CN1886028A - Composite Structure - Google Patents
Composite Structure Download PDFInfo
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- CN1886028A CN1886028A CN 200510078643 CN200510078643A CN1886028A CN 1886028 A CN1886028 A CN 1886028A CN 200510078643 CN200510078643 CN 200510078643 CN 200510078643 A CN200510078643 A CN 200510078643A CN 1886028 A CN1886028 A CN 1886028A
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- platform
- positioning
- slider
- composite structure
- clamp
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- 239000002131 composite material Substances 0.000 title claims description 14
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及一种组合结构,特别是涉及一种具有可对于电子进行定位的一夹具的组合结构。The present invention relates to a composite structure, in particular to a composite structure with a clamp capable of positioning electrons.
背景技术Background technique
图1A根据一现有夹具N的立体图,图1B表示沿着图1A中的线段a-a对于夹具N所进行的剖视图。FIG. 1A is a perspective view of a conventional fixture N, and FIG. 1B shows a cross-sectional view of the fixture N along line a-a in FIG. 1A .
夹具N包括一基底T1与一滑块T2。一凹陷部R10是形成于基底T1的上表面,此凹陷部R10是用以对于具有厚度s100的一印刷电路板(PCB)S进行收容。滑块T2是以可移动方式设置在基底T1之上,通过滑块T2可将PCB S抵压接触于凹陷部R10的一侧壁r101。The jig N includes a base T1 and a slider T2. A recess R10 is formed on the upper surface of the base T1, and the recess R10 is used for accommodating a printed circuit board (PCB) S having a thickness s100. The slider T2 is movably arranged on the base T1, and the PCB S can be pressed against the side wall r101 of the recess R10 through the slider T2.
如图1B所示,滑块T2是由一第一部件t21与一第二部件t22所共同构成的具有L型断面的构件。在沿着垂直的方向上,一距离t100是形成于凹陷部R10的底表面、最接近于第二部件t22的位置之间。As shown in FIG. 1B , the slider T2 is a component with an L-shaped cross section composed of a first part t21 and a second part t22 . In a vertical direction, a distance t100 is formed between the bottom surface of the recess R10 and the position closest to the second part t22.
就具有厚度s100的PCB S、或其它单片或多片堆栈的板件而言,其总厚度是受限于滑块T2的距离t100。换言之,若单片或多片堆栈的板件的厚度略大于距离t100时,则此夹具N便无法适用。As far as the PCB S with thickness s100, or other single-chip or multi-chip stacked boards, the total thickness is limited by the distance t100 of the slider T2. In other words, if the thickness of the single or multiple stacked boards is slightly greater than the distance t100, the fixture N cannot be used.
发明内容Contents of the invention
有鉴于此,本发明的目的就在于提供了可适用于不同厚度的电路板或板件进行夹持的组合结构,如此以提高生产效能。In view of this, the purpose of the present invention is to provide a combined structure suitable for clamping circuit boards or boards with different thicknesses, so as to improve production efficiency.
为达成上述目的,本发明提供一种组合结构,其包括了一电路板与一夹具。夹具是用以对于一电路板进行定位。夹具包括一平台与一滑块。平台包括一定位部,滑块是以可移动方式设置于平台。滑块包括一倾斜部,倾斜部用以将电路板抵接于定位部,如此使得电路板可在楔形效用的作用下而被夹持于滑块的倾斜部与定位部之间。To achieve the above object, the present invention provides a composite structure, which includes a circuit board and a clamp. The jig is used for positioning a circuit board. The fixture includes a platform and a slider. The platform includes a positioning part, and the slider is movably arranged on the platform. The slider includes an inclined portion, and the inclined portion is used to abut the circuit board against the positioning portion, so that the circuit board can be clamped between the inclined portion and the positioning portion of the sliding block under the action of a wedge.
为了让本发明的上述和其它目的、特征、和优点能更明显易懂,下文特举一较佳实施例,并配合所附图示,作详细说明如下:In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, and in conjunction with the attached drawings, the detailed description is as follows:
附图说明Description of drawings
图1A为一现有夹具的立体图;Figure 1A is a perspective view of an existing fixture;
图1B为图1A中的线段a-a对于夹具所进行的剖视图;Fig. 1 B is the sectional view that the line segment a-a in Fig. 1 A is carried out to fixture;
图2A为本发明的一组合结构W的立体图,其中,组合结构W包括一第一本体S与一第二本体M;FIG. 2A is a perspective view of a composite structure W of the present invention, wherein the composite structure W includes a first body S and a second body M;
图2B为图2A中的组合结W分解图;Figure 2B is an exploded view of the combined junction W in Figure 2A;
图3A为图2A的第二本体M的立体图;FIG. 3A is a perspective view of the second body M of FIG. 2A;
图3B为图3A的第二本体M的分解图;以及FIG. 3B is an exploded view of the second body M of FIG. 3A; and
图4为沿着图2A中的线段b-b对于组合结构W所进行的剖视图。FIG. 4 is a cross-sectional view of the combined structure W along line b-b in FIG. 2A .
具体实施方式Detailed ways
图2A表示根据本发明的一组合结构W的立体图,图2B表示图2A中的组合结构W的分解图。组合结构W包括一第一本体S与一第二本体M,其中,第一本体S设置于第二本体M之上,通过第二本体M对于第一本体S进行定位。在本实施例中,第一本体S为一印刷电路板(PCB)(或其它的电子元件),其具有一厚度s100,而第二本体M为一夹具(或一工作站)。FIG. 2A shows a perspective view of a composite structure W according to the present invention, and FIG. 2B shows an exploded view of the composite structure W in FIG. 2A . The composite structure W includes a first body S and a second body M, wherein the first body S is disposed on the second body M, and the first body S is positioned through the second body M. In this embodiment, the first body S is a printed circuit board (PCB) (or other electronic components) with a thickness s100, and the second body M is a fixture (or a workstation).
如图2B所示,夹具M包括一矩型平台1、一滑块2、两弹性装置3。于本实施例中,弹性装置3为一弹簧。As shown in FIG. 2B , the fixture M includes a rectangular platform 1 , a
平台1包括一上表面100u、一凹陷部10、一基部100、一导引部11及一定位部101。凹陷部10位于上表面100u,通过凹陷部10以收容PCB S。基部100为凹陷部10的底面,通过基部100以支承所收容的PCB S。定位部101为凹陷部10的侧壁,导引部11为相对于定位部101且连接于凹陷部10的另一凹部,其包括了相互间隔的两导引面111、112。The platform 1 includes an
图3A表示图2A的第二本体M的立体图,图3B表示图3A的第二本体M的分解图,而图4表示沿着图2A中的线段b-b对于组合结构W所进行的剖视图。3A shows a perspective view of the second body M of FIG. 2A, FIG. 3B shows an exploded view of the second body M of FIG. 3A, and FIG. 4 shows a cross-sectional view of the combined structure W along line b-b in FIG. 2A.
如图3A、图3B所示,一滑块2是以可移动方式设置于平台1。滑块2包括一倾斜部200,倾斜部200用以将PCB S抵接于定位部101,如此使得PCB S被夹持于滑块2的倾斜部200与定位部101之间,并且利用导引部11的两导引面111、112对于滑块2进行引导。弹簧3设置于平台1、滑块2之间,并且弹簧3的两端分别连接至滑块2的连接部201及凹陷部10的侧壁。当滑块2经由弹簧3连接于平台1时,滑块2便可在导引部11的两导引面111、112的引导下而沿着一既定方向移动。As shown in FIG. 3A and FIG. 3B , a
如图4所示,倾斜部200具有相对于凹陷部10的一角度α,即,角度α是形成于滑块2的倾斜部200与基部100之间。在本实施例中,角度α于实质上是小于90度。As shown in FIG. 4 , the
请再参阅图2B,PCB S包括四个侧壁s01、s02、s03及s04。当PCB S定位于夹具M之上时,PCB S是被夹持于滑块2与定位部101之间,即,PCB S的侧壁s01、s03是分别抵压接触于滑块2的倾斜部200、定位部101。Please refer to FIG. 2B again, the PCB S includes four sidewalls s01, s02, s03 and s04. When the PCB S is positioned on the fixture M, the PCB S is clamped between the
由图4可知,设置于平台1、滑块2之间的弹簧3是处于被压缩状态,此压缩状态的弹簧3所产生的一作用力是直接作用于滑块2之上,进而再经由倾斜部200对于PCB S进行夹持,此即为所谓的楔形效用(wedge-effect)。由此可知,不论就单片式或多片堆栈的板件而言,若其总厚度大于PCB S的厚度s100时,通过滑块2的倾斜部200而可有效地对于板件进行定位与夹持。因此,在滑块2的倾斜部200的作用下,PCB S是可被稳定地夹持于滑块2、定位部101之间。另外,当滑块2由一位置I-I移动至一位置II-II时,则PCB S便可被移除。It can be seen from Fig. 4 that the
虽然结合以上较佳实施例揭露了本发明,然而其并非用以限制本发明,任何熟悉此项技术者,在不脱离本发明的精神和范围内,可做更动与润饰,因此本发明的保护范围应以权利要求所界定的为准。Although the present invention has been disclosed in conjunction with the above preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200510078643 CN1886028A (en) | 2005-06-22 | 2005-06-22 | Composite Structure |
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CN 200510078643 CN1886028A (en) | 2005-06-22 | 2005-06-22 | Composite Structure |
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CN1886028A true CN1886028A (en) | 2006-12-27 |
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CN 200510078643 Pending CN1886028A (en) | 2005-06-22 | 2005-06-22 | Composite Structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101996913A (en) * | 2009-08-18 | 2011-03-30 | 综合测试电子系统有限公司 | System for post-processing of electronic components |
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2005
- 2005-06-22 CN CN 200510078643 patent/CN1886028A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101996913A (en) * | 2009-08-18 | 2011-03-30 | 综合测试电子系统有限公司 | System for post-processing of electronic components |
CN101996913B (en) * | 2009-08-18 | 2013-05-08 | 综合测试电子系统有限公司 | System for post-processing of electronic components |
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