CN1905140A - Image sensor package, optical glass therefor and processing method - Google Patents
Image sensor package, optical glass therefor and processing method Download PDFInfo
- Publication number
- CN1905140A CN1905140A CNA2005100888606A CN200510088860A CN1905140A CN 1905140 A CN1905140 A CN 1905140A CN A2005100888606 A CNA2005100888606 A CN A2005100888606A CN 200510088860 A CN200510088860 A CN 200510088860A CN 1905140 A CN1905140 A CN 1905140A
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- CN
- China
- Prior art keywords
- optical glass
- image sensor
- matsurface
- sensor package
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention relates to image sensor packaging piece and its optical glass and processing method. The packaging piece includes chip carrier, annular bearing, sensor chip, and optical glass. It includes the following steps: processing grinding before cutting the whole optical glass into many monomers; forming many optical glass monomers with at least one brim rough surface to adhere on the sensor chip bearing to reduce thermal expansion coefficient difference, avoid delaminating caused by thermal stress, prevent moisture and impurity from invading to ensure sensor chip accepting optical signal capacity.
Description
Technical field
The invention relates to a kind of image sensor package and used optical glass and processing method thereof, particularly about a kind of optical glass, this optical glass processing method of image sensor chip encapsulation and image sensor semiconductor packaging part that constitutes by this optical glass of being used for.
Background technology
See also Fig. 1; traditional image sensor package (Image sensor package) is provided with annular support seat 11 on chip carrier 10; sensor chip (Sensor chip) 12 connect put on chip carrier 10 and be contained in this supporting base 11; electrically connect this sensor chip 12 and chip carrier 10 by bonding wire 13; capping optical glass 15 above this sensor chip 12 afterwards; this optical glass 15 is by adhesion coating 14 sticking putting on this supporting base 11; and seal up this sensor chip 12; protect this sensor chip 12 to avoid the pollution of external environment; can pass through this optical glass 15 for light simultaneously, by sensing area 120 acquisitions of this sensor chip 12.Like this, this image sensor package of finishing the structure dress can be incorporated into as on the printed circuit board (PCB) external device (ED)s such as (PCB), as various electronic products such as digital camera (DSC), digital camera (DV), optical mouse, mobile phone, Fingerprint Identification Units.The patent of relevant image sensor semiconductor packaging part is United States Patent (USP) the 6th, 353,257,6,384,472,6,740,967,6,268,231,6,285,064,6,603,183 etc. for example.
See also Fig. 2 A to Fig. 2 E, it shows in the above-mentioned conventional image sensor semiconductor package part, the method for making of the processing method of this optical glass and this image sensor semiconductor packaging part.At first with full wafer optical glass 25 sticking put by wafer central (wafer ring) 26 around adhesive tape 27 on (shown in Fig. 2 A and Fig. 2 B); Then this full wafer optical glass 25 is cut, form a plurality of optical glass monomers 250 (shown in Fig. 2 C); Afterwards these optical glass monomer 250 usefulness suction nozzles 28 are grasped (shown in Fig. 2 D), and be loaded with chip and be provided with on the chip carrier 20 of supporting base 21 by sticking the putting of adhesion coating 24, make this optical glass monomer 250 cover sensor chip 22, composing images sensor semiconductor packaging part (shown in Fig. 2 E).
For the light of guaranteeing image can effectively be captured by sensor chip by this optical glass, the light transmittance requirement of this optical glass is high, therefore upper and lower surface must be very tight, careful, smooth, therefore, when this optical glass was glued the supporting base of putting on this chip carrier, this adhesion coating promptly can't be put on supporting base for optical glass is effectively sticking; Add between this supporting base and this optical glass because of thermal coefficient of expansion (CTE) difference each other, be subjected to thermal stress effect generation delamination easily, and then cause moisture or impurity to invade, have a strong impact on the receiving ability of sensor chip, cause the reliability decrease of image sensor semiconductor packaging part light.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of image sensor package and used optical glass and processing method thereof, increases the adhesive force of optical glass and adhesion coating.
Another purpose of the present invention is to provide a kind of image sensor package and used optical glass and processing method thereof, reduces optical glass generation delamination problems.
A further object of the present invention is to provide a kind of image sensor package and used optical glass and processing method thereof, avoids moisture and impurity to intrude in the zone of optical glass capping.
For reaching above-mentioned and other purpose, the used optical glass processing method of image sensor package of the present invention comprises: full wafer optical glass is marked off many cutting paths in advance, for a plurality of optical glass monomers of follow-up formation; Form matsurface along this cutting path; And utilize cutting tool to cut along this cutting path, wherein the width that should grind matsurface forms the optical glass monomer that a plurality of at least one edge surface have matsurface greater than this cutting tool width.
By above-mentioned processing method, the present invention also provides a kind of image sensor package used optical glass, and this optical glass is formed with matsurface at its at least one edge surface, utilizes this matsurface and adhesion coating to produce good adhesion.
The present invention also provides a kind of image sensor package in addition, and this packaging part comprises: chip carrier; The annular support seat is located on this chip carrier; At least one sensor chip connects and puts on this chip carrier and be accommodated in this supporting base; And optical glass, connect and put on this supporting base and this sensor chip of capping, wherein at least one edge surface of this optical glass is formed with matsurface, and this optical glass connects with its edge surface by adhesion coating and puts on this supporting base.
In sum, image sensor package of the present invention and used optical glass and processing method thereof, before full wafer optical glass is cut into a plurality of optical glass monomers, earlier carry out grinding operation along cutting path, follow-up finish cutting operation after, form the optical glass monomer that a plurality of at least one edge surface have matsurface, for the engaging force of this optical glass monomer by this matsurface efficient hardening and adhesion coating, follow-up when this optical glass is utilized adhesion coating to connect to put on the supporting base of taking in sensor chip, minimizing is because of the difference of thermal coefficient of expansion between each assembly, the delamination problems that caused by the generation of thermal stress, can avoid simultaneously guaranteeing the ability of sensor chip receiving optical signals in the zone of moisture and impurity invasion optical glass institute capping.
Description of drawings
Fig. 1 is the generalized section of conventional images sensor package;
Fig. 2 A to Fig. 2 E is existing optical glass processing method and image sensor package method for making schematic diagram;
Fig. 3 A to Fig. 3 D is the optical glass processing method schematic diagram that the present invention is applied in image sensor package; And
Fig. 4 is the generalized section of image sensor package of the present invention.
Embodiment
Embodiment
Fig. 3 A to Fig. 3 D is the used optical glass processing method schematic diagram of image sensor package of the present invention.
As shown in Figure 3A, at first provide full wafer optical glass 35, and on this full wafer optical glass 35, mark off many cutting path S in advance, form a plurality of optical glass monomers behind the cutting operation for follow-up finishing.This full wafer optical glass 35 can glue put by 36 of wafer centrals (wafer ring) around adhesive tape (tape) 37 on.
Shown in Fig. 3 B, utilization is for example ground along this cutting path S for milling tools such as abrasive wheels, forms matsurface 351 on this optical glass cutting path surface.
Shown in Fig. 3 C, it is the generalized section of corresponding diagram 3B full wafer optical glass 35, and wherein the degree of depth of this grinding matsurface 351 is approximately 1 μ m to 10 μ m, be preferable with 5 μ m, and the width of this grinding matsurface 351 is about 0.5mm to 2mm.
Shown in Fig. 3 D, utilize cutting tool to cut along this cutting path S, wherein should grind the width of the width of matsurface 351, after cutting operation is finished, form the optical glass monomer 350 that a plurality of at least one edge surface have matsurface 351 greater than this cutting tool.
It should be noted that in addition the milling tool and the cutting tool that use among the present invention can be incorporated in the same device, when the default cutting path on these full wafer optical glass 35 surfaces carries out grinding operation, can follow cutting operation, in order to quicken processing procedure.
By above-mentioned processing method, the present invention also provides the used optical glass monomer 350 of a kind of image sensor package (shown in Fig. 3 D), this optical glass monomer 350 is formed with matsurface 351 at its at least one edge surface, utilizes this matsurface 351 to produce good adhesion with adhesion coating.
Fig. 4 is an image sensor package generalized section of the present invention.As shown in the figure, this image sensor package comprises: chip carrier 40, annular support seat 41, sensor chip 42 and optical glass 450.Wherein, this annular support seat 41 is located on this chip carrier 40; This at least one sensor chip 42 connects to be put on this chip carrier 40 and is accommodated in this supporting base 41; This optical glass 450 connects to be put on this supporting base 41 and this sensor chip 42 of capping.Wherein at least one edge surface of this optical glass 450 is formed with matsurface 451, utilizes this matsurface 451 effectively to connect by adhesion coating 44 for this optical glass 450 and puts on this supporting base 41.
Wherein, this sensor chip 42 has active surface and relative non-active surface, and the active surface of this sensor chip 42 is provided with sensing area 420, and this sensor chip 42 is to connect with its non-active surface correspondence to put on this chip carrier 40, and is electrically connected to this chip carrier 40 by bonding wire 43; This supporting base 41 can be made of substrate or resin material.
Therefore, image sensor package of the present invention and used optical glass and processing method thereof, before full wafer optical glass is cut into a plurality of optical glass monomers, earlier carry out grinding operation along cutting path, follow-up finish cutting operation after, form the optical glass monomer that a plurality of at least one edge surface have matsurface, this optical glass monomer is by the engaging force of this matsurface efficient hardening and adhesion coating, follow-up when this optical glass is utilized adhesion coating to connect to put on the supporting base of taking in sensor chip, minimizing is because of the difference of thermal coefficient of expansion between each assembly, the delamination problems that cause is caused by the effect of thermal stress, simultaneously can avoid moisture and impurity to intrude in the zone of optical glass institute capping, guarantee that sensor chip receives the ability of light signal.
Claims (14)
1. optical glass processing method that image sensor package is used is characterized in that this method comprises:
Full wafer optical glass is marked off many cutting paths in advance;
Form matsurface along this cutting path; And
Utilize cutting tool to cut along this cutting path, wherein the width that should grind matsurface forms the optical glass monomer that a plurality of at least one edge surface have matsurface greater than this cutting tool width.
2. the optical glass processing method that image sensor package as claimed in claim 1 is used is characterized in that, the matsurface on this cutting path is that to utilize milling tool to grind formed.
3. the optical glass processing method that image sensor package as claimed in claim 2 is used is characterized in that, this milling tool can be incorporated in the same device with cutting tool, quickens processing procedure.
4. the optical glass processing method that image sensor package as claimed in claim 1 is used is characterized in that, the matsurface degree of depth on this cutting path is 1 μ m to 10 μ m.
5. the optical glass processing method that image sensor package as claimed in claim 1 is used is characterized in that, the matsurface degree of depth on this cutting path is good with 5 μ m.
6. the optical glass processing method that image sensor package as claimed in claim 1 is used is characterized in that, the matsurface width on this cutting path is 0.5mm to 2mm.
7. the optical glass processing method that image sensor package as claimed in claim 1 is used is characterized in that, this full wafer optical glass connect put by wafer central around adhesive tape on.
8. the optical glass that image sensor package is used is characterized in that, this optical glass is formed with matsurface at its at least one edge surface, utilizes this matsurface and adhesion coating to produce good adhesion.
9. the used optical glass of image sensor package as claimed in claim 8 is characterized in that, this matsurface degree of depth is 1 μ m to 10 μ m.
10. the used optical glass of image sensor package as claimed in claim 8 is characterized in that this matsurface degree of depth is good with 5 μ m.
11. an image sensor package is characterized in that, this packaging part comprises:
Chip carrier;
The annular support seat is located on this chip carrier;
At least one sensor chip connects and puts on this chip carrier and be accommodated in this supporting base; And
Optical glass connects and puts on this supporting base and this sensor chip of capping, and wherein at least one edge surface of this optical glass is formed with matsurface, and this optical glass connects with its edge surface by adhesion coating and puts on this supporting base.
12. image sensor package as claimed in claim 11 is characterized in that, this matsurface degree of depth is 1 μ m to 10 μ m.
13. image sensor package as claimed in claim 11 is characterized in that, this matsurface degree of depth is good with 5 μ m.
14. image sensor package as claimed in claim 11, it is characterized in that, this sensor chip has active surface and relative non-active surface, and the active surface of this sensor chip is provided with sensing area, this sensor chip is to connect with its non-active surface correspondence to put on this substrate, and is electrically connected to this chip carrier by bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100888606A CN1905140A (en) | 2005-07-29 | 2005-07-29 | Image sensor package, optical glass therefor and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100888606A CN1905140A (en) | 2005-07-29 | 2005-07-29 | Image sensor package, optical glass therefor and processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1905140A true CN1905140A (en) | 2007-01-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100888606A Pending CN1905140A (en) | 2005-07-29 | 2005-07-29 | Image sensor package, optical glass therefor and processing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN1905140A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8048708B2 (en) | 2008-06-25 | 2011-11-01 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
| CN102399052A (en) * | 2010-09-15 | 2012-04-04 | 利科光学股份有限公司 | Toughened glass cutting method with preset path |
| CN101807528B (en) * | 2008-12-24 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Techniques for glass attachment in image sensor package |
| CN105451466A (en) * | 2014-09-23 | 2016-03-30 | 罗伯特·博世有限公司 | Electronic module and manufacturing method thereof |
| CN106102340A (en) * | 2015-04-29 | 2016-11-09 | 巴伦电子有限公司 | Utilize many die stacks method of printed circuit board (PCB) and utilize its semiconductor package part |
-
2005
- 2005-07-29 CN CNA2005100888606A patent/CN1905140A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8048708B2 (en) | 2008-06-25 | 2011-11-01 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
| US8680634B2 (en) | 2008-06-25 | 2014-03-25 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
| CN101807528B (en) * | 2008-12-24 | 2015-09-30 | 南昌欧菲光电技术有限公司 | Techniques for glass attachment in image sensor package |
| CN102399052A (en) * | 2010-09-15 | 2012-04-04 | 利科光学股份有限公司 | Toughened glass cutting method with preset path |
| CN105451466A (en) * | 2014-09-23 | 2016-03-30 | 罗伯特·博世有限公司 | Electronic module and manufacturing method thereof |
| CN105451466B (en) * | 2014-09-23 | 2019-07-09 | 罗伯特·博世有限公司 | Electronic module and affiliated manufacturing method |
| CN106102340A (en) * | 2015-04-29 | 2016-11-09 | 巴伦电子有限公司 | Utilize many die stacks method of printed circuit board (PCB) and utilize its semiconductor package part |
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