,其与该激光器相连;及一光栏,其用于控制激光器产生的激光束射入所述聚焦装置与否。
3.如权利要求2所述激光成形加工装置,其特征在于,该激光器为二极管泵浦固体激光器。
4.如权利要求1所述激光成形加工装置,其特征在于,该控制装置包括一数据处理器,其用于处理来自所述检测装置的信息;及一控制器,其接收来自所述数据处理器的控制参数并控制所述激光发生装置产生激光束。
5.如权利要求1所述激光成形加工装置,其特征在于,该控制参数包括激光脉冲能量、激光脉冲时间及激光脉冲频率。
6.如权利要求1所述激光成形加工装置,其特征在于,该聚焦装置包括多个透镜。
7.如权利要求1所述激光成形加工装置,其特征在于,该检测装置为光电检测器。
8.如权利要求1至权利要求7的任一项所述激光成形加工装置,其特征在于,该激光成形加工装置还包括一气体喷吹装置,其用于加工时喷吹气体到工件加工处。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2005101009521A CN1958209A (zh) | 2005-11-03 | 2005-11-03 | 一种激光成形加工装置 |
US11/309,502 US20070095802A1 (en) | 2005-11-03 | 2006-08-14 | Laser treatment apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2005101009521A CN1958209A (zh) | 2005-11-03 | 2005-11-03 | 一种激光成形加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1958209A true CN1958209A (zh) | 2007-05-09 |
Family
ID=37994907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2005101009521A Pending CN1958209A (zh) | 2005-11-03 | 2005-11-03 | 一种激光成形加工装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070095802A1 (zh) |
CN (1) | CN1958209A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101909805A (zh) * | 2007-11-26 | 2010-12-08 | 比斯托尼可激光股份有限公司 | 用于具有移动聚焦透镜的激光加工工具的模块化加工头的可替换模块、具有这种可替换模块的模块化加工头、激光加工工具 |
CN101418706B (zh) * | 2008-11-20 | 2010-12-22 | 浙江工业大学 | 一种汽轮机抗气蚀叶片及其成形方法 |
CN103706957A (zh) * | 2013-12-16 | 2014-04-09 | 中山大学 | 一种热电制冷装置及应用该装置的激光加工方法 |
CN104039496A (zh) * | 2011-12-20 | 2014-09-10 | Ipg光子公司 | 高功率纤维激光器泻流孔钻孔装置和使用该装置的方法 |
CN106041335A (zh) * | 2016-07-22 | 2016-10-26 | 深圳市德堡数控技术有限公司 | 一种激光切割机和激光切割多层复合材料的能量控制系统 |
CN110497086A (zh) * | 2019-07-19 | 2019-11-26 | 江苏大学 | 一种基于激光放电改善制孔质量的激光打孔装置及方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8566239B2 (en) * | 2007-02-22 | 2013-10-22 | First Data Corporation | Mobile commerce systems and methods |
DE102010042503A1 (de) * | 2010-10-15 | 2012-04-19 | Siemens Aktiengesellschaft | Lasersystem zur Bearbeitung von Oberflächen sowie entsprechendes Verfahren |
CN106903206B (zh) * | 2017-03-22 | 2018-06-05 | 河南理工大学 | 一种多工艺参数匹配的激光冲击成型模具 |
WO2018227382A1 (en) * | 2017-06-13 | 2018-12-20 | GM Global Technology Operations LLC | Method for laser welding metal workpieces using a combination of weld paths |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734558A (en) * | 1983-05-16 | 1988-03-29 | Nec Corporation | Laser machining apparatus with controllable mask |
JPH0696198B2 (ja) * | 1987-04-30 | 1994-11-30 | ファナック株式会社 | レ−ザ用数値制御装置 |
US4806732A (en) * | 1987-05-14 | 1989-02-21 | Caterpillar Inc. | Multi-power laser seam tracking system |
US5283416A (en) * | 1992-06-26 | 1994-02-01 | Trw Inc. | Laser process monitoring and evaluation |
US6163010A (en) * | 1996-10-25 | 2000-12-19 | E. I. Du Pont De Nemours And Company | Method and apparatus for laser cutting materials |
US6039517A (en) * | 1997-09-30 | 2000-03-21 | Charewicz; Daniel Joseph | Internally cooled magnetic workpiece holder |
US6472295B1 (en) * | 1999-08-27 | 2002-10-29 | Jmar Research, Inc. | Method and apparatus for laser ablation of a target material |
JP3385361B2 (ja) * | 2000-05-09 | 2003-03-10 | 北海道大学長 | レーザ溶接方法及びレーザ溶接装置 |
US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
-
2005
- 2005-11-03 CN CNA2005101009521A patent/CN1958209A/zh active Pending
-
2006
- 2006-08-14 US US11/309,502 patent/US20070095802A1/en not_active Abandoned
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101909805A (zh) * | 2007-11-26 | 2010-12-08 | 比斯托尼可激光股份有限公司 | 用于具有移动聚焦透镜的激光加工工具的模块化加工头的可替换模块、具有这种可替换模块的模块化加工头、激光加工工具 |
CN101418706B (zh) * | 2008-11-20 | 2010-12-22 | 浙江工业大学 | 一种汽轮机抗气蚀叶片及其成形方法 |
CN104039496A (zh) * | 2011-12-20 | 2014-09-10 | Ipg光子公司 | 高功率纤维激光器泻流孔钻孔装置和使用该装置的方法 |
CN103706957A (zh) * | 2013-12-16 | 2014-04-09 | 中山大学 | 一种热电制冷装置及应用该装置的激光加工方法 |
CN103706957B (zh) * | 2013-12-16 | 2015-07-22 | 中山大学 | 一种热电制冷装置及应用该装置的激光加工方法 |
CN106041335A (zh) * | 2016-07-22 | 2016-10-26 | 深圳市德堡数控技术有限公司 | 一种激光切割机和激光切割多层复合材料的能量控制系统 |
CN106041335B (zh) * | 2016-07-22 | 2018-01-23 | 深圳市德堡数控技术有限公司 | 一种激光切割机和激光切割多层复合材料的能量控制系统 |
CN110497086A (zh) * | 2019-07-19 | 2019-11-26 | 江苏大学 | 一种基于激光放电改善制孔质量的激光打孔装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
US20070095802A1 (en) | 2007-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1958209A (zh) | 一种激光成形加工装置 | |
KR102404336B1 (ko) | 청색 레이저를 사용한 구리 용접 방법 및 시스템 | |
Hanon et al. | Experimental and theoretical investigation of the drilling of alumina ceramic using Nd: YAG pulsed laser | |
WO2022127942A1 (zh) | 一种基于脉冲激光控制熔池流动的激光复合增材制造及连接方法 | |
CN112518109B (zh) | 应用于异种金属复合热源焊接的高频激光脉冲方法 | |
CN1966197A (zh) | 一种激光加工系统及加工方法 | |
Hajavifard et al. | The effects of pulse shaping variation in laser spot-welding of aluminum | |
Liu et al. | Oxygen content and morphology of laser cleaned 5083 aluminum alloy and its influences on weld porosity | |
JP6777023B2 (ja) | 積層金属箔の溶接方法 | |
Pathak et al. | Application of Laser Technology in the Mechanical and Machine Manufacturing Industry | |
Huang et al. | Interactional relations between ablation and heat affected zone (HAZ) in laser cutting of glass fiber reinforced polymer (GFRP) composite by fiber laser | |
CN110280915A (zh) | 一种基于水下打孔改善制孔质量的激光打孔装置及方法 | |
Yürekli et al. | Additive manufacturing of binary Al-Li alloys | |
CN115570783A (zh) | 脉冲激光选区熔化一体化成型系统及方法 | |
US20230249290A1 (en) | Laser deburring and chamfering method and system | |
CN111139473A (zh) | 一种陶瓷颗粒增强金属基复合材料复合脉冲激光加工方法 | |
CN111545755A (zh) | 一种紫外激光3d打印铜和铜合金的方法及其装置 | |
Deng et al. | Optics and Apparatus for Solid State Laser Micro-processing | |
Brown et al. | High-brightness laser cutting & drilling of aerospace materials | |
CN117620223A (zh) | 一种水导激光辅助激光定向能量沉积的装置及方法 | |
TWI352004B (en) | A laser patterning apparatus | |
CN116728001B (zh) | 一种晶粒梯度细化的高完整性金属材料表面加工方法 | |
Bolin | Nd: YAG laser applications survey | |
CN112207429B (zh) | 基于三光束的复合激光增材制造方法及装置 | |
SADEGH | An intelligent knowledge based system for CO2 laser beam machining for optimization of design and manufacturing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |