CN1897189A - Bond-cap interval controlling method of keyboard - Google Patents
Bond-cap interval controlling method of keyboard Download PDFInfo
- Publication number
- CN1897189A CN1897189A CN 200510082587 CN200510082587A CN1897189A CN 1897189 A CN1897189 A CN 1897189A CN 200510082587 CN200510082587 CN 200510082587 CN 200510082587 A CN200510082587 A CN 200510082587A CN 1897189 A CN1897189 A CN 1897189A
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- keycap
- location division
- keyboard
- stator
- bond
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Abstract
A keycap spacing control method for keyboard, including the following steps: provides the positioning device, the stator, the first keycap, the second keycap and the base board; locates the stator at the positioning device; chooses the space between the first keycap and the second keycap; locates the first keycap and the second keycap respectively at the positioning device according to the space; fixes the first keycap and the second keycap at the stator respectively; separates the stator, the first keycap and the second keycap from the positioning device synchronously; puts the base board under the stator; fixes the base board under the first keycap and the second keycap.
Description
Technical field
The present invention relates to the bond-cap interval controlling method of keyboard and the keyboard that manufacturing gets according to the method.
Background technology
With present mobile phone market, display has the trend of doing bigger and bigger, and simultaneously, the device that adds such as digital camera, expansion board etc. also can get more and more.Yet, but be compact as much as possible for the requirement of mobile phone bulk shape, therefore, the space potential of infrastructure component must be saved.In order to satisfy this demand, develop then the mobile phone key that as piano key (gapless keypad), stitch with the small key of pursuing as piano key.
Common technology when group system mobile phone key, is made positioner according to the button external form earlier at present.And, on positioner, utilize mold injection or CNC processing, produce the prominent rib of effective location usefulness, by prominent rib the key seam size of mobile phone key is controlled again.
Yet, no matter be to utilize mould to penetrate or CNC processing, the prominent rib width that prior art can produce and its limit is highly all arranged, the key of resulting mobile phone key like this stitches size and also has its limit, usually more than 0.25mm.
Summary of the invention
In view of this, the invention provides a kind of bond-cap interval controlling method of keyboard, may further comprise the steps: a location device, a stator, one first keycap, one second keycap and a substrate are provided; This stator is positioned this positioner; Determine a spacing of this first keycap and this second keycap; According to this spacing this first keycap and this second keycap are positioned this positioner respectively; This first keycap and this second keycap are fixedly arranged on respectively on this stator; This stator, this first keycap and this second keycap are separated with this positioner simultaneously; This substrate is placed under this stator; And this substrate is fixedly arranged on respectively under this first keycap and this second keycap.
The present invention also provides a kind of keyboard, comprises a stator, one first keycap, one second keycap and a substrate, gets according to the bond-cap interval controlling method manufacturing of aforesaid keyboard.
Description of drawings
Fig. 1 a is the constitutional diagram of cell phone keyboard of the present invention and handset shell;
Fig. 1 b is the exploded view of cell phone keyboard of the present invention and handset shell;
Fig. 2 is the flow chart of steps of bond-cap interval controlling method of the present invention;
The location-plate schematic diagram of Fig. 3 for being made according to step S2;
The stator schematic diagram of Fig. 4 for being made according to step S3;
Fig. 5 is for to be positioned stator for the location-plate schematic diagram according to step S4;
First keycap and the second keycap schematic diagram of Fig. 6 for being made according to step S5;
Fig. 7 is for to be positioned first keycap and second keycap for location-plate according to step S6 respectively;
Fig. 8 is for separating stator, first keycap and second keycap according to step S8 and inserting in the utensil with location-plate;
The substrate schematic diagram of Fig. 9 for being made according to step S9;
Figure 10 is for to be fixedly arranged on first keycap and the second keycap schematic diagram according to step S10 and S11 with substrate.
Embodiment
Main spirit of the present invention is when group system mobile phone key, utilizes location-plate to control the key seam size of mobile phone key, so can obtain the key seam size less than 0.25mm, makes the mobile phone bulk shape more compact.
Fig. 1 a represents the constitutional diagram of cell phone keyboard 100 of the present invention and handset shell 106.Fig. 1 b represents the exploded view of cell phone keyboard 100 of the present invention and handset shell 106.Cell phone keyboard 100 of the present invention comprises stator 101, a plurality of keycap 102, substrate 104, circuit board 105.Again, a plurality of keycaps 102 comprise the first keycap 102a and the second keycap 102b.
Stator 101 can be polyester (PET) film or sheet metal.The first keycap 102a and the second keycap 102b are working of plastics.Substrate 104 is a silica gel spare.
Again, circuit board 105 has the induction structure 107 corresponding to the first keycap 102a and the second keycap 102b, and when the user pressed the first keycap 102a or the second keycap 102b, corresponding induction structure 107 was enabled and produces corresponding electronic signal.
Cell phone keyboard 100 of the present invention is organized system according to bond-cap interval controlling method of the present invention and is formed.By the method, the key seam size of mobile phone key can be controlled at small scope, for example in the 0.25mm.
Fig. 2 represents the flow chart of steps of bond-cap interval controlling method of the present invention.Cell phone keyboard 100 of the present invention is according to bond-cap interval controlling method of the present invention, and located the system of organizing by location-plate and form.
Under introduce each step of bond-cap interval controlling method of the present invention.What this need specify be, though be that example illustrates bond-cap interval controlling method of the present invention only with two keycaps herein, identical flow process and step can be bestowed plural a plurality of keycap equally, and then reach the effect of the spacing of a plurality of keycaps of control.
At first, in step S1, determine the spacing of the first keycap 102a and the required maintenance of the second keycap 102b, for example selected desired spacing is 0.2mm.
Fig. 3 represents the location-plate 200 made according to step S2.In step S2, according to selected desired spacing 0.2mm, and cooperate the width of the first keycap 102a and the second keycap 102b itself, suitably form first location division 201 and second location division 202 in location-plate 200.As shown in the figure, first location division 201 and second location division 202 are projection.
Fig. 4 represents the stator 101 made according to step S3.In step S3, form first perforation 203, second perforation 204 and location hole 205 in stator 101.
Fig. 5 represents according to step S4 stator 101 to be positioned location-plate 200.In step S4, respectively first perforation 203 and second perforation 204 are sheathed on first location division 201 and second location division 202 so that stator 101 is positioned location-plate 200.
Fig. 6 represents the first keycap 102a and the second keycap 102b that are made according to step S5.In step S5, form the 3rd location division 206 and the 4th location division 207 respectively in the first keycap 102a and the second keycap 102b.As shown in the figure, the 3rd location division 206 and the 4th location division 207 are groove.
Fig. 7 represents according to step S6 the first keycap 102a and the second keycap 102b to be positioned location-plate 200 respectively.In step S6, respectively first location division 201 and second location division 202 are sticked in the 3rd location division 206 and the 4th location division 207 so that the first keycap 102a and the second keycap 102b are positioned location-plate 200 respectively.
What this need remark additionally be, because in step S2, form first location division 201 and second location division 202 when location-plate 200, the width of the first keycap 102a and the second keycap 102b itself with due regard to, therefore, when the first keycap 102a and the second keycap 102b were positioned location-plate 200, the first keycap 102a and the actual spacing of being separated by of the second keycap 102b were desired spacing 0.2mm selected among the step S1.
Then, in step S7, apply industrial UV glue respectively between stator 101 and the first keycap 102a and the second keycap 102b, be used for the first keycap 102a and the second keycap 102b are glued at respectively the top of stator 101.
Fig. 8 represents stator 101, the first keycap 102a and the second keycap 102b are separated with location-plate 200 and to insert in the utensil 300 according to step S8.
What can remark additionally is that utensil 300 is a kind of aid, can be so that the assembling operation of substrate 104, stator 101, the first keycap 102a and the second keycap 102b is more easy herein.
In step S8, stator 101, the first keycap 102a and the second keycap 102b are separated with location-plate 200 simultaneously, and, via inserting after spinning upside down in the utensil 300.
Fig. 9 represents the substrate 104 made according to step S9.In step S9, form first joint portion 208 and second joint portion 209 in substrate 104.As shown in the figure, first joint portion 208 and second joint portion 209 are projection.
Figure 10 represents according to step S10 and S11 substrate 104 to be fixedly arranged on the first keycap 102a and the second keycap 102b.
In step S10, substrate 104 is placed the below of stator 101.In step S11, respectively with first joint portion 208 and the engaging of second joint portion 209 and be glued at the 3rd location division 206 and the 4th location division 207 substrate 104 is fixedly arranged on the below of the first keycap 102a and the second keycap 102b respectively.
What this need specify be, because in step S8, stator 101, the first keycap 102a and the second keycap 102b are by inserting after spinning upside down in the utensil 300, therefore, the actual practice of step S10 and S11 system spins upside down the top that is placed on stator 101 with substrate 104 and engages and glue together operation.
Then, substrate 104, stator 101, the first keycap 102a and the second keycap 102b that combination is finished shift out utensil 300 simultaneously, and spin upside down and be normal disposing way.
At last, in step S12, circuit board 105 is fixedly arranged on the below (seeing also Fig. 1 a and Fig. 1 b) of substrate 104.In step S13, by location hole 205 stator 101 is fixedly arranged on reference column 210 (seeing also Fig. 1 a and Fig. 1 b) in the handset shell 106, promptly finish the group manufacturing of cell phone keyboard 100 of the present invention.
In the present invention, the key seam of controlling mobile phone key by location-plate is big or small, so can obtain the key seam size less than 0.25mm, makes the mobile phone bulk shape more compact.
Again, cell phone keyboard of the present invention is the three layers structure with stator, therefore makes structure more firm, and effectively avoids a plurality of keycaps to be out of shape or the handset shell that bounces out because of being subjected to external force.
Moreover, by the location hole of stator, can more accurately cell phone keyboard be assembled and be fixed on the handset shell.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limit scope of the present invention; anyly be familiar with this operator; without departing from the spirit and scope of the present invention; can do some change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (18)
1. the bond-cap interval controlling method of a keyboard may further comprise the steps:
One location device, a stator, one first keycap, one second keycap and a substrate are provided;
This stator is positioned this positioner;
Determine a spacing of this first keycap and this second keycap;
According to this spacing this first keycap and this second keycap are positioned this positioner respectively;
This first keycap and this second keycap are fixedly arranged on respectively on this stator;
This stator, this first keycap and this second keycap are separated with this positioner simultaneously;
This substrate is placed under this stator; And
This substrate is fixedly arranged on respectively under this first keycap and this second keycap.
2. a keyboard comprises a stator, one first keycap, one second keycap and a substrate, the bond-cap interval controlling method manufacturing of keyboard according to claim 1 and getting.
3. the bond-cap interval controlling method of keyboard as claimed in claim 1 more may further comprise the steps:
One circuit board is provided; And
This circuit board is fixedly arranged under this substrate.
4. the bond-cap interval controlling method of keyboard as claimed in claim 1, further comprising the steps of:
One housing is provided;
Form a location hole in this stator; And
By this location hole this stator is fixedly arranged on this housing.
5. the bond-cap interval controlling method of keyboard as claimed in claim 1, wherein, this is that this first keycap and this second keycap are glued at respectively on this stator with the step that this first keycap and this second keycap are fixedly arranged on respectively on this stator, and this is that this substrate is glued at respectively under this first keycap and this second keycap with the step that this substrate is fixedly arranged on respectively under this first keycap and this second keycap.
6. the bond-cap interval controlling method of keyboard as claimed in claim 1, wherein, this positioner is a location-plate.
7. the bond-cap interval controlling method of keyboard as claimed in claim 1, wherein, this stator is a polyester (PET) film or a sheet metal.
8. the bond-cap interval controlling method of keyboard as claimed in claim 1, wherein, this first keycap and this second keycap are working of plastics.
9. the bond-cap interval controlling method of keyboard as claimed in claim 1, wherein, this may further comprise the steps the step that this first keycap and this second keycap are positioned this positioner respectively according to this spacing:
Form one first location division and one second location division in this positioner according to this spacing;
Form one the 3rd location division and one the 4th location division respectively in this first keycap and this second keycap; And
Respectively this first location division and this second location division are combined with the 3rd location division and the 4th location division so that this first keycap and this second keycap are positioned this positioner respectively.
10. the bond-cap interval controlling method of keyboard as claimed in claim 9, wherein, this combines this first location division and this second location division respectively and respectively this first location division and this second location division is sticked in the 3rd location division and the 4th location division so that this first keycap and this second keycap are positioned this positioner respectively with the step that this first keycap and this second keycap is positioned this positioner respectively with the 3rd location division and the 4th location division.
11. the bond-cap interval controlling method of keyboard as claimed in claim 9, wherein, this first location division and this second location division are projection, and the 3rd location division and the 4th location division are groove.
12. the bond-cap interval controlling method of keyboard as claimed in claim 11, wherein, this may further comprise the steps the step that this stator is positioned this positioner:
Form one first perforation and one second perforation in this stator; And
Respectively this first perforation and this second perforation are sheathed on this first location division and this second location division so that this stator is positioned this positioner.
13. a keyboard comprises a stator, one first keycap, one second keycap and a substrate, is that the bond-cap interval controlling method manufacturing according to keyboard as claimed in claim 12 gets.
14. the bond-cap interval controlling method of keyboard as claimed in claim 9, wherein, this may further comprise the steps the step that this substrate is fixedly arranged on respectively under this first keycap and this second keycap:
Form one first joint portion and one second joint portion in this substrate; And
Respectively this first joint portion and this second joint portion are combined with the 3rd location division and the 4th location division this substrate is fixedly arranged on respectively under this first keycap and this second keycap.
15. the bond-cap interval controlling method of keyboard as claimed in claim 14, wherein, this combines this first joint portion and this second joint portion respectively and respectively this first joint portion and this second joint portion is sticked in the 3rd location division and the 4th location division this substrate is fixedly arranged on respectively under this first keycap and this second keycap with the step that this substrate is fixedly arranged on respectively under this first keycap and this second keycap with the 3rd location division and the 4th location division.
16. the bond-cap interval controlling method of keyboard as claimed in claim 14, wherein, this first location division and this second location division are projection, and the 3rd location division and the 4th location division are groove, and this first joint portion and this second joint portion are projection.
17. the bond-cap interval controlling method of keyboard as claimed in claim 16, wherein, this respectively this first joint portion and this second joint portion are combined with the 3rd location division and the 4th location division with this substrate is fixedly arranged on respectively under this first keycap and this second keycap step respectively with this first joint portion and the engaging of this second joint portion and be glued at the 3rd location division and the 4th location division this substrate is fixedly arranged on respectively under this first keycap and this second keycap.
18. a keyboard comprises a stator, one first keycap, one second keycap and a substrate, is that the bond-cap interval controlling method manufacturing according to keyboard as claimed in claim 17 gets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510082587 CN1897189A (en) | 2005-07-11 | 2005-07-11 | Bond-cap interval controlling method of keyboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510082587 CN1897189A (en) | 2005-07-11 | 2005-07-11 | Bond-cap interval controlling method of keyboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1897189A true CN1897189A (en) | 2007-01-17 |
Family
ID=37609667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510082587 Pending CN1897189A (en) | 2005-07-11 | 2005-07-11 | Bond-cap interval controlling method of keyboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1897189A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944449A (en) * | 2010-09-29 | 2011-01-12 | 青岛海信移动通信技术股份有限公司 | Key structure and portable mobile terminal |
| CN104051170B (en) * | 2014-06-09 | 2016-05-11 | 苏州达方电子有限公司 | Keycap and processing method thereof |
| US9984834B2 (en) | 2014-05-02 | 2018-05-29 | Darfon Electronics Corp. | Keycap and manufacturing method thereof |
-
2005
- 2005-07-11 CN CN 200510082587 patent/CN1897189A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944449A (en) * | 2010-09-29 | 2011-01-12 | 青岛海信移动通信技术股份有限公司 | Key structure and portable mobile terminal |
| CN101944449B (en) * | 2010-09-29 | 2012-10-10 | 青岛海信移动通信技术股份有限公司 | Key structure and portable mobile terminal |
| US9984834B2 (en) | 2014-05-02 | 2018-05-29 | Darfon Electronics Corp. | Keycap and manufacturing method thereof |
| CN104051170B (en) * | 2014-06-09 | 2016-05-11 | 苏州达方电子有限公司 | Keycap and processing method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |