CN1908829A - Reflow soldering programming automatic management system and method - Google Patents
Reflow soldering programming automatic management system and method Download PDFInfo
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- CN1908829A CN1908829A CNA2005100362713A CN200510036271A CN1908829A CN 1908829 A CN1908829 A CN 1908829A CN A2005100362713 A CNA2005100362713 A CN A2005100362713A CN 200510036271 A CN200510036271 A CN 200510036271A CN 1908829 A CN1908829 A CN 1908829A
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Abstract
The automatic management system for reflow welding process comprises: a heat management system, a N2 management system, a cooling management system, and a control system connected with former systems by multimedia to start them and real-time monitor/manage. Besides, there are fast plotting function for temperature curve, automatic diagnosis system for cleaning flux, and an evaluation system on welding point reliability. This invention integrates ODE method and SPCD technology, and has well reliability.
Description
[technical field]
The present invention relates to a reflow welding programming automatic management system and a method, particularly a kind of reflow soldering programming automatic management system and method by multimedia computer control.
[background technology]
The reflow welding system of prior art comprises: technological processs such as temperature curve drafting, heat management system, nitrogen management system, cooling management system; But above-mentioned heat management system is not enough to temperature process window control accuracy, stages such as temperature curve is drawn, nitrogen management system and cooling management system all are by manually comparison or experience draws repeatedly, can there be very big difference in the manufacturing process parameter like this, and wastes time and energy.
[summary of the invention]
The purpose of reflow soldering programming automatic management system of the present invention and method is to avoid existing technical deficiency part and a kind of good reliability is provided, the reflow soldering programming automatic management system and the method for robotization control.
In order to reach described purpose, a kind of reflow soldering programming automatic management system and method, comprise heat management system, nitrogen management system, cooling management system, its said system is connected with a control system by multimedia, when entering reflow soldering programming, control system is opened said system and it is monitored in real time and manages.
Described heat management system is according to each heating module design temperature heating, behind temperature stabilization, enter real-time monitoring mode, system collects the reflow soldering process data automatically, output SPC chart and technological process control chart, be positioned at the guide rail both sides, the new data of thermal sensor collection of nearly top, PCB edge, and send back to the process data storehouse in relevant parameter compare processing, judge, if new sampled data does not match with the relevant parameter of making lane database, system carries out self-adaptation and regulates (PID), again according to the heating of each heating module design temperature, treat to enter real-time monitoring mode behind the temperature stabilization and will new SPC chart and the technological process control chart export; If the coupling of the relevant parameter in new sampled data and the process data storehouse, this system interval certain hour obtains data from thermal sensor again and compares processing, judges.
Described nitrogen management system detects actual oxygen content by oxygen analyzer, and compare with the oxygen content of setting in oxygen content value and product quality and the defective relational database, the standard oxygen content value all can be shown in the monitoring screen in real time with actual measurement oxygen content value.When the oxygen content value of the oxygen content value of being tested and oxygen content value and product quality and defective relational database was not complementary, nitrogen flow can be according to steering order, and the passing ratio variable valve is regulated automatically, realized robotization; If when the oxygen content value of oxygen content value of being tested and oxygen content value and product quality and defective relational database is not wanted to mate, enter regularly monitoring mode.Wherein, the engineer testing data that several lead-free solder pastes carry out the nitrogen protection reflow welding have been comprised in the process data storehouse in the computing machine; these data are analyzed test by the postwelding quality of welding spot being carried out outward appearance, interior tissue and structure, mechanical property and reliability etc., and use nitrogen protection zone of best oxygen content value, the best and oxygen content value and product quality and reflow welding connect the relation between the defective when drawing nitrogen protection.
Described cooling management system is at first according to setting the cooling temperature of circulating water refrigeration, temperature data (T0) when then extracting PCB and entering the cooling zone, calculate following variable according to setup parameter: PCB thermal capacitance (C) size and distribution thereof, circulation cooling air flow (Q), PCB be temperature (T1) when cooling zone hold-up time (t) and PCB go out the cooling zone, according to the controlled function F=F (C of above parameter, T0, T1, Q, t), thus obtain guide rail both sides, cooling zone thermal sensor temperature required (T).System compares from both sides, cooling zone sensor acquisition actual temperature and above-mentioned theory temperature required (T) in real time, if inconsistent, regulates the cool cycles cold water temperature; If consistent, carry out the real-time detection of next time period.Wherein above-mentioned steps cooling temperature of circulating water refrigeration realizes by the refrigeration plant of scalable circulating water temperature and the fan frequency conversion device of scalable cooling air flow.Wherein, the engineer testing data of several lead-free solder pastes under the different cooling speed and the different type of cooling have been comprised in the process data storehouse in the computing machine, these data are carried out outward appearance, interior tissue and structure by the postwelding solder joint is instructed, mechanical property and reliability etc. are analyzed test, draw the relation between best cooldown rate and the type of cooling and different cooling speed and the different type of cooling and product quality and the defective.
Described system comprises that also a temperature curve draws function fast, required soldering paste brand and model in the artificial calling technological parameter database of this function, to seek corresponding data from soldering paste technological parameter database, system will extract corresponding temperature curve parameter setting afterwards, back to be confirmed starts heating, realizes the fast temperature curve setting.
Described system comprises that also a scaling powder cleans diagnostic system automatically, and the cooldown rate data that this system utilizes above-mentioned cooling management system to monitor in real time analyze, judge whether to carry out the flux cleaning operation.
Described system also comprises a reliability assessment system, utilizes the real-time monitor data of oxygen content of above-mentioned nitrogen management system, the real-time monitor data of cooldown rate of cooling management system and the real-time monitor data of temperature of heat management system to carry out reliability assessment.
This system also comprises a test design (DOE) method, a statistics process control and an automatic diagnosis (SPCD).
Since above-mentioned by multimedia control system automatically the above-mentioned heat management system of control, nitrogen management system, cooling management system, temperature curve draw fast, flux cleaning auto-check system, welding spot reliability assessment system, test design (DOE) method, statistical Process Control and automatic diagnosis technological processs such as (SPCD), and realized a kind of good reliability, the reflow soldering programming automatic management system and the method for robotization control.
[description of drawings]
Below in conjunction with drawings and Examples effect of the present invention is further specified:
Fig. 1 is the general flow chart of reflow soldering programming automatic management system of the present invention and method;
Fig. 2 is the heat management system process flow diagram of reflow soldering programming automatic management system of the present invention and method;
Fig. 3 is the process flow diagram of the nitrogen management system of reflow soldering programming automatic management system of the present invention and method;
Fig. 4 is the process flow diagram of the cooling management system of reflow soldering programming automatic management system of the present invention and method;
Fig. 5 is the process flow diagram that the scaling powder of reflow soldering programming automatic management system of the present invention and method cleans diagnostic system automatically;
Fig. 6 is the process flow diagram of the welding spot reliability assessment system of reflow soldering programming automatic management system of the present invention and method;
Fig. 7 is the statistical Process Control of reflow soldering programming automatic management system of the present invention and method and the process flow diagram of automatic diagnosis (SPCD);
[embodiment]
Below in conjunction with description of drawings the preferred embodiments of the present invention.
Referring to Fig. 1, shown in embodiment wherein, reflow soldering programming automatic management system and method comprise: heat management system, nitrogen management system, cooling management system, wherein, said system is connected with a control system by multimedia, when entering reflow soldering programming, control system is opened said system and it is monitored in real time and manages.
The process flow diagram in each stage of reflow soldering programming automatic management system and method in Fig. 2 to Fig. 7 key diagram 1.
Fig. 2 is the process flow diagram of the heat management system of reflow soldering programming automatic management system of the present invention and method, as shown in Figure 2, after the total system among Fig. 1 starts, this heat management system is according to each heating module design temperature heating, behind temperature stabilization, enter real-time monitoring mode, and collect the reflow soldering process data automatically, export SPC chart and technological process control chart.Be subjected to the interference of some unpredictable factors in production run, furnace temperature changes, and the thermal sensor that is positioned at guide rail both sides, nearly top, PCB edge can send new sampled data back to and handle, judges with the relevant parameter of making lane database.If new sampled data does not match with the relevant parameter of making lane database, system carries out self-adaptation and regulates (PID), again according to the heating of each heating module design temperature, reach once more enter real-time monitoring mode behind the temperature stabilization and will new SPC chart and the technological process control chart export; If the coupling of the relevant parameter in new sampled data and the process data storehouse, this system interval certain hour obtains data from thermal sensor again and compares processing, judges.
Under the situation about exceeding standard for the process control Capability index, system can stopping alarm, prevent potential defective generation.In addition, heat management system also comprises an automation curve forecast function, helps the exploitation of user to the new technology process parameter.
When pcb board was come out of the stove, the data of every plank were refreshed and are preserved.Technical papers can be stored all data, curve, production data and alert event, and can indicate time and date, comprises the record that alarm takes place or confirms.All data are all for good and all recorded on the hard disk drive, and this makes the user to check process data from production data previously.
Heat management system can be eliminated the affirmation process of each turn-on temperature curve, and about 30min saves time; Product quality is prevented and monitored, ratio of defects is reached below the 34ppm, realize that zero-fault flows processing again, cause higher-quality welding and reliability, increased quality and benifit.
Fig. 3 is the process flow diagram of the nitrogen management system of reflow soldering programming automatic management system of the present invention and method; After entering this system's nitrogen input, the nitrogen flow meter is set carries out nitrogen flow control, the oxygen analyzer of the interior specific region of reflow welding stove this moment detects above-mentioned oxygen content, compare with the oxygen content of setting in oxygen content value and product quality and the defective relational database, and test result is shown on the screen of computing machine.Wherein, the engineer testing data that several lead-free solder pastes carry out the nitrogen protection reflow welding have been comprised in the process data storehouse in the computing machine; these data are analyzed test by the postwelding quality of welding spot being carried out outward appearance, interior tissue and structure, mechanical property and reliability etc., and use nitrogen protection zone of best oxygen content value, the best and oxygen content value and product quality and reflow welding connect the relation between the defective when drawing nitrogen protection.If when the oxygen content value of oxygen content value of being tested and oxygen content value and product quality and defective relational database is not complementary, the standard oxygen content value all can be shown in the monitoring screen in real time with actual measurement oxygen content value, and draw out oxygen content and time relation figure, and nitrogen flow can be according to steering order, the passing ratio variable valve is regulated automatically, realizes robotization; If during the oxygen content value of oxygen content value of being tested and oxygen content value and product quality and defective relational database coupling, enter regularly monitoring mode.
Wherein, the nitrogen flow meter is generally no longer regulated after the initialization according to demand, and the corresponding heating module of each variable valve is realized each module nitrogen flow is regulated separately, ratio adjusting valve is installed on the flowmeter input port, and source nitrogen pressure and flow are carried out Detection ﹠ Controling.
This nitrogen management system fully realizes the value of nitrogen, realizes value of the product to greatest extent with minimum nitrogen.Oxygen content value and product quality and defect database can prevent nitrogen misuse and the economic loss brought, and the automatic control of nitrogen flow closed loop can be saved the nitrogen use amount.
Fig. 4 is the process flow diagram of the cooling management system of reflow soldering programming automatic management system of the present invention and method; As shown in Figure 4, this system comprises the refrigeration plant of scalable circulating water temperature and the fan frequency conversion device of scalable cooling air flow, can satisfy the cooling rate demand of different process, realizes the adjusting of different cooling speed.Parameter-embedded database is to rely on engineer testing to set up, the one, the relational database between the different cooling speed that realizes under different refrigerating modes and the mode and solder joint mechanical property and the product quality, the 2nd, the relational database between PCB, belt speed and the setup parameter of actual cooldown rate and different thermal capacitances.At first according to setting the cooling temperature of circulating water refrigeration, temperature data (T0) when then extracting PCB and entering the cooling zone, calculate following variable according to setup parameter: PCB thermal capacitance (C) size and distribution thereof, circulation cooling air flow (Q), PCB is temperature (T1) when cooling zone hold-up time (t) and PCB go out the cooling zone, according to the controlled function F=F (C of above parameter, T0, T1, Q, t), thereby obtain guide rail both sides, cooling zone thermal sensor temperature required (T), obtain actual temperature from both sides, cooling zone sensor in real time simultaneously, temperature required (T) compares with above-mentioned theory, if inconsistent, regulate the refrigeration cycle cold water temperature by the refrigeration plant of scalable circulating water temperature and the fan frequency conversion device of scalable cooling air flow; If consistent, carry out the real-time detection of next time period.
Characteristic parameter by setting when the user uses, system will obtain a cooling zone set temperature value automatically, and strong cooperation temperature curve is drawn function fast.
The present invention can comprise that also a scaling powder cleans diagnostic system automatically, as shown in Figure 1, be connected with the cooling management system, Fig. 5 is the process flow diagram that the scaling powder of reflow soldering programming automatic management system of the present invention and method cleans diagnostic system automatically, as shown in Figure 5, this system comprises the thermal sensor that is positioned at guide rail both sides, cooling zone, and built-in cooldown rate process database, setting and corresponding cooling rate thereof that one unloaded standard is down arranged in this database, during System Operation, call above-mentioned diagnosis special process Parameter File, after no-load running was stable, thermal sensor was delivered to the chilling temperature of reality and is calculated an actual measurement cooling rate in the cooling rate process database, and compares with the standard configuration cooling rate, provide analysis report, whether decision needs to clean.
The flux cleaning auto-check system has solved effectively that untimely cleaning scaling powder pollutes and the cooling power decline problem brought, for cooling management system reliable operation provides strong guarantee.
Native system can comprise that also a temperature curve draws function fast, after system enters automated management system, can select temperature curve to draw function fast, required soldering paste brand and model in the artificial calling technological parameter database, to seek corresponding data from soldering paste technological parameter database, system will extract corresponding temperature curve parameter setting afterwards, and back to be confirmed starts heating, realizes the fast temperature curve setting.
Native system also can comprise a welding spot reliability assessment system, and as shown in Figure 6, this system mainly comprises a heating factor computational data storehouse.Enter this system, enter the valuation functions control panel, one calls the reliability assessment canonical function, and input product condition of work and expection service life obtain thermal reliability cycle index evaluation criterion in this function; Its two, enter failure mode analysis (FMA) (FMA), comprising: enter hot input quantity factor of influence mathematical model, call the temperature curve characteristic from above-mentioned heat management system, thereby calculate heating factor; Enter cooldown rate factor of influence mathematical model, from above-mentioned cooling management system call cooldown rate and solder joint mechanical performance data storehouse, the stress that produces thereby the prediction cooldown rate causes the PCB component heat not match is concentrated, thus the calculated stress concentration factor; Enter nitrogen protection factor of influence mathematical model; from above-mentioned nitrogen management system call oxygen content value and solder wetting database; the Solder Joint after thereby the prediction solder wetting changes; thereby calculate the Solder Joint factor; heating factor, fatiguestrength reduction factor and the Solder Joint factor that aforementioned calculation is gone out are input to valuation functions and obtain the thermal reliability cycle index; compare with the thermal reliability cycle index evaluation criterion that obtains in the one; meet the demonstration evaluation form, do not meet the different evaluation forms of same demonstration.
The welding spot reliability assessment system has solved numerous unfavorable factors of method for testing reliability, for marketization production provides an economical welding spot reliability guarantee system.
This system also comprises a test design (DOE) method, and it mainly is for operating personnel evaluate technology that described method is utilized 2k factorial design, cooperates welding spot reliability and the automatic diagnosis of reflow welding defective and sets up.
Fig. 7 is the statistical Process Control of reflow soldering programming automatic management system of the present invention and method and the process flow diagram of automatic diagnosis (SPCD), as shown in Figure 7, its flow process is: after entering system, fault effects (FEA) in producing is analyzed,, process data is extracted according to manually or automatically importing testing result, then diagnose, draw diagnosis report, but the above-mentioned technological parameter of one manual adjustments returns the FEA failure effect analysis (FEA); It is two by automatic control priority control function: F=F (n1, x1; N2 x2), and regulates technological parameter, returns the FEA failure effect analysis (FEA) again.Wherein formulate reflow welding defective automatic diagnosis database, comprise various defect map, generation reason and each influence factor priority, various defective solution.In the control chart for defectives spectrum the most frequently used a kind of be exactly Cause and Effect matrix, by the direct every kind of defect influence factor quantity and to the defect influence size as can be seen of Cause and Effect matrix, help operating personnel and auto-check system is controlled technology.Each influence factor contains three levels, and when regulating automatically, system regulates successively according to the priority size, till defective solves.Wherein, 2
kFactorial is designed for above-mentioned test design (DOE) method and evaluates technology, cooperates reflow welding defective automatic diagnosis etc., and it considers k numerous influence factors of every kind of defective.
And above-mentioned statistical Process Control and automatic diagnosis (SPCD) also combine with test design (DOE) method, the handled easily personnel study, analyze and conclude some new defectives, new problem that new technology, new material bring, editor's influence factor and solution database add in the defect diagonsis database.
Statistical Process Control and automatic diagnosis (SPCD) have solved weld defects and have produced reason and prevent this production difficult problem of measure, for marketization production provides favourable powerful technical support.
Because above-mentioned the above-mentioned heat management system of control, nitrogen management system, cooling management system, temperature curve are drawn function, flux cleaning auto-check system, welding spot reliability assessment system, test design (DOE) method, statistical Process Control and automatic diagnosis (SPCD) or the like technological process fast automatically by multimedia control system, and realized a kind of good reliability, the reflow soldering programming automatic management system and the method for robotization control.
Obviously, those skilled in the art can carry out various changes and modification to reflow soldering programming automatic management system of the present invention and method and not break away from the spirit and scope of the present invention, like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (12)
1. reflow soldering programming automatic management system and method, comprise heat management system, nitrogen management system, cooling management system, it is characterized in that: said system is connected with a control system by multimedia, when entering reflow soldering programming, control system is opened said system and it is monitored in real time and manages.
2. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: described heat management system is according to each heating module design temperature heating, behind temperature stabilization, enter real-time monitoring mode, system enters real-time monitor state, and collect the reflow soldering process data automatically, output SPC chart and technological process control chart, be positioned at the guide rail both sides, the new data of thermal sensor collection of nearly top, PCB edge, send back to the process data storehouse in relevant parameter compare processing, judge, if the relevant parameter in new sampled data and the process data storehouse does not match, system carries out self-adaptation and regulates, again according to the heating of each heating module design temperature, reach once more enter real-time monitoring mode behind the temperature stabilization and will new SPC chart and the technological process control chart export; If the coupling of the relevant parameter in new sampled data and the process data storehouse, this system interval certain hour obtains data from thermal sensor again and compares processing, judges.
3. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: described nitrogen management system detects above-mentioned oxygen content by oxygen analyzer, and compare with the oxygen content of setting in oxygen content value and product quality and the defective relational database, if when the oxygen content value of oxygen content value of being tested and oxygen content value and product quality and defective relational database is not complementary, nitrogen flow can be according to steering order, the passing ratio variable valve is regulated automatically, realizes robotization; If when the oxygen content value of oxygen content value of being tested and oxygen content value and product quality and defective relational database is not wanted to mate, enter regularly monitoring mode, wherein the standard oxygen content value all can be shown in the monitoring screen in real time with actual measurement oxygen content value.
4. according to claim 1 reflow soldering programming automatic management system and method; it is characterized in that: wherein; comprise several lead-free solder pastes in the process data storehouse in the computing machine and carried out nitrogen protection reflow soldering process test figure; these data are analyzed test by the postwelding quality of welding spot being carried out outward appearance, interior tissue and structure, mechanical property and reliability etc., and use nitrogen protection zone of best oxygen content value, the best and oxygen content value and product quality and reflow welding connect the relation between the defective when drawing nitrogen protection.
5. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: described cooling management system is at first according to setting the cooling temperature of circulating water refrigeration, temperature data T0 when then extracting PCB and entering the cooling zone, calculate following variable according to setup parameter: PCB thermal capacitance size and distribution thereof, circulation cooling air flow Q, PCB is temperature T 1 when cooling zone hold-up time t and PCB go out the cooling zone, according to the controlled function F=F (C of above parameter, T0, T1, Q, t), thereby obtain the temperature required T of guide rail both sides, cooling zone thermal sensor, system obtains actual temperature from both sides, cooling zone sensor in real time, temperature required T compares with above-mentioned theory, if inconsistent, regulates the circulating water temperature; If consistent, carry out the real-time detection of next time period.
6. according to claim 5 reflow soldering programming automatic management system and method, it is characterized in that: above-mentioned steps cooling temperature of circulating water refrigeration realizes by the refrigeration plant of scalable circulating water temperature and the fan frequency conversion device of scalable cooling air flow.
7. according to claim 5 reflow soldering programming automatic management system and method, it is characterized in that: wherein, comprised the reflow soldering process test figure that several lead-free solder pastes in the temperature curve drawing data storehouse carry out in the process data storehouse in the computing machine under different cooling speed and different cooling speed mode, these data are carried out outward appearance, interior tissue and structure by the postwelding solder joint is instructed, mechanical property and reliability etc. are analyzed test, draw the relation between best cooldown rate and the type of cooling and different cooling speed and the different type of cooling and product quality and the defective.
8. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: described system can comprise that also a temperature curve draws function fast, this function is by required soldering paste brand and model in the artificial calling technological parameter database, to seek corresponding data from soldering paste technological parameter lane database, system will extract corresponding temperature curve parameter setting afterwards, back to be confirmed starts heating, realizes the fast temperature curve setting.
9. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: described system comprises that also a scaling powder cleans diagnostic system automatically, the cooldown rate data that this system utilizes above-mentioned cooling management system to monitor are in real time analyzed, and judge whether to carry out the flux cleaning operation.
10. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: described system also comprises a welding spot reliability assessment system, utilizes the real-time monitor data of oxygen content of above-mentioned nitrogen management system, the real-time monitor data of cooldown rate of cooling management system and the real-time monitor data of temperature of heat management system to carry out reliability assessment.
11. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: this system also comprises a test design method, it mainly is for operating personnel evaluate technology that described method is utilized 2k factorial design, cooperates welding spot reliability and the automatic diagnosis of reflow welding defective and sets up.
12. according to claim 1 reflow soldering programming automatic management system and method, it is characterized in that: this system also comprises a statistics process control and an auto-check system, after entering described system, fault effects in producing is analyzed,, process data is extracted according to manually or automatically importing testing result, then diagnose, draw diagnosis report, but the above-mentioned technological parameter of one manual adjustments returns failure effect analysis (FEA); It is two by automatic control priority control function: F=F (n1, x1; N2 x2), and regulates technological parameter, returns failure effect analysis (FEA) again.
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| CNA2005100362713A CN1908829A (en) | 2005-08-04 | 2005-08-04 | Reflow soldering programming automatic management system and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN108176934A (en) * | 2016-08-23 | 2018-06-19 | 合肥国声电子通信有限责任公司 | A kind of control method of universal conversion integrating water route module |
| CN109343493A (en) * | 2018-11-09 | 2019-02-15 | 伟创力电子技术(苏州)有限公司 | Control system based on soldering paste detection device |
| CN111266686A (en) * | 2018-12-04 | 2020-06-12 | 西安中科恒境环保科技有限公司 | Intelligent control method and system for nitrogen reflow oven |
-
2005
- 2005-08-04 CN CNA2005100362713A patent/CN1908829A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103231139A (en) * | 2013-04-24 | 2013-08-07 | 无锡市崇安区科技创业服务中心 | Intelligent reflow soldering system |
| CN108176934A (en) * | 2016-08-23 | 2018-06-19 | 合肥国声电子通信有限责任公司 | A kind of control method of universal conversion integrating water route module |
| CN108176934B (en) * | 2016-08-23 | 2019-11-12 | 合肥国声电子通信有限责任公司 | A kind of control method of universal conversion integrating water route module |
| CN109343493A (en) * | 2018-11-09 | 2019-02-15 | 伟创力电子技术(苏州)有限公司 | Control system based on soldering paste detection device |
| CN111266686A (en) * | 2018-12-04 | 2020-06-12 | 西安中科恒境环保科技有限公司 | Intelligent control method and system for nitrogen reflow oven |
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