CN1916741A - Electro-optical device, method of testing the same, and electronic apparatus - Google Patents

Electro-optical device, method of testing the same, and electronic apparatus Download PDF

Info

Publication number
CN1916741A
CN1916741A CN 200610115927 CN200610115927A CN1916741A CN 1916741 A CN1916741 A CN 1916741A CN 200610115927 CN200610115927 CN 200610115927 CN 200610115927 A CN200610115927 A CN 200610115927A CN 1916741 A CN1916741 A CN 1916741A
Authority
CN
China
Prior art keywords
mentioned
terminal
inspection
signal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 200610115927
Other languages
Chinese (zh)
Other versions
CN100414420C (en
Inventor
石井贤哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN1916741A publication Critical patent/CN1916741A/en
Application granted granted Critical
Publication of CN100414420C publication Critical patent/CN100414420C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention provides an electro-optical device such as liquid crystal device can downsize and easily performing a test. The electro-optical apparatus is provided with a plurality of external circuit connection terminals which are arrayed along one side of a projected area projected from a counter substrate on one side of a peripheral area of an element substrate, and to which an external circuit for supplying various signals for displaying images on a plurality of display elements is connected and testing image signals are collectively supplied in the case of performing display tests. A plurality of first test terminals to which first test signals required in addition to testing image signals for display tests are supplied, are arranged on the end of the array of the plurality of external circuit connection terminals in the projected area. The first test terminals are arranged in a pitch wider than that of the external circuit connection terminals.

Description

Electro-optical device and inspection method thereof and electronic equipment
Technical field
The present invention relates to for example electro-optical device and inspection method thereof such as liquid-crystal apparatus, and possess this electro-optical device and the technical field of the electronic equipment that constitutes.
Background technology
This electro-optical device clamping electro-optical substance and constituting between a pair of device substrate and counter substrate.Arrange and the pixel region (perhaps being also referred to as image display area) of formation at a plurality of picture element matrix shape ground levels, in each pixel, form the display element that comprises electro-optical substance.In addition, from the plane, counter substrate forms with the size littler than device substrate, in the neighboring area of the periphery that is positioned at pixel region on device substrate or counter substrate, one side along the device substrate of giving prominence to from counter substrate or exposing disposes a plurality of external circuit-connecting terminal.When these a plurality of external circuit-connecting terminal are provided for driving at electro-optical device, select a plurality of display elements respectively and make various signals such as its picture signal of lighting, control signal, power supply signal.For example, such electro-optical device is by on the large substrate that comprises the polylith device substrate, make every configuration relatively of counter substrate and device substrate, and utilizing encapsulant individually attaching components substrate and counter substrate and after with its assembling, these 2 large substrates are cut into each separately device substrate and counter substrate are produced.
Usually, neighboring area on such device substrate, the inspection terminal is set, its in the manufacture process of electro-optical device, make back etc., before installation or before the commercialization etc., when broken string, short circuit, work are checked in circuit, wiring etc., so check display element light operation the time, signal is checked in input and output.
At this, a kind of like this structure is disclosed in patent documentation 1 or 2, promptly in electro-optical device as described above, easily light demonstration inspection in order to use cheap testing fixture, arrange a plurality of external circuit-connecting terminal in the neighboring area along one side of device substrate, and dispose a plurality of inspection terminals at the edge of such external circuit-connecting terminal.If adopt such structure, then in electro-optical device, when driving, display element is only lighted demonstration according to the drive signal that provides from the external circuit that is installed on a plurality of external circuit-connecting terminal, when checking, display element is only lighted demonstration according to being examined terminal via the inspection signal that probe provides.In more detail, when driving, red (R) with, blue (B) with and 3 kinds of picture signals of green (G) usefulness be comprised in a plurality of drive signals and provide, in addition, when checking, the picture signal of the 3 kind inspection usefulness corresponding with these picture signals also is comprised in a plurality of inspection signals and provides.
On the other hand, if adopt patent documentation 3, then in electro-optical device, in order to realize narrowization of neighboring area, and the neighboring area on device substrate, in the bight of pixel region, for attaching components substrate and counter substrate and the lower layer side of the encapsulant that is provided with, dispose a plurality of inspection terminals to see from the plane with the overlapping mode of the part of encapsulant.This checks terminal in the manufacturing of electro-optical device, uses during the inspection carried out before device substrate and counter substrate bonding.
[patent documentation 1] spy opens the 2004-205852 communique
[patent documentation 2] spy opens the 2004-226931 communique
[patent documentation 3] spy opens the 2004-4993 communique
But, if adopt disclosed technology in patent documentation 1 or 2, then for example when driving, replace R with, G with, B with these 3 kinds of signals with picture signal as 6 phases, 12 phases ... like that through string-and conversion after signal and under the situation about providing, the picture signal of the various inspection usefulness corresponding with these picture signals is provided when inspection.Thereby, provide the quantity of the inspection terminal of the picture signal of checking usefulness to increase, and need guarantee on device substrate that broad being used to is provided with the zone of checking terminal.In other words, under the situation of the miniaturization of seeking device substrate, exist probe touched and check that respectively terminal checks that this goes up extremely difficult technical matters in practice.
On the other hand, if adopt disclosed technology in patent documentation 3, the neighboring area on device substrate then, need on the degree that can dispose a plurality of inspection terminals, guarantee to form the zone of encapsulant, in addition, the outside in the zone that forms encapsulant, need guarantee to be provided for zone according to the driving circuit of a plurality of display elements of drive, and then in the manufacturing process of electro-optical device, need on large substrate, guarantee to be used to cut off the zone of adjacent device substrate along the periphery of each device substrate.
Summary of the invention
The present invention proposes in view of the above problems, its purpose is to provide the inspection that for example can carry out with comparalive ease after device substrate and counter substrate bonding, and the electro-optical device that can miniaturization and the inspection method of this electro-optical device, and possess the various electronic equipments that this electro-optical device is arranged.
In order to address the above problem, the 1st electro-optical device of the present invention possesses: device substrate; Counter substrate, mode and said elements base plate bonding that it is given prominence at outburst area with the part of above-mentioned device substrate; A plurality of pixel portions, it is arranged in the pixel region on the said elements substrate; A plurality of external circuit-connecting terminal, it is arranged in the above-mentioned outburst area among the neighboring area of the periphery that is positioned at the above-mentioned pixel region on the said elements substrate, and is provided from external circuit and comprises and be used to make above-mentioned a plurality of pixel portions to carry out the picture signal that image shows and the various signals of control signal; And a plurality of inspection terminals, it is configured in the edge that above-mentioned a plurality of external circuit-connecting terminal are arranged in the above-mentioned outburst area, and is provided the inspection signal; Wherein, above-mentioned a plurality of inspection terminals, and the arranged spaced with broad is compared at the interval between above-mentioned a plurality of external circuit-connecting terminal.
The 1st electro-optical device of the present invention, by a pair of device substrate and counter substrate are disposed relatively, and in the neighboring area of the periphery that is positioned at the pixel region between device substrate and counter substrate, for example utilize the encapsulant that forms at sealing area to make it bonding, assemble along the periphery of pixel region.In addition, between device substrate and counter substrate, arrange " pixel region " that forms at pel array shape ground levels that for example surround, a plurality of by sealing area, as electro-optical substance for example clamping liquid crystal is arranged.Pixel region on device substrate in each pixel, comprises display element such as liquid crystal cell for example and the pixel portions that constitutes, for example on direction in length and breadth mutually to separate at interval and to arrange rectangularly.Each pixel portions, for example by the pixel electrode in each pixel on being formed at device substrate, be formed in the mode relative that the clamping electro-optical substance forms between the opposite electrode on the counter substrate with this pixel electrode.Device substrate forms to see mode outstanding from one side of the counter substrate of correspondence on its one side at least or that expose from the plane, for example to compare with counter substrate with bigger planar dimension.At outburst area, Yi Bian along being arranged with a plurality of external circuit-connecting terminal.Typically, after the conduct of explanation shows that the bonding back of checking is checked afterwards, for example as COF (Chip On Flexible printed circuit, flexible print wiring on the sheet) is installed on the wiring substrate that comprises flexible substrate and the external circuit that forms, via FPC (Flexible Printed Circuit, flexible print wiring) or flexible substrate or flexible connector etc., be electrically connected to a plurality of external circuit-connecting terminal.
If adopt the 1st electro-optical device that constitutes like this, then when it drives usually, from external circuit a plurality of external circuit-connecting terminal are provided to comprise picture signal and control signal, and then the various signals of power supply signal etc. for example.In addition, a plurality of pixel portions, for example selected according to these various signals by each row, and then the pixel portions that is arranged on each row is selected by each row, and be driven.In driven like this pixel portions, for example, show and carry out image by apply voltage to electro-optical substance based on the current potential separately of pixel electrode and opposite electrode.
The 1st electro-optical device, when it is made, for example on the large substrate that comprises the polylith device substrate, will by cut apart counter substrate that the large substrate different with it form for each device substrate bonding after, by large substrate individually is divided into each device substrate and counter substrate are formed.After utilizing bonding the 1st electro-optical device of this manufacturing process, with external circuit with before a plurality of external circuit-connecting terminal are connected, carry out as to the image of each pixel portions show relevant operation inspection, typically as showing " inspection after the stickup " checked.In the inspection after bonding, in electro-optical device, roughly similarly drive a plurality of pixel portions by with common work the time, and the pixel region on device substrate, carry out whole image shows comprehensively, show fully roughly promptly that with picture the striped that for example is displayed on the background of medium tone shows the lines striated of black as for example black, white or the grey full-filling of particular color.Perhaps, compare, sometimes also drive each pixel portions with showing specific display frame, and the inspection after merely point defect or line defect etc. being pasted.
At this, in the 1st electro-optical device, the outburst area on device substrate particularly, the edge of the arrangement of circuit connecting terminals externally disposes a plurality of inspection terminals that use in this inspection after bonding.More specifically, on device substrate from the plane, externally an end of the arrangement of circuit connecting terminals or this arrangement is sandwiched in the middle of and at its two ends, arrange to check terminal.In addition, and the interval between the external circuit-connecting terminal relatively, and a plurality of inspection terminals are with the arranged spaced of broad.
That is, on the one hand, a plurality of external circuit-connecting terminal have relative thin space with the arranged spaced of relative narrower.Yet, connect before the external circuit and after device substrate and counter substrate bonding, carry out for example when showing that the bonding back of checking is checked, for in the terminal part that when working usually, is provided picture signal among a plurality of external circuit-connecting terminal, can provide the inspection picture signal together.For example, this providing in the lump carried out simply by the conducting rubber of striding a plurality of external circuit-connecting terminal.Thereby, even spacing is too narrow to each external circuit-connecting terminal contact probe difficulty or impossible degree, carrying out bonding back inspection this respect also without any problem.
On the other hand, though a plurality of inspection terminal has the spacing of relative broad with the arranged spaced of relative broad, for example with number with the string-and the external circuit-connecting terminal that turnover number correspondingly increases compare, can realize with a spot of number.Thereby, carrying out bonding back as described above when checking, obtain the inspection terminal that conducts even be configured in by making probe and each termination contact with abundant wide spacing, its needed plane space is also not too large.At least for checking terminal and external circuit-connecting terminal, and can on each terminal, compare by the needed plane space of contact probe, as long as obviously narrow plane space is just enough.And then, in addition, it is desirable to, each checks that terminal is to form to the planar dimension that can precision carries out well with the degree that conducts of probe than external circuit-connecting terminal is big.
In addition, when the bonding back of reality is checked, a plurality of external circuit-connecting terminal for thin space, can be for example by utilizing conducting of anisotropic conducting rubber formation, check and to use picture signal and provide together, and can for example provide the inspection signal respectively to a plurality of inspection terminals of broad spacing by probe.At this moment, in more detail,, provide via conducting rubber and to check and use picture signal for example for a part of terminal that is provided picture signal among a plurality of external circuit-connecting terminal, when the driving of electro-optical device from external circuit.Under the state that is provided signal like this, check in pixel portions and whether carry out showing with the corresponding image of picture signal with inspection.
In addition, to checking that terminal provides the inspection signal, the limit for example provides some signals via conducting rubber to the adjacent external circuit-connecting terminal more than at least 2 or 2 together by the limit, and the mode of carrying out checking bonding back is also included within the present invention.
In addition, when not only checking in bonding back, and the use for so a plurality of inspection terminals is arbitrarily when " the bonding preceding inspection " of the later explanation of carrying out for device substrate before device substrate and counter substrate bonding.
As mentioned above,,, check that the such structure of terminal compares, can reduce the quantity of inspection terminal significantly so only use when checking in bonding back then because need not to check the inspection terminal is set with picture signal in order to provide if adopt the 1st electro-optical device.Thereby, in the 1st electro-optical device, can reduce the zone that is used for the configuration inspection terminal on the outburst area on the device substrate, thus the implementation space savingization.Its result can reduce the outburst area of device substrate, finally can make the 1st electro-optical device miniaturization.Like this, carry out the inspection after device substrate before connecting external circuit and counter substrate bonding with comparalive ease, and the miniaturization of implement device integral body.
In a kind of mode of the 1st electro-optical device of the present invention, before above-mentioned a plurality of external circuit-connecting terminal are electrically connected the said external circuit and during the inspection of after said elements substrate and above-mentioned counter substrate bonding, carrying out, for when this electro-optical device is worked, becoming the terminal part that is provided above-mentioned picture signal, provide the inspection picture signal together; Above-mentioned a plurality of inspection terminal, when above-mentioned inspection after bonding, being provided for above-mentioned inspection after bonding becomes in above-mentioned inspection with required inspection signal beyond the picture signal.
If adopt this mode, then on the one hand,, but check and use picture signal, pasting aspect the inspection afterwards, also without any obstacle by being provided together even a plurality of external circuit-connecting terminal has the spacing of relative narrower.On the other hand, the a plurality of the 1st checks terminal, because realize with less relatively number, so when carrying out the inspection of bonding back, even with fully wide spacing configuration using contact probe and obtain the structure that conducts on each terminal, needed plane space is also not too large.Thereby, because need not check that be provided with the 1st with picture signal checks terminal in order to provide, thus only use when checking the 1st to check that the structure of terminal compares in bonding back, can be significantly and reduce the quantity of the 1st inspection terminal reliably.
In a kind of mode of the 1st electro-optical device of the present invention, above-mentioned a plurality of inspection terminals at the two ends that above-mentioned a plurality of external circuit-connecting terminal are arranged, are arranged on the extended line of above-mentioned a plurality of external circuit-connecting terminal arrangements.
If adopt this mode, the outburst area on device substrate then, because can along a limit external circuit-connecting terminal and inspection terminal be arranged in row on one side, on one side to arrange the former than thin space and with the broad spacing arrangement latter, so can avoid increasing the outstanding amplitude of the outburst area on the device substrate, and can realize further space savingization.
In order to address the above problem, the 2nd electro-optical device of the present invention possesses: device substrate; Counter substrate, mode and said elements base plate bonding that it is given prominence at outburst area with the part of above-mentioned device substrate; A plurality of pixel portions, it is arranged in the pixel region on the said elements substrate; A plurality of external circuit-connecting terminal, it is arranged in the above-mentioned outburst area among the neighboring area of the periphery that is positioned at the above-mentioned pixel region on the said elements substrate, and is provided from external circuit and comprises and be used to make above-mentioned a plurality of pixel portions to carry out the picture signal that image shows and the various signals of control signal; The a plurality of the 1st checks terminals, the edge that its above-mentioned a plurality of external circuit-connecting terminal that are configured in above-mentioned outburst area are arranged, and be provided and become the required the 1st for the inspection of after said elements substrate and above-mentioned counter substrate bonding, carrying out and check signal; And a plurality of the 2nd inspection terminals, it is configured at least in part and is in zone subregional along the periphery on other limits except above-mentioned one side, that covered by above-mentioned counter substrate in said elements substrate and the bonding back of above-mentioned counter substrate among the above-mentioned neighboring area, and is provided for become the required the 2nd in the above-mentioned inspection of carrying out before bonding and checks signal.
The 2nd electro-optical device of the present invention, compare with the structure of the 1st electro-optical device of the invention described above, except checking the terminal as a plurality of the 1st of above-mentioned a plurality of inspection terminals, a plurality of the 2nd inspection terminal this point are being set, with check that for external circuit-connecting terminal and the 1st terminal also is different continuously on the restriction this point, except these 2, has identical structure with the 1st electro-optical device substantially.In addition, the 2nd electro-optical device of the present invention when working usually, is similarly worked with above-mentioned the 1st electro-optical device of the present invention, for example as the inspection after showing check bonding the time, also similarly works with the 1st electro-optical device of the invention described above.On the other hand, the 2nd electro-optical device of the present invention also can be realized the convenience of the inspection before bonding.
That is, in the 2nd electro-optical device, particularly among the neighboring area along the peripheral part zone on other limits except the one side that is in outburst area, dispose a plurality of the 2nd at least in part and check terminals.The a plurality of the 2nd checks terminal, sees by counter substrate from the plane in bonding back to cover, and does not need for bonding back is checked.To so a plurality of the 2nd inspection terminals, provide for checking before bonding that becoming the needed the 2nd checks signal.In more detail, each the 2nd checks terminal, the peripheral part zone on device substrate, and to be blocked fully under counter substrate seeing from the plane on the counter substrate, the mode that perhaps is blocked under counter substrate at least to the degree that is difficult to survey is configured.Each the 2nd checks terminal, because can utilize after bonding like this zone that can not touch with probe and be formed on wherein, so can not cause the increase of the area of the increase of area of outburst area or device substrate.
When before using the such the 2nd to check terminal bonding, checking, for example when the checking of circuit, wiring etc., insulation inspections, performance review etc., for example provide the 2nd inspection signal to a plurality of the 2nd inspection terminals respectively via probe.Then, check according to the 2nd inspection signal.In addition, for example, also can be by will being built on the device substrate, and check signal to check circuit input and output the 2nd for the check circuit that the operations such as selection of each pixel portions are checked, carry out checking before bonding.
Thereby, can avoid because of the 2nd existence of checking terminal makes space-constrained situation on the substrate, and can be the 2nd spacing of checking terminal, have and expand to redundantly and can the 2nd check the degree that terminal place precision conducts well at each with probe.And then, in addition, check that with the 1st of above-mentioned the 1st electro-optical device the situation of terminal is same, it is desirable to, each the 2nd checks that terminal forms with the planar dimension bigger than external circuit-connecting terminal.
In addition, when such inspection before bonding, also can check that terminal provides the inspection signal via the 1st, also can be same with the situation that the bonding back that had illustrated is checked, via a plurality of external circuit-connecting terminal, for example by utilizing conducting that conducting rubber realizes, provide inspection with picture signal or other inspection signal together.Promptly, during by the inspection before bonding, check that with the 1st terminal, external circuit-connecting terminal etc. and the 2nd inspection terminal together use, in other words, by constituting, can reduce needed number of terminals in inspection as a whole in the mode of in repeatedly checking, using the 1st inspection terminal, external circuit-connecting terminal etc. arbitrarily.
In addition, in the 2nd electro-optical device, bonding back checks, and is same with the situation of the 1st electro-optical device, by checking that to the 1st terminal provides the 1st to check signal, and provides inspection to carry out with picture signal to external circuit-connecting terminal.Thereby, in the inspection after bonding, do not use a plurality of the 2nd to check terminal.
As mentioned above, if adopt the 2nd electro-optical device, then the obsolete the 2nd check terminal in the inspection after bonding, be disposed at the neighboring area of blocking by counter substrate in bonding back, that uses in bonding back is checked the 1st checks terminal, is disposed at after bonding not the outburst area that can be blocked by counter substrate.Like this,, and, also can carry out with comparalive ease for the inspection after bonding not only for the inspection before bonding, and miniaturization that can implement device integral body.
In a kind of mode of the 2nd electro-optical device of the present invention, the above-mentioned a plurality of the 1st checks terminal, and the interval between above-mentioned a plurality of external circuit-connecting terminal relatively, arranged spaced with broad, the above-mentioned a plurality of the 2nd checks terminal, and the interval between above-mentioned a plurality of external circuit-connecting terminal relatively, with the arranged spaced of broad.
If adopt this mode, in then before bonding, checking,, can utilize the probe precision to conduct well for the 2nd inspection terminal, in bonding back is checked,, can utilize the probe precision to conduct well for the 1st inspection terminal.And, can avoid effectively because the 2nd inspection terminal, the 1st is checked the existence of terminal and external circuit-connecting terminal, and make the space-constrained situation on the substrate.
In the another way of the 2nd electro-optical device of the present invention, the said elements substrate, by on the large substrate that comprises polylith said elements substrate, on every said elements substrate with the bonding above-mentioned counter substrate of the mode relative with above-mentioned counter substrate, and after said elements substrate and counter substrate are bonding, above-mentioned large substrate is divided into every said elements substrate and forms; The above-mentioned a plurality of the 2nd checks at least a portion among the terminal, replaces above-mentioned peripheral part zone or except above-mentioned peripheral part zone, divided location overlap ground formation when cutting apart above-mentioned large substrate.
If adopt this mode, then on large substrate, a plurality of the 2nd checks that at least a portion of terminal is configured in the cut-out zone that forms along the periphery of device substrate at least in part.That is, the peripheral part zone of each device substrate is adjacent or overlapping with the cut-out zone at least in part.In addition, after before bonding, checking that each device substrate and counter substrate is bonding, and implement cutting or line to cutting off the zone, and cut apart large substrate.At this, so-called " cutting " refers to utilize saw etc. to cutting off the mode that the zone cuts off, and so-called " line " refers to utilize scuffing cut-out such as cutter regional and cut apart the mode of large substrate along this cut.At this, especially also to cut off being configured in the 2nd inspection terminal that cuts off the zone at least in part.That is, check that as configuration the 2nd zone of terminal effectively utilizes with cutting off the zone.Like this, on large substrate, can effectively utilize and cut off the zone, and carry out the bonding preceding device substrate miniaturization of checking and make.
In the another way of the 2nd electro-optical device of the present invention, further possess: on the said elements substrate,,, make said elements substrate and above-mentioned counter substrate bonding encapsulant mutually at the sealing area that surrounds above-mentioned pixel region from the plane; Wherein, the above-mentioned a plurality of the 2nd check that terminal is configured in the above-mentioned sealing area at least in part.
If adopt this mode, the then a plurality of the 2nd checks that terminal is configured in the sealing area at least in part.That is, the peripheral part zone overlaps with sealing area at least in part.That is,, can carry out bonding preceding the inspection, and make the device substrate miniaturization by sealing area is checked that as disposing the 2nd the zone of terminal effectively utilizes.
In the another way of the 2nd electro-optical device of the present invention, the above-mentioned a plurality of the 1st checks terminals, at least in part, and except when the above-mentioned inspection after bonding, also in above-mentioned use when checking before bonding; The above-mentioned a plurality of the 2nd checks terminal, is to be provided with the 1st to check the different inspection signal of signal as the above-mentioned the 2nd terminal of checking signal when above-mentioned inspection before bonding, and the above-mentioned the 1st checks that signal is provided for above-mentioned the 1st inspection terminal.
If adopt this mode, when then before bonding, checking,, also check that to the 1st terminal provides the 1st to check signal except checking that to the 2nd terminal provides the 2nd to check the signal.In addition, for example also the check circuit of checking for the operations such as selection of each pixel portions can be built on the device substrate, replace the 2nd inspection signal and select each pixel portions, and, carry out bonding preceding inspection by check circuit is arrived in the 2nd inspection signal input and output with the 1st inspection signal.Thereby, when before bonding, checking, and only check that to the 2nd terminal provides the 2nd to check that the situation of signal compares, can reduce by the 2nd quantity that checks terminal.Therefore, can realize further space savingization on the device substrate.
In the another way of the 2nd electro-optical device of the present invention, the above-mentioned a plurality of the 2nd checks that terminals comprise the 2nd with the kind terminal, and the 2nd is provided with at least a congener signal of above-mentioned various signals with the kind terminal and checks signal as the above-mentioned the 2nd; The 2nd with the kind terminal, is electrically connected via at least a said external circuit connecting terminals that is provided above-mentioned various signals among resistive element and the above-mentioned a plurality of external circuit-connecting terminal; The above-mentioned the 2nd checks the above-mentioned congener signal among the signal, when above-mentioned inspection before bonding, is provided via above-mentioned resistive element from the above-mentioned the 2nd with the kind terminal.
If adopt this mode, when then before bonding, checking, check that to being included in a plurality of the 2nd the 2nd in the terminal with the kind terminal, provides at least a congener signal with various signals.And the 2nd is electrically connected via resistive element and the external circuit-connecting terminal that is provided congener signal with the kind terminal.Thereby, with the kind signal, can carry out the checking of the circuit part relevant, wiring portion, insulate inspection, performance review etc. according to this aptly with congener signal.And, by resistive element being arranged to relative high resistance, after can preventing from before bonding, to check, for example after manufacturing, when carrying, when driving etc., the 2nd immerse static from what ended task, thereby see the phenomenon of destroying the circuit that is connected with the opposition side of resistive element from the 2nd with the kind terminal with the kind terminal.
In the another way of the 2nd electro-optical device of the present invention, the above-mentioned a plurality of the 1st checks that terminals comprise the 1st with the kind terminal, and the 1st is provided with at least a congener signal of above-mentioned various signals with the kind terminal and checks signal as the above-mentioned the 1st; The 1st with the kind terminal, is electrically connected via at least a said external circuit connecting terminals that is provided above-mentioned various signals among resistive element and the above-mentioned a plurality of external circuit-connecting terminal; The above-mentioned the 1st checks the above-mentioned congener signal among the signal, when above-mentioned inspection after bonding, is provided via above-mentioned resistive element from the above-mentioned the 1st with the kind terminal.
If adopt this mode, then during the inspection after bonding, check that to being included in a plurality of the 1st the 1st in the terminals provide at least a congener signal with various signals with the kind terminal.And the 1st is electrically connected with the external circuit-connecting terminal that is provided congener signal via resistive element with the kind terminal.Thereby, according to this congener signal, can carry out bonding back aptly and check.And, by resistive element being arranged to relative high resistance, can prevent after bonding back is checked, for example after manufacturing, when carrying, when driving etc., the 1st immerse static from what ended task, thereby see the phenomenon of destroying the circuit that is connected with the opposition side of resistive element from the 1st with the kind terminal with the kind terminal.
In the another way of the 1st electro-optical device of the present invention, above-mentioned a plurality of inspection terminals comprise with the kind terminal, and this is provided at least a congener signal with above-mentioned various signals as above-mentioned inspection signal with the kind terminal; Should be with the kind terminal, be electrically connected via at least a said external circuit connecting terminals that is provided above-mentioned various signals among resistive element and the above-mentioned a plurality of external circuit-connecting terminal; Above-mentioned congener signal among the above-mentioned inspection signal when above-mentioned inspection after bonding, is provided via above-mentioned resistive element with the kind terminal from above-mentioned.
If adopt this mode, when then checking, provide at least a congener signal with various signals to being included in same kind terminal in a plurality of inspection terminals in bonding back.And, be electrically connected with the external circuit-connecting terminal that is provided congener signal via resistive element with the kind terminal.Thereby, according to this congener signal, can carry out bonding back aptly and check.And, by resistive element being arranged to relative high resistance, can prevent after bonding back is checked, for example after manufacturing, when carrying, when driving etc., immerse static from the same kind terminal that has ended task, thereby from see the phenomenon of destroying the circuit that is connected with the opposition side of resistive element with the kind terminal.
In order to address the above problem, the inspection method of electro-optical device of the present invention is to check the inspection method that possesses with the electro-optical device of lower member: device substrate; Counter substrate, mode and said elements base plate bonding that it is given prominence at outburst area with the part of above-mentioned device substrate; A plurality of pixel portions, it is arranged in the pixel region on the said elements substrate; A plurality of external circuit-connecting terminal, it is arranged in the above-mentioned outburst area among the neighboring area of the periphery that is positioned at the above-mentioned pixel region on the said elements substrate, and is provided from external circuit and comprises and be used to make above-mentioned a plurality of pixel portions to carry out the picture signal that image shows and the various signals of control signal; And a plurality of inspection terminals, the edge that its above-mentioned a plurality of external circuit-connecting terminal that are configured in above-mentioned outburst area are arranged; This inspection method comprises: after said elements substrate and above-mentioned counter substrate bonding and the bonding back of carrying out before making the said external circuit and the said external circuit connecting terminals being electrically connected when checking, for becoming the terminal that is provided above-mentioned picture signal among above-mentioned a plurality of external circuit-connecting terminal, provide the step of checking with picture signal together; For above-mentioned a plurality of inspection terminals,, above-mentioned bonding back provides the step of above-mentioned inspection for checking with the inspection signal beyond the picture signal; And check as above-mentioned bonding back, under the state that above-mentioned inspection is provided with picture signal and above-mentioned inspection signal, check the step of whether carrying out with the corresponding image demonstration of picture signal in above-mentioned a plurality of pixel portions with above-mentioned inspection.
If adopt the inspection method of electro-optical device of the present invention, then same with the situation of the 1st electro-optical device of the invention described above, external circuit-connecting terminal being provided together inspection, check and check with the corresponding image demonstration of picture signal and whether in a plurality of pixel portions, carry out with picture signal and to checking that terminal provides under the state of checking signal.Thereby, even with the interval of a plurality of inspection terminals relatively with a plurality of external circuit-connecting terminal of narrower arranged spaced, can carry out also that bonding back is checked and no problem.Its result, same with the situation of above-mentioned the 1st electro-optical device of the present invention, thus can reduce outburst area implementation space savingization on the device substrate, and can carry out bonding back with comparalive ease and check.
In a kind of mode of the inspection method of electro-optical device of the present invention, the above-mentioned step of checking with picture signal that provides together, conducting rubber is electrically connected with above-mentioned a plurality of external circuit-connecting terminal, and provides above-mentioned inspection picture signal together via this conducting rubber; The above-mentioned step that the 1st inspection signal is provided checks that to the above-mentioned a plurality of the 1st terminals provide the above-mentioned the 1st to check signal respectively via probe.
If adopt this mode, when then checking in bonding back, to a plurality of external circuit-connecting terminal of being arranged to thin space aptly, for example by utilizing conducting of anisotropic conducting rubber realization, provide inspection to use picture signal together, and for example provide the inspection signal respectively to a plurality of inspection terminals of being arranged to wide spacing aptly via probe.Thus, can realize further space savingization, and easily carry out bonding back and check.Especially by using less expensive conducting rubber to be electrically connected, can avoid device substrate is caused damage, and also can be electrically connected well.In addition, because the conducting rubber cost is low,, check thereby can also carry out bonding back with low cost so change easily.
In order to address the above problem, electronic equipment of the present invention possesses the 1st or the 2nd electro-optical device (still, comprising its variety of way) of the invention described above.
Electronic equipment of the present invention, constitute because possessing the 1st or the 2nd electro-optical device of the invention described above, so can realize the various electronic equipments such as video camera, workstation, videophone, POS terminal, touch panel of projection display device, televisor, mobile phone, electronic notebook, word processor that can miniaturization, find a view type or monitor direct viewing type.
Such effect of the present invention and other advantages can be apparent from the embodiment of following explanation.
Description of drawings
Fig. 1 is the integrally-built planimetric map that the liquid-crystal apparatus of present embodiment is shown;
Fig. 2 is that the H-H ' of Fig. 1 locates sectional view;
Fig. 3 is the block scheme that the electricity structure of liquid-crystal apparatus is shown;
Fig. 4 (a) illustrates the planimetric map that the 1st inspection terminal and the 2nd is checked the structure of terminal, and Fig. 4 (b) is the figure that the electricity structure of the 1st inspection terminal and external circuit-connecting terminal is shown;
Fig. 5 is used to illustrate the partial plan layout of making the liquid-crystal apparatus of present embodiment on mother substrate;
Fig. 6 is the local amplification view that the structure of a part of being surrounded by dotted line A0 among Fig. 5 is shown;
Fig. 7 is the comparative example for present embodiment, and the amplification view with the structure of a part of corresponding part of being surrounded by the dotted line A0 of Fig. 5 is shown;
Fig. 8 is used for illustrating the figure that provides that shows the various signals of checking such as the 1st inspection signal;
Fig. 9 is the circuit diagram of an example that the structure of check circuit is shown;
Figure 10 is the structure for one of this variation, and the local amplification view of the structure of the part corresponding with Fig. 6 is shown;
Figure 11 is another structure for this variation, and is same with Fig. 4 (a), and the planimetric map that the 1st inspection terminal and the 2nd is checked the structure of terminal is shown;
Figure 12 (a) to Figure 12 (c) be another structure for this variation, the 2nd local amplification view of structure of checking the configuration of terminal is shown;
Figure 13 is the planimetric map of structure that illustrates as the projector of an example of the electronic equipment of having used liquid-crystal apparatus;
Figure 14 is the skeleton view of structure that illustrates as the personal computer of an example of the electronic equipment of having used liquid-crystal apparatus; And
Figure 15 is the skeleton view of structure that illustrates as the mobile phone of an example of the electronic equipment of having used liquid-crystal apparatus.
Symbol description
The 10:TFT array base palte; 10a: image display area; 20: counter substrate; 50: liquid crystal layer; 102: external circuit-connecting terminal; 103a: the 1st checks terminal; 103b: the 2nd checks terminal.
Embodiment
With reference to the description of drawings embodiments of the present invention.Following embodiment is that electro-optical device of the present invention is applied to embodiment in the liquid-crystal apparatus.
＜1: the one-piece construction of liquid-crystal apparatus 〉
The one-piece construction of the liquid-crystal apparatus of present embodiment at first, is described referring to figs. 1 through Fig. 3.
Fig. 1 is the planimetric map of the liquid-crystal apparatus seen from the counter substrate side, and Fig. 2 is that the H-H ' of Fig. 1 locates sectional view.In Fig. 1 and Fig. 2, liquid-crystal apparatus by relative configuration, constitute as tft array substrate 10, the counter substrate 20 of the example of " device substrate " of the present invention.In Fig. 1, with dashed lines 200 area surrounded are represented the configuration example of counter substrate 20 relative tft array substrates 10.Tft array substrate 10, under state with counter substrate 20 and tft array substrate 10 relative configurations, with (promptly from the plane, in Fig. 1) tft array substrate 10 outstanding from one side of the counter substrate 20 of correspondence at least on one side or the mode exposed, the planar dimension of wanting big to compare with counter substrate 20 forms.
In addition, enclosing between TFT substrate 10 and counter substrate 20 has liquid crystal layer 50, and tft array substrate 10 and counter substrate 20 utilize the encapsulant 52 that is set in place the sealing area around image display area 10a bonding mutually.Thus, between tft array substrate 10 and counter substrate 20, the image display area 10a being surrounded by encapsulant 52 encloses liquid crystal layer 50.
Encapsulant 52 is made of for example ultraviolet hardening resin, the thermosetting resin etc. that are used for bonding two substrates, in manufacturing process, after it is applied on the tft array substrate 10, makes its sclerosis by ultraviolet ray irradiation, heating etc.In addition, in encapsulant 52, being scattered with the interval (gap between substrate) that is used to make tft array substrate 10 and counter substrate 20 becomes clearance materials such as the glass fibre of setting or beaded glass.
With the inboard of the sealing area that disposes encapsulant 52 concurrently, be provided with the edge photomask 53 of light-proofness of the fringe region of specified image viewing area 10a in counter substrate 20 sides.But part or all of such edge photomask 53 also can be used as built-in photomask and is arranged on tft array substrate 10 sides.
The neighboring area of the periphery that is positioned at image display area 10a on tft array substrate 10, one side along tft array substrate 10 from counter substrate 20 outstanding be provided with data line drive circuit 101 and a plurality of external circuit-connecting terminal 102.In addition, along this on one side, externally the edge of the arrangement of circuit connecting terminals 102 is provided with a plurality of the 1st and checks terminal 103a.That is, in Fig. 1, the outburst area in that the following laterally strip ground along tft array substrate 10 extends is arranged with a plurality of the 1st and checks terminal 103a.This a plurality of the 1st checks terminal 103a, for example is shown clearly in as Fig. 1, and the arrangement of external circuit-connecting terminal 102 is sandwiched in the centre and is arranged in its two ends.In addition, the 1st check that terminal 103a also can only be arranged in the edge (that is, only right-hand member or only left end in Fig. 1) that external circuit-connecting terminal 102 is arranged along one side of tft array substrate 10.And then, with a plurality of external circuit-connecting terminal 102, be electrically connected for example to be equipped with and go up the external circuit that forms by being installed in COF.
In addition, along 2 limits adjacent, be provided with scan line drive circuit 104 in the mode that is covered by edge photomask 53 with one side of the tft array substrate 10 that is arranged with external circuit-connecting terminal 102 grades.In addition, couple together because will be arranged on like this between two scan line drive circuits 104 of both sides of image display area 10a, so along remaining one side of tft array substrate 10, and to be provided with many wirings 105 by the mode of edge photomask 53 coverings.
And then, one of along 2 limits of the tft array substrate 10 that disposes scan line drive circuit 104 or its both sides, arrange and be provided with a plurality of the 2nd and check terminal 103b.That is, in Fig. 1 along the right longitudinal extension of tft array substrate 10, as the belt-like zone of the example in " peripheral part zone " of the present invention, be arranged with a plurality of the 2nd and check terminal 103b.In Fig. 1, show and check that with the 2nd terminal 103b is arranged on the structure on one side in 2 limits of tft array substrate 10.The a plurality of the 2nd checks terminal 103b, and from the plane (that is, in Fig. 1), at least a portion is configured in the belt-like zone that is covered or block by counter substrate 20 in the neighboring area on the tft array substrate 10 separately.Thus, belt-like zone on tft array substrate 10, a plurality of the 2nd checks terminal 103b, on counter substrate 20 from the plane, respectively below counter substrate 20, being blocked with part is configured for the mode of surveying degree of (probing) difficulty when the such inspection of aftermentioned.
In addition, on tft array substrate 10, dispose the Lead-through terminal up and down 106 that conducts that is used to guarantee with counter substrate 20.
In Fig. 2, on tft array substrate 10, be formed with pixel electrode 9a at pixel switch above with TFT, various wirings etc., and then be formed with alignment films above it.On the other hand, the image display area 10a on counter substrate 20 is formed with across liquid crystal layer 50 opposite electrode 21 relative with a plurality of pixel electrode 9a.In addition, the image display area 10a on tft array substrate 10, in each pixel, clamping liquid crystal layer 50 between pixel electrode 9a and opposite electrode 21 and constitute display element promptly, constitutes pixel portions in each pixel.In addition, by between pixel electrode 9a and opposite electrode 21, applying voltage, show and make display element carry out image.On this opposite electrode 21, be formed with the photomask 23 of clathrate or striated, and then be coated with alignment films thereon.Liquid crystal layer 50 for example is made of the composite liquid crystal of one or more nematic liquid crystals, and it forms the state of orientation of regulation between this a pair of alignment films.
And then, though it is not shown in Fig. 1 or Fig. 2, but on tft array substrate 10, except data line drive circuit 101, scan line drive circuit 104 etc., also be formed with as described later to the picture signal on the image signal line sample and offer data line sample circuit, be used for checking manufacture process, the check circuit of quality, defective etc. of this liquid-crystal apparatus when dispatching from the factory.In the present embodiment, except so various circuit, can also further be formed with the pre-charge circuit of the precharging signal that the assigned voltage level was provided respectively etc. before providing picture signal to many data lines.
In addition, a side that penetrates at the emergent light of side of the incident light incident of counter substrate 20 and tft array substrate 10, for example respectively with TN (Twisted Nematic, twisted-nematic) pattern, STN (supper TN, supertwist is to row) each of the black pattern of patterns such as pattern, D-STN (Double STN, double layers super twisted nematic) pattern, normal white mode/often etc. be accordingly with the direction configuration polarization film of regulation, phase retardation film, polarization plate etc.
Below, the electricity structure of above-mentioned liquid-crystal apparatus is described with reference to Fig. 3.Fig. 3 is the block scheme that the electricity structure of liquid-crystal apparatus is shown.In Fig. 3, the structure of liquid-crystal apparatus is, tft array substrate 10 and counter substrate 20 (not shown at this) dispose across liquid crystal layer is relative, and the voltage that control applies the pixel electrode 9a of the display element arranged at image display area 10a subregion, the electric field that liquid crystal layer is applied at each pixel modulation.Thus, control the light quantity that sees through between two substrates, show thereby image is carried out gray scale.In addition, in the present embodiment, suppose that this liquid-crystal apparatus adopts the tft active matrix type of drive.
At the image display area 10a of tft array substrate 10, form multi-strip scanning line 2 and many data lines 3 of arranging across mutually, and in each pixel, dispose display element accordingly with intersecting of sweep trace 2 and data line 3.Thus, the pixel electrode 9a of display element, the image display area 10a on tft array substrate 10 separates with the interval mutually with adjacent pixel electrodes 9a, and arranges rectangularly.
In addition, though it is not shown in Fig. 3, but be formed with TFT as the pixel switch element, be used to keep the memory capacitance of the voltage that pixel electrode 9a is applied, conducting on the power path of each pixel electrode 9a and data line 3, non-conduction is provided according to the sweep signal that provides respectively via sweep trace 2 pixel switch wherein.The pixel switch element except TFT, also can utilize formations such as various transistors or TFD.
In addition, neighboring area at image display area 10a, except data line drive circuit shown in Figure 1 101 grades, one side further be formed with check circuit 201 along what be provided with wiring 105 tft array substrate 10, wiring 105 is used for and will be electrically connected between 2 scan line drive circuits 104.
In the present embodiment, when the driving of liquid-crystal apparatus, as an example of " various signal " of the present invention, be provided for timing signal, picture signal VID or the opposite electrode current potential LCC such as clock signal C LX, CLY of driving data line drive circuit 101 and scan line drive circuit 104 to Fig. 1 or external circuit-connecting terminal 102 shown in Figure 2 from external circuit.
Data line drive circuit 101 is with according to X side clock signal C LX (and inversion signal CLXinv), X start pulse DX 102 that provide from external circuit-connecting terminal, specified period, generate and export sampled signal Si (i=1 successively from beginnings at different levels, ..., mode n) constitutes.
In addition, sample circuit 7 comprises and a plurality ofly is arranged on the sampling switch 71 on the data line 3 and forms.Each sampling switch 71 is for example formed by the single channel-type TFT of P channel-type or N channel-type or the TFT of complementary type.In addition, each sampling switch 71 to image signal line shown in Figure 36, is sampled to the picture signal VID that provides from external circuit-connecting terminal 102 according to the sampled signal Si from data line drive circuit 101 outputs, and is offered corresponding data line 3.Thus, a plurality of pixel electrode 9a that dispose are provided picture signal VID by its every row rectangularly, and selected and be driven in the orientation of data line 3.
At this, picture signal VID, for example externally in the circuit by string-and launch (that is phase demodulation) be 6 phases, 12 phases ..., further the polarity relative datum current potential of its voltage is reversed positive polarity (+) or negative polarity (-), and is provided for external circuit-connecting terminal 102.Then, like this by the picture signal VID behind the phase demodulation, a plurality of image signal lines 6 via the quantity with these picture signals VID forms accordingly are input to sample circuit 7.Like this,, the picture signal of serial is changed and the parallel picture signal that obtains if provide simultaneously for a plurality of image signal lines 6, then can be by every group of picture signal input of carrying out data line 3, thus can suppress driving frequency.In addition, in Fig. 3,, and, omitted diagram for the detailed formation that provides of the picture signal VID behind the phase demodulation for simple and the quantity of image signal line 6 is illustrated as 1.
In addition, scan line drive circuit 104 for according to picture signal and sweep signal, a plurality of pixel electrode 9a of disposing by each row vertical scanning in the orientation of sweep trace 2 rectangularly, constitutes in the mode that drives as described below.Promptly, provide the Y side clock signal C LY of the reference clock that applies as sweep signal and inversion signal CLYinv thereof, 2 kinds of Y start pulse DYL or DYR from external circuit-connecting terminal 102 to scan line drive circuit 104, and then also have 2 kinds and enable signal ENBY1 and ENBY2.Then, scan line drive circuit 104, generate sweep signal according to Y side clock signal C LY and inversion signal CLYinv thereof, 2 kinds of Y start pulse DYL or DYR, and each the timing to enable signal ENBY1 and ENBY2 based on 2 kinds, sweep signal applied successively to multi-strip scanning line 2.At this moment, in Fig. 3, apply voltage to each sweep trace 2 simultaneously from two ends.
In addition, in the present embodiment, scan line drive circuit 104, with according to 2 kinds of Y start pulse DYL and DYR, in Fig. 3 from the top down direction and this both direction of direction from bottom to top on a plurality of pixel electrode 9a are constituted by mode that each row carries out vertical scanning.In addition, scan line drive circuit 104 constitutes in the mode that is driven by 2 kinds of power vds D and VSS providing via external circuit-connecting terminal 102 from external circuit.
And then, provide opposite electrode current potential LCC from external circuit-connecting terminal 102 to the signal wire of drawing from Lead-through terminal 106 up and down.Opposite electrode current potential LCC is provided for opposite electrode 21 from Lead-through terminal 106 up and down.Opposite electrode current potential LCC suitably keeps the potential difference (PD) with pixel electrode 9a, is used to form the reference potential that liquid crystal keeps the opposite electrode 21 of electric capacity and be in.
Check the structure of terminal and 2nd inspection terminal at the＜2: the 1st 〉
Below, except Fig. 1 to Fig. 3, also further describe the 1st and check that terminal 103a and the 2nd checks the structure of terminal 103b with reference to Fig. 4 to Fig. 6.Fig. 4 (a) illustrates the 1st to check that terminal 103a and the 2nd checks the planimetric map of the structure of terminal 103b, and Fig. 4 (b) is the figure that the electricity structure of the 1st inspection terminal 103a and external circuit-connecting terminal 102 is shown.
In addition, Fig. 5 is used to illustrate the partial plan layout of making the liquid-crystal apparatus of present embodiment on mother substrate, and Fig. 6 is the local amplification view that the structure of a part of being surrounded by dotted line A0 among Fig. 5 is shown.
In the present embodiment, in the manufacturing process of liquid-crystal apparatus, after assembling by bonding tft array substrate 10 and counter substrate 20 etc., externally circuit connects or is installed to before a plurality of external circuit-connecting terminal 102, carries out the demonstration inspection for an example of the conduct of each display element " bonding back is checked " of the present invention.In addition, in the present embodiment, except this demonstration inspection, before tft array substrate 10 and counter substrate 20 bonding, as the electricity inspection of the driving of each display element, also for example carry out having or not broken string or short circuit, being used to confirm the various inspections of the action of data line drive circuit 101, scan line drive circuit 104 etc. of sweep trace 2 or data line 3.
In the present embodiment, use a plurality of the 1st to check terminal 103a when checking when showing inspection and before bonding, use a plurality of the 2nd inspection terminal 103b when before bonding, checking.
Fig. 4 (a) shows a plurality of the 1st and checks that terminal 103a and a plurality of the 2nd checks structure, these the 1st and the 2nd configuration relations of checking terminal 103a and 103b and counter substrate 20 and forming the sealing area 52a of encapsulant 52 of terminal 103b.And, same with Fig. 1 in Fig. 4 (a), use the configuration example of representing counter substrate 20 by dotted line 200 area surrounded.
In Fig. 4 (a), when checking when showing inspection and before bonding, to be used for various signals,, offer the 1st inspection terminal 103a that arranges along one side of the tft array substrate of giving prominence to from counter substrate 20 10 as the 1st inspection signal by each row or a plurality of display elements of each column selection.In the present embodiment, will be with the signal that offers external circuit-connecting terminal 102 Y side clock signal C LY of the same race, that be used for driven sweep line drive circuit 104 and inversion signal CLYinv thereof, 2 kinds of Y start pulse DYL or DYR, also have 2 kinds of each of enabling signal ENBY1 and ENBY2,2 kinds of power vd D and VSS to check that as the 1st signal offers a plurality of the 1st and checks terminal 103a.
At this, in Fig. 4 (b), show a plurality of the 1st and be transfused to the electricity structure that the 1st of Y start pulse DYL or DYR (DY) checks terminal 103a and external circuit-connecting terminal 102 among checking terminal 103a.
Shown in Fig. 4 (b), be transfused to the 1st of Y start pulse DY of the same race mutually and check terminal 103a and external circuit-connecting terminal 102, be electrically connected via resistive element 73.In addition, be provided for the Y start pulse DY of the 1st inspection terminal 103a, be provided for scan line drive circuit 104 via resistive element 73.In addition, resistive element 73 for example by conductive materials such as electric conductivity polysilicons, forms for for example mode about 2k Ω～3k Ω with resistance value.
In addition, in the present embodiment, for among a plurality of the 1st inspection terminal 103a, be provided Y side clock signal C LY and inversion signal CLYinv thereof, 2 kinds of other the 1st inspection terminals 103a that enable signal ENBY1 and ENBY2, power vd D and VSS, also similarly constitute with the 1st inspection terminal 103a that is transfused to Y start pulse DY.Thus, when checking when show checking or before bonding, can utilize to be provided for the 1st various signals of checking terminal 103a driven sweep line drive circuit 104 similarly during common driving after finishing with product.
Thereby, in the present embodiment,, electrical circuit is set, so can make tft array substrate 10 miniaturizations because need be do not form differently new wiring etc. with wiring of the driving of liquid-crystal apparatus etc. for the driving of each display element is not checked.In addition, check terminal 103a for the external circuit-connecting terminal 102 that is provided signal of the same race and the 1st, by resistive element 73 and the 1st is checked that terminal 103a is electrically connected, and the 1st inspection terminal 103a side is arranged to high resistance, after can preventing the manufacturing of liquid-crystal apparatus, when transporting, when driving etc., destroy the phenomenon of scan line drive circuit 104 from obsolete the 1st inspection terminal 103a immersion static.
In addition, a plurality of external circuit-connecting terminal 102 are arranged in the mode that the interval d0 with adjacent external circuit-connecting terminal 102 becomes the value of the degree that conducts difficulty when showing when checking or check before bonding, with probe separately.For example, a plurality of external circuit-connecting terminal 102, the interval d0 of adjacent separately external circuit-connecting terminal 102 is about 50 μ m, and arranges.Thus, even total for example because of string-and launch also the spread length of external connection terminals 102 to be suppressed at setting or following under the more situation of the number numbers that make external circuit-connecting terminal 102 such as many.
In addition, each the 1st inspection terminal 103a, interval d1a with the 1st adjacent inspection terminal 103a, compare with the interval d0 of external circuit-connecting terminal 102 adjacent in the arrangement of a plurality of external circuit-connecting terminal 102, the mode of the big degree that conducts well to the enough probe precision of energy is arranged.For example, a plurality of the 1st checks terminal 103a, and the interval d1a of the 1st adjacent separately inspection terminal 103a becomes about 100 μ m, and arranges.And then in addition, each the 1st checks terminal 103a, on the degree that conducts of can precision carrying out well with probe, to form than external circuit-connecting terminal 102 big sizes.
In addition, when before bonding, checking, under the situation that has driven scan line drive circuit 104, check terminal 103b to a plurality of the 2nd, check the end pulse YEP of signal input as the 2nd from the afterbody output of scan line drive circuit 104, the inspection that is used to drive check circuit shown in Figure 3 201 is with drive signal TX1 and TX2 and from the output signal CX (CX1 of check circuit 201 outputs, CX2, ..., CX8) each, wherein this a plurality of the 2nd checks terminal 103b, in Fig. 4 (a), on counter substrate 20,, be configured in the belt-like zone that is covered by counter substrate 20 in the neighboring area on the tft array substrate 10 from the plane.
In addition, the a plurality of the 2nd checks terminal 103b, check terminal 103a similarly with the 1st respectively, the mode of the degree that the interval d0 of adjacent external circuit-connecting terminal 102 compares, conducts well to the enough probe precision of energy greatly in the arrangement with the adjacent the 2nd interval d1b that checks terminal 103b and a plurality of external circuit-connecting terminal 102 is arranged.For example, a plurality of the 2nd checks terminal 103b, and the interval d1b of the 2nd adjacent separately inspection terminal 103b arranges about 100 μ m.And then in addition same with the 1st inspection terminal 103a, each the 2nd inspection terminal 103b is to form than external circuit-connecting terminal 102 big sizes.
At this, suppose the liquid-crystal apparatus of present embodiment, take on mother substrate S shown in Figure 5, once to form a plurality of modes.Promptly, on mother substrate S, liquid-crystal apparatus forms to distinguish the mode of arranging in length and breadth rectangularly, and in each liquid-crystal apparatus, form such various inscapes (TFT, sweep trace 2, data line 3 etc., perhaps scan line drive circuit 104, data line drive circuit 101 etc.) respectively referring to figs. 1 through Fig. 4 explanation.
Explanation in passing, the mother substrate S shown in Fig. 5 comprises a plurality of Fig. 1 and tft array substrate 10 shown in Figure 2.That is, on mother substrate S shown in Figure 5, form the various inscapes of tft array substrate 10 sides, different therewith, in Fig. 5, on the not shown glass substrate, form opposite electrode 21, alignment films or the like, thereby form a plurality of counter substrate 20, and individually cut apart each counter substrate 20.Then, make each tft array substrate 10 that is formed on the mother substrate S relative with counter substrate 20 separately, and for a pair of tft array substrate 10 and counter substrate 20, individually make it with encapsulant 52 bonding after, between tft array substrate 10 and counter substrate 20, enclose liquid crystal.By cut apart mother substrate S, and produce Fig. 1 and as shown in Figure 2 each independent liquid-crystal apparatus thereafter.
At this, as shown in Figure 6, the periphery of each tft array substrate 10 on the mother substrate S is provided with cuts off zone C t.Then, by zone C t implements cutting or mother substrate S is cut apart in line to cutting off.
In addition, as Fig. 4 or shown in Figure 6, the belt-like zone on tft array substrate 10, a plurality of the 2nd checks terminal 103b, from the plane, is configured in the position of separating with encapsulant 52 formed sealing area 52a respectively on tft array substrate 10.Perhaps, a plurality of the 2nd checks terminal 103b, from the plane, also can dispose in the mode of separating with sealing area 52a at least in part respectively from the tft array substrate 10.
Thereby, on mother substrate S, on each tft array substrate 10, can dispose encapsulant 52 to separate at interval with respect to the encapsulant 52 that on adjacent tft array substrate 10, forms.
At this, Fig. 7 is the comparative example for present embodiment, and the amplification view with a part of corresponding part of being surrounded by dotted line A0 of Fig. 5 is shown.In Fig. 7, the belt-like zone on tft array substrate 10, a plurality of the 2nd checks terminal 103b, from the plane, is configured in respectively and encapsulant 52 formed sealing area 52a position overlapped on tft array substrate 10.
On mother substrate S, when bonding tft array substrate 10 and counter substrate 20, can apply the pressure of regulation to the face separately of tft array substrate 10 and counter substrate 20, and the gap is maintained setting with the opposite face opposition side.At this moment, if adopt structure shown in Figure 7, then on adjacent tft array substrate 10, might be respectively flow out encapsulant 52 and contact, and under such state of contact, harden from sealing area 52a.Thereby, in the comparative example of Fig. 7, it is desirable to, even being separated the two, mutual adjacent encapsulant 52 flows out the degree that also can not contact.
In the present embodiment, on mother substrate S, on adjacent tft array substrate 10, because can form encapsulant 52 to separate at interval mutually respectively, the situation of sclerosis so can prevent encapsulant 52 contacts between these tft array substrates 10.
In addition, check the signal as the 1st,, can also be provided for the signal of driving data line drive circuit 101 perhaps for it except the signal that is provided for driven sweep line drive circuit 104 to a plurality of the 1st inspection terminal 103a.
In addition, except checking that to a plurality of the 2nd terminal 103b provide above-mentioned various signal to check the signal as the 2nd, perhaps for it, can also be provided for respectively driven sweep line drive circuit 104 signal, be used for the signal of driving data line drive circuit 101 etc.In addition, bonding preceding the inspection also can not used the 1st to check terminal 103a, and be used the 2nd to check that terminal 103b carries out.
＜3: the inspection of liquid-crystal apparatus 〉
Below, except Fig. 1 to Fig. 4,, demonstration inspection and bonding preceding inspection the in the liquid-crystal apparatus are described also with reference to Fig. 8 and Fig. 9.Fig. 8 is used for illustrating showing that the 1st figure that checks the supply of various signals such as signal that checks, Fig. 9 are the circuit diagrams of an example that the structure of check circuit 201 is shown.
At first, the demonstration inspection of carrying out is described in liquid-crystal apparatus.In the present embodiment, when showing inspection,,, for example carry out the demonstration of whole image constant brightness, striped demonstration etc., point defect, line defect etc. is checked by showing as specific image at the image display area 10a of liquid-crystal apparatus.At this, compare with showing specific display frame, sometimes also can merely drive each display element and point defect, line defect etc. is checked.
In the present embodiment, use a plurality of external circuit-connecting terminal 102 and a plurality of the 1st to check that terminal 103a shows inspection.In addition, when showing inspection, as shown in Figure 8,, for example be electrically connected anisotropic conducting rubber Gm, thereby conduct together for a plurality of external circuit-connecting terminal 102.In addition, for a plurality of the 1st inspection terminal 103a, for example utilize probe Pr to conduct respectively.Like this, be electrically connected by using less expensive conducting rubber, and avoid tft array substrate is caused damage, and can be electrically connected well.In addition, because the conducting rubber cost is low, thus also change easily, thus can check with low cost.
At this moment, via conducting rubber Gm, provide the inspection picture signal together to a plurality of external circuit-connecting terminal 102.In addition, by utilizing conducting that conducting rubber Gm carries out, come driving data line drive circuit 101, and opposite electrode current potential LCC is provided.
In addition, when showing inspection, check that to a plurality of the 1st terminal 103a are provided for the various signals of driven sweep line drive circuit 104, check signal as the 1st via probe Pr respectively.Thus, driven sweep line drive circuit 104, and provide sweep signal to each sweep trace 2.
Thereby when show checking, a plurality of display elements according to sweep signal, go out by each row is selected, and according to the inspection picture signal that provides via data line 3, carry out the image demonstration by each row.
Then, bonding preceding the inspection is described.In addition, before bonding, on tft array substrate 10, the pixel electrode 9a that is in each display element is formed on image display area 10a, and does not form the state of display element.
Below, as checking example before bonding, the relevant inspection of affirmation with the action of scan line drive circuit 104 is described, with the relevant inspection that has or not of the broken string of data line 3.
At first, in the inspection of the action of confirming scan line drive circuit 104, check that to a plurality of the 1st terminal 103a is provided for the various signals of driven sweep line drive circuit 104, checks signal as the 1st via probe respectively.Thus, driven sweep line drive circuit 104, and end of output pulse YEP check that as the 2nd signal offers the 2nd and checks terminal 103b.
In addition, the relevant inspection that has or not with the broken string of data line 3 utilizes check circuit 201 to carry out.At this, an example of the structure of check circuit 201 is described with reference to Fig. 9.
In Fig. 9, in check circuit 201, be formed with a plurality of on-off elements 75 that accordingly, for example utilize single channel-type TFT to form respectively with a plurality of data lines 3.Each on-off element 75, its source is electrically connected to data line 3, and its grid are electrically connected to be provided and check with the signal wire 210a of drive signal TX1 and be provided one of signal wire 210b that checks usefulness drive signal TX2.In addition, the electric leakage of each on-off element 75 be connected to 8 output signal line 212-1,212-2 ..., one of 212-8 (212).
At this, in the present embodiment, when in Fig. 3, counting under the situation of a plurality of data lines 3 accordingly successively with the output order of sampled signal Si, provide inspection drive signal TX1 via signal wire 210a respectively to the on-off element 75 that is electrically connected with the data line 3 that is positioned at even number, and provide inspection drive signal TX2 via signal wire 210b respectively to the on-off element 75 that is electrically connected with the data line 3 that is positioned at odd number.
In addition, a plurality of on-off elements 75, with per 8 ground and 8 output signal line 212-1,212-2 ..., the mode that is electrically connected of 212-8 constitutes.
In addition, when checking,, check terminal 103b via the 2nd,, provide and check with one of drive signal TX1 and TX2 by utilizing conducting that probe carries out to one of signal wire 210a and 210b.Thus, corresponding with the data line 3 of one of odd number and even number on-off element 75 becomes conducting (ON) state.
In addition, check equally,, for example provide inspection to use picture signal together via conducting rubber Gm to a plurality of external circuit-connecting terminal 102 with demonstration, and driving data line drive circuit 101.In addition, check equally, check that to a plurality of the 1st terminal 103a are provided for the various signals of driven sweep line drive circuit 104 with demonstration, as the 1st inspection signal, thus driven sweep line drive circuit 104.
Its result, each data line 3 becomes and checks with the corresponding current potential of picture signal by being driven.In addition, have the inspection signal of the current potential of this data line 3, be imported into the source of the on-off element 75 that becomes conducting state, and then output signal CX outputs to corresponding output signal line 212 from on-off element 75.
In addition, the demonstration inspection of above explanation or bonding before check, also can when the driving among a plurality of external circuit-connecting terminal 102, at liquid-crystal apparatus, be provided the part of picture signal VID, provide the inspection picture signal via conducting rubber, and to the 1st inspection terminal 103a, except the signal that is used for driven sweep line drive circuit 104 or for it, also be provided for the signal of driving data line drive circuit 101, check signal as the 1st, thereby except scan line drive circuit 104 or for it, go back driving data line drive circuit 101.
In addition, in before bonding, checking, also can check that the 2nd of terminal 103b checks signal, driven sweep line drive circuit 104 or data line drive circuit 101 according to being provided for the 2nd.
Thereby, in the present embodiment of above explanation, because need not check terminal 103a,, can reduce the quantity of the 1st inspection terminal 103a so compare with the structure of when showing inspection, only using the 1st inspection terminal 103a in order to provide inspection to be provided with the 1st with picture signal.
In addition, on counter substrate 20 from the plane, the untapped the 2nd checks terminal 103b in checking as the demonstration of the inspection after bonding, be configured in the belt-like zone on the tft array substrate 10, and that uses in checking as the demonstration of the inspection after bonding the 1st checks terminal 103a, is configured in the part of the neighboring area from the outstanding tft array substrate 10 of counter substrate 20.And then, in addition, when before bonding, checking, check that by using the 1st terminal 103a and the 2nd checks terminal 103b, and compare with the situation of only using the 2nd inspection terminal 103b, can reduce the quantity of the 2nd inspection terminal 103b.Thereby, in the neighboring area of tft array substrate 10, can reduce to be used to dispose the zone of the 2nd inspection terminal 103b.
Thereby, in the present embodiment, in liquid-crystal apparatus, from tft array substrate 10 from the outstanding part of counter substrate 20, reduced the zone that is used to dispose the 1st inspection terminal 103a, and as mentioned above, checked that by using the 1st terminal 103a and the 2nd checks terminal 103b, and at belt-like zone, also can the implementation space savingization.Its result can make the liquid-crystal apparatus miniaturization.
＜4: variation 〉
Except Fig. 1 to Fig. 9, the modified embodiment of the present embodiment of above explanation is described with reference to Figure 10 to Figure 12 also.
The structure of one of this variation at first, is described with reference to Figure 10.Figure 10 is the structure for one of this variation, and the local amplification view of the structure of the part corresponding with Fig. 6 is shown.
The a plurality of the 2nd checks terminal 103b, and the belt-like zone on the tft array substrate 10 of Fig. 6 from the plane, is configured in the position of separating with sealing area 52a to small part respectively on tft array substrate 10.Under situation about constituting like this, also same with structure shown in Figure 6, on mother substrate S, because can on adjacent tft array substrate 10, form encapsulant 52 to separate at interval mutually respectively, so can prevent between these tft array substrates 10, to contact the phenomenon of hardening because of encapsulant 52.
Below, another structure of this variation is described with reference to Figure 11 and Figure 12.Figure 11 is another structure for this variation, same with Fig. 4 (a), the 1st inspection terminal and the 2nd is shown checks the planimetric map of the structure of terminal, Figure 12 (a) is another structure for this variation to Figure 12 (c), illustrate with the corresponding part of Fig. 6 with the 2nd local amplification view of checking the structure that the configuration of terminal is relevant.And then, to Figure 12 (c),, the relevant structure of configuration with the 2nd inspection terminal is shown at Figure 12 (a) respectively for tft array substrate adjacent on mother substrate S 10.
At first, as shown in figure 11, the belt-like zone on tft array substrate 10, a plurality of the 2nd checks terminal 103b, also can arrange along 2 limits adjacent with one side of the tft array substrate 10 that is arranged with external circuit-connecting terminal 102 grades.
At this, as illustrating with reference to Fig. 1 or Fig. 4 (a), a plurality of the 2nd check under the situation that terminal 103b arranges along one of 2 limits adjacent with one side of the tft array substrate 10 that is arranged with external circuit-connecting terminal 102 etc., among tft array substrate 10L and 10R adjacent on the mother substrate S, in Figure 12 (a), be formed at least a portion that a plurality of the 2nd on the tft array substrate 10L that is disposed at the left side checks terminal 103bl, on mother substrate S, be configured at least in part and cut off zone C t.In addition, though it is not shown in Figure 12 (a), but in the figure, it is desirable to check terminal 103b, also check that with the 2nd of the tft array substrate 10L that is disposed at the left side terminal 103bl similarly disposes being formed on the 2nd on the tft array substrate 10R that is disposed at the right side.
Perhaps, as shown in figure 11, the a plurality of the 2nd check terminal 103b image display area 10a is sandwiched in the middle of and under the situation of arranging along 2 limits of the tft array substrate 10 that is positioned at its both sides, in Figure 12 (b), among tft array substrate 10L and 10R adjacent on the mother substrate S, be formed on the 2nd the checking that at least a portion among the terminal 103bl is configured in and cut off zone C t of one side of the tft array substrate 10L that is disposed at the left side, and the 2nd check that terminal 103bl together arranges with these, be formed on the 2nd the checking that at least a portion among the terminal 103br is configured in and cut off zone C t of one side of the tft array substrate 10R that is disposed at the right side.
And then, the a plurality of the 2nd check terminal 103b image display area 10a is sandwiched in the middle of and under the situation of arranging along 2 limits of tft array substrate 10, in Figure 12 (c), among tft array substrate 10L and 10R adjacent on the mother substrate S, be formed on the 2nd the checking that at least a portion among the terminal 103bl is configured in and cut off zone C t of one side of the tft array substrate 10L that is disposed at the left side, and be formed on the 2nd the checking that at least a portion among the terminal 103br is configured in and cut off zone C t of one side of the tft array substrate 10R that is disposed at the right side.In addition, per respectively 1 of the 2nd splicing ear 103br that is configured in the tft array substrate 10R on the 2nd splicing ear 103bl that cuts off zone C tft array substrate 10L t, the left side and right side arranges alternately.
As mentioned above, if adopt Figure 12 (a) to the structure shown in Figure 12 (c), then be configured in each that cut off the 2nd of zone C t and check terminal 103bl and 103br respectively, when cutting apart mother substrate S, its at least a portion is cut off.Thus, in liquid-crystal apparatus, a plurality of the 2nd checks at least a portion among the terminal 103b, one side form being cut off of tft array substrate 10 that is arranged with the 2nd inspection terminal 103b.Thereby, if adopt such structure, then cut off zone C t by on mother substrate S, effectively utilizing, can make tft array substrate 10 miniaturizations.
＜5: electronic equipment 〉
Below, illustrate that above-mentioned liquid-crystal apparatus is applied to the situation of various electronic equipments.
＜5-1: projector 〉
At first, explanation is with the projector of this liquid-crystal apparatus as the light valve use.Figure 13 is the planimetric map that the configuration example of projector is shown.As shown in the drawing, in projector 1100 inside, be provided with the lamp unit 1102 that constitutes by white light sources such as Halogen lamp LEDs.4 catoptrons 1106 and 2 dichronic mirrors 1108 that the projection light that penetrates from this lamp unit 1102 is set in the light guide way 1104 are separated into RGB 3 primary colors, and incide liquid crystal panel 1110R, 1110B and 1110G as the light valve corresponding with each primary colors.
The structure of liquid crystal panel 1110R, 1110B and 1110G is identical with above-mentioned liquid-crystal apparatus, uses respectively from external circuit (omitting diagram) and offers R, the G of external circuit-connecting terminal 102, the primary signal driving of B.In addition, the light of being modulated by these liquid crystal panels incides colour splitting prism 1112 from 3 directions.In this colour splitting prism 1112, R and B anaclasis 90 degree, G light straight ahead then on the other hand.Thereby, the result that the image of each color is synthesized, via projecting lens 1114 with colour image projection to screen.
At this, if be conceived to the demonstration picture that formed by each liquid crystal panel 1110R, 1110B and 1110G, then the demonstration picture that is formed by liquid crystal panel 1110G need be with respect to reversing about the demonstration picture that is formed by liquid crystal panel 1110R, 1110B.
In addition, because incide liquid crystal panel 1110R, 1110B and 1110G by dichronic mirror 1108, so do not need to be provided with color filter with R, G, light that each primary colors of B is corresponding.
＜5-2: portable computer 〉
Below, illustrate liquid-crystal apparatus is applied to example in the portable personal computer.Figure 14 is the skeleton view that the structure of this personal computer is shown.
In Figure 14, computing machine 1200 constitutes by possessing main part 1204, liquid crystal display 1206 that keyboard 1202 is arranged.This liquid crystal display 1206 is by constituting at the additional backlight in the back side of above-mentioned liquid-crystal apparatus 1005.
＜5-3: mobile phone 〉
Further specify the example that this liquid crystal panel is applied to mobile phone.Figure 15 is the skeleton view that the structure of this mobile phone is shown.
In Figure 15, mobile phone 1300 has the liquid-crystal apparatus 1005 of a plurality of action buttons 1302 and semi-penetration type.In the liquid-crystal apparatus 1005 of this semi-penetration type, at its back side backlight is set as required.
In addition, except the electronic equipment of reference Figure 13 to Figure 15 explanation, can also list LCD TV, the video camera of find a view type or monitor direct viewing type, automobile navigation apparatus, pager, electronic notebook, electronic calculator, word processor, workstation, videophone, POS terminal, possess device that touch panel is arranged etc.In addition, can certainly be applied to this various electronic equipments.
The present invention is not limited to above-mentioned embodiment, in the scope of the scope that requires without prejudice to accessory rights and whole purport of the present invention that obtains of instructions or thought, can change aptly, be accompanied by the electro-optical device and the inspection method thereof of this change, and the electronic equipment that possesses this electro-optical device is also included within the technical scope of the present invention.
In addition, as using electro-optical device of the present invention, except the liquid-crystal apparatus of above-mentioned embodiment, can also list reflective liquid crystal device, plasma display, electron emission display device, electrophoretic display device (EPD)s etc. such as LCOS.

Claims (14)

1. electro-optical device is characterized in that possessing:
Device substrate;
Counter substrate, mode and said elements base plate bonding that it is given prominence at outburst area with the part of above-mentioned device substrate;
A plurality of pixel portions, it is arranged in the pixel region on the said elements substrate;
A plurality of external circuit-connecting terminal, it is arranged in the above-mentioned outburst area among the neighboring area of the periphery that is positioned at the above-mentioned pixel region on the said elements substrate, and is provided from external circuit and comprises and be used to make above-mentioned a plurality of pixel portions to carry out the picture signal that image shows and the various signals of control signal; And
A plurality of inspection terminals, the edge that its above-mentioned a plurality of external circuit-connecting terminal that are configured in above-mentioned outburst area are arranged, and be provided the inspection signal;
Wherein, above-mentioned a plurality of inspection terminals, and the interval between above-mentioned a plurality of external circuit-connecting terminal is relatively with wideer arranged spaced.
2. electro-optical device as claimed in claim 1 is characterized in that:
Before above-mentioned a plurality of external circuit-connecting terminal are electrically connected the said external circuit and during the inspection of after said elements substrate and above-mentioned counter substrate bonding, carrying out, for when this electro-optical device is worked, becoming the terminal part that is provided above-mentioned picture signal, provide the inspection picture signal together;
Above-mentioned a plurality of inspection terminal, when above-mentioned inspection after bonding, being provided for above-mentioned inspection after bonding becomes in above-mentioned inspection with required inspection signal beyond the picture signal.
3. as claim 1 or 2 described electro-optical devices, it is characterized in that: above-mentioned a plurality of inspection terminals at the two ends that above-mentioned a plurality of external circuit-connecting terminal are arranged, are arranged on the extended line of above-mentioned a plurality of external circuit-connecting terminal arrangements.
4. electro-optical device is characterized in that possessing:
Device substrate;
Counter substrate, mode and said elements base plate bonding that it is given prominence at outburst area with the part of above-mentioned device substrate;
A plurality of pixel portions, it is arranged in the pixel region on the said elements substrate;
A plurality of external circuit-connecting terminal, it is arranged in the above-mentioned outburst area among the neighboring area of the periphery that is positioned at the above-mentioned pixel region on the said elements substrate, and is provided from external circuit and comprises and be used to make above-mentioned a plurality of pixel portions to carry out the picture signal that image shows and the various signals of control signal;
The a plurality of the 1st checks terminals, the edge that its above-mentioned a plurality of external circuit-connecting terminal that are configured in above-mentioned outburst area are arranged, and be provided and become the required the 1st for the inspection of after said elements substrate and above-mentioned counter substrate bonding, carrying out and check signal; And
The a plurality of the 2nd checks terminal, it is configured at least in part and is in zone subregional along the periphery on other limits except above-mentioned one side, that covered by above-mentioned counter substrate in said elements substrate and the bonding back of above-mentioned counter substrate among the above-mentioned neighboring area, and is provided for become the required the 2nd in the above-mentioned inspection of carrying out before bonding and checks signal.
5. electro-optical device as claimed in claim 4 is characterized in that:
The above-mentioned a plurality of the 1st checks terminal, and the interval between above-mentioned a plurality of external circuit-connecting terminal relatively, with the arranged spaced of broad;
The above-mentioned a plurality of the 2nd checks terminal, and the interval between above-mentioned a plurality of external circuit-connecting terminal relatively, with the arranged spaced of broad.
6. as claim 4 or 5 described electro-optical devices, it is characterized in that:
The said elements substrate, by on the large substrate that comprises polylith said elements substrate, on every said elements substrate with the bonding above-mentioned counter substrate of the mode relative with above-mentioned counter substrate, and after said elements substrate and counter substrate are bonding, above-mentioned large substrate is divided into every said elements substrate and forms;
The above-mentioned a plurality of the 2nd checks at least a portion among the terminal, replaces above-mentioned peripheral part zone or except above-mentioned peripheral part zone, divided location overlap ground formation when cutting apart above-mentioned large substrate.
7. as any described electro-optical device of claim 4 to 6, it is characterized in that further possessing:
On the said elements substrate,,, make said elements substrate and above-mentioned counter substrate bonding encapsulant mutually at the sealing area that surrounds above-mentioned pixel region from the plane;
Wherein, the above-mentioned a plurality of the 2nd check that terminal is configured in the above-mentioned sealing area at least in part.
8. as any described electro-optical device of claim 4 to 7, it is characterized in that:
The above-mentioned a plurality of the 1st checks terminal, at least in part, except when the above-mentioned inspection after bonding, also uses when above-mentioned inspection before bonding;
The above-mentioned a plurality of the 2nd checks terminal, is to be provided with the 1st to check the different inspection signal of signal as the above-mentioned the 2nd terminal of checking signal, and the above-mentioned the 1st checks that signal is provided for above-mentioned the 1st inspection terminal when above-mentioned inspection before bonding.
9. as any described electro-optical device of claim 4 to 8, it is characterized in that:
The above-mentioned a plurality of the 2nd checks that terminal comprises the 2nd with the kind terminal, and the 2nd is provided with at least a congener signal of above-mentioned various signals with the kind terminal and checks signal as the above-mentioned the 2nd;
The 2nd with the kind terminal, is electrically connected via at least a said external circuit connecting terminals that is provided above-mentioned various signals among resistive element and the above-mentioned a plurality of external circuit-connecting terminal;
The above-mentioned the 2nd checks the above-mentioned congener signal among the signal, when above-mentioned inspection before bonding, is provided via above-mentioned resistive element from the above-mentioned the 2nd with the kind terminal.
10. as any described electro-optical device of claim 4 to 9, it is characterized in that:
The above-mentioned a plurality of the 1st checks that terminal comprises the 1st with the kind terminal, and the 1st is provided with at least a congener signal of above-mentioned various signals with the kind terminal and checks signal as the above-mentioned the 1st;
The 1st with the kind terminal, is electrically connected via at least a said external circuit connecting terminals that is provided above-mentioned various signals among resistive element and the above-mentioned a plurality of external circuit-connecting terminal;
The above-mentioned the 1st checks the above-mentioned congener signal among the signal, when above-mentioned inspection after bonding, is provided via above-mentioned resistive element from the above-mentioned the 1st with the kind terminal.
11. any described electro-optical device as claim 1 to 3 is characterized in that:
Above-mentioned a plurality of inspection terminal comprises with the kind terminal, and this is provided at least a congener signal with above-mentioned various signals as above-mentioned inspection signal with the kind terminal;
Should be with the kind terminal, be electrically connected via at least a said external circuit connecting terminals that is provided above-mentioned various signals among resistive element and the above-mentioned a plurality of external circuit-connecting terminal;
Above-mentioned congener signal among the above-mentioned inspection signal, after said elements substrate and above-mentioned counter substrate bonding, carry out bonding after inspection the time, be provided via above-mentioned resistive element with the kind terminal from above-mentioned.
12. the inspection method of an electro-optical device is to check the inspection method that possesses with the electro-optical device of lower member: device substrate; Counter substrate, mode and said elements base plate bonding that it is given prominence at outburst area with the part of above-mentioned device substrate; A plurality of pixel portions, it is arranged in the pixel region on the said elements substrate; A plurality of external circuit-connecting terminal, it is arranged in the above-mentioned outburst area among the neighboring area of the periphery that is positioned at the above-mentioned pixel region on the said elements substrate, and is provided from external circuit and comprises and be used to make above-mentioned a plurality of pixel portions to carry out the picture signal that image shows and the various signals of control signal; And a plurality of inspection terminals, the edge that its above-mentioned a plurality of external circuit-connecting terminal that are configured in above-mentioned outburst area are arranged; It is characterized in that this inspection method comprises:
After said elements substrate and above-mentioned counter substrate bonding and the bonding back of carrying out before making the said external circuit and the said external circuit connecting terminals being electrically connected when checking, for becoming the terminal that is provided above-mentioned picture signal among above-mentioned a plurality of external circuit-connecting terminal, provide the step of checking with picture signal together;
For above-mentioned a plurality of inspection terminals,, above-mentioned bonding back provides the step of above-mentioned inspection for checking with the inspection signal beyond the picture signal; And
Check as above-mentioned bonding back, under the state that above-mentioned inspection is provided with picture signal and above-mentioned inspection signal, check the step of whether carrying out with the corresponding image demonstration of picture signal in above-mentioned a plurality of pixel portions with above-mentioned inspection.
13. the inspection method of electro-optical device as claimed in claim 12 is characterized in that:
The above-mentioned step of checking with picture signal that provides together makes conducting rubber be electrically connected with above-mentioned a plurality of external circuit-connecting terminal, and provides above-mentioned inspection picture signal together via this conducting rubber;
The above-mentioned step of checking signal that provides provides above-mentioned inspection signal to above-mentioned a plurality of inspection terminals respectively via probe.
14. an electronic equipment is characterized in that, possesses any described electro-optical device of claim 1 to 10.
CNB2006101159275A 2005-08-18 2006-08-18 Electro-optical device, method of testing the same, and electronic apparatus Active CN100414420C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005237188 2005-08-18
JP237188/2005 2005-08-18
JP140015/2006 2006-05-19

Publications (2)

Publication Number Publication Date
CN1916741A true CN1916741A (en) 2007-02-21
CN100414420C CN100414420C (en) 2008-08-27

Family

ID=37737757

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101159275A Active CN100414420C (en) 2005-08-18 2006-08-18 Electro-optical device, method of testing the same, and electronic apparatus

Country Status (1)

Country Link
CN (1) CN100414420C (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104808371A (en) * 2008-02-21 2015-07-29 精工爱普生株式会社 Electro-optical device and electronic apparatus
CN106773165A (en) * 2016-12-23 2017-05-31 武汉精立电子技术有限公司 Image for display module detection shows detection means and its detection method
CN107290879A (en) * 2017-08-11 2017-10-24 深圳市华星光电技术有限公司 Light shield for liquid crystal display panel
CN107664883A (en) * 2016-07-29 2018-02-06 株式会社日本显示器 Display device
CN109856834A (en) * 2017-11-30 2019-06-07 夏普株式会社 Electronic equipment
CN111538178A (en) * 2020-03-31 2020-08-14 上海天马微电子有限公司 Display panel mother board, display module, preparation method of display module and display device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109031723B (en) * 2018-08-22 2021-06-04 惠科股份有限公司 Array substrate, liquid crystal module and liquid crystal display equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69534159T2 (en) * 1994-02-24 2005-09-22 Kanegafuchi Kagaku Kogyo K.K. ELECTRODE PLATE FOR LIQUID CRYSTALS
JP4006304B2 (en) * 2002-09-10 2007-11-14 株式会社 日立ディスプレイズ Image display device
JP2004205852A (en) * 2002-12-25 2004-07-22 Kyocera Corp Liquid crystal display
JP4864598B2 (en) * 2006-08-11 2012-02-01 花王株式会社 Cleaning composition for hard surface

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104808371A (en) * 2008-02-21 2015-07-29 精工爱普生株式会社 Electro-optical device and electronic apparatus
CN107664883A (en) * 2016-07-29 2018-02-06 株式会社日本显示器 Display device
CN106773165A (en) * 2016-12-23 2017-05-31 武汉精立电子技术有限公司 Image for display module detection shows detection means and its detection method
CN107290879A (en) * 2017-08-11 2017-10-24 深圳市华星光电技术有限公司 Light shield for liquid crystal display panel
CN107290879B (en) * 2017-08-11 2020-06-09 深圳市华星光电技术有限公司 Light shield for liquid crystal display panel
CN109856834A (en) * 2017-11-30 2019-06-07 夏普株式会社 Electronic equipment
CN111538178A (en) * 2020-03-31 2020-08-14 上海天马微电子有限公司 Display panel mother board, display module, preparation method of display module and display device
CN111538178B (en) * 2020-03-31 2022-09-23 上海天马微电子有限公司 Display panel mother board, display module, preparation method of display module and display device

Also Published As

Publication number Publication date
CN100414420C (en) 2008-08-27

Similar Documents

Publication Publication Date Title
CN1204542C (en) Photoelectric device, IC for driving and electronic equipment
CN1591145A (en) Electrooptic device and electronic device
JP5194382B2 (en) Electro-optical device and electronic apparatus
CN1841139A (en) Electro-optical device and electronic apparatus
CN1495493A (en) Liquid crystal display
CN1841138A (en) Electro-optical device, method of mounting wiring substrate, and electronic apparatus
CN1721930A (en) Electrooptical device, mounting structure, and electronic apparatus
CN101055371A (en) Liquid crystal display device and method of fabricating the same
CN101046593A (en) Liquid crystal device and electronics apparatus
CN1410812A (en) Semitransmission reflecting liquid crystal device and electronic apparatus using same
CN1916741A (en) Electro-optical device, method of testing the same, and electronic apparatus
CN1410957A (en) Display
CN1811890A (en) Display panel assembly and display apparatus having the same
CN1318182A (en) Electro-optical device, method of manufacture thereof, and electronic device
CN1725069A (en) Electro-optical device and electronic apparatus
CN101034234A (en) Liquid crystal device, method of making the same, and electronic apparatus
CN100343744C (en) Substrate for electro-optical device, electro-optical device and electronic equipment
CN1374546A (en) Liquid crystal display device
CN1252528C (en) Display device substrate and liquid crystal display device with said substrate
CN1280922C (en) Semiconductor device and producing method thereof, electrooptical device and electronic equipment
CN1551092A (en) Electrooptical board drive circuit and electrooptical device and electroic device configured with it
CN1172282C (en) Electrooptical board and electronic equipment
CN1238827C (en) Display equipment
CN1501125A (en) Electro-optic panel and manufacturing method thereof
CN1447297A (en) Electrooptical deivce, drive circuit of electooptical device and electronic appliance

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant