CN1939661A - Cutting device - Google Patents
Cutting device Download PDFInfo
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- CN1939661A CN1939661A CN 200610139548 CN200610139548A CN1939661A CN 1939661 A CN1939661 A CN 1939661A CN 200610139548 CN200610139548 CN 200610139548 CN 200610139548 A CN200610139548 A CN 200610139548A CN 1939661 A CN1939661 A CN 1939661A
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- object lens
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- 238000005520 cutting process Methods 0.000 title claims abstract description 121
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000003754 machining Methods 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 143
- 238000012216 screening Methods 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 14
- 238000003384 imaging method Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 40
- 230000008093 supporting effect Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000005755 formation reaction Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000020347 spindle assembly Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Abstract
A cutting device comprises an alignment means equipped with an imaging means having an objective lens for detecting the machining region of a workpiece held on a chuck table, and a cutting means for cutting the workpiece held on the chuck table is further provided with a means for shielding the lower part of a case containing the objective lens of the imaging means. The shielding means comprises a guide member attached to the lower end of the objective lens case at right angles to the optical axis of the objective lens and having a first hole corresponding to the objective lens case, and a shielding member composed of a flexible sheet material and arranged movably on the under side of the guide member and having a second hole corresponding to the first hole, and an operating means for moving the shielding member along the lower surface of the guide member and positioning the shielding member at the position which is an action position wherein the second hole opposes the first hole and a position for shielding the first hole. The cutting device is capable of preventing the splash of cutting water scattered through cutting by a cutting means from adhering to the objective lens of an imaging means.
Description
Technical field
The present invention relates to a kind of topping machanism that cuts machined objects such as semiconductor wafer.
Background technology
For example, in semiconductor devices manufacturing process, by form the cancellate loop that forms IC, LSI etc. on a plurality of zones that preset lines divides of cutting apart that is called as the working face passage on the surface of the semiconductor wafer of circular plate shape roughly, each zone that forms this loop is cut apart along cutting apart preset lines, made semiconductor chip one by one.The general topping machanism that uses to cutter sweep of segmenting device as dividing semiconductor wafer.This topping machanism has the clamping platform that keeps machined object, the aligning guide of cutting zone to be detected the machined object that remains on this clamping platform, and will remain on the cutting mechanism that the machined object that is aligned on the clamping platform is cut.
In this kind topping machanism, proposed a kind of for improving stock-removing efficiency, have 2 clamping platforms, to remaining on during a machined object on the clamping platform implements cutting operation, the machined object that remains on another clamping platform is implemented to aim at operation, can not stop cutting mechanism and the topping machanism (for example with reference to Japanese documentation 1) of high-efficient cutting.
Patent documentation 1: TOHKEMY 2003-163178 communique
Invent technical problem to be solved
In above-mentioned topping machanism, implement the cutting zone of cutting operation and be set on the mobile route of clamping platform by the alignment area that aligning guide implements to aim at operation by cutting mechanism.Thereby when the clamping platform that keeps machined object being moved to cutting zone and implementing cutting operation by cutting mechanism, the spittle that exists cutting water can be attached on the aligning guide, pollutes the problem of object lens of the image mechanism of aligning guide.
Summary of the invention
The present invention In view of the foregoing makes, and the spittle that its major subjects provides a kind of cutting water that splashes because of the cutting of cutting mechanism can be attached to the topping machanism on the object lens of the image mechanism of aligning guide.
The scheme of technical solution problem
In order to solve above-mentioned major technology problem, the invention provides a kind of topping machanism, have: the clamping platform keeps machined object; Aligning guide has image mechanism, and this image mechanism has and will be maintained at the object lens of wanting machining area to be detected of the machined object on this clamping platform; Cutting mechanism is implemented machining to the machined object that remains on this clamping platform; Has the means for screening that the below of the object lens case of these object lens that will take in this image mechanism is covered, this means for screening has: guiding part, in the lower end of object lens case relatively this objective lens optical axis be mounted with meeting at right angles and have and corresponding the 1st hole of this object lens case; Curtain-shaped cover member is arranged on this guiding part downside movably and has and corresponding the 2nd hole, the 1st hole, constitutes by having flexual sheet material; Actuating mechanism makes this curtain-shaped cover member move along the lower surface of this guiding part, is located at opposed active position in the 2nd hole and the 1st hole and the hidden position of covering the 1st hole.
Above-mentioned actuating mechanism is made of air slide mechanism, and this air slide mechanism has: cylinder body, and the piston rod that is mounted slidably the piston in this cylinder body and is connected with this piston, this piston rod is connected with this curtain-shaped cover member.In addition, above-mentioned actuating mechanism is set on the main body of this image mechanism, so that the glide direction of this piston parallels with the optical axis of these object lens.
The effect of invention
According to topping machanism of the present invention, punctual curtain-shaped cover member with means for screening is positioned on the active position, implement alignment process.And because in cutting process, the curtain-shaped cover member of means for screening is positioned on the hidden position, and rinse water De Fei Droplets is covered by curtain-shaped cover member and can not pollute the object lens of image mechanism.
Description of drawings
Fig. 1 be the topping machanism that constitutes according to the present invention want portion's stereogram.
Fig. 2 is the exploded perspective view of the means for screening installed on the image mechanism that is provided in the topping machanism shown in Figure 1.
Fig. 3 illustrates the stereogram that means for screening shown in Figure 2 is installed to the state on the image mechanism.
Fig. 4 is the stereogram that the cutting mechanism of topping machanism shown in Figure 1 is shown.
Fig. 5 is the A-A profile among Fig. 1.
Fig. 6 is the key diagram of cutting position that the bite of the bite of the 1st cutting mechanism that is equipped with on the topping machanism shown in Figure 1 and the 2nd cutting mechanism is shown.
The most preferred embodiment of invention
Below, with reference to the preferred embodiment of accompanying drawing, be described in detail the topping machanism that constitutes according to the present invention.
Fig. 1 shows the stereogram of wanting portion of the topping machanism that constitutes according to the present invention.
Topping machanism shown in Figure 1 has support 2.On this support 2, disposing the clamping platform mechanism 3 that keeps machined object and move to the cutting direction of feed shown in the arrow X.
Clamping platform mechanism 3 in the illustrated embodiment has the 1st guide rail 31a and the 2nd guide rail 31b that is arranged on above the support 2.The 1st guide rail 31a and the 2nd guide rail 31b are made of pair of tracks parts 311,311 respectively, in the drawings, extend setting in parallel to each other along the cutting direction of feed shown in the arrow X.On the 1st guide rail 31a and the 2nd guide rail 31b, along the 1st guide rail 31a and the 2nd guide rail 31b the 1st supporting station 32a and the 2nd supporting station 32b are being set movably respectively.Promptly, constitute: on the 1st supporting station 32a and the 2nd supporting station 32b, be respectively equipped with and be guided groove 321,321, chimeric by the pair of tracks parts 311,311 that this are guided groove 321,321 and formation the 1st guide rail 31a and the 2nd guide rail 31b, the 1st supporting station 32a and the 2nd supporting station 32b can be moved along the 1st guide rail 31a and the 2nd guide rail 31b.
On the 1st supporting station 32a and the 2nd supporting station 32b, be equipped with the 1st cylinder part 33a and the 2nd cylinder part 33b respectively,, rotatably be equipped with the 1st clamping platform 34a and the 2nd clamping platform 34b respectively in the upper end of the 1st cylinder part 33a and the 2nd cylinder part 33b.The 1st clamping platform 34a and the 2nd clamping platform 34b are made of the suitable porous material as the porous ceramic, and are connected with not shown attraction mechanism.Therefore, the 1st clamping platform 34a and the 2nd clamping platform 34b are communicated with selectively with the attraction source, attract keeping the machined object of mounting on mounting surface 341,341 by not shown attraction mechanism.In addition, the 1st clamping platform 34a and the 2nd clamping platform 34b can suitably rotate by the impulse motor (not shown) that is arranged in the 1st cylinder part 33a and the 2nd cylinder part 33b respectively.And, upper end at the 1st cylinder part 33a and the 2nd cylinder part 33b, hole with perforation the 1st clamping platform 34a and the 2nd clamping platform 34b is being set respectively, and is covering the 1st cover 35a and the 2nd cover 35b of above-mentioned the 1st supporting station 32a and the 2nd supporting station 32b respectively.Be provided with the 1st 36a of blade testing agency and the 2nd 36b of blade testing agency that the position that detects the aftermentioned bite is respectively used at the 1st cover 35a with above the 2nd cover 35b.
Proceed explanation according to Fig. 1, the clamping platform mechanism 3 in the illustrated embodiment has makes the 1st clamping platform 34a and the 2nd clamping platform 34b be moved the 1st cutting feed mechanism 37a and the 2nd cutting feed mechanism 37b of usefulness respectively by the cutting direction of feed shown in the arrow X along the 1st guide rail 31a and the 2nd guide rail 31b in Fig. 1.The 1st cutting feed mechanism 37a and the 2nd cutting feed mechanism 37b are respectively by the external thread rod 371 that be arranged in parallel between the pair of tracks parts 311,311 that constitute the 1st guide rail 31a and the 2nd guide rail 31b, one bearing at end 372 of rotatably mounted external thread rod 371, and impulse motor 373 formations that are connected and drive these external thread rod 371 forward or reverse with the other end of external thread rod 371.The 1st cutting feed mechanism 37a that so constitutes and the 2nd cutting feed mechanism 37b make external thread rod 371 and internal thread 322 threaded engagement that are formed on above-mentioned the 1st supporting station 32a and the 2nd supporting station 32b respectively.Therefore, the 1st cutting feed mechanism 37a and the 2nd cutting feed mechanism 37b drive external thread rod 371 forward or reverse by driving pulse motor 373 respectively, the 1st clamping platform 34a and the 2nd clamping platform 34b that is arranged on above-mentioned the 1st supporting station 32a and the 2nd supporting station 32b can be moved by the cutting direction of feed shown in the arrow X in Fig. 1 along the 1st guide rail 31a and the 2nd guide rail 31b respectively.
Topping machanism in the illustrated embodiment has the bearing support 4 of the door type of crossing over above-mentioned the 1st guide rail 31a and the 2nd guide rail 31b and being provided with.This type bearing support 4 is by the 1st post portion 41 that is arranged on the 1st guide rail 31a side, be arranged on the 2nd post portion 42 of the 2nd guide rail 31b side, with the upper end that is connected the 1st post portion 41 and the 2nd post portion 42 and along perpendicular to the cutting direction of feed shown in the arrow X, constitute by the support 43 of the index feed direction setting shown in the arrow Y, central portion is provided with the opening 44 that allows above-mentioned the 1st clamping platform 34a and the 2nd clamping platform 34b to move.The upper end of the 1st post portion 41 and the 2nd post portion 42 forms the ground broad respectively, is provided with the opening 411 and 421 that the spindle assemblies that allows cutting mechanism described later moves respectively in this upper end.On above-mentioned support 43 1 sides' face along being provided with pair of guide rails 431,431 by the index feed direction shown in the arrow Y, on the opposing party's face as shown in Figure 5, along being provided with pair of guide rails 432,432 perpendicular to the direction of paper (in Fig. 1 by the index feed direction shown in the arrow Y).
Topping machanism in the illustrated embodiment has the 1st aligning guide 5a and the 2nd aligning guide 5b that is set up movably along the pair of guide rails 431,431 that is provided with on the support 43 of above-mentioned door type bearing support 4.The 1st aligning guide 5a and the 2nd aligning guide 5b are used to make this movable block 51 to constitute along travel mechanism 52,52 that pair of guide rails 431,431 moves and the image mechanism structure 53,53 that is installed on the movable block 51 respectively by movable block 51.On movable block 51,51, be respectively equipped with above-mentioned pair of guide rails 431,431 chimeric be guided groove 511,511, be entrenched on the pair of guide rails 431,431 by this being guided groove 511,511, can move along pair of guide rails 431,431 and constitute movable block 51,51.
Travel mechanism 52,52 is respectively by the external thread rod 521 that be arranged in parallel between pair of guide rails 431,431, rotatably mounted external thread rod 521 1 bearing at end 522, and impulse motor 523 formations that are connected and drive these external thread rod 521 forward or reverse with the other end of external thread rod 521.So the travel mechanism 52,52 that constitutes makes external thread rod 521 and internal thread 2 threaded engagement that are formed on the above-mentioned movable block 51,51 respectively.Therefore, travel mechanism 52,52 is by driving pulse motor 523 respectively and drive external thread rod 521 forward or reverse, movable block 51,51 can be moved by the index feed direction shown in the arrow Y in Fig. 1 along pair of guide rails 431,431.
The 1st aligning guide 5a and the 2nd aligning guide 5b in the illustrated embodiment have the means for screening 54 that the below of above-mentioned object lens 533 is covered.With reference to Fig. 2 and Fig. 3 this means for screening 54 is described.
Means for screening 54 in the illustrated embodiment has the guiding part 55 that the optical axis at the relative object lens 532 in the lower end of object lens case 533 meets at right angles and installs, be arranged on the curtain-shaped cover member 56 of these guiding part 55 downsides movably and with this curtain-shaped cover member 56 mobile actuating mechanism 57 below guiding part 55.
Guiding part 55 is made of the tubular installation portion 552 that forms OBL guidance part 551 and this guidance part 551 is installed on the bottom of object lens case object lens case 533.Guidance part 551 has at central portion and object lens case 533 corresponding the 1st hole 551a, a pair of guide channel 551b, the 551c of opposed formation alongst in its lower section.Tubular installation portion 552 upright setting around the 1st hole 551a forms.So the guiding part 55 that constitutes is entrenched in the bottom of object lens case 533 with tubular installation portion 552, by fixed mechanisms such as bonding agent or Screws, is installed on the object lens case 533.
Curtain-shaped cover member 56 has flexible sheet material formation by having PETG (PET) resin etc., is provided with corresponding the 2nd hole 56a with above-mentioned the 1st hole 551a on the precalculated position.So the curtain-shaped cover member 56 that forms is constituted as, and is fastened among a pair of guide channel 551b, the 551c that the guidance part 551 that constitutes above-mentioned guiding part 55 forms below by both sides, and can moves below guidance part 551.Therefore, by will be arranged on the 2nd hole 56a on the curtain-shaped cover member 56 be positioned at the opposed release position of above-mentioned the 1st hole 551a on, can realize the shooting of passing through object lens case 533 by image mechanism 53.In addition, it has moved on the hidden position of the amount that is at least the diameter that is equivalent to the 2nd hole 56a from above-mentioned release position by curtain-shaped cover member 56 is positioned at, and covers to live in to state the 1st hole 551a.And, on an end of curtain-shaped cover member 56, be provided with and be used for 2 hole 56b, 56b being connected with actuating mechanism 57.
The actuating mechanism 57 of above-mentioned formation as shown in Figure 3, the fixed mechanism by suitable is installed to cylinder body 571 on the main body 531 of image mechanism structure 53, so that the glide direction of piston 572 parallels with the optical axis of object lens 532.And attaching parts 574 are positioned at the top of length direction one end of the guidance part 551 that constitutes guiding part 55.For this reason, roughly be bent into the right angle by having curtain-shaped cover member 56 that flexual sheet material constitutes length direction one end margin from guidance part 551.Therefore, actuating mechanism 57 can move curtain-shaped cover member 56 by with the above-below direction action of piston rod 573 in Fig. 3 below the guidance part 551 that constitutes guiding part 55.Promptly, when the piston rod 573 that makes actuating mechanism 57 when moving by the lower position shown in the solid line, then curtain-shaped cover member 56 is positioned in the above-mentioned release position shown in the solid line among Fig. 3, when making piston rod 573 position when action upward, then curtain-shaped cover member 56 is positioned among Fig. 3 with the above-mentioned hidden position shown in the double dot dash line.By forming curtain-shaped cover member 56 by having flexual sheet material, it is easy that the configuration of actuating mechanism 57 becomes.
Return Fig. 1 and go on to say, on the another side (with the opposite face of face that is provided with above-mentioned the 1st aligning guide 5a and the 2nd aligning guide 5b) of the support 43 that constitutes above-mentioned door type bearing support 4, be provided with the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b.With reference to Fig. 4 and Fig. 5 the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b are described.The 1st cutting mechanism 6a and the 2nd cutting mechanism 6b have calibration travelling carriage 61 and feeding travelling carriage 62 and spindle assemblies 63 respectively.Calibration travelling carriage 61 is constituted as, on a side face, be provided with and be guided groove 611,611, this be guided groove 611,611 and the pair of guide rails 432,432 that is arranged on the another side of above-mentioned support 43 chimeric, be entrenched on the pair of guide rails 432,432 by this being guided groove 611,611, calibration travelling carriage 61 can move along pair of guide rails 432,432.In addition, on the another side of calibration travelling carriage 61, as shown in Figure 5, along being provided with pair of guide rails 612,612 (in Fig. 5, only showing a side guide rail) by the direction of feed shown in the arrow Z (with the perpendicular direction of the mounting surface 341 of the 1st clamping platform 34a and the 2nd clamping platform 34b).And, on a side's of calibration travelling carriage 61,61 face, be provided with the escape 613,613 of the external thread rod break-through that allows index feed described later mechanism in the above-below direction section of setting poorly.
Above-mentioned feeding travelling carriage 62 by the portion that is supported 621 of extending at above-below direction and from this be supported portion 621 lower ends at right angles eye, constitute along horizontally extending installation portion 622.As shown in Figure 4, be provided with on the face of installation portion 622 sides in being supported portion 621 and be guided groove 623,623 (in Fig. 5, only showing a side the groove that is guided), this is guided groove 623,623 and the last on the other hand pair of guide rails 612,612 that is provided with of above-mentioned calibration travelling carriage 61 is chimeric, by this being guided groove and pair of guide rails 612,612 is chimeric, feeding travelling carriage 62 can be along pair of guide rails 612,612 to constituting of being moved by the direction of feed shown in the arrow Z.Like this, the feeding travelling carriage 62 that is installed on the calibration travelling carriage 61 is configured to, as shown in Figure 1, installation portion 622 is from the opposing party's of above-mentioned calibration travelling carriage 61 that a type bearing support 4 is housed side, and is outstanding to the side's that above-mentioned the 1st aligning guide 5a and the 2nd aligning guide 5b are housed side by opening 44.
Above-mentioned spindle assemblies 63 is installed in the lower surface of the installation portion 622 of the feeding travelling carriage 62 that is formed the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b, installation portion 622 respectively.This spindle assemblies 63 as shown in Figure 4, has main shaft housing 631 respectively, rotatable rotary main shaft 632 by these main shaft housing 631 supportings, be installed in the bite 633 of these rotary main shaft 632 1 ends, supply with the cutting water supplying pipe 634 of cutting water, cover the cutter cover 635 of bite 633 and the not shown servo motor that rotation drives rotary main shaft 632, the axis direction of rotary main shaft 632 is along being provided with by the index feed direction shown in the arrow Y.And the bite 633 of the 1st cutting mechanism 6a and the bite 633 of the 2nd cutting mechanism 6b are set up opposed to each other.
The 1st cutting mechanism 6a in the illustrated embodiment and the 2nd cutting mechanism 6b have the index feed mechanism 64,64 that above-mentioned calibration travelling carriage 61,61 is moved usefulness along pair of guide rails 432,432 in Fig. 1 by the index feed direction shown in the arrow Y.Index feed mechanism 64,64 is respectively by the external thread rod 641 that be arranged in parallel between pair of guide rails 432,432, rotatably mounted external thread rod 641 ground one bearing at end 642 is with impulse motor 643 formations that are connected and drive these external thread rod 641 forward or reverse with the external thread rod other end.And, external thread rod 641,641 be set at respectively with escape 613, the 613 corresponding height and positions that are located on the above-mentioned calibration travelling carriage 61,61 on.So the index feed mechanism 64,64 that constitutes makes external thread rod 641,641 respectively and internal thread 614,614 threaded engagement of formation on above-mentioned index feed travelling carriage 61,61.Therefore, index feed mechanism 64,64 is by difference driving pulse motor 643,643, and drive external thread rod 641,641 forward or reverse, calibration travelling carriage 61,61 can be moved by the index feed direction shown in the arrow Y in Fig. 1 along pair of guide rails 432,432.This calibration travelling carriage 61,61 is when moving, and external thread rod 641,641 allows calibration travelling carriage 61,61 to move by being passed in the escape 613,613 that is provided with on the calibration travelling carriage 61,61.
In addition, the 1st cutting mechanism 6a in the illustrated embodiment and the 2nd cutting mechanism 6b as Fig. 4 and shown in Figure 5, have feeding travelling carriage 62,62 along pair of guide rails 612,612 to the feed mechanism 65,65 that is moved by the direction of feed shown in the arrow Z.Feed mechanism 65,65 is respectively by the external thread rod 651 that be arranged in parallel with pair of guide rails 612,612, rotatably mounted external thread rod 651 1 bearing at end 652 are connected with the other end of external thread rod 651 and the impulse motor 653 that drives these external thread rod 651 forward or reverse constitutes.So the feed mechanism 65,65 that constitutes make respectively external thread rod 651 with in the above-mentioned internal thread 622a threaded engagement that forms in the portion that is supported 621 of travelling carriage 62 into of cutting.Therefore,, drive external thread rod 651 forward or reverse, feeding travelling carriage 62 can be moved by the direction of feed shown in the arrow Z in Fig. 1 and Fig. 5 along pair of guide rails 622,622 by feed mechanism 65,65 difference driving pulse motors 653.
As above constituted the topping machanism in the illustrated embodiment, mainly described with regard to its action below with reference to Fig. 1.
At first, by not shown machined object conveying mechanism, will be transported to as the semiconductor wafer W (with reference to Fig. 6) of machined object on the 1st clamping platform 34a.This moment, the 1st clamping platform 34a was positioned in machined object loading position shown in Figure 1.And semiconductor wafer W forms cancellate a plurality of preset lines (working face passage) of cutting apart by the surface, forms a plurality of OBL zones, forms device respectively in these a plurality of OBL zones.So the semiconductor wafer W that forms pastes the surface of the boundary belt of installing on not shown annular support.The semiconductor wafer W of mounting on the 1st clamping platform 34a is attracted and remains on the 1st clamping platform 34a and go up (the 1st machined object keeps operation) under not shown attraction mechanism action.
Attract the 1st clamping platform 34a that keeps to pass through the 1st action of cutting feed mechanism 37a above-mentioned semiconductor wafer W, be moved on the 1st alignment area 50a.Then, make travel mechanism 52 action of the 1st aligning guide 5a, with the image mechanism structure 53 of the 1st aligning guide 5a be positioned at the 1st clamping platform 34a directly over.Then, make actuating mechanism 57 actions of means for screening 54, curtain-shaped cover member 56 is positioned at above-mentioned release position, the 1st hole 551a and the 2nd hole 56b are aimed at.Next,, take the surface that remains on the semiconductor wafer W on the 1st clamping platform 34a, detect and be formed on the lip-deep working face passage of semiconductor wafer W as cutting zone by the image mechanism structure 53 of the 1st aligning guide 5a.Then, make index feed mechanism 64 actions of the index feed mechanism 64 of the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b, implement to aim at each bite 633 and aim at (the 1st alignment process) by position, above-mentioned image mechanism structure 53 detected working face passage ground.
To remaining on during semiconductor wafer 10 on the 1st clamping platform 34a implements the 1st alignment process, by not shown machined object conveying mechanism, will be transported to as the semiconductor wafer W of machined object on the 2nd clamping platform 34b that is positioned on the machined object loading position, ground shown in Figure 1.The semiconductor wafer W of mounting on the 2nd clamping platform 34b done by not shown attraction mechanism earthquake, is attracted to remain on the 2nd clamping platform 34b upward (the 2nd machined object maintenance operation).
As crossing semiconductor wafer W is attracted to remain on the 2nd clamping platform 34b, then the 2nd clamping platform 34b is moved on the 2nd alignment area 50b by the action of the 2nd cutting feed mechanism 37b.Then, make travel mechanism 52 action of the 2nd aligning guide 5b, make the image mechanism structure 53 of the 2nd aligning guide 5b be positioned at the 2nd clamping platform 34b directly over.Then, make actuating mechanism 57 actions of means for screening 54, curtain-shaped cover member 56 is positioned at above-mentioned release position, the 1st hole 551a and the 2nd hole 56b are aimed at.Next, by the 2nd aligning guide 5b, enforcement will remain on the 2nd alignment process that zone that the semiconductor wafer W on the 2nd clamping platform 34b will cut is detected.And the 2nd alignment process and above-mentioned the 1st alignment process are similarly implemented.
On the one hand, if above-mentioned the 1st alignment process finishes, then make actuating mechanism 57 actions of means for screening 54, and curtain-shaped cover member 56 is positioned at above-mentioned hidden position, the 2nd hole 56a is backed out from the 1st hole 551a, cover the 1st hole 551a with the shielding portion 561 of curtain-shaped cover member 56.Then, the 1st clamping platform 34a is moved to cutting zone.Then, make index feed mechanism 64 actions of the 1st cutting mechanism 6a, as shown in Figure 6, the bite 633 of the 1st cutting mechanism 6a is positioned at and is formed on by on the corresponding position of central working face passage on the semiconductor wafer W of the 1st clamping platform 34a maintenance, further make feed mechanism 65 actions, bite 633 is descended, and be positioned on the predetermined supplying position.In addition, make index feed mechanism 64 actions of the 2nd cutting mechanism 6b, the bite 633 of the 2nd cutting mechanism 6b is positioned at and is formed on by on the corresponding position of working face passage, top on the semiconductor wafer W of the 1st clamping platform 34a maintenance, further make feed mechanism 65 actions, bite 633 is descended, to be positioned on the predetermined supplying position.Then, make bite 633 rotations of bite 633 and the 2nd cutting mechanism of the 1st cutting mechanism 6a by one side, one side makes the 1st cutting feed mechanism 37a action, the 1st clamping platform 34a is moved by the cutting direction of feed shown in the arrow X1 in Fig. 5, make the semiconductor wafer W that remains on the 1st clamping platform 34a be subjected to the effect of the bite 633 of the bite 633 of the 1st cutting mechanism 6a of rotation at a high speed and the 2nd cutting mechanism 6b, with along above-mentioned predetermined working face passage cutting (the 1st cutting process).
In the 1st above-mentioned cutting process, supply with cutting water to cutting portion by cutting water supplying pipe 634,634.The bite 633 of this cutting water by the 1st cutting mechanism 6a and the rotation of the bite 633 of the 2nd cutting mechanism 6b are splashed to the front and back of cutting direction of feed.The spittle part that this splashes is splashed to the 1st aligning guide 5a side.Yet, be positioned on the above-mentioned hidden position owing to be installed in the curtain-shaped cover member 56 of the means for screening 54 on the image mechanism structure 53 of the 1st aligning guide 5a, so the spittle of rinse water is covered by curtain-shaped cover member 56, and can not pollute the object lens 532 of image mechanism structure 53.
If along the predetermined above-mentioned semiconductor wafer W that keeps by the 1st clamping platform 34a of working face passage cutting, then make the index feed mechanism 64 of the 1st cutting mechanism 6a and index feed mechanism 64 actions of the 2nd cutting mechanism 6b, make the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b only in Fig. 1, move (index feed operation), implement the 1st above-mentioned cutting process by the index feed direction shown in the arrow Y1 with the amount of space of working face passage.So, by implementing index feed operation and the 1st cutting process repeatedly, semiconductor wafer W is just cut along the entire working surface passage that forms in a predetermined direction.If the entire working surface passage cutting semiconductor wafer W along being formed on predetermined direction then makes the 1st clamping platform 34a that keeps semiconductor wafer W revolve and turn 90 degrees.And by the semiconductor wafer W that remains on the 1st clamping platform 34a is implemented above-mentioned index feed operation and the 1st cutting process repeatedly, semiconductor wafer W is just cut along forming cancellate entire working surface passage, and is divided into each sheet.And, even, also paste on the boundary belt of installing on the not shown annular support, therefore can keep wafer form not at random because semiconductor wafer W is divided into each sheet.
After if the 1st above-mentioned cutting process finishes, the 2nd clamping platform 34b that the semiconductor wafer W of implementing above-mentioned the 2nd alignment process is kept moves to the 2nd cutting zone 60b (with reference to Fig. 2).In addition, make actuating mechanism 57 actions of the means for screening 54 on the image mechanism structure 53 that is contained in the 2nd aligning guide 5b, curtain-shaped cover member 56 is positioned on the above-mentioned hidden position, the 2nd hole 56a is backed out from the 1st hole 551a, cover the 1st hole 551a with the shielding portion 561 of curtain-shaped cover member 56.Then, after implementing the 1st cutting process,, the semiconductor wafer W that is kept by the 2nd clamping platform 34b is implemented 2nd cutting process identical with the 1st above-mentioned cutting process by the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b.In the 2nd cutting process, supply with water pipe 634,634 by cutting and supply with cutting water to cutting portion.This cutting water splashes because of the rotation of the bite 633 of the bite 633 of the 1st cutting mechanism 6a and the 2nd cutting mechanism 6b, and a spittle part of splashing is splashed to the 2nd aligning guide 5b side.But, be positioned in above-mentioned hidden position owing to be installed in the curtain-shaped cover member 56 of the means for screening 54 on the image mechanism structure 53 of the 2nd aligning guide 5b, so the spittle of rinse water is covered by curtain-shaped cover member 56, and can not pollute the object lens 532 of image mechanism structure 53.
During the 2nd cutting process of stating on the implementation, the 1st clamping platform 34a with the semiconductor wafer W of the 1st cutting process that is through with is kept moves to the machined object loading position from the 1st cutting zone 60a.At this, the attraction that is divided into the semiconductor wafer W of each sheet that is kept by the 1st clamping platform 34a keeps being disengaged.And the semiconductor wafer W that is split into each sheet is transported to following operation by not shown machined object conveying mechanism.
As mentioned above, be transported to ensuing operation, then on the 1st clamping platform 34a, implement above-mentioned the 1st machined object that ensuing semiconductor wafer W keeps is kept operation if will be split into the semiconductor wafer W of each sheet.And, sequentially implement the 1st above-mentioned alignment process, the 1st cutting process.
On the other hand, during implementing the 1st cutting process with respect to the ensuing semiconductor wafer W that is kept by the 1st clamping platform 34a, the 2nd clamping platform 34b that the semiconductor wafer W of having implemented above-mentioned the 2nd cutting process is kept moves to the machined object loading position from the 2nd cutting zone 60b.At this, the attraction of removing the semiconductor wafer W that is split into each sheet that is kept by the 2nd clamping platform 34b keeps.And, be split into the conveying mechanism of the semiconductor wafer W of each sheet by not shown machined object, be transported to following operation.So, be transported to ensuing operation, then on the 2nd clamping platform 34b, implement above-mentioned the 2nd machined object that ensuing semiconductor wafer W keeps is kept operation if will be split into the semiconductor wafer W of each sheet.And, sequentially implement the 2nd above-mentioned alignment process, the 2nd cutting process.
More than, describe the present invention in accordance with the embodiments illustrated, but the present invention is not limited to embodiment, in the scope of aim of the present invention, can carry out various distortion.For example, in illustrated embodiment, illustrated and be applicable to the example with topping machanism of 2 clamping platforms of the present invention, be 1 topping machanism but the present invention also is applicable to the clamping platform, and can obtain same effect and effect.
Claims (3)
1, a kind of topping machanism is characterized in that, has: the clamping platform is used to keep machined object; Aligning guide has image mechanism, and this image mechanism has and will be maintained at the object lens of wanting machining area to be detected of the machined object on this clamping platform; Cutting mechanism is implemented machining to the machined object that remains on this clamping platform,
It also has the means for screening that the below of object lens case of taking in these object lens of this image mechanism is covered, this means for screening has: guiding part, in the lower end of object lens case relatively this objective lens optical axis be mounted with meeting at right angles and have and corresponding the 1st hole of this object lens case; Curtain-shaped cover member is arranged on this guiding part downside movably and has and corresponding the 2nd hole, the 1st hole, is to constitute by having flexual sheet material; Actuating mechanism makes this curtain-shaped cover member move along the lower surface of this guiding part, is located at opposed active position in the 2nd hole and the 1st hole and the hidden position of covering the 1st hole.
2, according to the described topping machanism of claim 1, it is characterized in that this actuating mechanism is made of air slide mechanism, this air slide mechanism has: cylinder body, be mounted slidably piston and the piston rod that is connected with this piston in this cylinder body, this piston rod is connected with this curtain-shaped cover member.
According to the described topping machanism of claim 2, it is characterized in that 3, this actuating mechanism is set on the main body of this image mechanism, so that the glide direction of this piston parallels with the optical axis of these object lens.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005277944A JP4664788B2 (en) | 2005-09-26 | 2005-09-26 | Cutting equipment |
| JP277944/2005 | 2005-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1939661A true CN1939661A (en) | 2007-04-04 |
| CN100569441C CN100569441C (en) | 2009-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610139548XA Active CN100569441C (en) | 2005-09-26 | 2006-09-26 | Topping machanism |
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| Country | Link |
|---|---|
| JP (1) | JP4664788B2 (en) |
| CN (1) | CN100569441C (en) |
| TW (1) | TWI392004B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101995737A (en) * | 2009-08-25 | 2011-03-30 | 株式会社迪思科 | Photographic device |
| CN102083579A (en) * | 2008-07-02 | 2011-06-01 | 罗伯特·博世有限公司 | Machine tool, especially handheld machine tool |
| CN101357491B (en) * | 2007-08-01 | 2012-04-25 | 株式会社迪思科 | Cutting device |
| CN104425369A (en) * | 2013-09-02 | 2015-03-18 | 东和株式会社 | Cutting device and cutting method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5198910B2 (en) * | 2008-03-24 | 2013-05-15 | 株式会社ディスコ | Cutting equipment |
| JP5405972B2 (en) * | 2009-10-07 | 2014-02-05 | 株式会社ディスコ | Imaging device |
| JP5984038B2 (en) * | 2011-04-06 | 2016-09-06 | 株式会社東京精密 | Dicing machine |
| JP5955530B2 (en) * | 2011-11-02 | 2016-07-20 | 株式会社ディスコ | Cutting equipment |
| JP6985034B2 (en) | 2017-06-21 | 2021-12-22 | 株式会社ディスコ | Cutting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371644U (en) * | 1989-11-15 | 1991-07-19 | ||
| US6152803A (en) * | 1995-10-20 | 2000-11-28 | Boucher; John N. | Substrate dicing method |
| JP2000108119A (en) * | 1998-10-08 | 2000-04-18 | Disco Abrasive Syst Ltd | Working device |
| JP3485816B2 (en) * | 1998-12-09 | 2004-01-13 | 太陽誘電株式会社 | Dicing equipment |
| JP4694675B2 (en) * | 2000-06-28 | 2011-06-08 | 株式会社ディスコ | Imaging mechanism of cutting equipment |
| JP3956643B2 (en) * | 2001-04-27 | 2007-08-08 | 株式会社東京精密 | Dicing machine |
| JP4216565B2 (en) * | 2002-10-28 | 2009-01-28 | 株式会社ディスコ | Cutting equipment |
-
2005
- 2005-09-26 JP JP2005277944A patent/JP4664788B2/en active Active
-
2006
- 2006-08-24 TW TW95131173A patent/TWI392004B/en active
- 2006-09-26 CN CNB200610139548XA patent/CN100569441C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101357491B (en) * | 2007-08-01 | 2012-04-25 | 株式会社迪思科 | Cutting device |
| CN102083579A (en) * | 2008-07-02 | 2011-06-01 | 罗伯特·博世有限公司 | Machine tool, especially handheld machine tool |
| CN101995737A (en) * | 2009-08-25 | 2011-03-30 | 株式会社迪思科 | Photographic device |
| CN101995737B (en) * | 2009-08-25 | 2014-09-03 | 株式会社迪思科 | Photographic device |
| CN104425369A (en) * | 2013-09-02 | 2015-03-18 | 东和株式会社 | Cutting device and cutting method |
| CN104425369B (en) * | 2013-09-02 | 2017-09-08 | 东和株式会社 | Shearing device and cutting-off method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI392004B (en) | 2013-04-01 |
| JP4664788B2 (en) | 2011-04-06 |
| TW200721290A (en) | 2007-06-01 |
| JP2007088361A (en) | 2007-04-05 |
| CN100569441C (en) | 2009-12-16 |
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