CN1884419A - Use of decamethylene diamine in preparing copolyamide hot sol - Google Patents
Use of decamethylene diamine in preparing copolyamide hot sol Download PDFInfo
- Publication number
- CN1884419A CN1884419A CN 200610085799 CN200610085799A CN1884419A CN 1884419 A CN1884419 A CN 1884419A CN 200610085799 CN200610085799 CN 200610085799 CN 200610085799 A CN200610085799 A CN 200610085799A CN 1884419 A CN1884419 A CN 1884419A
- Authority
- CN
- China
- Prior art keywords
- melt adhesive
- hot melt
- acid
- diamine
- copolyamide hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 title claims description 16
- 239000004831 Hot glue Substances 0.000 claims abstract description 42
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 10
- 150000004985 diamines Chemical class 0.000 claims abstract description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 10
- RSJKGSCJYJTIGS-UHFFFAOYSA-N N-undecane Natural products CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 claims description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 6
- -1 undecane diamines Chemical class 0.000 claims description 6
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229960002684 aminocaproic acid Drugs 0.000 claims description 4
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 claims description 4
- 150000007520 diprotic acids Chemical class 0.000 claims description 3
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 claims description 2
- HCUZVMHXDRSBKX-UHFFFAOYSA-N 2-decylpropanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)C(O)=O HCUZVMHXDRSBKX-UHFFFAOYSA-N 0.000 claims description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- IIYFAKIEWZDVMP-UHFFFAOYSA-N linear paraffin C13 Natural products CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 claims description 2
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 abstract 2
- OYIFNHCXNCRBQI-UHFFFAOYSA-N 2-aminoadipic acid Chemical compound OC(=O)C(N)CCCC(O)=O OYIFNHCXNCRBQI-UHFFFAOYSA-N 0.000 abstract 1
- BOWUOGIPSRVRSJ-UHFFFAOYSA-N 2-aminohexano-6-lactam Chemical compound NC1CCCCNC1=O BOWUOGIPSRVRSJ-UHFFFAOYSA-N 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 4
- 235000021050 feed intake Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000005453 pelletization Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000577 Nylon 6/66 Polymers 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- YWJUZWOHLHBWQY-UHFFFAOYSA-N decanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCC(O)=O YWJUZWOHLHBWQY-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates the diamine product used to produce copolyamide hot melt adhesive. The method comprises the following steps: 1. using decanamine to prepare hot melt adhesive; 2. the copolymerization hot melt adhesive being ternary or polyvalent; 3. the copolymerization hot melt adhesive comprising a, b elementary units, a: two or many C6-13 diamine or two or many C6-13 dibasic acid, b: aminocaprolactam or aminoadipic acid; 4. 60-80% a and 20-40% b. The decanamine belongs to a. The invention has the advantages of simple technology, low cost, and easy operation.
Description
Technical field
The present invention relates to the application of the application, particularly decamethylene diamine product of the long carbochain diamine of class product in the preparation of copolyamide hot melt adhesive in the preparation of copolyamide hot melt adhesive.
Background technology
The copolyamide hot melt adhesive claims nylon hot-melt adhesive again.It is to be matrix with the polyamide resin, adds the thermoplastic nylon resin that other auxiliary composition is composited.The outstanding advantage of copolyamide hot melt adhesive is: snappiness that melt temperature is low, melting range is narrow, polarity is strong, bonding strength is high, processing characteristics is good, wear resisting property is good, chemical resistance is strong and good and washing resistance performance etc., thereby make it occupy suitable market in the bonding field of fabric, be usually used in adhesion lining cloth, leather bonds lining, shoes and hats etc., and application comparatively widely also arranged in industries such as automobile industry, packages printings.
The copolyamide hot melt adhesive is a kind of binary or multipolymer, promptly adopt two or more different carbon chain lengths monomer copolymerization by a certain percentage and make, because of the different monomers carbon chain lengths differs, the fusing point difference of height is apart from widening, so can effectively reduce degree of crystallinity and fusing point between component.Switzerland ENS company has developed nylon 6/66/12 terpolymer Grll-tex series tackiness agent, U.S. Dupont company has developed the terpolyamide adhesive lining.The external copolyamide hot melt adhesive of producing generally all contains nylon-11 or PA-12 monomer, and ratio can reach more than the 50-60%, and relative cost is higher.Domestic common employing nylon-1010 monomer is a feedstock production copolyamide hot melt adhesive, and its performance is basic near external like product.
Summary of the invention
The object of the present invention is to provide a class is main raw material with the decamethylene diamine, joins the diprotic acid of equivalent, without salify, and participates in the application method that copolymerization makes the copolyamide hot melt adhesive directly.
Application of the present invention can be simplified technical process, reduce production costs, and makes operation more convenient.
Technical scheme of the present invention is as follows:
1. decamethylene diamine does not need salify, and the participation copolymerization that directly feeds intake makes hot melt adhesive;
2. the copolymerization hot melt adhesive can be that ternary is formed, and can also be polynary composition;
3. the copolymerization hot melt adhesive is generally by two elementary cells of a, b:
A. two kinds or multiple C
6-13Diamine and two kinds or multiple C
6-13Diprotic acid (mol ratios such as amine, acid);
B. hexanolactam or epsilon-amino caproic acid;
Two unit of above-mentioned a, b consist of: raw material a.60-80%; Raw material b.20-40%.The decamethylene diamine class belongs to a raw material.
In the specific implementation, a, b two raw materials can directly feed intake, and need not salify and make copolyamide thermosol.
Described C
6-13Diamine mainly refers to decamethylene diamine, hexanediamine, also comprises nonamethylene diamine, undecane diamines, dodecane diamines, tridecane diamines etc.The states of matter existing way of diamine comprises liquid state, sheet is solid-state, the wax shape is solid-state.With the decamethylene diamine is example, and its desirable states of matter existing way is that sheet is solid-state, very convenient in operation, and can reduce the consumption of the energy in the production.
Described C
6-13Diprotic acid comprises hexanodioic acid, nonane diacid, sebacic acid, undecane diacid, dodecanedioic acid, undecane dicarboxylic acid etc.
Described copolyamide hot melt adhesive preparation method directly adds diamine, diprotic acid, hexanolactam or epsilon-amino caproic acid, makes the copolyamide hot melt adhesive through copolyreaction.
Described copolyamide hot melt adhesive preparation method, its processing condition are that polymerization temperature is controlled at 190-290 ℃, and pressure-controlling is at 0.8-2.0Mpa, and the omnidistance time was at 4-12 hour.Processing step for feed intake, process such as nitrogen protection, intensification, heat-insulation pressure keeping, dehydration step-down, normal pressure, treat fusing point, melting index after the assay was approved, discharge, water-cooled pelletizing just make copolyamide hot melt adhesive resin of the present invention.
The copolyamide hot melt adhesive that described method makes should have following feature: fusing point 90-150 ℃, molecular weight 8000-25000, melting index are that 10-50g/10min, relative viscosity are 1.5-2.5.Best melting index is at 25-50g/10min.
The present invention needs to add auxiliary agents such as phenylformic acid, 1010 oxidation inhibitor, phosphorous acid, water when preparation copolyamide hot melt adhesive; And look arts demand and also can add compositions such as anti-aging agent, white dyes, setting accelerator, static inhibitor, sterilant and colorant.
Phenylformic acid is a kind of molecule end-capping reagent, can prevent that polycondensation from proceeding, and its consumption adjustable size joint polymericular weight is to reach control fusing point and melting index.General consumption≤5 ‰.
Antioxidant 1010, phosphorous acid all are oxidation inhibitor, and polymkeric substance is shielded.
Water is balanced agent, and the polymer molecule quality is played proportionality action.
White dyes has whitening effect to hot melt adhesive, and gives the hot melt adhesive fluorescent characteristic.
Colorant plays painted effect.
Embodiment
Embodiment 1:
Proportioning raw materials is as follows:
Decamethylene diamine, sebacic acid 45 mass ratioes (mol ratios such as sebacic acid and decamethylene diamine)
Hexanolactam 30 mass ratioes
Nylon salt 25 mass ratioes (or mol ratios such as hexanediamine and hexanodioic acid add)
Benzoyl≤5 ‰
Suitable quantity of water, antioxidant 1010, phosphorous acid etc.
Feed intake by said ratio, be evacuated to-0.098Mpa, nitrogen replacement three times is warming up to 230 ℃, pressure 1.4Mpa, pressurize is after 2 hours, and slowly step-down was reduced to normal pressure in 3 hours, temperature rises to 240 ℃, continues reaction 2 hours, discharge, and the water-cooled pelletizing gets copolyamide hot melt adhesive resin.The index detected result is:
Fusing point: 110-120 ℃
Melting index: 〉=30g/10min
Molecular weight: 18000-20000
Relative viscosity: 1.8
Embodiment 2:
Proportioning raw materials is as follows:
Decamethylene diamine, sebacic acid 35 mass ratioes (mol ratios such as sebacic acid and decamethylene diamine)
NYLON610 salt 15 mass ratioes (or mol ratios such as hexanediamine and sebacic acid)
Nylon salt 20 mass ratioes
Hexanolactam 30 mass ratioes
Suitable quantity of water, antioxidant 1010, phosphorous acid etc.
Feed intake by said ratio, be evacuated to-0.098Mpa, nitrogen replacement three times is warming up to 220 ℃, pressure 1.3Mpa, pressurize is after 2.5 hours, and slowly step-down was reduced to normal pressure in 3 hours, temperature rises to 230 ℃, continues reaction 2.5 hours, discharge, and the water-cooled pelletizing gets copolyamide hot melt adhesive resin.The index detected result is:
Fusing point: 100-110 ℃
Melting index: 〉=40g/10min
Molecular weight: 15000-18000
Relative viscosity: 1.6
Prepared copolymerization particle need carry out drying, to guarantee moisture≤1.5%, then adopts liquid nitrogen freezing machine deep cooling to pulverize, and makes hot-melt adhesive powder.According to different application demands, the thermosol rubber powder of pulverizing is carried out the arrangement of order number, generalized case is:
Two point powder: 80-160um
Slurry point powder: 0-80um
Powder point powder: 0-160um
The hot melt adhesive main performance index that the present invention makes adopts following method test:
1. the mensuration of stripping strength
Flexible material and flexible material adherent T shape detection method according to the GB/T-2791-1995 standard code.
Sample production is pressed the method preparation that hot melt adhesive factory is recommended, and is bonding by sticking sample and make the glue blowization.General sample size is 200 * 250mm.Peeling rate carries out with (100 ± 10) mm/min, tests 5 times, averages.
2. fusing point (melting range) is measured
Adopt micro melting point apparatus.The sample that takes a morsel is measured through behind the careful porphyrize.Will examine sample variation during detection: the temperature that the crystal corner angle begin to become bowlder is initial melting temperature, and the temperature during the crystal completely dissolve is whole melting temperatur, repeats 2-3 time.
3. melt index determination
The employing melt indexer is measured.The 4-8g that materialses places in the barrel, and heating 5-6min makes sample fusion (about 140 ℃), and the 2.16kg that raises the price on piston top then gets 5 tangent planes and calculates.
4. relative viscosity is measured
Hot melt adhesive is dissolved in the solution that is made into 1%wt to cresols, adopts single capillary viscosimeter to record the time that solution and solvent streams are crossed, do ratio, promptly get relative viscosity.
Although above embodiment describes the present invention, the present invention is not limited to this, under the aim that does not depart from the scope of the invention and spirit, can make all distortion, interpolation and modification.Other embodiment of those skilled in the art is also within the scope of the invention.
Claims (6)
1. the application of decamethylene diamine product in the preparation of copolyamide hot melt adhesive is characterized in that:
1. decamethylene diamine does not need salify, and the participation copolymerization that directly feeds intake makes hot melt adhesive;
2. the copolymerization hot melt adhesive can be that ternary is formed, and can also be polynary composition;
3. the copolymerization hot melt adhesive generally contains two elementary cells of a, b:
A. two kinds or multiple C
6-13Diamine and two kinds or multiple C
6-13Diprotic acid (mol ratios such as amine, acid);
B. hexanolactam or epsilon-amino caproic acid;
Two unit of above-mentioned a, b consist of: raw material a.60-80%; Raw material b.20-40%.The decamethylene diamine class belongs to a raw material.
2. as claims 1 described copolyamide hot melt adhesive preparation method, it is characterized in that: C
6-13Diamine comprises decamethylene diamine, hexanediamine, nonamethylene diamine, undecane diamines, dodecane diamines, tridecane diamines.
3. as claims 1 described copolyamide hot melt adhesive preparation method, it is characterized in that: C
6-13Diprotic acid comprises hexanodioic acid, nonane diacid, sebacic acid, undecane diacid, dodecanedioic acid, undecane dicarboxylic acid etc.
4. as claims 1 described copolyamide hot melt adhesive preparation method, it is characterized in that: directly add diamine, diprotic acid, hexanolactam or epsilon-amino caproic acid, make the copolyamide hot melt adhesive through copolyreaction.
5. as claims 1 or 2 described copolyamide hot melt adhesive preparation methods, it is characterized in that: polymerization temperature is controlled at 190-290 ℃, and pressure-controlling is at 0.8-2.0Mpa, omnidistance 4-12 hour.
6. as claims 1 or 2 or 3 described copolyamide hot melt adhesive preparation methods, it is characterized in that: the copolyamide hot melt adhesive that makes: fusing point is 90-150 ℃, molecular weight is 8000-30000, and melting index is 10-50g/10min, and relative viscosity is 1.5-2.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100857994A CN100560677C (en) | 2006-07-03 | 2006-07-03 | The application of decamethylene diamine product in the preparation of copolyamide hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100857994A CN100560677C (en) | 2006-07-03 | 2006-07-03 | The application of decamethylene diamine product in the preparation of copolyamide hot melt adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1884419A true CN1884419A (en) | 2006-12-27 |
| CN100560677C CN100560677C (en) | 2009-11-18 |
Family
ID=37582726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100857994A Active CN100560677C (en) | 2006-07-03 | 2006-07-03 | The application of decamethylene diamine product in the preparation of copolyamide hot melt adhesive |
Country Status (1)
| Country | Link |
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| CN (1) | CN100560677C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103254425A (en) * | 2012-02-17 | 2013-08-21 | 上海东睿化学有限公司 | Blocked copolyamide hot melt adhesive and preparation method thereof |
| CN103525357A (en) * | 2013-10-23 | 2014-01-22 | 上海天洋热熔胶有限公司 | Preparation method of amino inhibited polyamide hot melt adhesive |
| CN105504271A (en) * | 2016-02-03 | 2016-04-20 | 温州华特热熔胶有限公司 | Low-melting-point copolyamide hot melt adhesive for clothes and processing method thereof |
| CN117050716A (en) * | 2023-09-26 | 2023-11-14 | 上海东睿化学有限公司 | Copolyamide hot melt adhesive and preparation method thereof |
-
2006
- 2006-07-03 CN CNB2006100857994A patent/CN100560677C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103254425A (en) * | 2012-02-17 | 2013-08-21 | 上海东睿化学有限公司 | Blocked copolyamide hot melt adhesive and preparation method thereof |
| CN103254425B (en) * | 2012-02-17 | 2016-08-17 | 上海东睿化学有限公司 | End-blocking copolyamide PUR and manufacture method thereof |
| CN103525357A (en) * | 2013-10-23 | 2014-01-22 | 上海天洋热熔胶有限公司 | Preparation method of amino inhibited polyamide hot melt adhesive |
| CN105504271A (en) * | 2016-02-03 | 2016-04-20 | 温州华特热熔胶有限公司 | Low-melting-point copolyamide hot melt adhesive for clothes and processing method thereof |
| CN117050716A (en) * | 2023-09-26 | 2023-11-14 | 上海东睿化学有限公司 | Copolyamide hot melt adhesive and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100560677C (en) | 2009-11-18 |
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Denomination of invention: Use of decamethylene diamine in preparing copolyamide hot sol Effective date of registration: 20151229 Granted publication date: 20091118 Pledgee: Wuxi rural commercial bank Limited by Share Ltd Pledgor: Xingda Wuxi nylon Co., Ltd.|Wuxi Yin Da nylon Co., Ltd. Registration number: 2015990001196 |
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Denomination of invention: Use of decamethylene diamine in preparing copolyamide hot sol Effective date of registration: 20181123 Granted publication date: 20091118 Pledgee: Wuxi rural commercial bank Limited by Share Ltd Pledgor: Wuxi Yinda Nylon Co., Ltd.|Xingda Nylon Co., Ltd., Wuxi City Registration number: 2018990001110 |
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