CN1935628A - Polyamide membrane self-assembling structure - Google Patents
Polyamide membrane self-assembling structure Download PDFInfo
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- CN1935628A CN1935628A CN 200510103523 CN200510103523A CN1935628A CN 1935628 A CN1935628 A CN 1935628A CN 200510103523 CN200510103523 CN 200510103523 CN 200510103523 A CN200510103523 A CN 200510103523A CN 1935628 A CN1935628 A CN 1935628A
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- kapton
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Abstract
The invention relates to a self-assembling structure for polyimide film, comprising: at least a micro-structured unmovable part and at least a micro-structured movable part, where the two parts use polyimide film as flexible contact, it generates surface tension at the flexible contact by return-welding making process, and rotationally lifts the movable part. And it can be widely applied to the self-assembling technique for multiple micromation industries, and has simple making steps, low cost and high accuracy.
Description
Technical field
The present invention relates to a kind of self-assembling structure of Kapton, it assembles planar technique for a kind of oneself who applies to microminiaturized science and technology, has simple, rapid and low-cost characteristic, can solve traditional known techniques shortcoming.
Background technology
Research and the application of microminiaturized science and technology are one of modern science two main trend, and particularly the oneself assembles (Self-assembly) technology, especially the assembling microstructures main stream approach of microcosmos in recent years.
With MEMS (Micro electromechanical Systems, the MEMS) mini-fan of technology made (Micro Fan), little formula actuator (Scratch Drive Actuator that grabs of mini-fan; SDA) must be and between the micro-blade structure by self-package technique and multi-user (MEMS) step (Multi-User MEMS Processes; MUMPs) just can finish.
So-called self-package technique refers to assembling microstructures mechanism i.e. location voluntarily after last release steps is finished, and existing self-package technique has following three kinds:
1, utilizes the residual stress release in the manufacture process to cause deformation, make micro-structural produce displacement; As U.S. Shandong gloomy (Lucent) the 3D glimmer switch that company developed.
2, produce surface wave by ultrasonic wave, micro-structural is vibrated to the precalculated position.
3, in little strand refining, make pliability contact (elastic joint) with leypewter ball (Solder Ball), photoresistance (Photoresist) or other high molecular polymer earlier, make contact in high temperature, be molten condition through reflow (Reflow) operation process again, and generation can be with the surface tension (Surface Tension Force) of micro-structural pull-up.
But aforementioned the 1st kind is only applicable to the micro-structural of stationary application or fixed-site with the 2nd kind of self-package technique, is not suitable for having the establishment of component of displacement action, therefore also is not suitable for the mini-fan with spinning movement and makes.
The 3rd kind of self-package technique, the material that can be used as flexible contact is a lot, and different materials has respectively also that it is excellent, the shortcoming characteristic, is example with the leypewter ball:
L, lead contamination: the leypewter ball is to mix (63Sn/37Pb) by tin, lead metal, and therefore when reflow, board and environment have the lead contamination phenomenon.
2, cost height: micro-structural mostly with polysilicon (Poly-si) as main structure, the leypewter ball is if will adhere on it, then must plate the golden liner of one deck (Gold Pad) at polysilicon surface earlier, as and the leypewter ball between the binding interface, this extra step can cause manufacture process difficulty and cost to increase.
3, precision is poor: when the lifting angle of calculating micro-structural or shift value, must accurately grasp the spheroid size, but the leypewter ball has the volumetric errors up to 25%, and lifting angle or shift value can't accurately be controlled.
4, manually-operated: the leypewter ball is placed on step on the golden liner, still relies on the manual-alignment operation at present fully.
5, can't miniaturization: the size of existing leypewter ball can't make the minimum dimension of flexible contact limited relatively less than 100 μ m.
Be example with photoresistance as flexible contactor material again:
The step of making flexible contact with photoresistance does not have leypewter ball complexity, and cost is also lower, but but must carry out the cantilever release of micro-structural through dry type or wet etching.
The dry-etching method is to utilize liquid carbon dioxide to discharge the cantilever and the replacement hydrone wherein of micro-structural, avoid cantilever to stick together (stick) effect, but, equipment price is high for the employed CO 2 supercritical machine of this method (Super criticalCO2 Dry Release), so relative cost is higher.
Wet etching does not need extra manufacturing equipment, so cost is lower, but with hydrofluoric acid (HF) or buffered hydrofluoric acid solution such as (BOE) with after the sacrificial layer etching, must with isopropyl alcohol (IPA) hydrone be volatilized fast again, to discharge cantilever, and isopropyl alcohol has the characteristic of dissolving photoresistance, therefore can destroy the flexible contact of original made.
Comprehensive above explanation, based on multiple considerations such as cost, manufacture process and microminiaturizations, the utmost point need be developed a kind of brand-new manufacture process really, to solve many shortcomings that leypewter ball or photoresistance are derived as the pliability contact.
Summary of the invention
At the problems referred to above, main purpose of the present invention is to provide a kind of self-assembling structure of Kapton, and it can be widely used in the self-package technique of multiple microminiaturized industry, and manufacturing step is simple, cost is low, accuracy is high.
For achieving the above object, the self-assembling structure of a kind of Kapton provided by the present invention, it comprises: at least one micro-structural partly movable; The movable part of at least one micro-structural; Described movable partly with described movable part with Kapton as the pliability contact, produce surface tension by reflow manufacturing process at described flexible contact, and with the movable part rotation lifting of described micro-structural.
The manufacturing process of the invention described above comprises: step 1, deposition one low stress sacrifice layer on a silicon matrix, deposition one main structure layer on described low stress sacrifice layer again; Step 2 etches the micro-structural shape with described main structure layer definition; Step 3 is coated with Kapton in shape in the micro-structural of described main structure layer; Step 4 etches flexible contact shape with described Kapton definition; Step 5 is carried out wet etching, with the predetermined part etching release of described low stress sacrifice layer; Step 6 is carried out reflow manufacturing process, makes described flexible contact be subjected to thermal contraction, and will be scheduled to described main structure layer rotation lifting partly.
Wherein said low stress sacrifice layer is a phosphorosilicate glass.
Described main structure layer is a polysilicon.
Adopt technique scheme, the present invention has the following advantages: 1, the unleaded contamination phenomenon of the present invention.2, the present invention does not need the golden liner of extra evaporation one deck as linking interface, so step is simple, cost is low.3, the present invention can carry out the quite high alignment actions of the degree of accuracy with photolithography techniques, so precision is preferable.But 4, the present invention's full automation operation.5, the microminiaturized size of the present invention is unrestricted.Therefore, the present invention can simplify manufacturing step, reduce cost, and thoroughly solves many shortcomings that leypewter ball or photoresistance are derived as the pliability contact.
The present invention can be applicable to oneself's assembling of oneself's assembling of oneself's assembling of mini-fan, miniature insect chip, miniature centipede actuator, oneself's assembling of micro-optics table chip, oneself's assembling of low-light communication switch and oneself's assembling of little passive component.
Description of drawings
Fig. 1 is a schematic appearance of the present invention;
Fig. 2 is the step schematic diagram of manufacturing process of the present invention;
Fig. 3 is the schematic diagram () that the present invention applies to mini-fan oneself assembling;
Fig. 4 is the schematic diagram (two) that the present invention applies to mini-fan oneself assembling.
The specific embodiment
In order to describe structure of the present invention and characteristics in detail, existing following preferred embodiment of act and conjunction with figs. are described as follows:
The present invention is about a kind of self-assembling structure of Kapton, and as shown in Figure 1, it comprises:
The movable part 53 of at least one micro-structural;
The movable part 54 of at least one micro-structural;
Wherein, has flexible contact 52 between movable part 53 and the movable part 54, flexible contact 52 is a kind of light sensitive polyimide (Polyimide) thin-film material, reflow (Reflow) manufacturing process through high temperature oven (Oven), can make flexible contact 52 be subjected to thermal contraction and produce surface tension, the movable part 54 rotation liftings of micro-structural can be made micro-structural oneself assembling.
Again as shown in Figure 2, self-assembling structure manufacturing process step of the present invention is as follows:
Step 1: electricity consumption slurry auxiliary chemical vapor deposition method (PECVD) sedimentary phosphor silex glass (PSG) on a silicon matrix 10, as low stress sacrifice layer 20, use Low Pressure Chemical Vapor Deposition (LPCVD) deposit spathic silicon (Poly-si) on low stress sacrifice layer 20 again, as main structure layer 30;
Step 2: carry out first road photolithography (Photolithography) step,, define micro-structural overall profile shape with inductance manifold type electric paste etching machine (ICP) etching main structure layer 30.
Step 3: on main structure layer 30, be coated with photosensitive polyimide film 40 with rotation coating machine (Spin Coater).
Step 4: carry out the second road photolithography step, define the shape of flexible contact 41.
Step 5: place buffered hydrofluoric acid (BOE) to carry out Wet-type etching micro-structural, and the predetermined part etching of low stress sacrifice layer 20 is discharged.
Step 6: carry out reflow (Reflow) operation process with high temperature oven (Oven), make flexible contact 41 in high temperature, be molten condition, produce contraction distortion after flexible contact 41 is heated, predetermined main structure layer 30 rotation are partly lifted.
Below, at first compare the present invention and leypewter ball excellent, shortcoming characteristic as flexible contact:
1, the unleaded contamination phenomenon of the present invention.
2, the present invention does not need the golden liner of extra evaporation one deck as linking interface, so step is simple, cost is low.
3, the present invention can carry out the quite high alignment actions of the degree of accuracy with photolithography techniques, so precision is preferable.
But 4, the present invention's full automation operation.
5, the microminiaturized size of the present invention is unrestricted.
Secondly, compare the present invention and photoresistance excellent, shortcoming characteristic again as flexible contact:
Though 1, photosensitive polyimide film is all high molecular polymer with photoresistance, but the surface tension of photosensitive polyimide film is bigger than photoresistance, and can keep out organic solution, so the present invention does not have flexible contact by the doubt of isopropyl alcohol (IPA) dissolved destruction.
2, because photosensitive polyimide film can be kept out organic solution, be applicable to lower-cost Wet-type etching manufacture process, so manufacturing cost of the present invention is relatively low.
Comprehensive above explanation, the present invention can simplify manufacturing step, reduce cost, and thoroughly solves many shortcomings that leypewter ball or photoresistance are derived as the pliability contact.
Enumerate the embodiment of practice of the present invention below in the blade construction oneself assembling of mini-fan:
1, at first, on a silicon matrix sedimentary phosphor silex glass as the low stress sacrifice layer, again on the low stress sacrifice layer deposit spathic silicon as the main structure layer;
2, as shown in Figure 3, adopt photolithography manufacturing process on the main structure layer, to etch the main body 50 of mini-fan and the shape of blade 51;
3, on the main body 50 of main structure layer and blade 51, be coated with photosensitive polyimide film again;
4, define the shape of flexible contact 52 with the second road photolithography manufacturing process;
5, carry out Wet-type etching, with the low stress sacrificial layer etching release of each blade 51 below;
6, carry out reflow manufacturing process at last, make flexible contact 52 be subjected to thermal contraction, and, promptly finish a mini-fan each blade 51 rotation lifting.
The present invention can be applicable to oneself's assembling of oneself's assembling of oneself's assembling of mini-fan, miniature insect chip, miniature centipede actuator, oneself's assembling of micro-optics table chip, oneself's assembling of low-light communication switch and oneself's assembling of little passive component.Wherein little passive component can be that miniature inductance also can be a micro capacitance.
Adopt above-mentioned design, the present invention becomes a kind ofly can thoroughly solve many shortcomings that leypewter ball or photoresistance are derived as the pliability contact, and can be widely used in the self-package technique of multiple microminiaturized industry, the particularly making of mini-fan, can break through the technical bottleneck of present mini-fan, reach simple, rapid and low-cost target, the real initiative that belongs in the middle of like product.
The above only is preferred embodiment of the present invention, and the equivalent structure that all application specification of the present invention, claims or accompanying drawing are done changes, and all should be included in the scope of patent protection of the present invention.
Claims (13)
1, a kind of self-assembling structure of Kapton is characterized in that comprising:
The movable part of at least one micro-structural;
The movable part of at least one micro-structural;
Described movable partly with described movable part with Kapton as the pliability contact, produce surface tension by reflow manufacturing process at described flexible contact, and with the movable part rotation lifting of described micro-structural.
2, the application of the self-assembling structure of Kapton in oneself's assembling of mini-fan according to claim 1.
3, as the self-assembling structure of Kapton as described in the claim 2, it is characterized in that: described mini-fan includes a main body and plural blade, between described main body and the described blade with described Kapton as the pliability contact, adopt reflow manufacturing process to produce surface tension at described flexible contact, and with described blade rotation lifting.
4, the application of the self-assembling structure of Kapton in oneself's assembling of miniature insect chip according to claim 1.
5, the application of the self-assembling structure of Kapton in oneself's assembling of miniature centipede actuator according to claim 1.
6, the application of the self-assembling structure of Kapton in oneself's assembling of micro-optics table chip according to claim 1.
7, the application of the self-assembling structure of Kapton in oneself's assembling of low-light communication switch according to claim 1.
8, the application of the self-assembling structure of Kapton in oneself's assembling of little passive component according to claim 1.
9, as the self-assembling structure of Kapton as described in the claim 8, it is characterized in that: described little passive component is a miniature inductance.
10, as the self-assembling structure of Kapton as described in the claim 8, it is characterized in that: described little passive component is a micro capacitance.
11, the self-assembling structure of Kapton according to claim 1 is characterized in that its manufacturing process comprises:
Step 1: deposition one low stress sacrifice layer on a silicon matrix, deposition one main structure layer on described low stress sacrifice layer again;
Step 2: described main structure layer definition etched the micro-structural shape;
Step 3: the micro-structural at described main structure layer is coated with Kapton in shape;
Step 4: described Kapton definition is etched flexible contact shape;
Step 5: carry out wet etching, with the predetermined part etching release of described low stress sacrifice layer;
Step 6: carry out reflow manufacturing process, make described flexible contact be subjected to thermal contraction, and will be scheduled to described main structure layer rotation lifting partly.
12, as the self-assembling structure of Kapton as described in the claim 11, it is characterized in that: described low stress sacrifice layer is a phosphorosilicate glass.
13, as the self-assembling structure of Kapton as described in the claim 11, it is characterized in that: described main structure layer is a polysilicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510103523 CN1935628A (en) | 2005-09-19 | 2005-09-19 | Polyamide membrane self-assembling structure |
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| CN 200510103523 CN1935628A (en) | 2005-09-19 | 2005-09-19 | Polyamide membrane self-assembling structure |
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| CN1935628A true CN1935628A (en) | 2007-03-28 |
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| CN 200510103523 Pending CN1935628A (en) | 2005-09-19 | 2005-09-19 | Polyamide membrane self-assembling structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102491261A (en) * | 2011-12-23 | 2012-06-13 | 哈尔滨工业大学 | Limit method for MEMS (Micro-electromechanical System) self assembly process based on lead bonding |
| CN102627258A (en) * | 2012-04-23 | 2012-08-08 | 中国科学院高能物理研究所 | Sub-micro self-supporting polyimide film and preparation method thereof |
-
2005
- 2005-09-19 CN CN 200510103523 patent/CN1935628A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102491261A (en) * | 2011-12-23 | 2012-06-13 | 哈尔滨工业大学 | Limit method for MEMS (Micro-electromechanical System) self assembly process based on lead bonding |
| CN102491261B (en) * | 2011-12-23 | 2014-12-03 | 哈尔滨工业大学 | Limit method for MEMS (Micro-electromechanical System) self assembly process based on lead bonding |
| CN102627258A (en) * | 2012-04-23 | 2012-08-08 | 中国科学院高能物理研究所 | Sub-micro self-supporting polyimide film and preparation method thereof |
| CN102627258B (en) * | 2012-04-23 | 2015-07-15 | 中国科学院高能物理研究所 | Sub-micro self-supporting polyimide film and preparation method thereof |
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