CN1885150A - Projector casing - Google Patents
Projector casing Download PDFInfo
- Publication number
- CN1885150A CN1885150A CN 200510078620 CN200510078620A CN1885150A CN 1885150 A CN1885150 A CN 1885150A CN 200510078620 CN200510078620 CN 200510078620 CN 200510078620 A CN200510078620 A CN 200510078620A CN 1885150 A CN1885150 A CN 1885150A
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- Prior art keywords
- heat
- shell
- casing
- conduction component
- casing according
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Projection Apparatus (AREA)
- Thermal Insulation (AREA)
Abstract
The invention relates to a frame of projector, for containing one heat source, wherein said frame comprises a frame and a thermal conductive element; the frame has one inner wall; the frame can contain heat source; the thermal conductive element is arranged on the inner wall between the frame and heat source; one thermal-insulated chamber is between thermal conductive element and the frame; said thermal-insulated chamber can avoid frame to be heated directly, to reach better thermal-insulated effect.
Description
[technical field]
The present invention is relevant for a kind of casing, and is particularly to a kind of casing of projection arrangement.
[background technology]
In modern society, along with the progress of photoelectricity science and technology and shadow casting technique, can export a large amount of being used of projection arrangement of high image quality and high-res and big picture.In order to make projection arrangement can reach the demand of high image quality and high brightness, must use more powerful light source, relative also will produce more heat, and cause projection arrangement inside and the overheated situation of casing.For the overheated problem in prevention projection arrangement casing surface, must possess good Design on thermal insulation on the casing, make projection arrangement in use, do not have overheated problem.
Please refer to Fig. 1, known applications comprises a shell 110 and a heat-conduction component 120 in the casing 100 of projection arrangement.Wherein, heat-conduction component 120 can be the element that aluminium or copper etc. have preferable pyroconductivity, and be attached at the inwall 110a of shell 110, cause shell 110 temperature too high with the inwall 110a that avoids light source 130 direct irradiation shells 110, and utilize heat-conduction component 120 reflection sources 130, in addition, utilize heat-conduction component 120 to have the characteristic of preferable pyroconductivity, shell 110 is heated evenly.But the shell 110 that the heat that heat-conduction component 120 is absorbed still has part to be conducted to be in contact with it, so that the temperature of shell 110 still can be higher.
Please refer to Fig. 2, another kind of existing casing 100 ' comprises a shell 110 and a heat-conduction component 120 and a foam 140.The difference of itself and Fig. 1 is: casing 100 ' has comprised foam 140 (its pyroconductivity k=6.06 * 10 that are disposed between shell 110 and the heat-conduction component 120
-2And this foam 140 is the heat that conducts to shell 110 from heat-conduction component 120 in order to isolated W/mK).Though so the low-thermal conductivity by foam 140 can lower the heat of heat transferred to shell 110, the effect of heat insulation of foam 140 is limited, cost an arm and a leg and the foam of thinner thickness is obtained difficult.On the other hand, during as the preferable effect of heat insulation of need, the thickness of foam need thicken, and the thickness that increases foam will increase the instability of system impedance and assembling.
Except aforesaid Design on thermal insulation, known technology also can adopt heat dissipation technology to avoid the overheated problem of shell.Specifically, can utilize air flow through between light source and the shell between the crack come cooled enclosure, to reach cool effect.But,, will make that the cooling effect of shell is limited if when the too small or flow resistance in crack is excessive between between light source and shell.In addition, might be positioned at element heating before the light source by other, and then have influence on the cooling effect of shell in order to the air of cooled enclosure.
[summary of the invention]
Purpose of the present invention is exactly that a kind of casing of projection arrangement is being provided, to reach preferable insulation effect.
For reaching above-mentioned purpose, the invention provides a kind of casing, it comprises a shell and a heat-conduction component.Wherein, shell has an inwall, and shell is in order to hold thermal source.Heat-conduction component is on the inwall that is disposed between shell and the thermal source, and has a heat insulation cavity between heat-conduction component and the shell.
Described according to one embodiment of the invention, casing for example is the casing of a projector, and this casing also comprises a glue-line, and this glue-line is to be adhered between shell and the heat-conduction component.Shell has one first groove, and heat-conduction component is to cover first groove to form heat insulation cavity.In addition, shell more comprises a plurality of first salient points that are positioned at first groove, and these first salient points are to be connected with heat-conduction component.In addition, the height of these first salient points for example is consistent with the degree of depth of first groove, and in a preferred embodiment, the height of first salient point is then between 1 millimeter to 7 millimeters.Thermal source is a light source for example, and heat-conduction component comprises a reflector plate, with most of light that reflection source was sent.In addition, the reflector plate of present embodiment for example has the plane of reflection or the scattering surface towards thermal source.Heat-conduction component has one second groove, and shell is to cover second groove to form heat insulation cavity.In addition, heat-conduction component also comprises a plurality of second salient points that are positioned at second groove, and wherein these second salient points are to be connected with shell.In addition, the height of these second salient points for example is consistent with the degree of depth of second groove, and in a preferred embodiment, the height of these second salient points is then between 1 millimeter to 7 millimeters.The heat-insulation chamber style of this casing is as being an airtight cavity, and for example has an insulated gas in the heat insulation cavity, and aforesaid insulated gas for example is gas, air or other gas that injects separately that a pyroconductivity is lower than foam.In addition, heat insulation cavity can also be a vacuum cavity.Based on above-mentioned, the present invention uses the heat insulation cavity that forms between shell and heat-conduction component to avoid thermal source shell directly to be heated.Therefore, the present invention need not to use any foam, can reach good insulation effect.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
[description of drawings]
Fig. 1 is equipped on the synoptic diagram of projection arrangement for existing a kind of casing.
Fig. 2 is equipped on the synoptic diagram of projection arrangement for existing another kind of casing.
Fig. 3, Fig. 4 and Fig. 5 are respectively the casing synoptic diagram of first embodiment of the present invention projection arrangement.
Fig. 6 is the partial enlarged drawing of the casing of Fig. 3.
Fig. 7 is the casing partial enlarged drawing of the second embodiment of the present invention.
Fig. 8 is the casing partial enlarged drawing of the third embodiment of the present invention.
Fig. 9 is the casing partial enlarged drawing of the fourth embodiment of the present invention.
Figure 10 is the casing partial enlarged drawing of the fifth embodiment of the present invention.
[main element symbol description]
100,100 ', 200a-200g: casing
110,210,210 ': shell
110a, 210a: inwall
120,220,220 ', 220 ": heat-conduction component
130: light source
140: foam
212: the first grooves
214: the first salient points
222 ': reflector plate
222 ": second groove
224 ": second salient point
230: heat insulation cavity
240: thermal source
250: glue-line
[embodiment]
Fig. 3, Fig. 4 and Fig. 5 are respectively the casing synoptic diagram of first embodiment of the present invention projection arrangement.Please refer to Fig. 3, the casing 200a of present embodiment is suitable for holding a thermal source 240, and casing 200a comprises a shell 210 and a heat-conduction component 220.Wherein, shell 210 has an inwall 210a, and shell 210 is in order to hold thermal source 240.With general projection arrangement is example, and its inner thermal source 240 is for example for the required light source of projection or other are easy to generate the element of high heat.Heat-conduction component 220 is on the inwall 210a that is equipped between shell 210 and the thermal source 240.In the present embodiment, heat-conduction component 220 for example is one to have the sheet metal of preferable reflectivity and preferable heat-resisting character.
Please also refer to Fig. 3, Fig. 4 and Fig. 5, in the present embodiment, have a heat insulation cavity 230 between heat-conduction component 220 and the shell 210, and this heat insulation cavity 230 is top (being shown in Fig. 3), left side (being shown in Fig. 4) that are positioned at thermal source 240, or below (being shown in Fig. 5).Certainly, the present invention also can do suitable variation with the design attitude of heat insulation cavity 230.
Fig. 6 is shown the partial enlarged drawing of the casing of Fig. 3.Please refer to Fig. 6, casing 210a for example can further comprise a glue-line 250, and shell 210 is connected with heat-conduction component 220 by glue-line 250.In one embodiment, glue-line 250 for example can adopt resistant to elevated temperatures material, to guarantee the adhesiveness after glue-line 250 is subjected to thermal source 240 heating.
Please refer to Fig. 6 equally, in the present embodiment, shell 210 has one first groove 212, and heat-conduction component 220 is to cover first groove 212 of shell 210 to form heat insulation cavity 230.When projection arrangement is in mode of operation, its inner thermal source 240 can heat casing 200a, at this moment, heat-conduction component 220 can be in order to the warm of disperseing thermal source 240 to be produced, and reduce the heat that is passed to shell 210 from heat-conduction component 220 by heat insulation cavity 230, and then avoid shell 210 directly to be heated by thermal source 240.
Fig. 7 is shown the casing partial enlarged drawing of the second embodiment of the present invention.Please refer to Fig. 7, the disclosed casing 200a of the casing 200d of present embodiment and first embodiment is similar, and the casing 200d of present embodiment has more increased the design of first salient point 214 except comprising a shell 210 and a heat-conduction component 220.Specifically, shell 210 has first groove 212, and shell 210 comprises a plurality of first salient points 214 that are positioned at first groove 212, and these first salient points 214 for example are to be arranged in first groove 212 with array way.In the present embodiment, first salient point 214 for example is to be connected with heat-conduction component 220 by glue-line 250.In addition, glue-line 250 can adopt resistant to elevated temperatures material, to guarantee the adhesiveness after glue-line 250 is subjected to thermal source 240 heating.
Please refer to Fig. 7 equally because present embodiment designed many first salient points 214 in first groove 212, so when shell 210 with after heat-conduction component 220 is connected, first salient point 214 just can be distributed in the heat insulation cavity 230.In the present embodiment, the height of first salient point 214 for example is consistent with the degree of depth of first groove 212, so that first salient point 214 can contact with heat-conduction component 220 or be connected to each other by glue-line 250.When first salient point 214 can contact with heat-conduction component 220 or be connected to each other by glue-line 250, first salient point 214 not only can further increase the then area between shell 210 and the heat-conduction component 220, and can effectively keep the degree of depth of heat insulation cavity 230.
In a preferred embodiment, the length of these first salient points 214, width and highly for example be respectively between 1 millimeter to 7 millimeters.More specifically, first salient point 214 for example is all cube or rectangular parallelepipeds between 1 millimeter to 7 millimeters of length.
Fig. 8 is shown the casing partial enlarged drawing of the third embodiment of the present invention.Please refer to Fig. 8, the disclosed casing 200a of the casing 200e of present embodiment and first embodiment is similar, precisely because difference is: the heat-conduction component 220 of first embodiment is one to have the sheet metal of the plane of reflection, and the casing 200e of present embodiment adopts another kind of special heat-conduction component 220 '.Particularly, the heat-conduction component 220 ' of present embodiment is a zigzag and sheet metal with good reflection characteristic, and heat-conduction component 220 ' has towards the scattering surface 222 ' of thermal source 240, in order to the heat that divergent light source produced, and with light that light source sent reflection (scattering).
Fig. 9 illustrates the casing partial enlarged drawing into the fourth embodiment of the present invention.Please refer to Fig. 9, the casing 200f of present embodiment comprises a shell 210 ' and a heat-conduction component 220 ".Wherein, heat-conduction component 220 " have one second groove 222 ", and heat-conduction component 220 " second groove 222 " be to cover by shell 210 ', to form heat insulation cavity 230.Similar to first embodiment, the casing 200f of present embodiment can further comprise a glue-line 250, in order to connect shell 210 ' and heat-conduction component 220 ".
Figure 10 illustrates the casing partial enlarged drawing into the fifth embodiment of the present invention.Please refer to Figure 10, the casing 200g of present embodiment comprises a shell 210 ' and a heat-conduction component 220 ".Wherein, heat-conduction component 220 " have second groove 222 ", and heat-conduction component 220 " comprise a plurality of second grooves 222 that are positioned at " second salient point 224 ", these second salient points 224 " for example be to be arranged in second groove 222 with array way " in.In the present embodiment, second salient point 224 " for example be by glue-line 250 and heat-conduction component 220 " be connected.In addition, glue-line 250 can adopt resistant to elevated temperatures material, to guarantee the adhesiveness after glue material 250 is subjected to thermal source 240 heating.
In the present embodiment, relevant for second salient point 224 " design similar to first salient point 214, so no longer repeat in this.
Hold above-mentionedly, the heat-insulation chamber style in the casing is as being an airtight cavity, and for example has an insulated gas in the heat insulation cavity, and the insulated gas that generally can adopt for example is air (its pyroconductivity k=2.63 * 10
-2W/mK), pyroconductivity is lower than foam (its pyroconductivity k=6.06 * 10
-2W/mK) gas, or other gases that inject separately.Certainly, heat insulation cavity of the present invention can also be a vacuum cavity.In addition, the casing design narrated of above-mentioned second embodiment to the, five embodiment also can be done suitable combining and variation with the described position feature of first embodiment.
In sum, casing of the present invention has following advantage at least:
1. the present invention can utilize the heat insulation cavity that is formed between shell and the heat-conduction component, is directly heated by thermal source effectively to avoid shell.
2. the present invention can further be provided with salient point in the heat insulation cavity between shell and heat-conduction component, to keep the degree of depth of heat insulation cavity.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; replace with equivalence when doing a little change, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (18)
1. a casing is suitable for holding a thermal source, and this casing comprises:
One shell has an inwall, and this shell is in order to hold this thermal source; And
One heat-conduction component is disposed on this inwall between this shell and this thermal source, wherein has a heat insulation cavity between this heat-conduction component and this shell.
2. casing according to claim 1 also comprises a glue-line, is adhered between this shell and the heat-conduction component.
3. casing according to claim 1, wherein this shell has one first groove, and this heat-conduction component covers this first groove to form this heat insulation cavity.
4. casing according to claim 3, wherein this shell also comprises a plurality of first salient points that are positioned at this first groove, wherein these first salient points are connected with this heat-conduction component.
5. casing according to claim 4, wherein the height of these first salient points is consistent with the degree of depth of this first groove.
6. casing according to claim 4, wherein the height of these first salient points is between 1 millimeter to 7 millimeters.
7. casing according to claim 1, wherein this thermal source comprises a light source, and this heat-conduction component comprises a reflector plate, to reflect the light that this light source is sent.
8. casing according to claim 7, wherein this reflector plate has a scattering surface towards this thermal source.
9. casing according to claim 1, wherein this heat-conduction component has one second groove, and this shell is to cover this second groove to form this heat insulation cavity.
10. casing according to claim 9, wherein this heat-conduction component also comprises a plurality of second salient points that are positioned at this second groove, wherein these second salient points are connected with this shell.
11. casing according to claim 10, wherein the height of these second salient points is consistent with the degree of depth of this second groove.
12. casing according to claim 10, wherein the height of these second salient points is between 1 millimeter to 7 millimeters.
13. casing according to claim 1 also comprises an insulated gas, is arranged in this heat insulation cavity.
14. casing according to claim 13, wherein this insulated gas is an air.
15. casing according to claim 13, wherein this insulated gas is the gas that a pyroconductivity is lower than foam.
16. casing according to claim 1, wherein this heat insulation cavity is a vacuum cavity.
17. casing according to claim 1, wherein this heat insulation cavity is an airtight cavity.
18. casing according to claim 1, wherein this casing is the casing of a projector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100786208A CN100507708C (en) | 2005-06-23 | 2005-06-23 | Projector casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100786208A CN100507708C (en) | 2005-06-23 | 2005-06-23 | Projector casing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1885150A true CN1885150A (en) | 2006-12-27 |
| CN100507708C CN100507708C (en) | 2009-07-01 |
Family
ID=37583364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100786208A Active CN100507708C (en) | 2005-06-23 | 2005-06-23 | Projector casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100507708C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131373A (en) * | 2011-03-15 | 2011-07-20 | 中兴通讯股份有限公司 | Heat-insulating structure and method for data card |
| CN103337261A (en) * | 2013-05-24 | 2013-10-02 | 中山市众盈光学有限公司 | Optical engine box structure |
| CN107072368A (en) * | 2014-11-18 | 2017-08-18 | Seb公司 | Steam hairdressing apparatus with improved housing |
-
2005
- 2005-06-23 CN CNB2005100786208A patent/CN100507708C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131373A (en) * | 2011-03-15 | 2011-07-20 | 中兴通讯股份有限公司 | Heat-insulating structure and method for data card |
| CN102131373B (en) * | 2011-03-15 | 2014-12-10 | 中兴通讯股份有限公司 | Heat-insulating structure and method for data card |
| CN103337261A (en) * | 2013-05-24 | 2013-10-02 | 中山市众盈光学有限公司 | Optical engine box structure |
| CN107072368A (en) * | 2014-11-18 | 2017-08-18 | Seb公司 | Steam hairdressing apparatus with improved housing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100507708C (en) | 2009-07-01 |
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