CN1935442B - Free solder, method and device for reinforcing tin weldability - Google Patents
Free solder, method and device for reinforcing tin weldability Download PDFInfo
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- CN1935442B CN1935442B CN2005101041279A CN200510104127A CN1935442B CN 1935442 B CN1935442 B CN 1935442B CN 2005101041279 A CN2005101041279 A CN 2005101041279A CN 200510104127 A CN200510104127 A CN 200510104127A CN 1935442 B CN1935442 B CN 1935442B
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Abstract
The present invention provides a method for raising solder property and its device, in particular, it relates to a kind of lead-free solder capable of raising soldering tin property. Said lead-free solder at least includes a first metal material and a second metal material, in which the oxidation potential of said second metal material is higher than that of first metal material. Said invention also provides a welding device with appearance identifiability. It includes at least a first metal material layer and a second metal material layer, in which the second metal material layer is formed on said first metal material layer, and said second metal material layer is different from said first metal material layer in the color.
Description
Technical field
The present invention relates to a kind of apparatus and method that improve solderability, particularly a kind of apparatus and method that improve no lead component solderability.
Background technology
Lifting along with living standard, people have dropped into increasing concern for the negative effect that the industry manufacturing is brought, thereby quickened stipulating and interim execution process of many international environmental laws rule, limit the use amount of harmful substance with the legal provision of strictness, and then ensure the sustainable development that industry is made; In recent years, " green industry " is promptly flourish in this atmosphere.
The main target of development " green industry " promptly is to provide " green product " of no lead content, in other words, is devoted to promptly to realize that the unleaded nothing in the electronics industry processing procedure poisons demand.In the green industrial requirements voice that grows to even greater heights, the noxious material that was proposed in 2002 no more than European Union that attracted attention by present industry limits the use of (Restriction of Hazardous Substances, RoHS) instruction, it defined from July 1st, 2006, and the consumption electronic products in input EU member country market must reach unleaded requirement comprehensively.At present, also there have been many international manufacturers to require to produce online comprehensive importing leadless process and lead-free product at it for beginning in response to this ban.
Consider that based on above-mentioned factor the lead component that has that replaces in the conditional electronic industrial process with no lead component has become the necessary development trend of present industry, has also brought a series of novel challenge.
In conditional electronic industry is made, all use the soldering tin material of typical leypewter to carry out between chip and substrate and encapsulating structure engages.It so is development trend in response to above-mentioned no lead component, industrial circle all is devoted to seek to reduce high lead content in the soldering tin material, can keep assembly joint reliability and conservatory wlding technology simultaneously again at present, and hope can be developed the soldering tin material of other alternative alloying component.
Except the alloying component of soldering tin material, one of direction that the solderability of wlding is also sought to improve for industry; At american documentation literature US5,086, disclosed a kind of method and wlding composition in 966 in order to the soldering tin material wetability of improving leypewter, it is at known leypewter wlding surface deposition one palladium metal layer (palladium), wlding is for the wettability of substrate metal during with the lifting reflow, even when not using solder flux, provide this patent disclosed method, still can produce enough bond strengths.
Yet this method is to design at the leypewter wlding, obviously still can't meet international developing goal for no lead component, thereby still existence needs improvements.In addition, because the progressively importing of leadless process, how in the existing unleaded production line that has plumbous production line and desire to import, to ensure the identifiability of leaded material and unleaded material,, at this active demand of being badly in need of when plumbous technology and the Lead-Free Technology crossover is arranged especially to avoid taking place the batch mixing situation.
Produce method and the device that proposes raising solderability of the present invention therefrom, by the present invention, can with the prerequisite of present processing procedure compatibility under, the wetting reaction between acceleration component coating and scolding tin, and then improve its solderability, and can promote the long-acting keeping quality of no lead component; In addition, the present invention has also realized the identifiability of no lead component, and then can avoid the generation of batch mixing situation when importing leadless process, has application potential and industry promotional value.
Summary of the invention
A scheme of the present invention is to provide a kind of lead-free solder that improves solderability, it comprises at least one first metal material and one second metal material, wherein this second metal material is formed on the surface of this first metal material, and the oxidizing potential of this second metal material is high than this first metal material.
According to such scheme, wherein this first metal material comprises tin.
According to such scheme, wherein this second metal material be selected from the group that constituted by nickel, gold, palladium, platinum and silver etc. one of them.
Alternative plan of the present invention is to provide a kind of pb-free solder device of tool outward appearance identity, it comprises at least one first metal material layer and one second metal material layer, wherein this second metal material is formed on the surface of this first metal material, the oxidizing potential of this second metal material is high than this first metal material, and the color of this second metal material is different with the color of this first metal material.
According to such scheme, wherein this welder be selected from a tin ball, a projection, a pin and a termination electrode one of them.
According to such scheme, wherein the lead content of this welder is less than 1000ppm.
According to such scheme, wherein this first metal material comprises tin.
According to such scheme, wherein this second metal material is an inert metal material.
According to such scheme, wherein this inert metal material comprises gold.
Third party's case of the present invention is to provide the welder discerned of the high solderability of a kind of tool, it is in order to connect on chip to a substrate, this welder has at least one the first metal layer and one second metal level, wherein this second metal level is positioned on this first metal layer, and its color is different with this first metal layer.
According to such scheme, wherein the oxidizing potential of this second metal level is than this first metal layer height.
Cubic case of the present invention is to provide the welder discerned of the high solderability of a kind of tool, it is in order to connect on encapsulating structure to a circuit board, this welder has at least one the first metal layer and one second metal level, wherein this second metal level is positioned on this first metal layer, and its color is different with this first metal layer.
According to such scheme, wherein the oxidizing potential of this second metal level is than this first metal layer height.
The 5th scheme of the present invention is to provide a kind of method that improves no lead component solderability, and it comprises the following step: (a) form a unleaded projection on this chip; (b) form a metal level on the surface of this unleaded projection, wherein this unleaded projection comprises tin, and the oxidizing potential of this metal level is higher than the oxidizing potential of tin; And (c) this chip is connected on the substrate.
According to such scheme, its in step (b), utilize immersion plating, plating, electroless plating, evaporation, sputter and chemical vapour deposition (CVD) mode etc. one of them and on this unleaded projection, form this metal level.
According to such scheme, wherein this metal level be selected from the group that constituted by nickel, gold, palladium, platinum and silver etc. one of them.
The 6th scheme of the present invention is to provide a kind of method that improves no lead component solderability, it comprises the following step: (a) form a metal level on the surface of a unleaded jockey, wherein this unleaded jockey comprises tin, and the oxidizing potential of this metal level is higher than the oxidizing potential of tin; And (b) one encapsulating structure is connected on the circuit board by at least one unleaded jockey.
According to such scheme, its in step (a), utilize immersion plating, plating, electroless plating, evaporation, sputter and chemical vapour deposition (CVD) mode etc. one of them and on this unleaded jockey, form this metal level.
According to such scheme, wherein this metal level be selected from the group that constituted by nickel, gold, palladium, platinum and silver etc. one of them.
According to such scheme, wherein this unleaded jockey be a projection, a tin ball, a pin and a termination electrode one of them.
By following accompanying drawing and detailed description, can more understand the present invention in depth.
Description of drawings
Fig. 1 is the method flow diagram according to raising solderability of the present invention, is applied to the key step that engages between chip and substrate in order to explanation the inventive method the inventive method;
Fig. 2 (a) and Fig. 2 (b) are according to one first preferred embodiment of the present invention, in order to further application of the present invention to be described;
Fig. 3 (a) and Fig. 3 (b) are according to one second preferred embodiment of the present invention, in order to further application of the present invention to be described;
Fig. 4 is according to one the 3rd preferred embodiment of the present invention, in order to further application of the present invention to be described;
Fig. 5 is the method flow diagram according to raising solderability of the present invention, is applied to the key step that engages between encapsulating structure and circuit board in order to explanation the inventive method;
Fig. 6 is according to one the 4th preferred embodiment of the present invention, in order to further application of the present invention to be described;
Fig. 7 is according to one the 5th preferred embodiment of the present invention, in order to further application of the present invention to be described;
Fig. 8 (a) and Fig. 8 (b) are respectively the solderability result of the test of no lead component of tradition and no lead component provided by the present invention; And
Fig. 9 (a) and Fig. 9 (b) are respectively the outward appearance of no lead component of tradition and no lead component provided by the present invention.
Wherein, description of reference numerals is as follows:
11,12,13 steps
2,3,4 chip-packaging structures, 20,30,40 Pb-free solder projections
21,31,41 chips, 22,32,42 substrates
23,33,43 encapsulation agents, 44 pre-layers
51,52,53 steps
6 Lead-free in Electronic Packaging assemblies, 60 Pb-free solder projections
61 chips, 62 substrates
63 encapsulation agents, 65 terminals
66 circuit boards, 70 chip-packaging structures
75 pins, 76 circuit boards
The specific embodiment
The invention provides a kind of method and apparatus of raising solderability of novelty, it is especially at the solderability that promotes wlding in the no lead component and wetability and and then give no lead component identifiability and develop.
In a preferred embodiment of the present invention; utilize the immersion plating mode on unleaded wlding, to deposit the metal level of a high oxidation potential (oxidizing potential that is higher than tin); because the oxidizing potential of this metal level is higher than tin; thereby the surface of unleaded wlding can be replaced by this metal level via an idiopathic substitution reaction; form a sealer; improve the non-oxidizability of no lead component thus, and then promote its keeping quality.
With reference to Fig. 1, it is the method flow diagram according to raising solderability of the present invention, is applied to the key step that engages between chip and substrate in order to explanation the inventive method; In this example, the inventive method is applied to engaging between chip and substrate.At first, on a chip, form at least one unleaded projection, shown in step 11; Then, behind this unleaded lug surface of activation, promptly utilize the immersion plating mode to be coated with an au film coating, shown in step 12 on its surface; At last, this chip is connected on the substrate, shown in step 13, promptly forms the Pb-free solder assembly of high solderability of the present invention and high antioxidant.
In this example, utilize the immersion plating mode on unleaded lug surface, to be coated with an au film coating and more preferably select for one of the inventive method, right category of the present invention then is not limited thereto; Except that the immersion plating mode, other depositional mode is as: industries such as plating, electroless plating, evaporation, sputter or chemical vapour deposition (CVD) rete depositional mode commonly used, all with the method compatibility of raising solderability of the present invention, and the metal that is coated with also can be nickel, silver, platinum or palladium etc., so with have with the different persons of unleaded projection color for more preferably selecting, it can further give this no lead component scolding tin identifiability.
With reference to Fig. 2 (a) and Fig. 2 (b), it is according to one first preferred embodiment of the present invention, in order to further application of the present invention to be described; Wherein, the device of raising solderability of the present invention further cooperates bottom filling mode (Underfill) and carries out the chip encapsulation; Gold-plated Pb-free solder projection 20 after utilizing immersion plating to finish an and chip 21 is engaged on the substrate 22, and one encapsulation agent 23 is provided and is sealed in the mode of splashing into, a lead-free chip encapsulating structure 2 formed.
With reference to Fig. 3 (a) and Fig. 3 (b), it is according to second preferred embodiment of the present invention, in order to further application of the present invention to be described, wherein, the device of raising solderability of the present invention further cooperates the mobile bottom filling mode (No-Flow Underfill) of nothing and carries out the chip encapsulation; In this example, the gold-plated Pb-free solder projection 30 after utilizing immersion plating to finish an and chip 31 is engaged on the substrate 32 that is covered with encapsulation agent 33 is promptly sealed, and forms a lead-free chip encapsulating structure 3.
In the present invention, also can be used pre-solder flux does not have lead component with further lifting joint reliability; With reference to Fig. 4, it is according to the 3rd preferred embodiment of the present invention, in order to the further application of device that raising solderability of the present invention is described.In this example, the same mobile bottom filling mode (No-Flow Underfill) of nothing that utilizes carries out the chip encapsulation, gold-plated Pb-free solder projection 40 after utilizing immersion plating to finish an and chip 41 is engaged to is sealed on the substrate 42 that is covered with encapsulation agent 43, in addition, on the desire abutment of substrate 42, be pre-formed a pre-layer 44, to help the conjugation grade that promotes lead-free chip encapsulating structure 4.Except that the execution of described pre-layer 44; the present invention also can cooperate wicking (Immersion Sn), soaks silver (Immersion Ag), the execution of gold processing procedures such as (ENIG) is soaked in no nickel plating or coated with an organic protection layer (OSP), with the long-acting keeping quality of this lead-free chip encapsulating structure of further lifting.
Equally, the inventive method also can be applicable to engaging between encapsulating structure and circuit board; With reference to Fig. 5, it is the method flow diagram according to raising solderability of the present invention, is applied to the key step that engages between encapsulating structure and circuit board in order to explanation the inventive method.At first, utilize lead-free solder to form the required unleaded jockey of an encapsulating structure, shown in step 51; Behind the overlay coating of this unleaded jockey of activation, promptly on this unleaded jockey, form an au film coating, shown in step 52; Promptly assemble at last,, shown in step 53, and form the Pb-free solder device of high solderability of the present invention and high antioxidant so that this encapsulating structure is connected on the circuit board.
In this embodiment, this unleaded jockey can be a projection, a tin ball, a pin or a termination electrode, and other depositional mode also is applicable in the present embodiment as: industries such as plating, electroless plating, evaporation, sputter or chemical vapour deposition (CVD) rete depositional mode commonly used; And except that gold, the metal that is coated with also can be metals such as nickel, palladium, platinum and silver.
With reference to Fig. 6, it is according to the 4th preferred embodiment of the present invention, in order to further application of the present invention to be described.Gold-plated Pb-free solder projection 60 after utilizing immersion plating to finish is engaged to chip 61 on the substrate 62 that is covered with encapsulation agent 63 and is sealed, and after forming a lead-free chip encapsulating structure, to cover crystalline substance (Flip-Chip) mode this lead-free chip encapsulating structure is carried out component package, and form a Lead-free in Electronic Packaging assembly 6; At this moment, utilize the present invention once more, be thus connected on circuit board 66 in order to follow-up use further on this Lead-free in Electronic Packaging assembly 6, to form the no lead terminal 65 of other surface gold-plating.
With reference to Fig. 7, it is according to the 5th preferred embodiment of the present invention, in order to further application of the present invention to be described.In this embodiment, utilize the present invention equally and on the pin 75 of connection-core chip package 70 and circuit board 76, be coated with an au film coating, with non-oxidizability and the identity that promotes unleaded pin 75.
With reference to Fig. 8 (a) and Fig. 8 (b), it is respectively the solderability result of the test comparison of traditional no lead component with no lead component provided by the present invention; As seen from the figure, the wettability of no lead component of the present invention (Fig. 8 (b)) is good far beyond traditional no lead component (Fig. 8 (a)), and it on test substrate scope wetting reaction takes place fully.
In above preferred embodiment, be by the immersion plating mode, to utilize commercial at present printed circuit boardization gold liquid medicine and be coated with an au film coating at unleaded assembly surface, its preferred immersion plating condition is temperature below 90 ℃, immersion plating time to be about 10 minutes; Under this immersion plating condition, the au film coating thickness that is coated with is about 0.25 μ m.Because the oxidizing potential of gold is higher than the oxidizing potential of the major metal composition-Xi in the no lead component, therefore when immersion plating, unleaded assembly surface will produce a spontaneous substitution reaction and by the gold displacement, form an au film coating; And owing to the high oxidation potential of surperficial au film coating, can promote the non-oxidizability of this no lead component, long-lasting protective effect is provided; Can learn also that via all tests and observation no lead component provided by the present invention has quite superior wettability, its solderability also obtains further lifting.
In addition, with reference to Fig. 9 (a) and Fig. 9 (b), it is respectively the outward appearance comparison of traditional no lead component with no lead component provided by the present invention; Because the color of gold has lead component different with traditional, therefore no lead component provided by the present invention is except that above-mentioned advantageous characteristic, its outward appearance has identifiability, can avoid having when importing leadless process the situation of lead component and no lead component batch mixing, has application potential and industry promotional value.
Comprehensive above-mentioned explanation as can be known, the present invention is the invention of a novelty, progress and tool industrial applicability in fact, has dynamogenetic value.The present invention does various modifications by this area metal personnel, does not all break away from the scope as the desire protection of attached claim institute.
Claims (9)
1. lead-free solder that improves solderability, it comprises at least one first metal material and one second metal material, wherein this second metal material is formed on the surface of this first metal material, and the oxidizing potential of this second metal material is high than this first metal material.
2. lead-free solder as claimed in claim 1, wherein:
This first metal material comprises tin; And/or
This second metal material be selected from the group that constituted by nickel, gold, palladium, platinum and silver one of them.
3. the pb-free solder device of a tool outward appearance identity, it comprises at least one first metal material and one second metal material, wherein this second metal material is formed on the surface of this first metal material, the oxidizing potential of this second metal material is high than this first metal material, and the color of this second metal material is different with the color of this first metal material.
4. pb-free solder device as claimed in claim 3, wherein:
This welder be selected from a tin ball, a projection, a pin and a termination electrode one of them; And/or
The lead content of this welder is less than 1000ppm.
5. pb-free solder device as claimed in claim 3, wherein:
This second metal material is an inert metal material; And
This inert metal material comprises gold.
6. method that improves no lead component solderability, it comprises the following step:
(a) on a chip, form a unleaded projection;
(b) form a metal level on the surface of this unleaded projection, wherein this unleaded projection comprises tin, and the oxidizing potential of this metal level is higher than the oxidizing potential of tin; And
(c) this chip is followed on a substrate.
7. method as claimed in claim 6 wherein in step (b), is utilized one of them of immersion plating, plating, electroless plating, evaporation, sputter and chemical vapour deposition (CVD) mode and form this metal level on this unleaded projection.
8. method that improves no lead component solderability, it comprises the following step:
(a) form a metal level on the surface of a unleaded jockey, wherein this unleaded jockey comprises tin, and the oxidizing potential of this metal level is higher than the oxidizing potential of tin; And
(b) by this unleaded jockey one encapsulating structure is followed on a circuit board.
9. method as claimed in claim 8, wherein:
Step (a) is to utilize one of them of immersion plating, plating, electroless plating, evaporation, sputter and chemical vapour deposition (CVD) mode and form this metal level on this unleaded jockey; And
This unleaded jockey be a projection, a pin and a termination electrode one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2005101041279A CN1935442B (en) | 2005-09-19 | 2005-09-19 | Free solder, method and device for reinforcing tin weldability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2005101041279A CN1935442B (en) | 2005-09-19 | 2005-09-19 | Free solder, method and device for reinforcing tin weldability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1935442A CN1935442A (en) | 2007-03-28 |
| CN1935442B true CN1935442B (en) | 2010-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005101041279A Expired - Fee Related CN1935442B (en) | 2005-09-19 | 2005-09-19 | Free solder, method and device for reinforcing tin weldability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1935442B (en) |
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2005
- 2005-09-19 CN CN2005101041279A patent/CN1935442B/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1935442A (en) | 2007-03-28 |
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Granted publication date: 20101201 Termination date: 20190919 |