CN1901296A - Connecting element and circuit connecting device using the connecting element - Google Patents

Abstract

To provide a connection element and a circuit connection device using the same capable of positioning and mounting the connection element provided with an elastic contact to a circuit member in high accuracy. A flexible base plate 11 is wound around a supporting body 2 of the connection element 1, and flexible contacts 15, 16 are formed on the flexible base plate 11. A positioning hole 7 is formed on the supporting body 2. A first positioning part 30 is positioned and soldered on a metal layer 24 formed on a mother base plate 21, and a second positioning part 40 is positioned and soldered on a metal layer 27 formed on an electronic part 22. The positioning hole 7 of the connection element 1 is inserted through the first positioning part 30, and the first positioning part 30 is fitted to the second positioning part 40 in jagged form. By this, the connection element 1 is positioned by the mother base plate 21 and the electronic part 22.

Description

Connection Element and the circuit connecting mechanism that has used above-mentioned Connection Element

Technical field

The present invention relates to have the Connection Element of a plurality of elastic contacts that are connected with the conducting portion of circuit substrate and circuit blocks such as IC assembly, and the circuit connecting mechanism that above-mentioned Connection Element is connected with the foregoing circuit positioning parts.

Background technology

In following patent documentation 1, the face that discloses an a kind of side of substrate shape supporting mass is provided with a plurality of helical form elastic contacts, is provided with on the face of opposite side and the above-mentioned elastic contact Connection Element of a plurality of fixed contacts of conducting one to one.

The described fixed contact of above-mentioned Connection Element, be formed on main substrate on the state that is connected of a plurality of conducting portions under, the spherical splicing ear that makes the IC assembly is by on the above-mentioned elastic contact that is pressed in Connection Element.And, by Connection Element, make the conducting portion conducting respectively of the above-mentioned spherical splicing ear and the main substrate of IC module.

This invention, owing to the spherical splicing ear of IC assembly is pushed by the elastic contact elasticity of above-mentioned Connection Element and is formed connection, so, can carry out the IC replacement of component.

[patent documentation 1] spy opens 2002-175859 communique (corresponding USP6517362)

State in the use under the situation of the Connection Element that patent documentation 1 put down in writing, each conducting portion that needs to be arranged on each fixed contact in the Connection Element and main substrate carries out the correct location of man-to-man relation, and splicing ear is fixed on the main substrate.In addition, under situation about the IC assembly being arranged on the Connection Element, need carry out the location of IC assembly in that the spherical terminal that is arranged on the IC assembly is formed under the corresponding one to one state with the elastic contact of Connection Element.

In patent documentation 1, following structure is disclosed, promptly be provided with the holding member that keeps the IC assembly from both sides at main substrate, utilize this holding member that the IC assembly is positioned and keep.But, clearly be not documented in the structure of the substrate shape supporting mass of the element that is located by connecting on the main substrate.In the sort circuit jockey,, need relative main substrate carry out high-precision positioning and fixing to Connection Element in order to make the terminal that is arranged on the IC assembly and the correctly corresponding conducting of conducting portion on being arranged on main substrate.

In addition, even will be installed in the optional position of main substrate at the Connection Element that upper and lower surface has a terminal constituting, IC assembly etc. is installed in the above, and, also need to make the relative main substrate of Connection Element to carry out high-precision located and fixed by under the situation of Connection Element with the structure of conductings such as main substrate and IC assembly.But, development along with the densification of the miniaturization of parts and circuit, the contact size that is arranged in the Connection Element is more and more littler, and, the configuration density of contact is also more and more higher, therefore, for the location of splicing ear, a plurality of contacts that more and more are difficult to reach Connection Element and a plurality of conducting portions of main substrate are relative degree accurately.

Summary of the invention

The present invention for solve above-mentioned in the past problem and propose, its purpose is, circuit blocks such as a kind of circuit substrate relatively or IC assembly are provided and, elastic contact are correctly located and Connection Element that disposes and the circuit connecting mechanism that has used this Connection Element as the circuit block of other electronic devices.

Connection Element of the present invention comprises: has and connects with the supporting mass of opposed faces and be arranged on a plurality of elastic contacts of described opposed faces,

In the zone that described elastic contact is not set of described supporting mass, be formed with hole or the recess or the projection of location usefulness.

Connection Element of the present invention since on the supporting mass of supporting elastic contact direct integrally formed hole, recess or projection, so, can be benchmark with this hole, recess or projection, on the circuit block of circuit substrate, IC assembly etc., carry out the location of Connection Element.Based on this location, can make each elastic contact correctly opposed with the conducting portion that is arranged on the circuit block.

According to the present invention, described opposed faces be arranged on described supporting mass on each face of opposition side, the opposed faces of one side is provided with the 1st group of elastic contact, and the opposed faces of opposite side is provided with the 2nd group of elastic contact, the 1st group of elastic contact and the 2nd group of elastic contact conducting.

Based on above-mentioned structure, the wiring pattern that on the face of a side of flexible base, board, is formed with the 1st group of elastic contact and the 2nd elastic contact and makes the 1st group of elastic contact and the 2nd group of elastic contact conducting, described flexible base, board is fixed on the described supporting mass by bending, make the 1st group of elastic contact be positioned on the opposed faces of a side, the 2nd group of elastic contact is positioned on the opposed faces of opposite side.

Perhaps, according to the present invention, described opposed faces be arranged on described supporting mass on each face of opposition side, the opposed faces of a side is provided with a plurality of elastic contacts, the opposed faces of opposite side is provided with a plurality of fixed contacts, described elastic contact and described fixed contact conducting.

Based on above-mentioned structure, on the face of a side of flexible base, board, be formed with a plurality of elastic contacts and a plurality of fixed contact and make a plurality of elastic contacts and the wiring pattern of a plurality of fixed contact conductings, described flexible base, board is fixed on the described supporting mass by bending, make elastic contact be positioned on the opposed faces of a side, fixed contact is positioned on the opposed faces of opposite side.

The Connection Element of above-mentioned structure is owing to can use 1 piece of flexible base, board to dispose the elastic contact and the fixed contact of mutual conduction respectively on 2 opposed faces of supporting mass, so but simplified construction.

The present invention preferably is provided with the detent mechanism of described flexible base, board positioning and fixing on described supporting mass.

By by detent mechanism with the flexible base, board positioning and fixing on supporting mass, can determine to be arranged on location on the supporting mass accurately with the relative position of hole or recess or projection and elastic contact and fixed contact.

Circuit connecting mechanism of the present invention is characterized in that, has any one above-mentioned Connection Element and locatees the positioning element of this Connection Element,

Described positioning element can be installed on the circuit block with the conductive part that connects described elastic contact.

And, by described positioning element and described supporting mass is concavo-convex chimeric, come described relatively circuit block to locate described Connection Element.

Therefore, above-mentioned positioning element is to be embedded into the above-mentioned location that is arranged on the above-mentioned supporting mass with the parts in the hole or be embedded into the parts that are arranged on the above-mentioned projection on the above-mentioned supporting mass.

For example, circuit connecting mechanism of the present invention is characterized in that, have above-mentioned Connection Element and locate the 1st positioning element and the 2nd positioning element of this Connection Element,

On described supporting mass, be formed with the location hole that embeds described the 1st positioning element or the 2nd positioning element, the 1st positioning element and the 2nd positioning element can be concavo-convex chimeric, the 1st positioning element can be installed on the 1st circuit block with the conducting portion that connects the 1st group of elastic contact, and the 2nd positioning element can be installed on the 2nd circuit block with the conducting portion that connects the 2nd group of elastic contact.

Perhaps, circuit connecting mechanism of the present invention is characterized in that, have above-mentioned Connection Element and locate the 1st positioning element and the 2nd positioning element of this Connection Element,

On described supporting mass, be formed with the location hole that embeds described the 1st positioning element or the 2nd positioning element, the 1st positioning element and the 2nd positioning element can be concavo-convex chimeric, the 1st positioning element can be installed on the 1st circuit block with the conducting portion that connects described elastic contact, and the 2nd positioning element can be installed on the 2nd circuit block with the conducting portion that connects described fixed contact.

The foregoing circuit jockey is owing to have chimeric the 1st positioning element and the 2nd positioning element mutually, so, utilize these two positioning elements and the location hole that is formed on the supporting mass, can distinguish the such mutual opposed circuit block of relative circuit substrate and IC assembly, correctly carry out the location of Connection Element.

In addition, circuit connecting mechanism of the present invention, preferably on described circuit block, be formed with the metal level of location usefulness, described positioning element is welded on the described metal level by soldering, described Connection Element is installed on the described circuit block by the location of described positioning element, perhaps, preferably on the 1st circuit block and the 2nd circuit block, be formed with the metal level of location usefulness respectively, the 1st positioning element is welded on the described metal level of the 1st circuit block by soldering, the 2nd positioning element is welded on the described metal level of the 2nd circuit block by soldering, the 1st positioning element and the 2nd positioning element are chimeric mutually, between the 1st circuit block and the 2nd circuit block, the described Connection Element of location and installation.

Such structure can be fixed on positioning element on the circuit block by the soldering operation, thereby can be simply and constitute the structure of the element that is located by connecting accurately.

In this case, the described metal level of preferred described conducting portion and location usefulness is by same metal material, adopts identical technology to form.

If form conducting portion and the metal level that is arranged on the circuit block with identical technology, then can determine the relative position of conducting portion and metal level accurately, as a result, can determine to be welded on the positioning element on the metal level and the relative position relation of conducting portion accurately.

And, in the present invention, preferably in described positioning element, be provided with fixed base, this fixed base is width dimensions opposed and have regulation on this opposed direction across the inner space, described circuit block is provided with partition distance on described opposed direction and the described metal level with Rack that forms, described fixed base contacts with described metal level, and described fixed base and described metal level are welded by soldering.

As mentioned above, by mutual opposed fixed base is set on positioning element, and partition distance on circuit substrate and the metal level of the Rack that contacts with each fixed base face is set, when the metal level that devices spaced apart is formed and fixed base are welded, utilize the surface tension of the scolder of molten condition, make positioning element be positioned at devices spaced apart easily and on the opposed center of the metal level that disposes.That is, with on single metal level, make opposed each fixed base face contact, the fixing means that welds is compared, and can bring into play the locating effect based on surface of molten solder tension force effectively.

Positioning element of the present invention, as explanation in the back, fixed base is not limited to form colyliform, also positioning element can be bent into コ word shape, the fixed base of specific length is formed across the inner space of positioning element and opposed shape.

In this case, between the outer rim of preferred metal layers between the distance on the described opposed direction is more than or equal to the outer rim of described fixed base the distance on described opposed direction, between the inner edge of metal level between the distance on the described opposed direction is smaller or equal to the inner edge of described fixed base the distance on described opposed direction.

But also can make between the outer rim of metal level distance in described opposed direction more than or equal to the distance between the outer rim of described fixed base in described opposed direction, make between the inner edge of metal level distance in described opposed direction more than or equal to the inner edge of described fixed base between in the distance of described opposed direction.

And, between the outer rim of preferred described metal level the distance of described opposed direction, and the outer rim of described fixed base between poor in the distance of described opposed direction, more than or equal to 0mm smaller or equal to 0.3mm, between the inner edge of described metal level the distance of described opposed direction, and the inner edge of described fixed base between poor in the distance of described opposed direction, more than or equal to 0mm smaller or equal to 0.3mm.

In addition, preferred implementation of the present invention is, described positioning element be provided with colyliform be formed at the inner space around, and has a fixed base of Rack size, described circuit block is provided with the described metal level with Rack that forms colyliform, described fixed base contacts with described metal level, and described fixed base and described metal level are welded by soldering.

In this case, also the outer peripheral edges diameter of preferred described metal level is more than or equal to the outer peripheral edges diameter of described fixed base, and the inner peripheral diameter of metal level is smaller or equal to the inner peripheral diameter of described fixed base.

But also can make the outer peripheral edges diameter of the outer peripheral edges diameter of described metal level, make the inner peripheral diameter of the inner peripheral diameter of metal level more than or equal to described fixed base more than or equal to described fixed base.

In above-mentioned, the outer peripheral edges diameter of preferred described metal level and the outer peripheral edges diameter of described fixed base poor, more than or equal to 0mm and smaller or equal to 0.3mm, the inner peripheral diameter of described metal level and the inner peripheral diameter of described fixed base poor is more than or equal to 0mm and smaller or equal to 0.3mm.

In addition, above-mentioned positioning element is that the full-size between the outer rim of for example fixed base or the diameter dimension of outer peripheral edges are below the 5mm, and quality is the following lightweight component of 1g, preferably above-mentioned being of a size of below the 3mm, and quality is the following lightweight component of 0.5g.

The present invention can will have the Connection Element of a plurality of elastic contacts or have the Connection Element of a plurality of elastic contacts and a plurality of fixed contacts, be oppositely arranged on the conducting portion on the circuit blocks such as circuit substrate, IC assembly and other electronic devices, carry out location and installation correctly.

And, can be in the process that the positioning element soldering is welded on the metal level that is arranged at circuit block, with the positioning element assigned position of positioning and fixing on circuit block accurately, and can constitute and use this positioning element, circuit block correctly positions Connection Element relatively.

Description of drawings

Fig. 1 is the exploded perspective view of the Connection Element of expression the present invention the 1st execution mode.

Fig. 2 (A) is the vertical view that constitutes the supporting mass of Connection Element, (B) is the front view of supporting mass.

Fig. 3 is the stereogram of employed brace in the Connection Element.

Fig. 4 is the local amplification stereogram of above-mentioned brace.

Fig. 5 is the stereogram of expression positioning element and circuit block.

Fig. 6 is the profile of the circuit connecting mechanism of the 1st execution mode.

Fig. 7 is the profile of the circuit connecting mechanism of the present invention's the 2nd execution mode.

Fig. 8 is the stereogram of brace of the Connection Element of expression the present invention the 3rd execution mode.

Fig. 9 is the local amplification stereogram of the brace of the 3rd execution mode.

Figure 10 is the profile of the circuit connecting mechanism of the 3rd execution mode.

Figure 11 (A) is the amplification plan view of the 1st positioning element, (B) is its enlarged side view.

Figure 12 (A) is the profile of the 1st positioning element, (B) is the vertical view of metal level.

Figure 13 is the vertical view of self-calibration function of the relative metal level of explanation the 1st positioning element.

Figure 14 is the amplification profile at the junction surface of the fixed base of the 1st positioning element and metal level, (A) expression the 1st positioning element fixing state that misplaced, (B) state that is positioned of expression the 1st positioning element.

The curve chart of the self-calibration function when Figure 15 is expression welding the 1st positioning element.

The curve chart of the self-calibration function when Figure 16 is expression welding the 1st positioning element.

The curve chart of the self-calibration function when Figure 17 is expression welding the 1st positioning element.

Figure 18 is the exploded perspective view of the circuit connecting mechanism of the present invention's the 4th execution mode.

Figure 19 is the exploded perspective view of the circuit connecting mechanism of the present invention's the 5th execution mode.

Among the figure: the 1-Connection Element; The 2-supporting mass; 3-substrate maintaining part; 3a-the 1st opposed faces; 3b-the 2nd opposed faces; 3c-installs the side; The 3d-dorsal surface; The 4-installation portion; The 6-location division; The 7-location hole; The 10-brace; The 11-flexible base, board; The 1st group of elastic contact of 12-; The 2nd group of elastic contact of 13-; The 14-wiring pattern; 15,16-elastic contact; The 20-circuit connecting mechanism; 21-is as the main substrate of circuit block; 22-is as the electronic device of circuit block; The 23-conducting portion; The 24-metal level; The 26-conducting portion; The 27-metal level; 30-the 1st positioning element; The 32-location division; The 33-embedded hole; The 35-inner space; 36-is provided with face; The 37-outer peripheral edges; The 38-chamfered section; The 39-inner peripheral; 40-the 2nd positioning element; The 42-mosaic process; The 120-circuit connecting mechanism; The 124-metal level; The 124a-outer peripheral edges; The 124b-inner peripheral; 50-the 2nd positioning element; The 201-Connection Element; 212-elastic contact group; 213-fixed contact group; The 216-fixed contact; The 220-circuit connecting mechanism; The 230-positioning element; The 320-circuit connecting mechanism; The 301-Connection Element; 307,308-locator protrusions; The 420-circuit connecting mechanism; The 401-Connection Element; The 408-locator protrusions.

Embodiment

Fig. 1 is the exploded perspective view of the Connection Element of expression the present invention the 1st execution mode, Fig. 2 (A) is arranged on the vertical view of the supporting mass on the Connection Element, Fig. 2 (B) is the front view of supporting mass, Fig. 3 will be installed in the stereogram of the brace planar development in the Connection Element, and Fig. 4 is the local amplification stereogram of above-mentioned brace.

Connection Element 1 shown in Figure 1 is defined as: the Y direction is a length direction, and directions X is a Width, and the Z direction is a thickness direction.Below, the size of length direction is called linear foot cun, the size of Width is called width dimensions, the size on the thickness direction is called gauge.

This Connection Element 1 has supporting mass 2.Shown in Fig. 1 and Fig. 2 (A), (B), this supporting mass 2 is linear foot cun elongate shape bigger than width dimensions, and is gauge than little tabular of width dimensions.Supporting mass 2 is formed by the synthetic resin material, can be as for example liquid crystal polymer resin etc., and by the size that can determine various piece accurately, and coefficient of linear expansion is little, and the resin material that the dimensional variations that corresponding temperature changes is little forms.In addition, supporting mass 2 can be formed by polyvinyl resin, polyacetal resin and polyimide resin etc., can also be formed by the elastomer resin of elastically deformable.

Supporting mass 2 has substrate maintaining part 3.Substrate maintaining part 3 has: towards plane the 1st opposed faces 3a of the upside of Z direction with towards plane the 2nd opposed faces 3b of the downside of Z direction.The 1st opposed faces 3a and the 2nd opposed faces 3b be respectively towards mutually opposite direction up and down, and be parallel to each other.In addition, the 1st opposed faces 3a and the 2nd opposed faces 3b are formed towards the Z direction flexure plane of convex curvature slightly.

Substrate maintaining part 3 has the installation side 3c that above-mentioned the 1st opposed faces 3a is connected with the 2nd opposed faces 3b both sides.Side 3c is installed is and the 1st opposed faces 3a and the vertical plane of the 2nd opposed faces 3b both sides, or slightly is the flexure plane of convex towards directions X.The dorsal surface 3d relative with side 3c is installed is and the 1st opposed faces 3a and the vertical plane of the 2nd opposed faces 3b both sides.

Supporting mass 2 has formed installation portion 4,4 on the both ends of the length direction of aforesaid substrate maintaining part 3.Shown in Fig. 2 (B), the gauge t2 of installation portion 4,4 is littler than the gauge t1 of substrate maintaining part 3, is formed with end difference 5 at the both ends of substrate maintaining part 3 and the interface of each installation portion 4.By forming this end difference 5, make the top 4a of installation portion 4 form the low single order of the 1st opposed faces 3a than substrate maintaining part 3, the following 4b of installation portion 4 forms the low single order of the 2nd opposed faces 3b than substrate maintaining part 3.Therefore, as shown in Figure 6, after the 1st positioning element 30 that will illustrate later and the 2nd positioning element 40 and installation portion 4 combinations, constituting these positioning elements 30,40 can be near the top 4a and the following 4b of installation portion 4, at this moment, the 1st opposed faces 3a of substrate maintaining part 3 and the 2nd opposed faces 3b and 30,40 mutually noninterferes of above-mentioned positioning element.

Shown in Fig. 1 and Fig. 2 (A), front side portion 4c, the 4c of above-mentioned installation portion 4,4 is forwards more outstanding than the installation side 3c of substrate maintaining part 3, is formed with on this ledge from 3c forwards outstanding location division 6,6 in side is installed.This location division 6,6 is the plane, its above-mentioned relatively the 1st opposed faces 3a and the 2nd opposed faces 3b and the face vertical extent separately that side 3c is installed, and mutual opposed location division 6 is parallel to each other with location division 6.

On each installation portion 4, be formed with location hole 7.This supporting mass 2 is to form by the injection moulding operation of injecting synthetic resin in metal die, can determine the relative position size of various piece with the machining accuracy of metal die accurately.Therefore, can control the internal diameter size of each location hole 7 accurately.And, also can determine relative position, the center line O1 and relative position that side 3c is installed and the relative position of center line O1 and dorsal surface 3d of relative position, center line O1 and the 1st opposed faces 3a and the 2nd opposed faces 3b of the center line O1 of location hole 7 and location division 6 accurately.

As shown in Figure 1, brace 10 with by the state of warpage accurately positioning and fixing on aforesaid substrate maintaining part 3.As shown in Figure 3, brace 10 has rectangle flexible base, board 11, is formed with the 1st group of elastic contact 12 and the 2nd group of elastic contact 13 and will constitutes a plurality of elastic contacts 15 of the 1st group of elastic contact 12 and the corresponding one to one wiring pattern 14 that is connected of a plurality of elastic contacts 16 that constitute the 2nd group of elastic contact 13 on the surperficial 11a of flexible base, board 11.

Fig. 4 amplifies a part of having represented above-mentioned flexible base, board 11 and the part of elastic contact 15, elastic contact 16 and wiring pattern 14.

Flexible base, board 11 is formed by the electrical insulating property synthetic resin thin plate of polyimide resin etc. or non-conductive sheet metal or nonmetal thin plate.Be formed on the elastic contact 15 on the flexible base, board 11 surperficial 11a, its fixed part 15a is fixed on the above-mentioned surperficial 11a, and has the helical form strain 15b of portion that extends from this fixed part 15a one.The 15b of strain portion is not fixed on the surperficial 11a of flexible base, board 11, and forms along with near spiral central part 15c, the three-dimensional shape that leaves gradually from surperficial 11a.Elastic contact 16 is same with elastic contact 15, has fixed part 16a, the helical form strain 16b of portion and spiral central part 16c, and forms the three-dimensional shape that rises from the surperficial 11a of flexible base, board 11.

In execution mode shown in Figure 4, because each elastic contact 16 of each elastic contact 15 of the 1st group of elastic contact 12 of formation, the 2nd group of elastic contact 13 of formation forms with identical pattern, so, can adopt identical technology to form the 1st group of elastic contact 12 and the 2nd group of elastic contact 13.Therefore, for the relative position of each elastic contact 15 that constitutes the 1st group of elastic contact 12 and each elastic contact 16 that constitutes the 2nd group of elastic contact 13, also can form operation and determine accurately by film.

Wherein, also can with constitute each elastic contact 15 of the 1st group of elastic contact 12, the hand of spiral that constitutes each elastic contact 16 of the 2nd group of elastic contact 13 is arranged to antispin direction.

Above-mentioned elastic contact 15 and elastic contact 16 have conductivity, and can bring into play elastic force, by for example nickel (Ni), nickel-phosphorus alloy elastomeric elements such as (Ni-P) and copper, silver or golden constant resistance than the complex of little conductive metal and form.Elastic contact 15 and elastic contact 16 can perhaps form by metallic plate is carried out punching press by carrying out etching and form being formed on metallic film on the flexible base, board 11 surperficial 11a.Perhaps can also form by plating technic at the surperficial 11a of flexible base, board 11.

Making elastic contact 15 and elastic contact 16 wiring pattern 14 of conducting one to one, is the figure that is formed than little metal material by the Copper Foil constant resistance.

The length dimension L1 of brace 10 is identical with the opposed interval L2 of location division 6 shown in Fig. 2 (A) and location division 6, and perhaps L2 is smaller at interval than this.Above-mentioned length dimension L1 and above-mentioned opposed interval L2's is poor, is set in the desired margin of tolerance in location of elastic contact 15,16.

The width dimensions W1 of brace 10 forms with the width dimensions of the width dimensions of the 1st opposed faces 3a, the 2nd opposed faces 3b and that the aggregate value of width dimensions of side 3c is installed is identical, perhaps smaller than this aggregate value.Above-mentioned width dimensions W1 and above-mentioned aggregate value poor is set in the desired margin of tolerance in location of elastic contact 15,16.

As shown in Figure 1, brace 10 is configured to be wound on the substrate maintaining part 3 of supporting mass 2.Brace 10 is installed into its 1st group of elastic contact 12 and is positioned at the surface of the 1st opposed faces 3a of substrate maintaining part 3, the surface that its 2nd group of elastic contact 13 is positioned at the 2nd opposed faces 3b of substrate maintaining part 3, and the zone between the 1st group of elastic contact 12 and the 2nd group of elastic contact 13 contacts with the installation side 3c of substrate maintaining part 3.And, utilize bonding agent that the back side and the substrate maintaining part 3 of the flexible base, board 11 of brace 10 is fixing.

By wiring pattern 14 one to one the configuration relation of elastic contact 15 and the elastic contact 16 of corresponding conducting be: under brace 10 is installed in state on the supporting mass 2, with the elastic contact 16 of elastic contact 15 conductings just in time be positioned at this elastic contact 15 under.

Brace 10 is fixed to location division 6,6 butts of its 2 minor face 10a, 10a and supporting mass 2 on supporting mass 2.Thus, brace 10 relative supporting masses 2 are positioned on longitudinal direction (Y direction).In addition, brace 10 is fixed on substrate maintaining part 3: the long limit 10b of a side of brace 10 is consistent with the edge part 3e that the 1st opposed faces 3a that becomes substrate maintaining part 3 and dorsal surface 3d have a common boundary, and the long limit 10c of opposite side is consistent with the edge part that becomes the 2nd opposed faces 3b and dorsal surface 3d boundary.Thus, brace 10 relative supporting masses 2 are positioned on Width (directions X).

By above-mentioned localization method, feasible each elastic contact 16 that is positioned at each elastic contact 15 of the 1st group of elastic contact 12 of formation on the 1st opposed faces 3a and constitutes the 2nd group of elastic contact 13, with the relative position of the center line O1 of above-mentioned location hole 7,7, the both sides of longitudinal direction (Y direction) and Width (directions X) by hi-Fix.

Therefore, this Connection Element 1 is by being that benchmark is arranged in the various circuit blocks with location hole 7,7, can make the conductive part that is arranged in the circuit block and elastic contact 15 and elastic contact 16 opposed mutually under by the state of hi-Fix.

Fig. 5 is that expression constitutes the 1st positioning element the 30, the 2nd positioning element 40 of the circuit connecting mechanism 20 used above-mentioned Connection Element 1 and via the exploded perspective view of Connection Element 1 interconnective circuit block.Wherein, not shown Connection Element 1 in Fig. 5.Fig. 6 is the part sectioned view of the state after 20 assemblings of indication circuit jockey.

Lateral circuit parts that connect by Connection Element 1 are main substrates (circuit substrate) 21, and the opposite side circuit block is IC assembly or other electronic units 22.On the surface of main substrate 21, be formed with each elastic contact 16 opposed a plurality of conducting portions (terminal pad) 23 with the 2nd group of elastic contact 13 that constitutes above-mentioned Connection Element 1.And, on the surface of main substrate 21, be formed with the metal level 24 of locating usefulness.Conductive part 23 and metal level 24 are formed by conductive metal such as Copper Foils.Conductive part 23 adopts identical operation to form with metal level 24.This operation can adopt by implementing the method that etching forms to evenly being formed at metal film such as main substrate 21 lip-deep Copper Foils, and perhaps the method for type metal film waits and realizes on the surface of main substrate 21.Corresponding with a plurality of elastic contacts 16 of the 2nd group of elastic contact 13 that constitutes Connection Element 1, be provided with the above-mentioned conducting portion 23 of equal number, a pair of location hole 7 of corresponding respectively Connection Element 1 and a pair of above-mentioned metal level 24 is set.

Owing to adopt same technology to form each conductive part 23 and metal level 24, so the relative position of conductive part 23 and metal level 24 is determined accurately in the margin of tolerance of above-mentioned technology.

Above-mentioned electronic unit 22 with 21 opposed of main substrates on, be formed with and each elastic contact 15 opposed a plurality of conductive parts (terminal pad) 26 of the 1st group of elastic contact 12 that constitutes Connection Element 1 and the metal level 27 of location usefulness.Because this conductive part 26 and metal level 27 also are to adopt same technology to form, so its relative position is determined by high accuracy.Corresponding with a plurality of elastic contacts 15 of the 1st group of elastic contact 12 of formation of Connection Element 1, the above-mentioned conducting portion 26 of equal number is set, and a pair of location hole 7 of corresponding respectively Connection Element 1 is provided with a pair of above-mentioned metal level 27.

As shown in Figure 5 and Figure 6, on the metal level 24 that is arranged at the main substrate 21 that becomes lateral circuit parts, be fixed with the 1st positioning element 30 by soldering (based on the engaging force of motlten metal).The 1st positioning element 30 is formed by the such easy strain such as phosphor bronze and the metal material that can carry out soldering, and as shown in Figure 6, its inside is the cavity.

The 1st positioning element 30 is provided with the fixed base 31 of colyliform, and the outer peripheral edges diameter dimension of this fixed base 31 is roughly consistent with the diameter dimension of the above-mentioned metal level 24 that forms circular pattern.On the top of said fixing base portion 31, be formed with the location division 32 of drum.The outside dimension of this location division 32 is roughly consistent with the internal diameter size of the location hole 7 of above-mentioned Connection Element 1, perhaps forms more smallerly than the internal diameter size of location hole 7.The outside dimension of location division 32 than the little situation of the internal diameter size of location hole 7 under, its poor δ 1 in footpath (with reference to Fig. 6) is set in the margin of tolerance, so that each elastic contact 15 can be opposed mutually with each conducting portion 23 with each conducting portion 26 and each elastic contact 16.

Upper surface at the 1st positioning element 30 connects the embedded hole 33 that is formed with circle.And, on above-mentioned upper surface, be formed with 3 places and above-mentioned embedded hole 33 continuously and with the cut-out portion 34 of radial extension.By forming this cut-out portion 34, the circumference that can make embedded hole 33 is strain up and down.The center of curvature of above-mentioned embedded hole 33 is consistent with the center of curvature of said fixing base portion 31.

On the above-mentioned metal level 27 that is arranged at the electronic unit 22 that becomes the opposite side circuit block, be fixed with the 2nd positioning element 40 by soldering (based on the engaging force of motlten metal).The 2nd positioning element 40 by phosphor bronze etc. easily strain and the metal material that can carry out soldering form, its section shape is as shown in Figure 6.

On the 2nd positioning element 40, be provided with the discoid fixed base 41 that has the hole at the center, the outer peripheral edges diameter dimension of this fixed base 41 is roughly consistent with the diameter dimension of the above-mentioned metal level 27 that forms circular pattern.Central part place in fixed base 41 has formed fitting projection 42 downwards.The axle center of fitting projection 42 is consistent with the center of curvature of said fixing base portion 41.The front end of above-mentioned fitting projection 42 forms roughly sphere, and the outside dimension of fitting projection 42 forms more smallerly than the internal diameter size of the embedded hole 33 of above-mentioned the 1st positioning element 30.When in the embedded hole 33 of this fitting projection 42 being forced insert the 1st positioning element 30, the 1st positioning element 30 and the 2nd positioning element 40 consistent coaxial with being assembled into mutual a nothings deviation.

Below, the assembling sequence of foregoing circuit jockey 20 is described.

Be coated at the braze slurry that reflow soldering is used under the state on the metal level 24 of above-mentioned main substrate 21, utilize the installation of automatic installation apparatus to attract head absorption to keep the 1st positioning element 30, and utilize this installation to attract head that the 1st positioning element 30 is installed on the metal level 24.Then, carry out heating process,, the 1st positioning element 30 is fixed on the metal level 24 by making the braze slurry fusion.Because in automatic installation apparatus, by to be formed on the coordinate calibration control that telltale mark on the main substrate 21 is a benchmark, decide the installation site of the 1st positioning element 30, so, the 1st positioning element 30 by hi-Fix, be fixed on the surface of main substrate 21.

Even situation about misplacing has appearred in the 1st positioning element of supposing to be installed on the metal level 24 that is coated with braze slurry 30, in heating process during the braze slurry fusion, based on surface of molten solder tension force, also can bring into play the axle center that makes the 1st positioning element 30 and reach the consistent self-calibration function of high accuracy with the center of metal level 24.

The 2nd positioning element 40 is by automatic installation procedure same as described above and reflow soldering operation and be fixed on the metal level 27 by soldering.At this moment, also be based on the positioning accuracy and the surface of molten solder tension force of automatic installation apparatus, make the axle center of the 2nd positioning element 40 consistent, 40 solderings of the 2nd positioning element are fixed on the metal level 27 with metal level 27 high accuracy.

As shown in Figure 6, Connection Element 1 is set at the surface of main substrate 21.At this moment, lead on the periphery of each location division 32 of a pair of the 1st positioning element 30 that is fixed in main substrate 21, Connection Element 1 is positioned on the main substrate 21 by a pair of location hole 7 of Connection Element 1 is inserted respectively.As mentioned above, in main substrate 21, each conducting portion 23 is determined by high accuracy with the relative position of metal level 24, the result, and the relative position of each conducting portion 23 and the 1st positioning element 30 is determined by high accuracy.And in Connection Element 1, each elastic contact 16 that constitutes the 2nd group of elastic contact 13 is determined by high accuracy with the relative position of the center line O1 of location hole 7.Therefore, even each elastic contact 16 is little, and the closeness height of elastic contact 16, also can make each elastic contact 16 and the corresponding one to one contact of each conducting portion 23.

Then, electronic unit 22 is installed on the main substrate 21, at this moment, a pair of the 2nd positioning element 40 fitting projection 42 separately that is fixed on the electronic unit 22 is embedded in the embedded hole 33 of the 1st positioning element 30.Because fitting projection 42 seamlessly is embedded in the embedded hole 33, so, can make the center of center and the metal level 27 of electronic unit 22 of metal level 24 of main substrate 21 consistent coaxial.

In electronic unit 22, each conducting portion 26 is determined by high accuracy with the relative position of metal level 27; In Connection Element 1, each elastic contact 15 that constitutes the 1st group of elastic contact 12 and the center line O1 of location hole 7 are by hi-Fix.Therefore, under the chimeric state of the 1st positioning element 30 and the 2nd positioning element 40, each conducting portion of each elastic contact 15 of the 1st group of elastic contact 12 of the formation of Connection Element 1 and electronic unit 22 26 is correct opposed and contact.

As shown in Figure 6, across Connection Element 1 and under the mutual opposed state, if electronic unit 22 is pushed to main substrate 21, then elastic contact 16 deforms, it is connected at main substrate 21 and electronic unit 22 effectively with the conducting portion 23 of main substrate 21; Strain takes place in elastic contact 15, and it is connected conscientiously with the conducting portion 26 of electronic unit 22.Be under the state of strain at elastic contact 15 and elastic contact 16, electronic unit 22 and main substrate 21 are interfixed by the press fit maintaining body or by screw or method such as bonding by not shown.

As shown in Figure 6, be pressed against on the main substrate 21 at electronic unit 22, elastic contact 15 and elastic contact 16 are out of shape to greatest extent, under the state to conducting portion 23 and conducting portion 26 effect sufficient elasticity pressing forces, on the installation portion 4 of Connection Element 1, form small gap delta 2 between the fixed base 41 of 4a and the 2nd positioning element 40.That is, have under the concavo-convex chimeric state of above-mentioned gap delta 2 at the 1st positioning element 30 and the 2nd positioning element 40, elastic contact 15 and elastic contact 16 can be guaranteed the sufficient elasticity deformed region.

Fig. 7 is the figure of the circuit connecting mechanism 120 of expression the present invention the 2nd execution mode, is the part sectioned view suitable with Fig. 6.

This circuit connecting mechanism 120, except the 2nd positioning element 40 of its 2nd positioning element 50 and the 1st execution mode was different, other structures were identical with the 1st execution mode.

Employed the 2nd positioning element 50 has in the circuit connecting mechanism 120 of the 2nd execution mode: rounded and can carry out the discoid fixed base 51 of metallic of soldering and embedding the central part of this fixed base 51 by plastic fitting projection 52, on this fitting projection 52, be formed with grooving 52a from the front end position that partways.On the other hand, the 1st positioning element 30 end thereon is formed with embedded hole 33, in this case, also cut-out portion 34 can be set.The outside dimension of the fitting projection 52 of the 2nd positioning element 50 forms to such an extent that be slightly larger than the internal diameter size of the embedded hole 33 of the 1st positioning element 30.

The fixed base 51 of the 2nd positioning element 50 is fixed on the metal level 27 of electronic device 22 by the reflow soldering operation.As shown in Figure 7, owing on the fitting projection 52 that is arranged at the 2nd positioning element 50, be formed with grooving 52a, so, under the state that its diameter shrinks, can be inserted in the embedded hole 33 of the 1st positioning element 30, after the insertion, fitting projection 52 is gapless chimeric with embedded hole 33 formation, and thus, the 1st positioning element 30 and the 2nd positioning element 50 can be located on coaxial.

Fig. 8 to Figure 10 represents the 3rd execution mode of the present invention.Fig. 8 is mounted in the stereogram of the brace 210 in the Connection Element 201 of the 3rd execution mode, and Fig. 9 is its local amplification stereogram.Figure 10 is the part sectioned view of the circuit connecting mechanism 220 of expression the 3rd execution mode.

In Figure 10, though show the part of Connection Element 201, the supporting mass shown in the supporting mass 2 that constitutes this Connection Element 201 and Fig. 1 and Fig. 2 (A), (B) is identical.Be installed in the brace 210 on this supporting mass 2, have the flexible base, board 11 identical with brace shown in Figure 3 10.The length dimension of flexible base, board 11 is that L1, width dimensions are W1, and the relation of these sizes and the size of supporting mass 2 is identical with the 1st execution mode shown in Figure 1.

As shown in Figure 8, in brace 210, the surperficial 11a of flexible base, board 11 is provided with elastic contact group 212.This elastic contact group 212 is carried out systematicness with a plurality of elastic contacts 15 and is arranged, and this elastic contact 15 has the structure identical with the elastic contact 15 of brace shown in Figure 4 10.In brace 210, the surperficial 11a of flexible base, board 11 is provided with fixed contact group 213, and this fixed contact group 213 is arranged a plurality of fixed contact 216 systematicness ground.As shown in Figure 9, each fixed contact 216 forms protuberance based on solder pad or plating pad etc., and strain does not take place in fact.

And elastic contact 15 and fixed contact 216 are in corresponding one to one mode, by wiring pattern 14 conductings.

Same with Connection Element 1 shown in Figure 1, in Connection Element 201, brace 210 is fixed on the supporting mass 2.Brace 210 is reeled to be fixed on the supporting mass 2, and above-mentioned elastic contact group 212 is positioned on the surface of the 1st opposed faces 3a of substrate maintaining part 3 of supporting mass 2, and said fixing contact group 213 is positioned on the surface of the 2nd opposed faces 3b of substrate maintaining part 3.The location structure of brace 210 relative supporting masses 2 is identical with the Connection Element 1 of the 1st execution mode.

In this Connection Element 201, with the fixed contact 216 of elastic contact 15 conductings, just in time be in this elastic contact 15 of being positioned at the 1st opposed faces 3a under.

As shown in figure 10, in the circuit connecting mechanism 220 of the 3rd execution mode, on main substrate 21, be formed with a plurality of conducting portions 23 corresponding with each fixed contact 216 of said fixing contact group 213.In the Connection Element 201, each fixed contact 216 is oriented to each conducting portion 23 opposed, and fixed contact 216 is fixed on the conducting portion 23 by soldering.The location of the Connection Element 201 on the main substrate 21 of this moment can be installed to this Connection Element 201 on the main substrate 21 automatically by utilizing automatic installation apparatus, and adopts reflow soldering operation welding conducting portion 23 and fixed contact 216 to realize.Perhaps also can use anchor clamps that Connection Element 201 is positioned on the main substrate 21, weld fixing then.

In electronic device 22, same with Fig. 5, form a plurality of conducting portions 26 and circular metal level 27 by identical technology.And positioning element 230 automatically is installed on the above-mentioned metal level 27 by automatic installation apparatus, and with behind positioning element 230 and metal level 27 location, carries out soldering and fix.

Positioning element 230 is and the identical parts of the 1st positioning element 30 shown in Figure 5, or does not form the parts of embedded hole 33 and cut-out portion 34 in the 1st positioning element 30.

When being installed in electronic device 22 on the main substrate 21, the positioning element 230 that is fixed on the electronic device 22 is embedded in the location hole 7 of the Connection Element 201 that is fixed on the main substrate 21.Thus, can make each elastic contact 15 of Connection Element 201 opposed one to one with the conducting portion 26 of electronic device 22.Therefore, be fixed on the main substrate 21 by electronic device 22 is pushed, lip-deep each elastic contact 15 of the 1st opposed faces 3a that is arranged on Connection Element 201 is connected on each conducting portion 26 by the elasticity pressure.

Below, for the preferred fixture construction that Fig. 5 carries out hi-Fix and soldering to the 1st positioning element 30 relative main substrates 21 shown in Figure 7 can being described.

Figure 11 (A) is the vertical view that amplifies above-mentioned the 1st positioning element 30 of expression, and Figure 11 (B) is its end view.Figure 12 (A) is the profile of the 1st positioning element 30, and Figure 12 (B) is arranged on the vertical view of main substrate 21 lip-deep metal levels 124.This metal level 124 replaces Fig. 5 is formed on main substrate 21 to metal level 24 shown in Figure 7 surface.Figure 13 is the vertical view of the self-calibration function of explanation the 1st positioning element 30 when metal level 124 is by arranged in dislocation relatively.Figure 14 (A), (B) are the figure of the identical self-calibration function of explanation, are the amplification profiles of the soldering portion of the 1st positioning element 30 and metal level 124.

The 1st positioning element 30 shown in Figure 11 (A), (B) and Figure 12 (A) as illustrated in the 1st execution mode, is that leaf spring materials such as phosphor bronze sheet about 0.03～0.3mm form by thickness, and in this execution mode, thickness is 0.1mm.The 1st positioning element 30 is formed with fixed base 31 and has the drum location division 32 of the inner space 35 in cavity in the inboard, is formed with embedded hole 33 in the upper end of this location division 32.In addition, in the 1st positioning element 30 shown in Figure 11 (A), (B) and Figure 12 (A), do not form cut-out portion 34 shown in Figure 5.

Shown in Figure 11 (A), the flat shape of fixed base 31 is to be formed with the 31a of colyliform portion, 31a on the opposed position, the left and right sides across above-mentioned inner space 35.The 31a of colyliform portion, 31a form with certain width dimensions along being the arc track at center with center line O1.The angular range, theta of the relative center line O1 of the 31a of left and right sides colyliform portion, 31a is spent smaller or equal to 180 more than or equal to 90 degree respectively, but in the present embodiment, above-mentioned angular range, theta is 120 degree.

In fixed base 31, on the part beyond the above-mentioned colyliform 31a of portion, the 31a, be provided with from outer rim to center position with 4 notch 31b of concavity breach be sandwiched in projection piece 31c, the 31c of notch 31b, 31b.With 30 solderings of the 1st positioning element on metal level 124 time, the 31a of colyliform portion, 31a are to the big self calibration power of relative directive effect.Therefore, on main substrate 21, preferably the 1st positioning element 30 is mounted to, makes the relative direction of the above-mentioned colyliform 31a of portion, 31a, towards the Y direction of the length direction that becomes Connection Element 1 shown in Figure 1.Perhaps, also can be mounted to and make the relative direction of the 31a of colyliform portion, 31a towards directions X, in a pair of the 1st positioning element 30 that embeds in a pair of location hole 7,7 of Connection Element 1 one can also be mounted to make the above-mentioned colyliform 31a of portion, 31a relative direction towards the Y direction, with another be mounted to make the above-mentioned colyliform 31a of portion, 31a relative direction towards directions X.

Among Figure 12 (A) and Figure 14 (A), (B), show the above-mentioned colyliform 31a of portion of fixed base 31, the concrete structure of 31a.Below the above-mentioned colyliform 31a of portion, 31a, be formed with the plane face that is provided with 36.In addition, outer peripheral edges 37 and above-mentioned the setting between the face 36 of the 31a of colyliform portion, 31a, what stride across the 31a of colyliform portion, 31a is formed with chamfered section 38 full week.The volume of the excision of this chamfered section 38 is very little, chamfered section 38 is " C0.05 ", that is, and and in profile, to eat the width of 0.05mm (50 μ m) into and to eat into to short transverse from face 36 is set that the height of 0.05mm (50 μ m) carries out chamfering to center line O1 direction from outer peripheral edges 37.

In the interior perimembranous of the 31a of colyliform portion, 31a, be formed with towards the location division that 32 inner peripheral surface erects, the curve part 30R that radius ratio is bigger.Therefore, in the present embodiment, suppose, the cross part of this horizontal line L a and above-mentioned curve part 30R inner peripheral 39 as the 31a of colyliform portion, 31a by outer peripheral edges 37 horizontal line L a with the point of interface of chamfered section 38.In addition, removing under the bigger situation of volume ratio of above-mentioned chamfered section 38, that is, and the C of chamfered section 38 greater than 0.05 situation under, above-mentioned the outer peripheral edges that face 36 and the interface of chamfered section 38 can become the 31a of colyliform portion, 31a are set.

The 1st positioning element 30 is that the diameter D1 of outer peripheral edges 37 is below the 5mm, and quality is the following lightweight component of 1g, and preferably above-mentioned diameter D1 is below the 3mm, and quality is the following lightweight component of 0.5g.In the present embodiment, the diameter D1 of outer peripheral edges 37 is 2.0mm, and the diameter of inner peripheral 39 is 1.5mm.Therefore, outer peripheral edges 37 are 0.25mm with the width dimensions of inner peripheral 39.

Being formed on main substrate 21 lip-deep metal levels 124 as mentioned above, is to adopt the technology identical with the conductive part 23 shown in Fig. 5 waits and pattern formation, and its flat shape is a colyliform.Constitute below the 31a of colyliform portion of the fixed base 31 of the 1st positioning element 30 and can carry out face with the surface of metal level 124 and contact.

The outer peripheral edges 124a of metal level 124 and inner peripheral 124b are to be the concentric circles of the center of curvature with center O a.The diameter Da of outer peripheral edges 124a is identical or bigger than above-mentioned diameter D1 with the diameter D1 of the outer peripheral edges 37 of the 31a of colyliform portion of the 1st positioning element 30.Under the situation of diameter Da greater than diameter D1, the difference of preferred diameter Da and diameter D1 and is more preferably 0.05～0.15mm below 0.3mm.In the present embodiment, the difference of diameter Da and diameter D1 is 0.1mm.Thus, when the center line O1 of the 1st positioning element 30 was consistent with the center O a of metal level 124, the outer peripheral edges 124a of metal level 124 was set to the outer peripheral edges 37 outstanding 0.05mm (50 μ m) from the 1st positioning element 30.

The diameter D2 of the diameter Db of the inner peripheral 124b of metal level 124 and the outer peripheral edges 39 of the 31a of colyliform portion of the 1st positioning element 30 is identical or diameter group D2 is little.Under the situation of diameter Db less than diameter D2, the difference of preferred diameter Db and diameter D2 is below 0.3mm, and 0.05～0.15mm more preferably.In the present embodiment, above-mentioned diameter Db equates with above-mentioned diameter D2.

By metal level 124 being formed the colyliform that has notch 124c at central part, and on the metal level 124 of the Rack of this colyliform, make the 31a of colyliform portion, the contact of 31a face of the 1st positioning element 30, and carry out soldering, utilize surface of molten solder tension force, can bring into play self-calibration function effectively, thereby make the center line O1 of the 1st positioning element 30 consistent with the center O a of metal level 124.Therefore, the diameter Da of outer peripheral edges 124a that preferably possesses metal level 124 greater than the diameter Db of the inner peripheral 124b of the diameter D1 of the outer peripheral edges 37 of the 1st positioning element 30 and metal level 124 less than in these two conditions of diameter D2 of the inner peripheral 39 of the 1st positioning element 30 at least one.In addition, under the situation of the diameter Da of outer peripheral edges 124a greater than the diameter D1 of outer peripheral edges 37, the diameter Db of inner peripheral 124b also can be slightly larger than the diameter D2 of inner peripheral 39.

Below, above-mentioned calibration function is elaborated.

For the 1st positioning element 30 is installed on the main substrate 21, have in the surface applied of colyliform metal level 124 under the state of the braze slurry that reflow soldering uses, utilize the installation adsorption head absorption of automatic installation apparatus to keep the 1st positioning element 30, and the 1st positioning element 30 is installed on the metal level 124 by this installation adsorption head.Then, make the braze slurry fusion by heating process, and then, cool off and make solder solidification.In Figure 14 (A), (B), symbol 150 expression is heated and is in the fusion welding of molten condition.

In Figure 13, represent normal axis by the center O a of metal level 124 with Y0 and X0.Among Figure 13, the first half more than axle Y0, left is to the state of dislocation in figure to represent to be installed into its position by the 1st positioning element 30, and the latter half below axle Y0 is represented the state of having finished the location that the center line O1 of the 1st positioning element 30 is consistent with the center O a of metal level 124.In addition, in Figure 13, for convenience of explanation, it all is the diagram of the 31a of colyliform portion that the fixed base 31 of the 1st positioning element 30 was shown on its full week.Figure 14 (A) expression the 1st positioning element 30 is installed into its position, and left is to the state of dislocation in figure, and Figure 14 (B) expression is oriented to the center line O1 state consistent with the center O a of metal level 124 of the 1st positioning element 30.

Shown in the first half and Figure 14 (A) of Figure 13, if the 1st positioning element 30 in figure left to dislocation, right side in the drawings then, can between the outer peripheral edges 37 of the outer peripheral edges 124a of metal level 124 and the 31a of colyliform portion of the 1st positioning element 30, the formation greatest width dimension be the accumulation portion in the scolder bight of Wa, and left side in the drawings, can be between the inner peripheral 39 of the inner peripheral 124b of metal level 124 and the 31a of colyliform portion, the formation greatest width dimension is the accumulation portion in the scolder bight of Wb.

In common fitting machine, the maximum position departure when being installed in the 1st positioning element 30 on the main substrate 21 is about 0.05mm (50 μ m).Therefore, in the present embodiment, under the situation that the 1st positioning element 30 is mounted with the maximum position deviation, the width dimensions Wa of accumulation portion in the scolder bight on right side is 0.1mm, and the inner peripheral 39 on colyliform portion 31a right side is than the close central side of the right side inner peripheral 124b of metal level 124.And the width dimensions Wb of accumulation portion in the scolder bight in left side is 0.05mm, and in the left side, the outer peripheral edges 37 of the 31a of colyliform portion are roughly consistent with the outer peripheral edges 124a of metal level 124.

Therefore, shown in Figure 14 (A), surface tension based on the fusion welding 150 of the accumulation portion that is positioned at scolder bight, right side, the 1st positioning element 30 is produced the directed force F a that it is moved to right, based on the surface tension of the fusion welding 150 of the accumulation portion in scolder bight on the left of being positioned at, the 1st positioning element 30 is produced the directed force F b that it is moved to right.Under the effect of above-mentioned power Fa, Fb, the 1st positioning element 30 moves to right.Shown in Figure 14 (B), when the center line O1 of the 1st positioning element 30 consistent with the center O a of metal level 124, when perhaps roughly consistent, the outside surface tension F1 that acts on the outer peripheral edges 37 of the 31a of colyliform portion reaches balance with the surface tension F2 to center position that acts on inner peripheral 39.When having reached this poised state, fusion welding 150 curing that is cooled, thereby with the center O a place of the 1st positioning element 30 positioning and fixing at metal level 124.

By notch part 124c is set on metal level 124, and each metal level 124 across the opposed Rack of this notch part 124c is contacted with the 31a of the colyliform portion face of the Rack of the 1st positioning element 30, bring into play above-mentioned high accuracy self-calibration function.For example, as shown in Figure 5, if use rounded and do not have the circular metal layer 124 of notch part in inside, then shown in Figure 14 (A), when arranged in dislocation during the 1st positioning element 30, in the middle of the left and right sides colyliform 31a of portion, 31a, can form the accumulation portion in large-area scolder bight, the result, its surface tension is greater than the power Fa on right side, and the power Fb on the left of can not producing.Therefore, compare the situation of having used toroidal metal level 24 shown in Figure 5, used 124 of colyliform metal levels that have a notch part 124c at central portion can bring into play high self-calibration function.

Figure 15, Figure 16, Figure 17 represent to measure the diameter of inner peripheral 124b of colyliform metal level 124 and the line chart as a result of the relation between the self-calibration function.

Employed the 1st positioning element 30 in mensuration, as mentioned above, the diameter of outer peripheral edges 37 is made as 2.0mm, and the diameter of inner peripheral 39 is made as 1.5mm.With the fixed diameter of the outer peripheral edges 124a of metal level 124 is 2.1mm, makes the vary in diameter of inner peripheral 124b.Among Figure 15 to Figure 17, transverse axis is represented the diameter of inner peripheral 124b, the longitudinal axis represent from the 1st positioning element 30 arranged in dislocation till the solder solidification during, the distance (calibrator quantity) that the center line O1 of the 1st positioning element 30 is moved.Measurement result when Figure 15 represents the center line O1 of the 1st positioning element 30 intentionally installed from the center O a dislocation 0.07mm (70 μ m) of metal level 124.Figure 16 is the measurement result when making the magnitude of misalignment of center line O1 be 0.1mm (100 μ m), and Figure 17 is the measurement result when making the magnitude of misalignment of center line O1 be 0.12mm (120 μ m).

From the measurement result of Figure 15 to Figure 17, can find out, no matter under any circumstance, as long as the difference of the diameter Db of the inner peripheral 124b of the diameter D2 of the inner peripheral 39 of the 1st positioning element 30 and metal level 124 can be brought into play self-calibration function in 0.3mm.In addition, if the difference of above-mentioned diameter in 0.2mm, then can further improve self-calibration function, if the difference of above-mentioned diameter is zero, promptly diameter D2 is consistent with diameter Db, then can further improve self-calibration function.And, even the position offset of the 1st positioning element 30 increases to the degree of 0.12mm, also can bring into play this self-calibration function.

Therefore, the diameter D2 of the diameter Db of the inner peripheral 124b of metal level 124 and the inner peripheral 39 of the 31a of colyliform portion of the 1st positioning element 30 is identical or diameter group D2 is little, under the situation of diameter Db less than diameter D2, the difference of preferred diameter Db and diameter D2 is more preferably 0.05～0.15mm below 0.3mm.

On the other hand, the diameter Da of outer peripheral edges 124a is identical or bigger than above-mentioned diameter D1 with the diameter D1 of the outer peripheral edges 37 of the 31a of colyliform portion of the 1st positioning element 30, under the situation of diameter Da greater than diameter D1, the difference of preferred diameter Da and diameter D1 is more preferably 0.05～0.15mm below 0.3mm.

In addition, more than, be illustrated at the 1st positioning element 30, but the 2nd positioning element 40 shown in Figure 6 and positioning element 230 shown in Figure 10 also have identical construction.

Perhaps, even be not cylindric at positioning element but form コ word shape, and across a pair of parts of the fixed base opposite disposed of inner space and Rack, and have in certain arranged spaced of being separated by on the main substrate 21 under the situation of corresponding with each fixed base respectively strip metal layer, also can bring into play self-calibration function.

Figure 18 is the exploded perspective view of the circuit connecting mechanism 320 of expression the present invention the 4th execution mode.

Connection Element 301 is provided with a plurality of elastic contacts 15 that constitute the 1st group of elastic contact on substrate shape supporting mass 303, below supporting mass 303, be provided with a plurality of elastic contacts that constitute the 2nd group of elastic contact, the top elastic contact 15 and the following elastic contact mutual conduction of supporting mass 303, and, on supporting mass 303, form outstanding upward locator protrusions 307 and outstanding locator protrusions 308 downwards.

As circuit block, have the 1st circuit substrate 321 and the 2nd circuit substrate 322.On the 1st circuit substrate 321, be provided be arranged on Connection Element 301 below the corresponding a plurality of conducting portions 323 of each elastic contact, below the 2nd circuit substrate 322, be provided be arranged on Connection Element 301 above the corresponding a plurality of conducting portions of each elastic contact 15.In addition, on the 1st circuit substrate 321, be formed with location hole 310, on the 2nd circuit substrate 322, be formed with location hole 309.

By with above-mentioned locator protrusions 308 no gaps or minimum clearance be inserted in the above-mentioned location hole 310, with above-mentioned locator protrusions 307 no gaps or minimum clearance be inserted in the above-mentioned location hole 309, relative the 1st circuit substrate 321 and the 2nd circuit substrate 322 and the element 301 that is located by connecting, thereby make each elastic contact be arranged on below the Connection Element 301 contact, be arranged on each top elastic contact 15 of Connection Element 301 each conducting portions following and contact with being arranged on the 2nd circuit substrate 322 with each conducting portion 323 on the 1st circuit substrate 321.

Figure 19 is the exploded perspective view of the circuit connecting mechanism 420 of expression the present invention the 5th execution mode.

Connection Element 401 constitutes by the fixing brace 10 shown in Figure 3 of reeling on supporting mass 403, and has formed locator protrusions 408 and location hole 407 on supporting mass 403.On surface, be formed with a plurality of conducting portions 423, on the 1st circuit substrate 421, be formed with installing hole 410 as the 1st circuit substrate 421 of circuit block.On the 2nd circuit substrate 422, be formed with location hole 409 and installing hole 411 as circuit block.

Be fitted to by the locator protrusions 408 with Connection Element 401 in the location hole 409 of the 2nd circuit substrate 422, element 401 and the 2nd circuit substrate 422 are located by connecting.In addition, mounting screw 503 is inserted in the installing hole 411 that is formed on the 2nd circuit substrate 422, and passes the location hole 407 of Connection Element 401 and the installing hole 410 of the 1st circuit substrate 421, screw togather and be fixed in the female screw 502 that is formed on the framework 501.

According to above-mentioned structure, the installation that is positioned of relative the 1st circuit substrate 421 and the 2nd circuit substrate 422, Connection Element 401.And, be arranged on conducting portion 423 opposed contacts of elastic contact and the 1st circuit substrate 421 below the Connection Element 401, be arranged on Connection Element 401 top elastic contacts 15 and be connected with the following conducting portion that is arranged on the 2nd circuit substrate 422.

In addition, the invention is not restricted to above-mentioned execution mode.For example, to execution mode shown in Figure 10, the circuit block of upside also can not be an electronic unit 22 at Fig. 1, but upper circuit substrate etc.And, for example in circuit connecting mechanism shown in Figure 6 20, also can uneasy electronic parts 22, and constitute elastic contact 16 only is set on the 2nd opposed faces 3b of Connection Element 1, utilize positioning element 30 that this Connection Element 1 is positioned on the main substrate 21, the conducting portion on the main substrate 21 23 is connected to each other by above-mentioned elastic contact 16.

And elastic contact is not limited to the shape of helical form protuberance, also can be the arm shape contact of performance elastic force.

In addition, in the brace 10 of Fig. 3, constitute the elastic contact 15 of the 1st group of elastic contact 12 and constitute the elastic contact 16 of the 2nd group of elastic contact 13, by wiring pattern 14 conducting one to one, but also can for example pass through 1 wiring pattern 14 with a plurality of elastic contacts 15 and the 16 whole conductings of a plurality of elastic contact, can also be by of the varying number corresponding conducting of same wiring pattern 14 with elastic contact 15 and elastic contact 16.This is identical in the relation of the elastic contact 15 of brace shown in Figure 8 210 and fixed contact 216.

Claims (19)

1. Connection Element comprises:

Have and connect with the supporting mass of opposed faces and be arranged on a plurality of elastic contacts of described opposed faces,

In the zone that described elastic contact is not set of described supporting mass, be formed with hole or the recess or the projection of location usefulness.

2. Connection Element according to claim 1, it is characterized in that, described opposed faces be set at described supporting mass on each face of opposition side, the opposed faces of one side is provided with the 1st group of elastic contact, the opposed faces of opposite side is provided with the 2nd group of elastic contact, the 1st group of elastic contact and the 2nd group of elastic contact conducting.

3. Connection Element according to claim 2, it is characterized in that, the wiring pattern that on the face of a side of flexible base, board, is formed with the 1st group of elastic contact and the 2nd elastic contact and makes the 1st group of elastic contact and the 2nd group of elastic contact conducting, described flexible base, board is fixed on the described supporting mass by bending, make the 1st group of elastic contact be positioned on the opposed faces of a side, the 2nd group of elastic contact is positioned on the opposed faces of opposite side.

4. Connection Element according to claim 1, it is characterized in that, described opposed faces be set at described supporting mass on each face of opposition side, the opposed faces of one side is provided with a plurality of elastic contacts, the opposed faces of opposite side is provided with a plurality of fixed contacts, described elastic contact and described fixed contact conducting.

5. Connection Element according to claim 4, it is characterized in that, on the face of a side of flexible base, board, be formed with a plurality of elastic contacts and a plurality of fixed contact and make elastic contact and the wiring pattern of fixed contact conducting, described flexible base, board is fixed on the described supporting mass by bending, make elastic contact be positioned on the opposed faces of a side, fixed contact is positioned on the opposed faces of opposite side.

6. Connection Element according to claim 3 is characterized in that, is provided with the detent mechanism of described flexible base, board positioning and fixing on described supporting mass.

7. circuit connecting mechanism has the described Connection Element of claim 1 and locatees the positioning element of this Connection Element,

Described positioning element can be installed on the circuit block with the conductive part that connects described elastic contact.

8. circuit connecting mechanism according to claim 7 is characterized in that, described positioning element and described supporting mass are concavo-convex chimeric, and described relatively circuit block is located described Connection Element.

9. circuit connecting mechanism has the described Connection Element of claim 2 and locatees the 1st positioning element and the 2nd positioning element of this Connection Element,

On described supporting mass, be formed with the location hole that embeds described the 1st positioning element or the 2nd positioning element, the 1st positioning element and the 2nd positioning element can be concavo-convex chimeric, the 1st positioning element can be installed on the 1st circuit block with the conducting portion that connects the 1st group of elastic contact, and the 2nd positioning element can be installed on the 2nd circuit block with the conducting portion that connects the 2nd group of elastic contact.

10. circuit connecting mechanism has the described Connection Element of claim 4 and locatees the 1st positioning element and the 2nd positioning element of this Connection Element,

On described supporting mass, be formed with the location hole that embeds described the 1st positioning element or the 2nd positioning element, the 1st positioning element and the 2nd positioning element can be concavo-convex chimeric, the 1st positioning element can be installed on the 1st circuit block with the conducting portion that connects described elastic contact, and the 2nd positioning element can be installed on the 2nd circuit block with the conducting portion that connects described fixed contact.

11. circuit connecting mechanism according to claim 7, it is characterized in that, on described circuit block, be formed with the metal level of location usefulness, described positioning element is welded on the described metal level by soldering, and described Connection Element is installed on the described circuit block by the location of described positioning element.

12. circuit connecting mechanism according to claim 9, it is characterized in that, on the 1st circuit block and the 2nd circuit block, be formed with the metal level of location usefulness respectively, the 1st positioning element is welded on the described metal level of the 1st circuit block by soldering, the 2nd positioning element is welded on the described metal level of the 2nd circuit block by soldering, the 1st positioning element and the 2nd positioning element are chimeric mutually, between the 1st circuit block and the 2nd circuit block, and the described Connection Element of location and installation.

13. circuit connecting mechanism according to claim 11 is characterized in that, uses identical metal material, and adopts identical technology to form the described metal level of described conducting portion and location usefulness.

14. circuit connecting mechanism according to claim 11 is characterized in that, is provided with fixed base in described positioning element, this fixed base is across the inner space and width dimensions opposed and have regulation on this opposed direction; The described metal level that in described circuit block, is provided with partition distance on described opposed direction and forms with Rack, described fixed base contacts with described metal level, and described fixed base and described metal level are welded by soldering.

15. circuit connecting mechanism according to claim 14, it is characterized in that, between the outer rim of metal level between the distance of described opposed direction is more than or equal to the outer rim of described fixed base in the distance of described opposed direction, between the inner edge of metal level between the distance of described opposed direction is smaller or equal to the inner edge of described fixed base in the distance of described opposed direction.

16. circuit connecting mechanism according to claim 15, it is characterized in that, between the outer rim of described metal level the distance of described opposed direction, and the outer rim of described fixed base between poor in the distance of described opposed direction, more than or equal to 0mm smaller or equal to 0.3mm

Between the inner edge of described metal level the distance of described opposed direction, and the inner edge of described fixed base between poor in the distance of described opposed direction, more than or equal to 0mm smaller or equal to 0.3mm.

17. circuit connecting mechanism according to claim 11, it is characterized in that, described positioning element be provided with colyliform be formed at the inner space around, and has a fixed base of Rack size, on described circuit block, be provided with the described metal level of the Rack that forms colyliform, described fixed base contacts with described metal level, and described fixed base and described metal level are welded by soldering.

18. circuit connecting mechanism according to claim 17 is characterized in that, the outer peripheral edges diameter of described metal level is more than or equal to the outer peripheral edges diameter of described fixed base, and the inner peripheral diameter of metal level is smaller or equal to the inner peripheral diameter of described fixed base.

19. circuit connecting mechanism according to claim 18 is characterized in that, the outer peripheral edges diameter of described metal level and the outer peripheral edges diameter of described fixed base poor, more than or equal to 0mm smaller or equal to 0.3mm,

The inner peripheral diameter of described metal level and the inner peripheral diameter of described fixed base poor, more than or equal to 0mm smaller or equal to 0.3mm.

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