CN1916106A - Heat conducting cream, and prepartion method - Google Patents
Heat conducting cream, and prepartion method Download PDFInfo
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- CN1916106A CN1916106A CN 200510036766 CN200510036766A CN1916106A CN 1916106 A CN1916106 A CN 1916106A CN 200510036766 CN200510036766 CN 200510036766 CN 200510036766 A CN200510036766 A CN 200510036766A CN 1916106 A CN1916106 A CN 1916106A
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- heat
- conducting cream
- heat conduction
- conduction powder
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Abstract
This invention provides a method for preparing heat-conducting grease, which comprises a matrix and heat-conducting powder dispersed in the matrix. The surface of the heat-conducting powder is distributed with Ag particles. The method comprises: (1) providing AgNO3 aqueous solution; (2) immersing the heat-conducting powder in the AgNO3 aqueous solution so that AgNO3 is adsorbed on the surface of the heat-conducting powder; (3) separating the heat-conducting powder from the aqueous solution; (4) decomposing AgNO3 by thermal treatment so that Ag particles are adsorbed on the surface of the heat-conducting powder; (5) mixing the heat-conducting powder and the matrix to obtain the heat-conducting grease.
Description
[technical field]
The invention relates to a kind of heat interfacial material, especially a kind of heat-conducting cream and preparation method thereof.
[background technology]
Along with the intensive and microminiaturized degree of unicircuit is more and more higher, the more and more littler and operation at full speed that electronic component becomes, electronic component just can guarantee to have good working performance and stability in its operating temperature range, therefore, its requirement to heat radiation is more and more higher.For heat is distributed, at electronical elements surface one heat abstractor being installed becomes general in the industry way, utilizes the heat conductivity of heat abstractor material, and heat is distributed to the outside rapidly.But there are certain interval in heat abstractor and electronical elements surface, make heat abstractor and electronic component fail closely to contact, and this is a big defective of heat abstractor heat radiation.At the contact problems of heat abstractor and electronical elements surface, way in the industry generally is to add a heat interfacial material between electronic component and heat abstractor, to improve the heat conduction efficiency between electronic component and the heat abstractor.
Usually, be used for the heat interfacial material that helps heat radiation heat-conducting cream, heat conduction thin slice, radiating fin etc. being arranged on the heat-generating electronic elements.Wherein, heat-conducting cream is to add ceramic powder, Graphite Powder 99 or metal powder in the liquid macroimolecule body material, and to make liquid or semi-solid heat-conducting cream, mainly acting as of these powders served as heat passage main body, filled up the concavo-convex place of electronical elements surface.But the particle diameter of these powders is bigger, can not fill up the unfairness of electronical elements surface effectively.
For filling up the concavo-convex place of electronic component effectively, improve the performance of heat-conducting cream, improve its thermal conductivity, utilize in the prior art and fill nano level high thermal conductivity material, the material that has the excellent heat conductivity performance as nano-silver powder, diamond powder and nano carbon microsphere etc.Though the heat conductivility of the heat-conducting cream that is provided in the above-mentioned prior art has a distinct increment, still have certain gap with desired result.Its reason is when adding nano level high thermal conductivity material in polymer matrix material, because the high thermal conductivity scantling is a nano level, specific surface area is big, surface energy is high, make nano-powder in body material, can tendency dwindle surface-area to tend towards stability, so be easy to be gathered into the particle of big particle diameter, cause electronic component and heat-conducting cream to be difficult to fully contact, thereby cause the thermal resistance of heat-conducting cream to increase, influence the heat conductivility of heat-conducting cream.
In view of this, be necessary to provide heat-conducting cream that a kind of thermal resistance is little, heat conductivility is excellent and preparation method thereof.
[summary of the invention]
Below heat-conducting cream that a kind of thermal resistance is little, heat conductivility is excellent and preparation method thereof will be described by embodiment.
For realizing foregoing, a kind of heat-conducting cream is provided, this heat-conducting cream comprises matrix and is dispersed in heat conduction powder in the matrix that this conductive powder surface has silver particles.
The size of this silver particles is 1～100 nanometer (nm).
And, a kind of heat-conducting cream preparation method is provided, this method may further comprise the steps:
The aqueous solution of one Silver Nitrate is provided;
The heat conduction powder is immersed among the above-mentioned aqueous solution, makes the conductive powder surface adhere to Silver Nitrate;
The heat conduction powder is separated from the aqueous solution;
Thermal treatment is attached with the heat conduction powder of Silver Nitrate, and Silver Nitrate is decomposed, and silver particles is attached to the conductive powder surface;
Heat conduction powder and matrix are mixed and made into heat-conducting cream.
The concentration of this silver nitrate aqueous solution is 1 * 10
-4～0.1 rubs/liter (mol/L), and the weight ratio of heat conduction powder and silver nitrate solution is 1: 1000～3: 10.
Compared with prior art, the conductive powder surface of the heat-conducting cream of present embodiment has the silver particles that particle diameter is little, thermal conductivity is high, this silver particles can be filled up the unfairness of electronical elements surface, the air at concavo-convex place is discharged, therefore can reduce the thermal contact resistance between heat-conducting cream and the electronic component, have excellent heat conductivility.
[description of drawings]
Fig. 1 is the synoptic diagram of first embodiment of the invention heat-conducting cream.
Fig. 2 is a user mode reference drawing of the present invention.
Fig. 3 is second embodiment of the invention heat-conducting cream preparation method's a schema.
[embodiment]
As shown in Figure 1, it is the heat-conducting cream 10 that first embodiment of the invention provided, and this heat-conducting cream 10 comprises matrix 12 and is dispersed in heat conduction powder 14 in this matrix 12.Wherein, these heat conduction powder 14 surfaces are evenly distributed with silver particles 140.
The size of this heat conduction powder 14 is 1～100 micron (μ m), and the particle diameter of silver particles 140 is between 1～100nm, and this heat conduction powder 14 is 1: 1～1: 20 with the weight ratio of matrix 12.
This matrix 12 can be selected from macromolecular material, as the mixture of one or several compositions in polyvinyl acetate, polyethylene, silicone oil, CALCIUM ACRYLATE, polypropylene, Resins, epoxy, polyoxymethylene, polyvinyl alcohol, the olefin resin.
This heat conduction powder 14 can be selected from the material with good heat conductive performance, as the mixture of one or several compositions in copper, nickel, aluminum oxide, nickel boron, silicon carbide, aluminium carbide, silicon-dioxide, zinc oxide, the titanium dioxide.
As shown in Figure 2, during use, heat-conducting cream 10 is coated between electronic component 20 and the heat abstractor 40, the silver particles 140 on heat conduction powder 14 surfaces can be filled up electronic component 20 depressions in the surface 22, reduce the thermal contact resistance between heat-conducting cream 10 and the electronic component 20, make heat-conducting cream 10 have excellent heat conductivility.
See also Fig. 3, it is second embodiment of the invention heat-conducting cream preparation method's a schema, and this method may further comprise the steps:
Step 3 is separated the heat conduction powder from the aqueous solution;
Below in conjunction with specific embodiment each step is elaborated.
This heat conduction powder is optional from the material with good heat conductive performance, as the mixture of one or several compositions in copper, nickel, aluminum oxide, nickel boron, silicon carbide, aluminium carbide, silicon-dioxide, zinc oxide, the titanium dioxide.Preferably, thermally conductive material is powder or microgranular texture, and its particle diameter is 1～100 μ m.
Step 3 is that the heat conduction powder is separated from the aqueous solution.The heat conduction powder in silver nitrate solution, soak 24 as a child after, it is separated from silver nitrate solution, can be residual there be silver nitrate solution isolated conductive powder surface.This separation method can adopt the separate mode of suitable solids such as centrifugation, filtration, liquid.
This matrix can be selected from macromolecular material, as the mixture of one or several compositions in polyvinyl acetate, polyethylene, silicone oil, CALCIUM ACRYLATE, polypropylene, Resins, epoxy, polyoxymethylene, polyvinyl alcohol, the olefin resin.
Adopt the heat-conducting cream of this method preparation, the conductive powder surface of big particle diameter has small silver particles, this silver particles can be filled up the unfairness of electronical elements surface, the air at concavo-convex place is discharged, and itself has good heat-conducting silver particles, therefore can reduce the thermal contact resistance between heat-conducting cream and the electronic component, make heat-conducting cream have excellent heat conductivility.
In addition, those skilled in the art can also do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (17)
1. heat-conducting cream comprises matrix and is dispersed in heat conduction powder in this matrix that it is characterized in that: described conductive powder surface has silver particles.
2. heat-conducting cream as claimed in claim 1 is characterized in that: the size of described heat conduction powder is 1～100 micron.
3. heat-conducting cream as claimed in claim 1 is characterized in that: the size of described silver particles is 1～100 nanometer.
4. heat-conducting cream as claimed in claim 1 is characterized in that: described matrix is the mixture of one or several compositions in polyvinyl acetate, polyethylene, silicone oil, CALCIUM ACRYLATE, polypropylene, Resins, epoxy, polyoxymethylene, polyvinyl alcohol, the olefin resin.
5. heat-conducting cream as claimed in claim 1 is characterized in that: described heat conduction powder is the mixture of one or more compositions in copper, nickel, aluminum oxide, nickel boron, silicon carbide, aluminium carbide, silicon-dioxide, zinc oxide, the titanium dioxide.
6. heat-conducting cream as claimed in claim 1 is characterized in that: described silver particles is evenly distributed on the conductive powder surface.
7. heat-conducting cream as claimed in claim 1 is characterized in that: the weight ratio of described heat conduction powder and matrix is 1: 1～1: 20.
8. heat-conducting cream preparation method may further comprise the steps:
The aqueous solution of one Silver Nitrate is provided;
The heat conduction powder is immersed among the above-mentioned aqueous solution, makes the conductive powder surface adhere to Silver Nitrate;
The heat conduction powder is separated from the aqueous solution;
Thermal treatment is attached with the heat conduction powder of Silver Nitrate, and Silver Nitrate is decomposed, and silver particles is attached to the conductive powder surface;
Heat conduction powder and matrix are mixed and made into heat-conducting cream.
9. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: the concentration of aqueous solution of described Silver Nitrate is 1 * 10
-4～0.1 rub/liter.
10. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: the weight ratio of described heat conduction powder and silver nitrate aqueous solution is 1: 1000～3: 10.
11. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: described heat conduction powder isolating mode among the aqueous solution comprises centrifugation, filtering separation.
12. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: described heat treatment mode is to be calcining.
13. heat-conducting cream preparation method as claimed in claim 12 is characterized in that: described incinerating temperature is 450～500 ℃.
14. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: the weight ratio of described heat conduction powder and matrix is 1: 1～1: 20.
15. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: the size of described heat conduction powder is 1～100 micron.
16. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: described matrix is the mixture of one or several compositions in polyvinyl acetate, polyethylene, silicone oil, CALCIUM ACRYLATE, polypropylene, Resins, epoxy, polyoxymethylene, polyvinyl alcohol, the olefin resin.
17. heat-conducting cream preparation method as claimed in claim 8 is characterized in that: described heat conduction powder is the mixture of one or more compositions in copper, nickel, aluminum oxide, nickel boron, silicon carbide, aluminium carbide, silicon-dioxide, zinc oxide, the titanium dioxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510036766 CN1916106A (en) | 2005-08-19 | 2005-08-19 | Heat conducting cream, and prepartion method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510036766 CN1916106A (en) | 2005-08-19 | 2005-08-19 | Heat conducting cream, and prepartion method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1916106A true CN1916106A (en) | 2007-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510036766 Pending CN1916106A (en) | 2005-08-19 | 2005-08-19 | Heat conducting cream, and prepartion method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002345A (en) * | 2009-09-02 | 2011-04-06 | 比亚迪股份有限公司 | Method for preparing heat-conducting ointment and heat-conducting ointment prepared thereby |
-
2005
- 2005-08-19 CN CN 200510036766 patent/CN1916106A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002345A (en) * | 2009-09-02 | 2011-04-06 | 比亚迪股份有限公司 | Method for preparing heat-conducting ointment and heat-conducting ointment prepared thereby |
| CN102002345B (en) * | 2009-09-02 | 2013-12-04 | 比亚迪股份有限公司 | Method for preparing heat-conducting ointment and heat-conducting ointment prepared thereby |
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