CN1920549A - Sound wave sensing method and apparatus with integrated micro flow passage - Google Patents
Sound wave sensing method and apparatus with integrated micro flow passage Download PDFInfo
- Publication number
- CN1920549A CN1920549A CN 200510093706 CN200510093706A CN1920549A CN 1920549 A CN1920549 A CN 1920549A CN 200510093706 CN200510093706 CN 200510093706 CN 200510093706 A CN200510093706 A CN 200510093706A CN 1920549 A CN1920549 A CN 1920549A
- Authority
- CN
- China
- Prior art keywords
- sound wave
- tool
- substrate
- sensing apparatus
- wave sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Abstract
The invention relates to a sonic wave sensor for combining micro current channel and relative method, wherein it uses one piezoelectric block as base plate; uses electromechanical or chemical processing method to produce sensing area to be piezoelectric base plate; uses inter-digital transducer IDT to produce plate flexible wave. The invention uses same process or combining method to integrate micro current channel into base plate with same piezoelectric character. The invention uses new element and design to produce the element with better piezoelectric character, stable temperature compensation, and firm structure, to apply plate flexible wave on liquid sensor.
Description
Technical field
The present invention provides a kind of sound wave sensing apparatus and method thereof of tool integrated micro flow passage, refers to that especially a kind of sound wave sensing apparatus is a substrate with the piezoelectricity bulk, and utilizes micro electronmechanical processing procedure processing, and made sensor can be applied to the analysis of special component in the liquid gaseous state.
Background technology
(Flexural Plate Wave, ripple FPW) passes characteristic, makes it in liquid, the characteristic of limitation NE BY ENERGY TRANSFER is arranged, and be applied among the liquid sensor because of plate flexural wave.Existing FPW element mainly is to utilize silicon substrate as platform, finishes the making of element after growth piezoelectric membrane and the etching.But in practical application, the speciality of growth multilayer film is difficult for grasping, and the piezoelectric property of piezoelectric film promptly determines the important parameter of the performance characteristic of FPW element.In addition, the structure of film is comparatively fragile, and is very easily broken on the FPW element application.
In U.S. Pat 5,212, in 988, piezoelectric is used laminating structure (layerstructure), make it can produce symmetric and asymmetric lamb wave (Lamb wave); And in the design of processing procedure, need ground electrode layer (Ground electrode layer).In U.S. Pat 5,212, in 988, be shown in equally and use thin film deposition and silicon etch process on the processing procedure.In addition, in U.S. Pat 6,688, in 158, emphasize to utilize sacrifice layer processing procedure (sacrificial layer micro-maching) to finish the less element of area, but and reach the purpose of array, and its piezoelectric layer material is aluminium nitride (aluminum nitride), zinc paste (zinc oxide) and lead zirconium titanate (lead zirconiumtitanate) etc.
On existing literature, people such as Qing-Yun Caiz institute; " Vapor recognition with anintegrated array of polymer-coated flexural plate wave sensors " Sensorsand Actuators B; the 62; the 121-130 page or leaf, the Christian era 2000 years.The plate flexural wave structure of this piece is to be substrate with the silicon substrate, with the structure of piezoelectric membrane as actuating, but but its Integration Design becomes array structure, and combine with the amount of circuitry examining system; And on using, mainly bias toward identification on the gas.
People such as Philippe Luginbuhl institute; " Microfabricated Lamb Wave DeviceBased on PZT Sol-Gel Thin Film for Mechanical Transport of SolidParticles and Liquids " Journal of microelectro-mechanical; the 73; the 112-123 page or leaf, Christian era calendar year 2001.The plate flexural wave structure of this piece has illustrated that it utilizes FPW to cause fluid can utilize mechanical motion to transmit the particulate and the fluid of solid, but has not proved sensed result in fluid.
As from the foregoing, above-mentioned existing sound wave sensing apparatus on reality is used, obviously has not enough and the shortcoming existence.Edge is, the improving of the above-mentioned shortcoming of this creator thoughts is that the spy concentrates on studies and cooperates the utilization of scientific principle, proposes a kind of reasonable in design and effectively improve this creation of above-mentioned shortcoming finally.
Summary of the invention
In view of this, purposes of the present invention be not good for the piezoelectric property that solves existing sound wave sensing apparatus, membrane structure is fragile or stable problem such as not good.In order to reach above-mentioned purpose, the invention provides a kind of sound wave sensing apparatus and method thereof of tool integrated micro flow passage, utilize new element processing procedure and design, have to produce that piezoelectric property is good, temperature compensation characteristic is stable and element firm in structure, will make plate flexural wave can be applicable on the liquid sensor.Therefore, as substrate, do its sensing region with electromechanics or chemical process mode becomes the piezoelectricity thin plate to the present invention's proposition with a piezoelectricity bulk, and (Inter-digitaltransducer IDT) makes it produce plate flexural wave to utilize fourchette shape electrode structure again.The present invention more can further combine micro sprue system with same processing procedure or juncture.
Sound wave sensing apparatus of the present invention, this sound wave sensing apparatus comprises: the substrate of a tool piezoelectric property, this substrate material can be a quartz, lithium niobate or a tantalum niobate, make the substrate thickness of a certain substrate regions of this substrate transmit wavelength with electromechanics grinding or chemical etching processing mode less than sound wave, and make it have the condition that produces plate flexural wave, wherein this substrate forms the zone of thin plate as producing sound wave or stress wave transmission, in order to the usefulness as detection gas phase or liquid phase molecule;
One tool refers to the electrode layer of difference shape structure, be located on the front or reverse side of substrate regions that this tool produces the plate flexural wave condition, and this electrode layer that refers to difference shape structure comprises two corresponding one first electrode layers and a second electrode lay, and those electrode layers are to utilize metal as structural sheet, wherein coating one sensing material on the bang path between this first electrode layer and this second electrode lay forms a sensing region;
The material layer of one tool electrode characteristic protection, this material layer be with high one's share of expenses for a joint undertaking polymkeric substance as material, coat on this first electrode layer and this second electrode lay periphery, the sensing effect of right sensing region is not influenced by this protective material layer.
This sound wave sensing apparatus more can comprise a fluid channel in addition, and this sensing region that produces under the plate flexural wave condition in tool forms with dynamo-electric etching or chemical etching processing mode; Form the sound wave sensing apparatus of a tool integrated micro flow passage thus.The present invention more can further be incorporated into fluid channel on the substrate of same tool piezoelectric property with same processing procedure or juncture, forms the sound wave sensor of the tool fluid channel that comprises the sound wave sensing apparatus of the present invention more than two.
As above-mentioned, the manufacturing method thereof of sound wave sensing apparatus of the present invention, this method comprises the following steps: at first to grind with electromechanics or the single or double processing mode is adopted in chemical etching, make the substrate thickness in a certain zone on the tool piezoelectric property substrate transmit wavelength, and make the substrate regions of this thickness attenuation have the condition that produces plate flexural wave less than sound wave; Form a tool then and refer to that the electrode layer of difference shape structure is on the substrate regions of this tool plate flexural wave condition, wherein this tool refers to that the electrode layer of difference shape structure comprises two corresponding one first electrode layers and a second electrode lay, if previous step is adopted the single-sided process mode, then this tool refers to that the electrode layer of difference shape structure is in the enterprising shape of advancing of front, reverse side or tow sides in the bent territory of substrate of this tool plate flexural wave condition what is more; Then be coated with a sensing material and refer in this tool form a sensing region on the bang path between the electrode layer of difference shape structure, wherein sensing material can be coated electrode layer that this tool refers to difference shape structure with one side, opposite another side or coat the two sides simultaneously; And coating one electrode protection material refer in this tool difference shape structure electrode layer arround locate.
Above-mentioned step more can comprise at last: grind or the chemical etching mode with electromechanics, form a fluid channel in having this sensing region that produces under the plate flexural wave condition; Thus, form the sound wave sensing apparatus of a tool integrated micro flow passage.Wherein this step can be carried out less than the step that sound wave transmits wavelength simultaneously with the substrate thickness that makes a certain zone on the tool piezoelectric property substrate at the beginning.
Description of drawings
Figure 1A is the top view of sound wave sensing apparatus under etching is monolateral of tool integrated micro flow passage of the present invention;
Figure 1B is the stereographic map of sound wave sensing apparatus under etching is monolateral of tool integrated micro flow passage of the present invention;
Fig. 1 C is the sectional axonometric drawing of sound wave sensing apparatus under etching is monolateral of tool integrated micro flow passage of the present invention;
Fig. 2 A is the top view of sound wave sensing apparatus of the present invention under etching is bilateral;
Fig. 2 B is the stereographic map of sound wave sensing apparatus of the present invention under etching is bilateral;
Fig. 2 C is the sectional axonometric drawing of sound wave sensing apparatus of the present invention under etching is bilateral;
Fig. 2 D is the top view of sound wave sensing apparatus under etching is bilateral of tool integrated micro flow passage of the present invention;
Fig. 2 E is the sectional axonometric drawing of sound wave sensing apparatus under etching is bilateral of tool integrated micro flow passage of the present invention;
Fig. 3 A is as the stereographic map of sound wave sensing apparatus of the present invention under etching is bilateral with reference to sensing apparatus;
Fig. 3 B has the sectional axonometric drawing of sound wave sensing apparatus under etching is two-sided of sensed layer for the present invention;
Fig. 4 A is the top view of the sound wave sensor of tool integrated micro flow passage of the present invention;
Fig. 4 B is the stereographic map of the sound wave sensor of tool integrated micro flow passage of the present invention;
Fig. 4 C is the three-dimensional section body of the sound wave sensor of tool integrated micro flow passage of the present invention;
Fig. 5 is the manufacture method process flow diagram of sound wave sensing apparatus of the present invention; And
Fig. 6 is the manufacture method process flow diagram of the sound wave sensing apparatus of tool integrated micro flow passage of the present invention.
The element explanation
Figure 1A, Figure 1B and Fig. 1 C:
Sound wave sensing apparatus 10
The substrate 11 of tool piezoelectric property
Tool refers to the electrode layer 12 of difference shape structure
The zone 13 of coating sensing material
The material layer 14 of tool electrode characteristic protection
Fig. 2 A, Fig. 2 B are to Fig. 4 C:
Sound wave sensing apparatus 20
The substrate 21 of tool piezoelectric property
Tool refers to the electrode layer 22 of difference shape structure
The zone 23 of coating sensing material
The material layer 24 of tool electrode characteristic protection
The sensor 30 of tool integrated micro flow passage
Embodiment
See also Figure 1A, Figure 1B and Fig. 1 C, the sound wave sensing apparatus of tool integrated micro flow passage of the present invention each synoptic diagram under etching is monolateral, sound wave sensing apparatus 10 utilizes the substrate 11 of a tool piezoelectric property, make substrate 11 thickness of substrate 11 a certain substrate regions transmit wavelength with electromechanics grinding or chemical etching (can adopt the chromium gold and carry out etching) processing mode, and make it meet the sound wave transmission that can produce plate flexural wave (or title lamb wave) under vibration condition and the boundary condition less than sound wave as etch mask.Wherein the substrate zone of substrate 11 thickness attenuation is as producing sound wave or stress wave transmission, and substrate 11 utilizes the phase change of its ripple bang path or the frequency shift during as oscillator, can be used as the usefulness of the sound wave sensing that detects gas phase or liquid phase molecule.Select for use piezoelectric substrate 11 advantages to be, it has more existing piezoelectric membrane that better performance is arranged on temperature compensation coefficient, and the efficient that sound wave activates is taken from electromechanical coupling factor, and piezoelectric substrate 11 also has higher electromechanical coupling factor, so its piezoelectric property is good.
One tool refers to the electrode layer 12 of difference shape structure, be located on the front or reverse side in substrate 11 zones that tool produces the plate flexural wave condition, and the electrode layer 12 that refers to difference shape structure comprises two corresponding one first electrode layers and a second electrode lay, different finger difference spacings and other parameter can influence resonant frequency and other characteristics of attitude response frequently, and those electrode layers are to utilize metal as structural sheet, wherein be coated with a sensing material on the bang path between this first electrode layer and this second electrode lay, form the sensing region 13 of a coating sensing material, be mainly used in the sensing region 13 of sensing gas-liquid phase molecule and this bang path.The material layer 14 of one tool electrode characteristic protection; material layer 14 is as material with high one's share of expenses for a joint undertaking polymkeric substance; on coating arround this first electrode layer on the electrode layer 12 that tool refers to difference shape structure and this second electrode lay, wherein uncoated tool electrode characteristic protective material layer 14 is on sensing region 13.
Sound wave sensing apparatus 10 more is included in the sensing region 13 that tool produces under the plate flexural wave condition and forms a fluid channel 15 with dynamo-electric etching or chemical etching processing mode in addition; Form the sound wave sensing apparatus 10 of a tool integrated micro flow passage thus.
Except the etched design of single face, make in order to develop immersion or accelerating structure, the present invention also proposes two-sided etched structure.See also Fig. 2 A, Fig. 2 B and Fig. 2 C, sound wave sensing apparatus 20 of the present invention each synoptic diagram under etching is bilateral.Similarly, see also Fig. 2 D and Fig. 2 E, sound wave sensing apparatus 20 also can form a fluid channel 25 with dynamo-electric etching or chemical etching processing mode in the sensing region 23 that tool produces under the plate flexural wave condition; Form the sound wave sensing apparatus 20 of a tool integrated micro flow passage thus.
And in the measurement of sensing, structure mainly can be designed to as Fig. 3 A one with reference to sensing apparatus and as the sound wave sensing apparatus with sensed layer 20 of Fig. 3 B, in order to get rid of the factor of other influences.Technical at the sound wave sensing, because when the physical characteristics of plate flexural wave is that velocity of wave when its transmission is less than sensing liquid velocity of wave, in the ripple that energy can be confined to transmit, can not scatter and disappear, so sound wave sensing apparatus 10 of the present invention or 20 is used for the liquid sensing, more existing have preferable sensitivity, and in conjunction with the fluid sensing, must consider that the interface that sound wave sensing apparatus 10 or 20 is integrated with fluid influences.Wherein sensing circuit 26 is used to measure the phase change of frequency shift (FS) or transmission ripple.
With two-sided etching and processing is example, sees also Fig. 4 A, Fig. 4 B and Fig. 4 C.Sound wave sensing apparatus 20 of the present invention is except proposition forms with piezoelectric substrate 21 direct processing and fabricatings, more also process with same processing procedure because of most fluid channel 25, so can be at the beginning of design, promptly fluid channel 25 is incorporated on the substrate 21 of same tool piezoelectric property, further sound wave sensing apparatus 20 arrays and fluid channel 25 is formed sound wave sensor 30 wafers of the tool fluid channel that comprises the sound wave sensing apparatus of the present invention 20 more than two with same processing procedure or juncture.
See also Fig. 5, Fig. 5 is the manufacture method process flow diagram of sound wave sensing apparatus of the present invention.Sound wave sensing apparatus 10 of the present invention or 20 manufacturing method thereof, this method comprises the following steps: at first to grind with electromechanics or the single or double processing mode is adopted in chemical etching, make the substrate 11 or 21 thickness in a certain zone on a tool piezoelectric property substrate 11 or 21 transmit wavelength, and make substrate 11 or 21 zones have the condition (step 500) that produces plate flexural wave less than sound wave.
Form the electrode layer 12 or 22 that a tool refers to difference shape structure then and go up (steps 502) in the substrate 11 or 21 zones of this tool plate flexural wave condition, wherein tool refers to that the electrode layer 12 or 22 of difference shape structure comprises that two corresponding one first electrode layers and a second electrode lay measure its attitude response frequently again; If step 500 is adopted the single-sided process mode, then tool refers to that the electrode layer 12 of difference shape structure carries out on front, reverse side or the tow sides in substrate 10 zones of tool plate flexural wave condition what is more.
Then being coated with a sensing material refers on the electrode layer 12 of difference shape structure or 22 s' the bang path in tool, to form a sensing region 13 or 23, wherein sensing material can be coated electrode layer 12 or 22 that tool refers to difference shape structure with one side, opposite another side or coat two sides (step 504) simultaneously.Be coated with at last an electrode protection material layer 14 or 24 arround tool refers to this first electrode layer on the electrode layer 12 or 22 of difference shape structure and this second electrode lay on, wherein uncoated tool electrode characteristic protective material layer 14 or 24 is on sensing region 13 or 23 (step 506).
See also Fig. 6, Fig. 6 is the manufacture method process flow diagram of the sound wave sensing apparatus of tool fluid channel of the present invention.More can comprise after the step 506: grind or the chemical etching mode with electromechanics, form a fluid channel 15 or 25 (steps 508) in having this sensing region 13 or 23 that produces under the plate flexural wave condition; Thus, form the sound wave sensing apparatus 10 or 20 of a tool integrated micro flow passage.Wherein step 508 can be carried out simultaneously with step 500.
The invention provides a kind of sound wave sensing apparatus and method thereof of tool integrated micro flow passage, utilize new element processing procedure and design, have to produce that piezoelectric property is good, temperature compensation characteristic is stable and element firm in structure, will make plate flexural wave can be applicable on the liquid sensor.Specifically, the present invention can make substrate form two depressions by two-sided processing mode, and partly reaches filminess in central diaphragm; The design of fluid channel helps fluid conduction to be measured to sensing region, quickens the reaction of sensing film and determinand, and can link with other outward elements; The present invention simultaneously can be integrated in the biochemistry detection purposes and array detects the synchronization gain analysis detecting data.
In sum, it only is the detailed description of preferable possible embodiments of the present invention and graphic, non-so the promptly inflexible claim of limitting this creation, so equivalent alternate embodiment of using this creation instructions and graphic content to do such as, all in like manner all be contained in the range content of this creation, anyly be familiar with this skill person in the field of the invention, can think easily and variation or modify the claim scope that all can be encompassed in this case.
Claims (38)
1. the sound wave sensing apparatus of a tool integrated micro flow passage is characterized in that, this sound wave sensing apparatus comprises:
The substrate of one tool piezoelectric property makes the substrate thickness of a certain substrate regions of this substrate transmit wavelength less than sound wave with electromechanics or chemical process mode, and has the condition that produces plate flexural wave;
One tool refers to the electrode layer of difference shape structure, be located on the front or reverse side of substrate thickness weakened region that this tool produces the plate flexural wave condition, and this electrode layer that refers to difference shape structure comprises two corresponding one first electrode layers and a second electrode lay, wherein be coated with a sensing material on the bang path between this first electrode layer and this second electrode lay, to form a sensing region;
The material layer of one tool electrode characteristic protection is coated on this first electrode layer and this second electrode lay periphery; And
One fluid channel, this sensing region that produces under the plate flexural wave condition in tool forms with electromechanics or chemical process mode.
2. sound wave sensing apparatus as claimed in claim 1 is characterized in that, this substrate forms the zone of thin plate as producing sound wave or stress wave transmission, in order to the usefulness as detection gas phase or liquid phase molecule.
3. sound wave sensing apparatus as claimed in claim 1 is characterized in that, the substrate material of this tool piezoelectric property is a quartz, a lithium niobate or a tantalum niobate.
4. sound wave sensing apparatus as claimed in claim 1 is characterized in that, the substrate of this tool piezoelectric property is the substrate thickness attenuation that makes this a certain substrate regions with dynamo-electric lapping mode.
5. sound wave sensing apparatus as claimed in claim 1 is characterized in that, the substrate of this tool piezoelectric property is the substrate thickness attenuation that makes this a certain substrate regions in the chemical etching mode.
6. sound wave sensing apparatus as claimed in claim 1 is characterized in that, the processing mode of the substrate of this tool piezoelectric property for carrying out single-sided process or two-sided processing mode, and is made the substrate thickness attenuation of this a certain substrate regions.
7. sound wave sensing apparatus as claimed in claim 1 is characterized in that, this tool refers to that the electrode layer of difference shape structure is to utilize metal as structural sheet.
8. sound wave sensing apparatus as claimed in claim 1 is characterized in that, the material layer of tool electrode characteristic protection is as material with high one's share of expenses for a joint undertaking polymkeric substance.
9. sound wave sensing apparatus as claimed in claim 1 is characterized in that, this fluid channel is to process in the chemical etching mode.
10. sound wave sensing apparatus as claimed in claim 1 is characterized in that, this fluid channel is to process with dynamo-electric lapping mode.
11. the sound wave sensor of a tool integrated micro flow passage is characterized in that, comprise sound wave sensing apparatus as claimed in claim 1 more than two, and the substrate of the tool piezoelectric property of those sound wave sensing apparatus interconnects.
12. sound wave sensor as claimed in claim 11 is characterized in that, each sound wave sensing apparatus is to be made on the substrate of same tool piezoelectric property.
13. sound wave sensor as claimed in claim 11 is characterized in that, each sound wave sensing apparatus is to utilize juncture to be integrated into a sound wave sensor.
14. a sound wave sensing apparatus is characterized in that, this sound wave sensing apparatus comprises:
The substrate of one tool piezoelectric property makes the substrate thickness of a certain substrate regions of this substrate transmit wavelength less than sound wave with electromechanics or chemical process mode, and makes it have the condition that produces plate flexural wave;
One tool refers to the electrode layer of difference shape structure, be located on the front or reverse side of substrate regions that this tool produces the plate flexural wave condition, and this electrode layer that refers to difference shape structure comprises two corresponding one first electrode layers and a second electrode lay, wherein be coated with a sensing material on the bang path between this first electrode layer and this second electrode lay, to form a sensing region; And
The material layer of one tool electrode characteristic protection is coated on this first electrode layer and this second electrode lay periphery.
15. sound wave sensing apparatus as claimed in claim 14 is characterized in that, this substrate forms the zone of thin plate as producing sound wave or stress wave transmission, in order to the usefulness as detection gas phase or liquid phase molecule.
16. sound wave sensing apparatus as claimed in claim 14 is characterized in that, the substrate material of this tool piezoelectric property is a quartz, a lithium niobate or a tantalum niobate.
17. sound wave sensing apparatus as claimed in claim 14 is characterized in that, the substrate of this tool piezoelectric property makes the substrate thickness attenuation of this a certain substrate regions with dynamo-electric lapping mode.
18. sound wave sensing apparatus as claimed in claim 14 is characterized in that, the substrate of this tool piezoelectric property is the substrate thickness attenuation that makes this a certain substrate regions in the chemical etching mode.
19. sound wave sensing apparatus as claimed in claim 14 is characterized in that, the processing mode of the substrate of this tool piezoelectric property for carrying out single-sided process or two-sided processing mode, and is made the substrate degree attenuation of this a certain substrate regions.
20. sound wave sensing apparatus as claimed in claim 14 is characterized in that, this tool refers to that the electrode layer of difference shape structure is to utilize metal as structural sheet.
21. sound wave sensing apparatus as claimed in claim 14 is characterized in that, the material layer of tool electrode characteristic protection with high one's share of expenses for a joint undertaking polymkeric substance as material.
22. sound wave sensing apparatus as claimed in claim 14 is characterized in that, more comprises a fluid channel, this sensing region that produces under the plate flexural wave condition in tool forms with electromechanics or chemical process mode.
23. sound wave sensing apparatus as claimed in claim 22 is characterized in that, this fluid channel processes in the chemical etching mode.
24. sound wave sensing apparatus as claimed in claim 22 is characterized in that, this fluid channel processes with dynamo-electric lapping mode.
25. the manufacturing method thereof of a sound wave sensing apparatus is characterized in that, this method comprises the following steps:
Make the substrate thickness in a certain zone on the tool piezoelectric property substrate transmit wavelength, and make this substrate regions have the condition that produces plate flexural wave less than sound wave;
Form a tool and refer to that the electrode layer of difference shape structure is on the substrate regions of this tool plate flexural wave condition;
Being coated with a sensing material one of refers in this tool between the electrode layer of difference shape structure to form a sensing region on the bang path; And
Be coated with an electrode protection material refer in this tool difference shape structure electrode layer arround arround locate.
26. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25 is characterized in that, the substrate material of this tool piezoelectric property is a quartz, a lithium niobate or a tantalum niobate.
27. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25 is characterized in that, makes the step of the substrate thickness in a certain zone on the tool piezoelectric property substrate less than sound wave transmission wavelength, makes the substrate thickness attenuation with dynamo-electric lapping mode.
28. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25 is characterized in that, makes the step of the substrate thickness in a certain zone on the tool piezoelectric property substrate less than sound wave transmission wavelength, makes the substrate thickness attenuation in the chemical etching mode.
29. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25 is characterized in that, makes the step of the substrate thickness in a certain zone on the tool piezoelectric property substrate less than sound wave transmission wavelength, with single-sided process or two-sided processing mode, and makes the substrate thickness attenuation.
30. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 29, it is characterized in that, if when adopting single face worker processing mode, in forming the step of electrode layer on the substrate regions of this tool plate flexural wave condition that a tool refers to difference shape structure, then this tool refers to that the electrode layer of difference shape structure forms on front, reverse side or the tow sides of the substrate regions of this tool plate flexural wave condition.
31. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25, it is characterized in that, in forming the step of electrode layer on the substrate regions of this tool plate flexural wave condition that a tool refers to difference shape structure, this tool refers to that the electrode layer of difference shape structure is to utilize metal as structural sheet.
32. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25, it is characterized in that, in forming the step of electrode layer on the substrate regions of this tool plate flexural wave condition that a tool refers to difference shape structure, this tool refers to that the electrode layer of difference shape structure comprises two one of corresponding first electrode layer and the second electrode lays.
33. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25, it is characterized in that, one of refer between the electrode layer of difference shape structure the step on the bang path in this tool in coating one sensing material, this sensing material is coated electrode layer that this tool refers to difference shape structure with one side, opposite another side or coat the two sides simultaneously.
34. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25; it is characterized in that; refer in coating one electrode protection material in this tool difference shape structure electrode layer arround the step located, the material layer of this tool electrode characteristic protection is as material with high one's share of expenses for a joint undertaking polymkeric substance.
35. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 25 is characterized in that, more comprises the following steps:
Form a fluid channel in having this sensing region that produces under the plate flexural wave condition;
Thus, form the sound wave sensing apparatus of a tool integrated micro flow passage.
36. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 35 is characterized in that, in forming a fluid channel in having the step that produces this sensing region under the plate flexural wave condition, this fluid channel is to be processed to form in the chemical etching mode.
37. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 35 is characterized in that, in forming a fluid channel in having the step that produces this sensing region under the plate flexural wave condition, this fluid channel is to be processed to form with dynamo-electric lapping mode.
38. the manufacturing method thereof of sound wave sensing apparatus as claimed in claim 35, it is characterized in that, in forming a fluid channel, be to carry out simultaneously less than the step that sound wave transmits wavelength with the substrate thickness that makes a certain zone on the tool piezoelectric property substrate in having the step that produces this sensing region under the plate flexural wave condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100937068A CN100549689C (en) | 2005-08-23 | 2005-08-23 | The sound wave sensing apparatus of tool integrated micro flow passage and manufacture method thereof and sound wave sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100937068A CN100549689C (en) | 2005-08-23 | 2005-08-23 | The sound wave sensing apparatus of tool integrated micro flow passage and manufacture method thereof and sound wave sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1920549A true CN1920549A (en) | 2007-02-28 |
| CN100549689C CN100549689C (en) | 2009-10-14 |
Family
ID=37778315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100937068A Expired - Fee Related CN100549689C (en) | 2005-08-23 | 2005-08-23 | The sound wave sensing apparatus of tool integrated micro flow passage and manufacture method thereof and sound wave sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100549689C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181665A (en) * | 2015-09-18 | 2015-12-23 | 中国科学院苏州生物医学工程技术研究所 | Molecular dynamics test platform based on acousto-optical combination |
| CN110508336A (en) * | 2018-05-22 | 2019-11-29 | 德累斯顿莱布尼茨固体材料研究所 | Acoustic fluid component and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI607206B (en) | 2016-11-15 | 2017-12-01 | 中原大學 | Electronic device for sensing triple-axial force and triple-axial force measurement sensor thereof |
-
2005
- 2005-08-23 CN CNB2005100937068A patent/CN100549689C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181665A (en) * | 2015-09-18 | 2015-12-23 | 中国科学院苏州生物医学工程技术研究所 | Molecular dynamics test platform based on acousto-optical combination |
| CN105181665B (en) * | 2015-09-18 | 2018-09-14 | 中国科学院苏州生物医学工程技术研究所 | Based on molecular dynamics test platform associated with acousto-optic |
| CN110508336A (en) * | 2018-05-22 | 2019-11-29 | 德累斯顿莱布尼茨固体材料研究所 | Acoustic fluid component and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100549689C (en) | 2009-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI343180B (en) | The acoustic wave sensing-device integrated with micro channels | |
| JP6916176B2 (en) | Resonant structure with enhanced shear and longitudinal mode reflections of acoustic vibrations | |
| US10864553B2 (en) | Piezoelectric transducers and methods of making and using the same | |
| JP5431301B2 (en) | Physical / biochemical sensor using multi-size piezoelectric microcantilever resonator array and method for manufacturing the same | |
| EP3377886B1 (en) | Acoustic resonator with reduced mechanical clamping of an active region for enhanced shear mode response | |
| Andrei et al. | AlN as an actuation material for MEMS applications: The case of AlN driven multilayered cantilevers | |
| JP6898344B2 (en) | BAW sensor fluid system with increased dynamic measurement range | |
| TW201131843A (en) | Micromachined transducers and method of fabrication | |
| JP2018533310A5 (en) | ||
| US10330642B2 (en) | BAW sensor device with peel-resistant wall structure | |
| US10352904B2 (en) | Acoustic resonator devices and methods providing patterned functionalization areas | |
| JP2000180250A (en) | Mass sensor and mass detection method | |
| EP2100125A2 (en) | Piezoelectric microcantilever sensors for biosensing | |
| JP2018533310A (en) | Acoustic resonator device and manufacturing method providing hermeticity and surface functionalization | |
| CN1920549A (en) | Sound wave sensing method and apparatus with integrated micro flow passage | |
| US20240328994A1 (en) | Method of manufacturing a field effect transducer | |
| CN113406541B (en) | Resonant type double-shaft magnetic sensor and double-shaft magnetic sensor testing system | |
| Zhou et al. | Fabrication and characterization of micromachined high-frequency tonpilz transducers derived by PZT thick films | |
| JPS5923612A (en) | Manufacture of piezoelectric resonator | |
| US20080290431A1 (en) | Nanorod sensor with single-plane electrodes | |
| JP2003222581A (en) | Quartz oscillator and method for manufacturing the same | |
| CN112179981A (en) | Surface acoustic wave sensor | |
| CN112449743A (en) | Sensor with droplet retention structure | |
| Sawane et al. | Design and Optimization of MEMS based AlN Sensor for Acoustic Application: AlN SENSOR FOR ACOUSTIC APPLICATION | |
| Lee et al. | Integrated ZnO Surface Acoustic Wave Microfluidic Components for Biosensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091014 Termination date: 20180823 |