CN1922524A - Circuit board and method for embedding an optical component in a circuit board - Google Patents
Circuit board and method for embedding an optical component in a circuit board Download PDFInfo
- Publication number
- CN1922524A CN1922524A CNA2005800051407A CN200580005140A CN1922524A CN 1922524 A CN1922524 A CN 1922524A CN A2005800051407 A CNA2005800051407 A CN A2005800051407A CN 200580005140 A CN200580005140 A CN 200580005140A CN 1922524 A CN1922524 A CN 1922524A
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- Prior art keywords
- circuit board
- parts
- optical bus
- conductive
- active region
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Optical Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a circuit board, at least partly embedded inside which there is an optically active component, as well as to a method for embedding an optically active component inside the circuit board. The component, which is embedded at least partly inside the circuit board, is in optically active contact with an optical signal inside the circuit board, in such a way that the optically active area of the component is at essentially right angles to the plane of the circuit board.
Description
The present invention relates to a kind ofly as claimed in claim 1 the optics active parts is embedded in method in the circuit board.The invention still further relates to a kind of circuit board as claimed in claim 13.
According to disclosing of prior art, for example patented claim discloses the solution that US2002/0141163 is disclosed, and wherein optoelectronic components is to be embedded in the circuit board.In these solutions, use catoptron along optical bus with light signal these parts that lead.The problem of these solutions is that efficient is lower, because the conversion of light signal has weakened light intensity.Typical loss may be about 50%.
In open according to some of prior art, without catoptron along optical bus direct light signal.For example, patent disclosure EP1376180 has disclosed light-receiving and transmitter module has been embedded in the circuit board, makes described module contact with optical bus between them.Light-receiving and transmitter module are electrically connected to wire pattern.Patent disclosure US5,521,992 have also disclosed corresponding solution.Patent disclosure US6,477,286 have disclosed a solution, and wherein parts are embedded in the circuit board and by means of soldered ball and are attached on its substrate.Patent disclosure US4,732,446 have disclosed a solution, and wherein the seat (carrier) that carries of parts is embedded in the circuit board, and this circuit board is connected between two other circuit board.
The present invention will set up a kind of novel method that the optics active parts is embedded in the circuit board.
The present invention is based on a conception of species, with top and/or surface is that the active parts of light partly or entirely are embedded in the circuit board, make the end of light active region adjacent optical bus of these parts, and the surface of light active region is positioned at basically and the rectangular position of circuit board plane.
More particularly, by the described content description of claim 1 characteristic according to the characteristics of the inventive method.
By the described content description of claim 13 characteristic according to the characteristics of structure of the present invention.
In structure, light active region and one or more zone of containing conductive material are arranged on first of parts according to the preferred embodiments of the present invention.When built in items, this light active region is located at the position of adjacent optical terminal bus, makes the light active region of described parts meet at right angles with circuit board plane basically.The light active region can be for example smooth or curved surface, its emission or reception light.Active region also can be the surface that is made of a plurality of subassemblies.Emission or receive the surface of the parts active region of light, the surface of subassembly preferably is placed to circuit board plane and meets at right angles.Therefore light signal directly is directed to the active region surface of parts or is directed to optical bus from described surface, makes signal not need deflection.This has been avoided taking place weakening of light signal when by mirror reflects.
Can realize and being electrically connected of the conductive layer of circuit board by the zone that comprises conductive material in the parts.Conductive material can be same one side, the reverse side that for example is positioned at parts with the light active region, or adjacent face.
Can obtain very big advantage by means of the present invention.In existing solution, cause a large amount of losses of signal intensity away from the conversion of the light signal of board plane.Loss owing to the light signal conversion typically has about 50%.If for example, the light path from the transmitter to the receiver (opticalpath) comprises two optical transition,, make the loss of signal strength 75% then because the loss that causes of conversion of signals.
The present invention has a plurality of preferred embodiments.By means of the present invention, can embed and have high efficiency optoelectronic components, for example detecting device and luminous component.Preferably embed active smooth parts, particularly on the top of circuit board and/or surface from its end face emission or detect the parts of light.Such parts are included in the existing smooth active region of one side at least one conductive region again.It is cheaply more a lot of than the light parts of emission from the side that needs special technique to make or detection light to make such parts.
Below, by means of embodiment with set forth the present invention in greater detail with reference to the attached drawings.Embodiment is not used for retraining the protection domain that is defined by the claims.
Fig. 1 has shown according to the sectional view of a circuit board of the present invention at parts connecting line place.
Fig. 2 has shown the sectional view of the depression that gets out on circuit board.
Fig. 3 has shown the sectional view attached to the parts in the depression.
Fig. 4 remains the sectional view that caves in around having shown filling component.
Fig. 5 has shown that parts are connected to the sectional view of the conductive layer of circuit board.
In conjunction with the present invention, term " circuit board " refers to multilayer circuit board, and at least two conductive layers (patterned usually), electrically conductive signal layer are wherein arranged.Composition is meant that conductive layer is not a homogeneous, but is made of conductive pattern, and this conductive pattern is to be formed by the conductor that is electrically insulated from each other.Conductor is some conductive materials, metal typically, and copper normally.Conductive layer is separated each other by insulation course.The conductor or the insulation course of at least one circuit board comprise optical bus.
Term " optical bus " refers to a groove, can be along this groove with the light signal guiding parts, or leave parts.Can fill optical bus with the suitable material that forms light path.The material that is suitable for filling has for example various polymkeric substance or glass-like materials.
In the open US2003/0006068 of for example patented claim, disclosed the structure of optical bus.
Optoelectronic components is partially submerged into board structure of circuit wherein at least, preferably only on the embedded location of parts insulating material is arranged.Can use laser drill method or other similar boring method to form the depression of the insert depth of wanting like this on the embedded location of parts, this depression ends at metal level.Also can use several different methods, for example, form initial depression with machining earlier and finish with method for drilling holes again.
With with circuit board on the mode that intersects of optical bus be formed for the depression of parts.Term " intersect " be meant the depression and optical bus between formed common interface, transfer to depression along the signal that optical bus advances from optical bus by it, or correspondingly, light signal is transferred to along optical bus from depression and is advanced.In this article, such interface is called intersection surface.This intersection surface is preferably cut off optical bus fully, and preferably meets at right angles with direction of motion along optical bus basically.Under vantage, this intersection surface corresponds essentially to the xsect at the optical bus of optical bus end.Can use any suitable method to make actual intersection surface, but in manufacturing technology, the method for the simplest manufacturing intersection surface is: during fabrication, to remove the material of optical bus in the end of bus.In a plurality of embodiment, it is to make together in conjunction with depression to carry out that described material is removed.
When parts are embedded in the depression, use some suitable insulation materials partly or wholly to fill remaining space on every side.Use the light active region of transparent insulation material filling component and the depression between the optical bus end, preferably use the material identical materials that comprises with optical bus.Can use the partially or completely space of other direction around the filling component of identical or other insulating material.At the manufacture view of circuit board, if insulating material is and the identical transparent material of material in the optical bus will be simpler.In certain embodiments, can stay at least a portion depression is not filled.
Parts are placed in the depression, make the intersection surface of light active region adjacent optical bus of described parts.Like this, notion " vicinity " also comprises special circumstances, wherein the light active region of the intersecting plane contact component of optical bus.In operation, notion " vicinity " is meant signal that permission advances along optical bus from the optical bus to the intersection surface and pass possible medium to the parts active region, or oppositely opposite, fully effectively the distance and the position of transfer.In the embodiment of reality, distance is typically in the scope of 0-2 millimeter and preferably in the scope of 100-500 micron between the surface of light active region and the intersection surface of optical bus.
Electrically contact in order to form, parts can be included in the conductive material on one or more surfaces of this parts.Parts can be electrically connected to conductive layer at the differing heights of circuit board.For example can be connected to the conductive layer on the circuit board first surface and be connected to conductive layer on the second surface of circuit board.Like this, the first surface of circuit board refers to parts and embeds face, and second surface refers to the surface of circuit board opposition side.Certainly, parts also can be connected to the one or more conductive layers in the circuit board, as the conductive layer that increases or replace circuit board surface.
Be implemented to the connection of the conductive layer of circuit board first surface in following mode, make depression between incomplete filling component of insulating material and the circuit board, fill with conductive material on top, and the conductive material of parts can be connected to the conductive layer on the circuit board surface like this.Alternatively, can from the embedded location of parts and the depression between the circuit board, remove insulating material, and replace with conductive material.Preferably, conductive material does not extend to the point that may interfere with the propagation of light signal on the optical bus.If necessary, suppose that conductive material does not interfere with advancing of light signal, then conductive material can extend to the bottom of depression just.
Can be by various connections, the conductive material of parts is connected to conductive layer on the circuit board first surface, maybe can be established to the connection of conductive layer and being connected of circuit board first surface to the conductive layer of circuit board second surface.In the fabrication phase of circuit board, can stay continuous or discontinuous metal level by the insert depth under parts, the metal level of preferred same material is as the conductive layer on same height.Set up other connection if pass below the parts, can by electroconductive binder, scolder or conducting polymer with adhering components to this metal level.Can use for example micro through hole method of suitable connecting line method, the metal level below the parts is connected to the conductive layer that is positioned at the circuit board lower surface.Alternatively, if all connect all pass parts above, can be by means of insulating binder with adhering components to metal level.According to the preferred embodiment, the light parts with active end face that are arranged in circuit board the inside are connected to the metal level of below by means of electroconductive binder.
For example, can connect by means of engaging connection or the part that (for example, the lead by means of gold or aluminum steel or electroconductive binder engages) be established to the conductive layer of the surface that is positioned at circuit board or the inside.
Be somebody's turn to do " parts " optoelectronic components typically, for example, detecting device or luminous component.The components, which transmits effect can be equal to reception like this.Parts are active light parts on top and/or surface preferably, particularly from the end face emission or detect the parts of light.From end face emission or the parts that the detect light existing for example zone that electrically contacts as the anode contact of conductive material that comprises on one side preferably, the parts of light active region are arranged again.Comprise conductive material for example the second area that electrically contacts as negative electrode contact can be positioned on the same one side of parts with the light active region or on the opposite face.When parts were set in place on the face of circuit board, the surface of light active region also had the surface that electrically contacts (liner) and circuit board of anode and negative electrode to meet at right angles.Active smooth examples of members is photodiode, laser instrument and LED.
Described parts can partly or entirely be embedded in the circuit board, and it can be adhered to arbitrary of circuit board.
The term of light parts " active region " refers to the function that needs in order to obtain, the surface of light components, which transmits and/or reception light.For example the active region of semiconductor device can be converted into luminous energy with electric energy, or vice versa.The light that receives also can for example discharge charge carrier in active region, so the conductivity of parts changes.The term active region also can refer to components, which transmits that is made of a plurality of subassemblies or the surface that receives light.For example, semiconductor such as semiconductor laser, LED or the photodiode of emission or reception light constitute the function of source region.
Need how many conductive layers, this point depends on application.One of them semiconductor layer can represent 0, i.e. ground connection reference planes, its ground connection or be connected to 0 electromotive force that other 0 electromotive force for example is connected to circuit.
If necessary, can promptly come guard block from the top of parts by means of for example conducting electricity label from parts embedding face.
Around the parts that embed, the protective seam of opposing from the next electromagnetic radiation of circuit board direction can also be arranged, for example so-called EMI shielding.For example in undocumented patented claim FI20031796 also, disclosed preferred construction.In order to construct the EMI shielding; embedded location around parts on circuit board forms depression; and use the conductive material bedding or fill this depression; like this should be by the base (bezel) of being recessed to form of bedding or filling around parts, its guard block is avoided at least from the horizontal effect of electromagnetic radiation of circuit board.Parts and base insulation course insulated from each other will be arranged between the embedding opening of the base of formation and parts.In situation of the present invention, the shielding base can not be complete, but stays an opening in the position of optical bus.In addition, should be transparent at the material of opening part, light signal can pass this material from the optical bus to parts like this, or from parts to the optical bus.Term " transparent " is interpreted as relevant with the wavelength that uses, and for example transparent material allows employed wavelength to pass through easily, but may be opaque to other wavelength.In application, for example, transparent material can allow the light of infrared wavelength to pass through, but does not allow the visible wavelength of human eye to pass through.
The material that may be used for optical bus has, for example, and siloxane polymer, acrylate, polyimide, alkene, SU-8, sol-gel, ORMOCER (organically-modified pottery), PMGITM and Ultem.
Insulating material between the conductive layer of circuit board can be plastics or epoxy resin or some similar materials.Insulating material is not as the material of electrical transmission path.For example, insulating material can be selected from following group: various resins, expoxy glass, polyimide (for example, the KAPTON of Du Pont), the polyimide quartz, polyester, propylene, the inferior vinegar amine of two Malins, triatsine, glass fibre, cyanate ester glass, XPC (paper phenol), FR-1 (paper material, comprise the phenol cementing agent), FR-2 (paper material, comprise phenol cementing agent UL94-V0), FT-3 (paper material, comprise epoxy resin), FR-4 (glass fibre epoxy lamination), CEM (composite epoxy material), CEM-1 (paper substrate lamination, it is braided glass fibre that one deck (7628) is wherein arranged), CEM-3 (glass epoxide), aromatic polyamides (aramid fiber, for example Kevlar of Du Pont, Epoxy-Kevlar or Nobel's Twaron), PTFE (Teflon), benzocyclobutene, microfibril lamination and bakelite.
Usually in LTCC (LTCC), HTCC (High Temperature Co Fired Ceramic), glass, quartz/silicon dioxide, AIN, SiC, silicon, BeO and BN, aluminium can be used as special base-material.
Can be in circuit board as the plastics of insulating material, can comprise: tygon, polypropylene, polybutylene, polymethylpentene, polyamide, polyimide, polysulfones, polyetheretherketone (PALAP for example, by Denso Corp and Mitsubishi Plastics, Inc research and development), Polyvinylchloride, polyglass, cellulosics, polymethylmethacrylate (PMMA), polyacrylonitrile, polycarbonate, polyethylene terephthalate and fluorite plastics.
Conducting polymer and bonding agent can be divided into thermmohardening polymkeric substance and thermoplastic polymer.In order to increase conductivity, can use filling material, for example silver, gold or nickel.
Conducting polymer be for example polyacetylene, polythiophene, poly-ly cough up, poly-(p-phenylene vinylene, polyaniline, poly-/2,3-ethyldioxitophene).
Electroconductive binder generally includes three major parts: conductive filler, polymkeric substance, for example epoxy resin, modified epoxy or silicones, and the additive/agent that antistatic effect for example is provided.The bonding agent that depends on use uses UV light or heating to be cured/drying.Some bonding agent at room temperature can be dry.
Commercial (one or both components) conduction isotropic adhesives comprises:
Emerson&Cumming
Ablebond 976-1, flexibility, electroconductive binder is filled silver
Ablebond 84-ILMI NB, the conductive epoxy resin bonding agent is filled silver
Eccobond 57C, the conductive epoxy resin bonding agent is filled silver
Eccobond 50298, bi-component, and the conductive epoxy resin bonding agent is filled silver
AMICON C 850-6 epoxy adhesive is filled silver
AMICON CE 8500, conduction, the modified epoxy bonding agent is filled silver
Northrop Grumman company
SE-SECURE 9502, and electroconductive binder is filled silver
Loctite
Product 3880, the conductive epoxy resin bonding agent is filled silver (be specifically designed to and adhere to the EMI parts)
Product 3888, epoxy adhesive is filled silver
Product 5420, the conductive silicon resin
Product 5421 RTV, silicones (the EMI/RFI shielding is provided)
Dow?Corning
DA 6524, the conductive silicon bonding agent
DA 6533, the conductive and heat-conductive silicon resin adhesive
Panacol-Elosol?Gmbh
Elecolit 312 LV, not solvent-laden epoxy adhesive is filled silver
Elecolit 323, and the conductive epoxy resin bonding agent is filled silver
Elecolit 342, and conduction acrylate bonding agent is filled silver
Elecolit X-160378, the conductive epoxy resin bonding agent is filled silver
Commercial (one or both components) electric anisotropy bonding agent comprises:
Loctite
Product 3441, epoxy adhesive, gold surface polymkeric substance
Product 3446, epoxy adhesive, fusible filling material
Product 3440, the metal/polymer filling material
Product 3445, but molten solder filling material
Telephus
AcpMat series, the epoxy adhesive resin plaster, it comprises conductive filler and other special filling agent.
Fig. 1 has shown the sectional view of a basic structure of circuit board.Interrelate structure conductive layer 1 and insulation course 2 alternately in circuit board with the manufacturing of circuit board.In addition, optical bus is process in circuit board, can be transmitted into parts along optical signals, or away from parts.In the circuit board of this example, have two conductive layers at least: a conductive layer on the bus and a conductive layer under the bus.Typically, 2-4 conductive layer arranged on or below the top of optical layers.It is not only the position of conductive layer that optical layers can be arranged on, and can also be on the position of insulation course.In addition, a conductive layer can be linked the ground connection datum, for example the 0-level.
For parts more easily are embedded in the circuit board, in the fabrication phase of circuit board, at least in a side for example in the face of a side of parts embedded location, in zone of parts embedded location structure, thereby this zone is not contained conductive layer and is only comprised insulating material.In the embodiment shown in fig. 1, at the parts embedded location, in conductive layer 1, stay the next one to have the opening of insert depth.In the fabrication phase of circuit board, can in this opening, stay the continuous or discontinuous metal level 5 that the copper by the conductive layer 1 on for example same level of metal constitutes.In this opening, stay insulating material 2.
If wish to allow parts and parts embedded location conductive layer 1 down electrically contact, preferably use for example micro through hole method of some suitable connecting line methods, the insulation course 2 that passes the parts embedded location is to following conductive layer, manufacturing connecting line 6 before manufacturing metal level 5.Connecting line 6 be by some conductive materials for example metal constitute.
Fig. 2 has shown the sectional view of the depression 4 that gets out in the circuit board of Fig. 1.Use selective laser boring or similar approach, in the embedded location of parts, form depression 4 in circuit board, it extends to the conductive layer that is positioned at the insert depth under the parts embedded location.This conductive layer is preferably located in the below in the whole zone of holing, to help the degree of depth control of boring.Preferably, in the boring zone, do not have conductive layer 1, can carry out degree of depth control by means of metal conducting layer like this.For example, laser drill corroding metal not optionally, an etching insulating layer, when arriving conductive layer 1, boring will stop like this.
Fig. 3 has shown the sectional view of the parts 8 that the one side at Fig. 1 and 2 circuit board is embedded in.In the embodiments of figure 3, conductive material 10 and 12 are arranged, can be connected to the conductive layer that is positioned at the circuit board differing heights, for example, be connected to the conductive layer 1 on first and second surfaces that are positioned at circuit board by their parts in the separately both sides of parts.One side of parts comprises light active region 11.Built in items makes the surface of light active region meet at right angles with the light signal working direction basically by this way, and therefore meets at right angles with circuit board.In the embodiments of figure 3, light active region 11 and the zone 12 that comprises conductive material are in the same side of parts, and the second area that comprises conductive material 10 is on a relative side.A zone in the regions of conductive material also can be in a side of adjacent light active region.
For example use anisotropy or isotropic electroconductive binder 7 or use scolder or use conducting polymer, parts 8 are fixed to its contact pedestal (contact base) with abundant high conductivity.In the embodiments of figure 3, parts are attached to metal level 5 by means of electroconductive binder 7.Can use some connecting line method to pass insulation course 2, micro through hole method (micro through hole 5) for example is implemented to the electrical connection that is positioned at the conductive layer 1 below the parts 8.Only pass the conductive layer 1 of the insulation course that is positioned under parts 8 embedded locations 2 below also can structural member 8 after realizing being electrically connected finishing.Alternatively, the conductive layer 1 under the embedded location of parts 8 can be ready to, and can pass it and realize connecting.
If all connections are to utilize electroconductive binder, lead joint or other appropriate method to realize from the top of parts, can also parts be attached to pedestal by means of nonconducting bonding agent.
Fig. 4 has shown the sectional view of the parts 8 that embed in the circuit board of Fig. 1 and 2.After parts 8 embed, the depression 4 of using some suitable insulation material 9 partly or entirely to stay around the filling component.Principal element is the insulating material light active region 11 of filling component and the zone between the optical bus at least, and is transparent at this point insulating material at least.Insulating material 9 preferably with optical bus 3 in the material identical materials.The insulating material 9 of parts 8 on other side also preferably with optical bus 3 in the insulating material identical materials.
Fig. 5 shown in the circuit board that is embedded in Fig. 1 and 2 and has been connected to the conductive layer of the differing heights of circuit board, for example is connected to the conductive layer 1 of circuit board first surface or is connected to the conductive layer of second side or is connected to the sectional view of the parts 8 of the two simultaneously.Layer 12 conductive layer 1 that can be connected on the circuit board first surface of the conductive material on the first surface of parts, like this between parts 8 and circuit board depression 4 superstructure by conductive material 13 electroconductive binder or the polymkeric substance pit of filling for example.If insulating material all is filled in the depression 4 between parts 8 and the circuit board, then should removes this insulating material and use conductive material 13 to replace.Alternatively, depression 4 only is filled to and is higher than optical bus 3, is filled the top of depression by conductive material.Can rely between parts and the circuit board conductive material 13 on the top of depression 3, between the conductive layer 1 of the layer 12 of conductive material on parts first side and circuit board first surface, form and electrically contact.
Also can be implemented to the electrical connection that is positioned at conductive layer 1 on the circuit board second surface by the conductive material 10 that is positioned at parts second side.By micro through hole 6, pass the metal level 5 that is positioned under the parts embedded location to the conductive layer 1 that is positioned under the parts, electroconductive binder 7, scolder or polymkeric substance by the parts attachment point form and electrically contact.
Alternatively, for example, can be by means of engaging connection or the part connection that (for example, using the lead of gold or aluminum steel to engage) is implemented to the conductive layer that is positioned at circuit board first or second surface.
If necessary, for example can promptly parts be protected from the parts top by means of the conduction label from a relative side of parts attachment point.
Claims (17)
1, a kind of parts (8) are embedded method in the circuit board at least in part, wherein said parts comprise light active region (11), and described circuit board comprises conductive layer (1) and insulation course (2) alternately, and at least one optical bus (3), it is characterized in that
Form described depression (4) with depression and the mode that optical bus (3) intersects at the embedded location place of parts (8),
Be included in the existing smooth active region of a side (11) at least one conductive region (10 is arranged again, 12) described parts are provided with in such a way, make the light active region (11) of described parts be positioned near the intersection surface of optical bus, the surface of light active region meets at right angles with the position of circuit board basically.
2, the method for claim 1 is characterized in that, when forming depression (4), only removes not one or more materials as electrical transmission path (1) from circuit board.
3, method as claimed in claim 1 or 2 is characterized in that, after embedding transparent insulation material (9) is placed in the depression (4) remaining around the described parts, makes space between the intersection surface of filling insulating material light active region and optical bus.
4, method as claimed in claim 3 is characterized in that, the depression of being left on every side by the described parts of insulating material (9) complete filling after embedding (4).
As claim 3 or 4 described methods, it is characterized in that 5, the upper section in cave in (4) stays or form pit, fills described depression (4) with conductive material (13).
6, method as claimed in claim 5 is characterized in that, the conductive material (13) that is used for filling depression is conducting polymer, electroconductive binder or metal.
7, as the described method of above-mentioned each claim, it is characterized in that, in the zone (10,12) that on the face of the described parts of optical bus, comprises light active region (11) and one or more conductive materials.
As each the described method among the claim 5-7, it is characterized in that 8, the zone of one or more conductive materials (10,12) are being electrically connected to the conductive layer (1) that is positioned on the circuit board surface on the embedding face of parts.
9, as the described method of above-mentioned each claim, it is characterized in that, do not include the zone (10) of conductive material at described parts on the face of optical bus or the adjacent face.
10, method as claimed in claim 9 is characterized in that, the zone of the conductive material of described parts (10) are electrically connected to the conductive layer (1) on the circuit board surface that is positioned at parts embedded location below.
11, as the described method of above-mentioned each claim, it is characterized in that, described parts are fixed on the metal level (5) of its below by means of electroconductive binder.
As the described method of above-mentioned each claim, it is characterized in that 12, the end face of parts (8) is emission or light reception element spare.
13, a kind of circuit board comprises:
Light parts (8), and
Optical bus (3), light signal may be directed to described parts by described optical bus or away from described parts,
It is characterized in that, parts (8) are embedded in the circuit board at least in part, make described parts contact with optical bus optics, be included in the existing smooth active region of a side (11) at least one conductive region (10 is arranged again, 12) described parts (8) are provided with in such a way, make the light active region (11) of described parts meet at right angles with the plane of circuit board basically.
14, circuit board as claimed in claim 13 is characterized in that, parts (8) are embedded in the circuit board, makes described parts fully between first and second surfaces of circuit board.
15, as claim 13 or 14 described circuit boards, it is characterized in that, use and material that optical bus (3) is same comes the light active region (11) of filling component (8) and the space between the optical bus (3).
16, circuit board as claimed in claim 15, it is characterized in that, parts (8) comprise first regions of conductive material (12) and second regions of conductive material (10), and form and the electrically contacting of first conductive layer (1) of circuit board from first regions of conductive material (12), form and the electrically contacting of second conductive layer (1) of circuit board from second regions of conductive material (10), second conductive layer (1) of described circuit board is positioned at the different levels on the circuit board thickness direction.
As the described circuit board of above-mentioned each claim, it is characterized in that 17, the end face of described parts is emission or light reception element spare.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20040253A FI20040253A (en) | 2004-02-17 | 2004-02-17 | Circuit board and method for immersing an optical component in a circuit board |
| FI20040253 | 2004-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1922524A true CN1922524A (en) | 2007-02-28 |
Family
ID=31725729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005800051407A Pending CN1922524A (en) | 2004-02-17 | 2005-02-17 | Circuit board and method for embedding an optical component in a circuit board |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1716441A1 (en) |
| JP (1) | JP2007522664A (en) |
| CN (1) | CN1922524A (en) |
| FI (1) | FI20040253A (en) |
| WO (1) | WO2005078497A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872925A (en) * | 2016-09-27 | 2018-04-03 | 奥特斯奥地利科技与系统技术有限公司 | Part is embedded in the core on conductive foil |
| CN114567962A (en) * | 2020-11-27 | 2022-05-31 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT505834B1 (en) | 2007-09-21 | 2009-09-15 | Austria Tech & System Tech | CIRCUIT BOARD ELEMENT |
| DE102009008087A1 (en) | 2009-02-09 | 2010-08-19 | Continental Automotive Gmbh | Electro-optical control or regulating device and method for exchanging control and regulating signals |
| US20150182967A1 (en) * | 2013-12-31 | 2015-07-02 | Canon U.S. Life Sciences, Inc. | Printed circuit board designs for laminated microfluidic devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4732446A (en) * | 1985-10-02 | 1988-03-22 | Lamar Gipson | Electrical circuit and optical data buss |
| DE19917554C2 (en) * | 1999-04-19 | 2001-07-12 | Siemens Ag | Position fixation in printed circuit boards |
| JP3728147B2 (en) * | 1999-07-16 | 2005-12-21 | キヤノン株式会社 | Opto-electric hybrid wiring board |
| US6768826B2 (en) * | 2001-07-30 | 2004-07-27 | Infineon Technologies Ag | Delivering data optically to an integrated circuit |
| JP3846284B2 (en) * | 2001-11-26 | 2006-11-15 | 株式会社トッパンＮｅｃサーキットソリューションズ | Manufacturing method of optical waveguide |
| TWI294262B (en) * | 2002-06-28 | 2008-03-01 | Matsushita Electric Ind Co Ltd | A light reception/emission device built-in module with optical and electrical wiring combined therein and method of making the same |
-
2004
- 2004-02-17 FI FI20040253A patent/FI20040253A/en unknown
-
2005
- 2005-02-17 WO PCT/FI2005/000104 patent/WO2005078497A1/en not_active Application Discontinuation
- 2005-02-17 CN CNA2005800051407A patent/CN1922524A/en active Pending
- 2005-02-17 EP EP05708184A patent/EP1716441A1/en not_active Withdrawn
- 2005-02-17 JP JP2006552645A patent/JP2007522664A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872925A (en) * | 2016-09-27 | 2018-04-03 | 奥特斯奥地利科技与系统技术有限公司 | Part is embedded in the core on conductive foil |
| US10743422B2 (en) | 2016-09-27 | 2020-08-11 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding a component in a core on conductive foil |
| CN114567962A (en) * | 2020-11-27 | 2022-05-31 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
| CN114567962B (en) * | 2020-11-27 | 2023-11-10 | 鹏鼎控股(深圳)股份有限公司 | Method for manufacturing circuit board and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| FI20040253A (en) | 2005-08-18 |
| JP2007522664A (en) | 2007-08-09 |
| FI20040253A0 (en) | 2004-02-17 |
| EP1716441A1 (en) | 2006-11-02 |
| WO2005078497A1 (en) | 2005-08-25 |
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