CN1883950A - Head module, liquid ejection head, liquid ejection apparatus, and method of fabricating head module - Google Patents
Head module, liquid ejection head, liquid ejection apparatus, and method of fabricating head module Download PDFInfo
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- CN1883950A CN1883950A CN 200610106488 CN200610106488A CN1883950A CN 1883950 A CN1883950 A CN 1883950A CN 200610106488 CN200610106488 CN 200610106488 CN 200610106488 A CN200610106488 A CN 200610106488A CN 1883950 A CN1883950 A CN 1883950A
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Abstract
A head module includes a nozzle sheet, a wiring board, and a module frame having a plurality of head-chip positioning holes formed therein, and a head chip including an electrode. The head chip is disposed in each head-chip positioning hole. The nozzle sheet is disposed on a first surface of the module frame so as to partially cover the head-chip positioning hole. The size of the nozzle sheet is set to a minimum size required for partially covering the head-chip positioning hole. The head chip is disposed from a second surface of the module frame. The electrode is exposed through an area of the head-chip positioning hole not covered by the nozzle sheet. An electrode of the wiring board is electrically connected to the electrode of the head chip and the wiring board is disposed on the first surface of the module frame so as to cover the exposed electrode.
Description
Technical field
The present invention relates to be included in head module in the jet head, use the jet head of this head module, the method for using the liquid-jet device of this head module and making this head module.Especially, the present invention relates to reduce the technology of nozzle surface of the foxy module of technology peace of head module material cost.
Background technology
Ink-jet printer is the example of well-known liquid-jet device.The technology of the used head (jet head) of multiple relevant ink-jet printer has been proposed.
For example, describe among the Japan Patent No.3608526 with a plurality of chip join to the nozzle piece to form the technology of line head.
In this technology that Japan Patent No.3608526 describes, a plurality of nozzles (inkjet mouth) are formed on the nickel nozzle piece of making by the electroforming mode.Afterwards, a plurality of chips are engaged on the nozzle piece.And then the framework with hole is engaged on the nozzle piece, so that engaged chip surrounded by the hole, and makes nozzle piece head of a quilt frame supported.
In addition, Japanese Unexamined Patent Application No.2005-131948 has described a kind of technology that a jet head is divided into a plurality of head modules.After making head module, the head module that makes is arranged to form jet head.
In the described technology of Japanese Unexamined Patent Application No.2005-131948, nozzle piece joins on each head module, attached four stature chips on each head module.
In the described technology of Japan Patent No.3608526,, can improve the positional precision that each nozzle is set because a nozzle piece forms a jet head.Yet there is weak point in this technology, that is, the increase of nozzle piece size has reduced the intensity of nozzle piece, therefore, and nozzle piece easy deformation and damage.In addition, if a part of nozzle piece or a part of jet head are owing to moving of the installation site of a chip is damaged, then whole jet head all lost efficacy.Therefore, be difficult to management manufacturing process, thus, produce in enormous quantities very difficult.In addition, from the angle of safeguarding, even that damage or out of order chip is the division header chip, whole jet head all must be changed.Make efficient reduce and need the maintenance cost of burden great number like this.
On the contrary, be in the described technology of Japanese Unexamined Patent Application of No.2005-131948 at publication number, because jet head is divided into a plurality of head modules, can only replace defectiveness or out of order head module with new head module.Therefore, this jet head is suitable for producing in batches.In addition, this jet head has the advantage that is easy to safeguard.
Nozzle piece is the thin layer that is formed by metal, for example nickel.Nozzle piece is by for example mode retrofit of electroforming.Therefore, publication number is that the described technology of the Japanese Unexamined Patent Application of No.2005-131948 is compared with the described technology of Japan Patent No.3608526, needs manufacturing cost still less.Yet because a nozzle piece joins on the module frame, the cost of nozzle piece is still very high.
In addition, as above-mentioned Japan Patent No.3608526, publication number is that the Japanese Unexamined Patent Application of No.2003-175609 and Japanese Unexamined Patent Application that publication number is No.2004-223878 are described, a rigidity framework of the head of ink-jet printer (jet head) is used for the support nozzle sheet, is arranged with a plurality of nozzles that are used to spray China ink in the nozzle piece.In addition, a chip and the energy generating element (for example, heating element heater) with the gate spacer layers that is used to form liquid chamber is installed on the nozzle piece.Wiring plate connects to the end on the chip.The order that die response is sent from printer controller drives energy generating element the China ink in the liquid chamber is applied jet power.Like this, from nozzle ejection China ink, thus print image.
In this head, adopt spun gold (welding wire) that the electrode of proximity heads chip is connected on the terminal of adjacent wire plate.Interconnection is that the opening that utilizes engagement device to be passed in to form in the nozzle piece is realized.The opening that is provided is used to realize electrical interconnection.Thereby the opening setting makes spun gold pass the wiring plate that opening arrival is arranged on the nozzle piece back side from the front surface of nozzle piece.If opening is opened all the time, a large amount of China inks or dust enter in the head, therefore, can be short-circuited or pollute in head.Therefore, after interconnection was finished, the sealing opening polluted the inside of head to avoid foreign particle.Opening is by resin-sealed dose of sealing, makes the resin-sealed dose of spun gold that encirclement is exposed from opening.When opening was sealed by resin-sealed dose, spun gold and coupling part thereof were fixed by resin.Thereby, avoided head to be polluted by foreign particle.In addition, avoided spun gold to disconnect owing to vibrating or impacting.
Yet, forming opening with the interconnection of implementing electricity and wire bond (wire bonding) is finished after in the method for this opening of sealing, manufacturing process's quantity increases, therefore, the manufacturing cost increase.Another problem is the resin-sealed dose of projection from the surface imperfection of nozzle piece ink-jet side (nozzle surface).Resin-sealed dose of clean operation that hinders nozzle surface of this projection.
Therefore, above-mentioned head also needs resin-sealed operation with spun gold fixing and the protection interconnection except needs wire bond operation.Thereby increased the quantity of manufacturing process.Therefore, manufacturing cost increases.In addition, extensive use is cleaned to safeguard the ink-jet printer of jet performance nozzle surface.In clean operation, cleaning element (for example roller or scraping blade) is sliding to remove the impurity that is deposited on the nozzle surface on the nozzle surface.Nozzle surface is preferably smooth, so that cleaning element is pressed to the contact pressure of nozzle surface is even.Yet in above-mentioned head, because resin-sealed dose from nozzle surface projection partly, clean-up performance is lowered.
Summary of the invention
Therefore, the invention provides a kind of head module, a kind of jet head, a kind of liquid-jet device and a kind of head module processing method,, reduce the distortion and the damage of nozzle piece so that reduce the cost of head module material therefor, and the nozzle surface of level and smooth head module.
According to embodiments of the invention, head module comprises a chip, nozzle piece, wiring plate and module frame.Electrode to be connected on chip comprises a plurality of energy generating element, gate spacer layers and is arranged on semiconductor substrate with external electric.Energy generating element is with the predetermined space arrangement of roughly embarking on journey, and gate spacer layers forms liquid chamber around energy generating element.Nozzle piece has the nozzle that is formed at wherein.Wiring plate is electrically connected the electrode of chip to the end, and module frame has a plurality of chip locating hole that is formed at wherein.The size of each the chip locating hole all size than a chip is big slightly, and a chip is arranged in the stature chip locating hole.Provide jet power that the liquid in the liquid chamber is sprayed from nozzle by energy generating element to liquid.Nozzle piece is arranged on the first surface of module frame, thereby nozzle is positioned in the chip locating hole, and nozzle piece partly covers a chip locating hole, and the size of nozzle piece is confirmed as part and covers a required minimum dimension of chip locating hole.Chip is arranged on the second surface of module frame, thereby makes a chip be arranged in a chip locating hole, and energy generating element is in the face of nozzle corresponding with it.Expose in the zone that is never covered by nozzle piece that is arranged on the electrode tip chip locating hole of the chip in the chip locating hole.The electrode of wiring plate is electrically connected the electrode of chip to the end, and wiring plate is arranged on the first surface of module frame to cover the electrode that exposes of a chip.
According to another embodiment of the present invention, the method for making head module comprises following operation.Head module comprises a plurality of energy generating element, gate spacer layers and is arranged on the electrode to be connected with external electric on the semiconductor substrate.Energy generating element is with the predetermined space arrangement of roughly embarking on journey.Gate spacer layers forms liquid chamber around energy generating element.Nozzle piece has the nozzle that is formed at wherein.Wiring plate is electrically connected the electrode of chip to the end, and module frame has a plurality of chip locating hole that is formed at wherein, and a chip is arranged in the stature chip locating hole.Provide jet power that the liquid in the liquid chamber is sprayed from nozzle by energy generating element to liquid.Described method comprises operation: (a) in first temperature environment, the engagement nozzle sheet is to the first surface of module frame, so that nozzle is positioned in the chip locating hole, and make nozzle piece partly cover a chip locating hole, (b) be lower than in second temperature environment of temperature of first environment in temperature, the engagement head chip is to the second surface of module frame, so that a chip is positioned in the chip locating hole, and enable volume production and give birth to component side pair nozzle corresponding with it, (c) the installation wiring plate to the first surface of module frame so that the electrode of wiring plate be electrically connected the electrode of chip to the end and (d) covering join the end of the nozzle piece and the wiring plate of module frame to.
Description of drawings
Fig. 1 is the plane according to the jet head of the embodiment of the invention from the hydrojet surface observation of jet head;
Fig. 2 be from the plane of the surface observation jet head of hydrojet surface opposite;
Fig. 3 is the sketch that is provided with the jet head of control panel in the front side of as shown in Figure 2 jet head;
Fig. 4 is the one of the head chip in the chip and the cutaway view of near zone thereof;
Fig. 5 A-5C is the plane of module frame manufacturing process;
Fig. 6 be with nozzle piece and a chip join to module frame and flexible distributing board is joined to the plane of the head module behind the head module;
Fig. 7 is the perspective view of a chip, nozzle piece and flexible distributing board;
Fig. 8 is the plane of flexible distributing board and buffer memory container;
Fig. 9 is the cutaway view according to the near zone of a chip of the method manufacturing of the embodiment of the invention and this chip;
Figure 10 is the plane that has engaged over cap on module frame, nozzle piece and flexible distributing board;
Figure 11 is the cutaway view of employing according to a chip and near zone thereof in the jet head of the method manufacturing of the embodiment of the invention; With
Figure 12 is the plane that forms over cap on module frame, nozzle piece and flexible distributing board;
The specific embodiment
Below with reference to respective drawings exemplary embodiments of the present invention is described.Fig. 1 is the plane according to the jet head 1 of embodiments of the invention from the hydrojet surface observation.Fig. 2 be from the plane of the surface observation jet head 1 of hydrojet surface opposite; Fig. 3 shows the sketch that is provided with the jet head of control panel 4 in the front side of as shown in Figure 2 jet head 1.
Jet head 1 is mounted in the head of (being colored line ink-jet printer in this embodiment) in the liquid-jet device.As shown in Figure 1, jet head 1 comprises a framework 2, flexible distributing board 3, and a plurality of head module 10.Shown in the plane of Fig. 1, in head module locating hole 2a, two head modules 10 in the length direction serial together.Two head modules 10 cover the width of A4 size paper, thus printable monochrome image.Four lines is set altogether, and every row comprises dual serial head module 10 together, thereby forms the jet head 1 of (Y, M, C and the K) of printable four kinds of colors.
Each head module 10 comprises eight stature chips 20.Fig. 4 is the one of the head chip in the chip 20 and the cutaway view of near zone thereof.
Each chip 20 comprises the semiconductor substrate of being made by silicon for example 21, and the heating element heater 22 that the mode by deposit forms on semiconductor substrate 21.Heating element heater 22 is corresponding to the energy generating element of the embodiment of the invention.Heating element heater 22 is formed on the marginal surface of semiconductor substrate 21.With another the relative edge of edge that forms heating element heater 22, electrode 23 is formed on the surface of semiconductor substrate 21.
On the surface of a chip 20 that is formed with heating element heater 22, piling up has gate spacer layers 24 and nozzle piece 25.Gate spacer layers 24 forms the sidewall of black chamber (pressurised chamber) 26.Gate spacer layers 24 also makes a chip 20 (hereinafter describing) couple together with nozzle piece 25.Gate spacer layers 24 is formed by for example photosensitive thermoprene resist or exposure-sclerosis dry film photoresist.After photosensitive thermoprene resist or exposure-sclerosis dry film photoresist being applied the whole surface of the semiconductor substrate that is formed with heating element heater 22 21 of chip 20 to the end, will not need part to remove by photoetching process, thereby form gate spacer layers 24.In addition, in plane, gate spacer layers 24 has roughly the shape as printer's letter U, its in four sides of heating element heater 22 three.
In addition, a plurality of nozzle 25a are formed on the nozzle piece 25.For example, the method by electroforming forms nozzle 25a with nickel.Nozzle piece 25 is engaged on the gate spacer layers 24, thereby makes the position of nozzle 25a and the position alignment of heating element heater 22, that is, nozzle 25a is in the face of heating element heater 22, and more specifically, in plane, the central shaft of nozzle 25a overlaps with the central shaft of heating element heater 22.
Usually, each chip 20 comprises 100 groups of heating element heaters 22.The order that response is sent from printer control module (not shown), each heating element heater 22 all can be selected, and spray among the nozzle 25a relative with this China ink chamber 26 with Mo Kecong in the corresponding black chamber 26 of selected heating element heater 22.
That is, when black chamber 26 is filled with China ink, for example pulse current etc. at short notice (for example, 1 to 3 second) be applied on the heating element heater 22.Like this, heating element heater 22 produces heat fast.Thereby, produce the China ink bubble with heating element heater 22 contacted China inks.The China ink (China ink boiling) of certain volume is discharged in the expansion of China ink bubble.The China ink that has with the displaced volume equal volume sprays from nozzle 25a with ink droplets.Therefore, by on record-paper, precipitating ink droplet, form point (pixel).
Be described in more detail below the structure and the manufacturing process of head module 10.Fig. 5 A is the plane of module frame 11.According to present embodiment, head module 10 comprises module frame 11, eight stature chips 20, nozzle piece 25 and buffer memory container 12.
In plane, module frame 11 has the shape of essentially rectangular.Module frame 11 all has standing part 11a in left side and right side.Standing part 11a is cut the roughly part of L-shaped shape.
In addition, on module frame 11, be formed with two installing hole 11d.Installing hole 11d is used on the head module 10 fixing frameworks 2 to the end.In addition, in module frame 11, be formed with recessed container 11c (among Fig. 5 A shown in the hacures) with outward flange around each chip locating hole 11b.
Fig. 5 A-5C shows and joins nozzle piece 25 on the module frame 11 manufacturing process.Shown in Fig. 5 B, sticker 14 is applied to (being printed onto) edge region surrounded by a chip locating hole 11b and recessed container 11c.When nozzle piece 25 was engaged on the module frame 11, the zone that applies sticker 14 had the size roughly the same with the outward flange size of nozzle piece 25.
After applying sticker 14, nozzle piece 25 is engaged on the module frame 11 (sees Fig. 5 C).At this moment, part sticker 14 enters recessed container 11c inside, is absorbed by recessed container 11c.
In addition, nozzle piece 25 is engaged on the module frame 11, thereby covers the part zone of a chip locating hole 11b.In addition, the size of nozzle piece 25 is confirmed as being supported required minimum nozzle piece 25 sizes by module frame 11.Therefore, when nozzle piece 25 was engaged on the module frame 11, nozzle piece 25 only covered the part zone of a chip locating hole 11b and the zone that applies sticker 14.That is, nozzle piece 25 has minimum dimension, thereby covers the subregion of a required chip locating hole 11b and have minimum adhesion area.
In addition, in the present embodiment, nozzle piece 25 engages by the mode of the thermal bonding of employing hot pressing.Carry out (for example, about 150 ℃ :) under the maximum temperature condition of this bonding operation in the operation of making head module 10 and jet head 1 according to first temperature environment of the embodiment of the invention.Module frame 11 is compared with nozzle piece 25, and nozzle piece 25 has the linear expansion coefficient higher than module frame 11 (just, nozzle piece 25 is easier to expand and shrink along with variation of temperature).Therefore, to module frame 11, under the temperature conditions lower than maximum temperature (for example, room temperature), nozzle piece 25 is by module frame 11 expansions by engagement nozzle sheet 25 under the maximum temperature condition in manufacturing process.
That is, after nozzle piece 25 is engaged on the module frame 11, the expansion of the nozzle piece 25 that causes by variations in temperature and shrink and controlled by module frame 11.
Therefore, in order farthest to guarantee the rigidity of module frame 11, wish that the aperture area of a chip locating hole 11b of module frame 11 keeps required minimum of a value.Consequently, the size of a chip locating hole 11b is bigger slightly than the size of a chip 20.
Through hole is embarked on journey to arrange and is formed nozzle 25a.Each through hole is respectively in the face of each heating element heater 22 in the stature chip 20.Therefore, the quantity of the heating element heater 22 in the quantity of through hole and the stature chip 20 is consistent.
In order to form nozzle 25a, can use excimer laser.Because the nozzle 25a that forms by laser beam is taper, when forming nozzle 25a, on the surface of laser beam directive nozzle piece 25 proximity modules frameworks 11.Like this, nozzle 25a is tapered, thereby makes the diameter of opening of through hole reduce gradually towards ink discharging surface (outer surface of nozzle piece 25).
Embark on journey and arrange and be in the pitch that pitch between each nozzle 25a among the chip locating hole 11b is confirmed as between each heating element heater 22 with a chip 20 and (for example equate, when formation has the head module 10 of resolution ratio of 600dpi, the about 42.3 μ m of pitch).
In addition, shown in Fig. 5 C, the nozzle 25a in each chip locating hole 11b embark on journey (that is, the row at the center by nozzle 25a) form, thereby make the center line of the contiguous described module frame 11 of formed row along its length direction.Chip locating hole 11b is defined as " N1 " from the left side right overhead, " N2 ", " N3 ", ... when " N8 ", be defined as " N1 ", " N3 ", the formed row of nozzle 25a among the chip locating hole 11b of " N5 " and " N7 " is positioned on the line that parallels with the center line of above-mentioned module frame 11.Similarly, be defined as " N2 ", " N4 ", the formed row of nozzle 25a among the chip locating hole 11b of " N6 " and " N8 " is positioned on the line that parallels with the center line of above-mentioned module frame 11.
Therefore, the formed row of nozzle 25a in two adjacent chip locating hole 11b, for example, the formed row of nozzle 25a in " N1 " and " N2 " is positioned at respectively on two lines that parallel with center line.
In the present embodiment, eight stature chip locating hole 11b are formed in the module frame 11.Yet,, also preferably satisfy above-mentioned position relation even be less than a chip locating hole 11b of eight or be formed in the module frame 11 more than a chip locating hole 11b of eight.
Subsequently, a chip 20 that is formed with gate spacer layers 24 thereon is provided with and is fixed among the stature chip locating hole 11b.This operates in second temperature environment and carries out, and described second temperature environment is meant keeps the temperature lower than first temperature environment (for example, room temperature (about 25 ℃)).Under this condition, gate spacer layers 24 is engaged on the nozzle piece 25.Here, a chip 20 is positioned by using the substrate installing rack, and engages by the mode of hot press.In addition, a chip 20 is engaged, make nozzle 25a be located in a chip 20 heating element heater 22 under and keep approximately ± precision of 1 μ m.
As mentioned above, when a chip 20 that is formed with gate spacer layers 24 thereon is arranged among the chip locating hole 11b, and when nozzle piece 25 was engaged to the end on the chip 20, the surface of the nozzle piece 25 of proximity heads chip 20, gate spacer layers 24 and the surface that is formed with a chip 20 of heating element heater 22 on it formed black chamber 26 together.
In addition, when chip 20 was engaged on the nozzle piece 25 right overhead, the electrode 23 of a chip 20 was exposed on the outside (see figure 4) that is not covered by nozzle piece 25.Therefore, after a chip 20 is provided with to the end among the chip locating hole 11b, can forms with a chip 20 and effectively be electrically connected.
Therefore, the electrode 23 that is formed on the chip 20 is connected (electrical connection) with flexible distributing board 3.This operation also is to carry out in the 3rd temperature environment, and the 3rd temperature environment is meant keeps the temperature lower than first temperature (for example, room temperature (about 25 ℃)).Fig. 6 joins a nozzle piece 25 and a chip 20 on the module frame 11 to, and flexible distributing board 3 is joined to the plane of the head module 10 behind the head module 10.For the ease of understanding this figure, a chip 20 that joins the back side to adopts solid line (hacures) expression.
As shown in Figure 7, flexible distributing board 3 is made by go up formation copper-film wiring diagram 3a in flexible film substrate (for example polyimide film substrate).Flexible circuit board 3 has at the structure that copper film for example is set between the two membranes by the polyimides manufacturing (well-known sandwich structure).Two flexible distributing boards 3 are attached on the head module 10.Four stature chips 20 are arranged in rows, and two row are arranged in parallel.Flexible distributing board 3 is attached to each row.As shown in Figure 7, copper-film circuit layout card 3a is formed on the flexible distributing board 3.Copper-film wiring diagram 3a contacts with electrode 23.At this moment, flexible distributing board 3 is connected on the head module 10, thus the outer edge that makes nozzle piece 25 in the outward flange of flexible distributing board 3 near position contacting.
As shown in Figure 4, the electrode 23 of a chip 20 is by anisotropic conducting film 28 be connected with flexible distributing board 3 (ACF is connected).
After electrode 23 was connected on the flexible distributing board 3, resin 29 (for example, epoxy resin) was applied to the slit that is arranged between a chip 20 and the module frame 11 (at the opposite side of flow path channel 27), thereby makes anisotropic conductive film 28 sealed.This structure has avoided causing that owing to the intrusion of China ink electricity activates the short circuit of part that invading China ink is that the near zone of a chip 20 (upper area shown in Figure 4) is filled with the cause of China ink because in the process of using head module 10.In addition, slit-shaped is formed between the outward flange of the outward flange of flexible distributing board 3 and nozzle version 25.Apply resin 30 and stretch, to cover this slit with sidepiece from adjacent nozzles sheet 25.That is, seal this slit.
Here, as shown in Figure 9, conductive particle can be sneaked in the cement 14.In this case, at the exposing surface of wiring diagram 3a, promptly and between the external margin of nozzle piece 25 form small gap, the exposing surface of described wiring diagram 3a is meant the external margin (cross-sections surfaces) of flexible distributing board 3.Then, use the conduction sticker that flexible distributing board 3 is fixed to (see figure 9) on the module frame 11.
By adopting above-mentioned ACF to connect, known essential wire bond operation can be omitted.In addition, be used for fixing and protect the resin-sealed operation of spun gold of interconnection also can be omitted.Further, the projection of the resin sealing portion of wire bond can be eliminated.
Therefore, ACF connects the nozzle surface that can reduce manufacturing cost and no sealing resin projection can be provided.Yet, say exactly, as shown in Figure 7, by nozzle piece 25 and flexible distributing board 3 being joined to the nozzle surface that forms on the surface of module frame 11 in the end of nozzle piece 25 and to have highly be the step part of tens μ m at the place, end of flexible distributing board 3, described height is the thickness of nozzle piece 25 or flexible distributing board 3.Though this step part and resin sealing portion and different height, the crestal line of end forms each edge, and therefore, in the process of clean surface, when roller or scraping blade moved through step part, roller or scraping blade were easy to be blocked by this step part.Thereby the nozzle piece 25 or the flexible distributing board 3 that are blocked by roller or scraping blade may peel off from module frame 11.In addition, when moving through this step part, roller or scraping blade also may be damaged.
Usually, when not working right overhead, nozzle surface is covered by the skull (not shown).Skull can protect nozzle surface to be damaged and to avoid China ink dry to avoid nozzle surface.Some skull comprises the black absorbing mechanism that is used to absorb China ink, to avoid black plug nozzle 25a.In order to make the advantage maximization of these features, skull is formed by elastomeric material, for example rubber.Skull is designed to keep air-tightness when skull covering nozzles surface.Yet,, can't keep air-tightness if skull is arranged on the step part of nozzle surface.
Further, engage and be fixed in the structure on the module frame 11 at flexible distributing board 3, owing to have the slit between the side surface of wiring diagram 3a and nozzle piece 25, the side surface that connects the wiring diagram 3a on the electrode 23 of chip 20 to the end is exposed to the outside.If conductive ink or dust are deposited to side surface, then can be short-circuited.
Further, when nozzle surface (for example is used to make the stainless steel of module frame 11 by engaging different materials, be used to make the nickel of nozzle piece 25, when and the polyimides that is used to make flexible distributing board 3) forming, because the wettability difference of different materials, the surface state of nozzle surface will change according to the position.In addition, if the difference between wettability is big, the China ink amount difference of diverse location place precipitation on the nozzle surface.Like this, near nozzle 25a, will produce black hydrops.If black hydrops appear at nozzle 25a near, it is unstable that inkjet direction becomes.Like this, record (image) quality obviously worsens.For example, excalation can appear in the character of the printing image that can be out of shape or print.In addition, owing to the China ink amount skewness that is deposited on the nozzle surface, the distribution that is deposited in the pollutant on the nozzle surface is also inhomogeneous.Like this, clean-up performance becomes unstable.
As mentioned above, the end of the end of nozzle piece 25 and flexible distributing board 3 (step part of nozzle surface) hindered clean operation and overlapping operation.In addition, the slit of the exposing surface of adjacent wire Fig. 3 a (cross-sections surfaces) can cause short circuit.Further, if nozzle surface is formed by different materials, wettability difference then.Like this, inkjet performance and clean-up performance all can reduce.
In order to solve these problems relevant with the nozzle surface structure, over cap 30 can join on the nozzle surface.Figure 10 is the plane that has engaged over cap 30 on module frame 11, nozzle piece 25 and flexible distributing board 3.As shown in figure 10; over cap 30 has covered and has removed nozzle 25a and nozzle 25a adjacent domain (promptly; be defined as the zone of opening portion 30a) outside other zone of nozzle piece 25; other zone of module frame 11 except that the adjacent domain of installing hole 11d and installing hole 11d, and flexible distributing board 3 and module frame 11 equitant parts.In this embodiment, over cap 30 forms by following mode: the thermosetting cement is applied to the composition surface that (being printed onto) has the flexible polyimide film (see figure 9) of high-fire resistance, high-insulativity; This polyimide film is engaged to nozzle surface; And by heating, polyimide film is by thermmohardening and be fixed on nozzle surface.Opening portion 30a has the size that can in the process of clean operation the nozzle surface dust is removed, and is the substantially elliptical shape, makes that roller or scraping blade are easy to move on opening portion 30a.
Over cap (bonding polyimide film) 30 covers and the end of protection nozzle piece 25 and the end of flexible distributing board 3, thereby makes the edge of nozzle piece 25 and the edge cover lid of flexible distributing board 3.Like this, the height of the step part of nozzle surface is lowered.Further, the slit between the outward flange of the outward flange of flexible distributing board 3 and nozzle piece 25 is capped.Therefore, when roller or scraping blade move through step part cleaning nozzle surface, can reduce the probability that probability that nozzle piece 25 or flexible distributing board 3 peel off and roller or scraping blade damage.In addition, situation about being short-circuited on the exposing surface (cross-sections surfaces) of the wiring diagram 3a that can eliminate at flexible distributing board 3.In addition, because step part becomes the gentle slope part, having general flexible skull (not shown) can be with this gentle slope partial shape modification.Like this, can guarantee the air-tightness of skull.In addition, because the surface (except the part of adjacent nozzles 25a) of nozzle piece 25, flexible distributing board 3 and module frame 11 can adopt same material (polyimide resin) to form, the wettability of any position of nozzle surface is roughly consistent.Like this, can improve recording quality and also stablize clean-up performance.
It should be noted that China ink comprises ionic material, as being convenient to detect the employed conductive agent of residual China ink amount.Therefore, as shown in Figure 9, the slit that is positioned between a chip 20 and the module frame 11 (opposition side of passage 27) is sealed by resin 29 (for example, epoxy resin), causes that to prevent China ink electricity activates the short circuit of part.
Thereafter, shown in Fig. 4 and 8, thereby buffer memory container 12 is engaged the top that covers a chip 20.Fig. 8 shows the plane of buffer memory container 12 and flexible distributing board 3.
As shown in Figure 8, in plane, buffer memory container 12 has the shape roughly the same with module frame 11.As shown in Figure 4, be formed with the liquid flow path (in Fig. 4, illustrating) of hollow with the site in buffer memory container 12 inside.Especially, according to present embodiment, buffer memory container 12 in the bottom (in a side of the composition surface of proximity modules framework 11) by opening.The sidewall of buffer memory container 12 and roof have same thickness.The cross sectional shape of buffer memory container 12 is inverted U-shaped roughly.
As shown in Figure 8, after buffer memory container 12 was attached on the module frame 11, buffer memory container 12 covered all chip locating hole 11b.Simultaneously, as shown in Figure 4, via the flow channel 27 between a chip locating hole 11b and a chip 20, the inside of buffer memory container 12 is communicated with the black chamber 26 of each chip 20.Like this, buffer memory container 12 has formed the shared liquid flow conduits of all chips 20 of head module 10.
On the roof of buffer memory container 12, form the hole (not shown).China ink is fed to the inside of buffer memory container 12 from the print cartridge (not shown) by this hole.
Therefore, according to present embodiment, jet head 1 comprises a plurality of head modules 10.
As shown in Figure 1, head module locating hole 2a is formed in the rigidity framework 2.According to present embodiment, in head module locating hole 2a, be provided with eight head modules 10 (two head modules 10 together, and four pairs of serials head module 10 together is arranged to four row) by serial.By screw that each head module 10 is fixing, thus make the fixed-site of each head module 10.
In Fig. 2, show the buffer memory container 12 of eight head modules 10.Buffer memory container 12 by 13 serials of U-shaped pipe together.For each head module 10, two of flexible distributing board 3 connect end (dashed area among Fig. 2) and extend perpendicular to plane shown in Figure 2.
As shown in Figure 3, adopt screw 5, be used to control the surface that buffer memory container 12 is installed that control panel 4 that liquid sprays is fixed to its higher authorities' framework 2.On control panel 4, be provided with multiple capacitor and the connector 4a that is used for being connected with flexible distributing board 3.In the adjacent domain of connector 4a, be formed with notch portion 4b.The top of flexible distributing board 3 pass notch portion 4b from the lower surface of control panel 4 to extending to upper surface.This top is connected on the connector 4a of control panel 4.
Like this, two head modules 10 by serial together to be formed for the line head of A4 antiquarian.In addition, four lines head module 10 (every row comprises dual serial head module 10 together) is set, to be formed for printing the colored line head of four kinds of colors (for example Y, M, C, and K).
Figure 11 is according to the chip 20 in the jet head 1 of another embodiment of the present invention and the cutaway view of adjacent domain thereof.Figure 12 is the plane of module frame 11, nozzle piece 25 and the flexible distributing board 3 of protected lid 30 coverings.
In the embodiment shown in Figure 11 and 12, over cap 30 is resin beds, and it covers exposed portions serve, and module frame 11 equitant flexible distributing board 3 parts of other zone, the module frame 11 of the nozzle piece 25 except that nozzle and near zone thereof.
Over cap 30 adopts the thermosetting epoxy resin with good characteristic (for example adherence, pliability, hear resistance, electrical insulating property and rotproofness) to form.The mode that adopts stencilization (serigraphy) is applied to whole nozzle surface (seeing the dashed area of Figure 12) except that nozzle 25a and adjacent domain thereof with these resins.Screen painting can make epoxy resin accurately apply, thereby makes the adjacent domain of nozzle 25a corresponding with opening portion 30a just.The epoxy resin that is applied is heated sclerosis.The epoxy resin of sclerosis forms over cap 30.
Over cap (epoxy resin film of sclerosis) 30 covers and protects the edge of nozzle piece 25 and flexible distributing board 3, thus the end of the end of covering nozzles sheet 25 and flexible distributing board 3.Like this, the height of the step part of nozzle surface is lowered.In addition, the slit between the outward flange of the outward flange of flexible distributing board 3 and nozzle piece 25 is capped.Therefore, when mobile roller or scraping blade by step part during with the cleaning nozzle surface, can reduce the probability that nozzle piece 25 or flexible distributing board 3 peel off and reduce roller or probability that scraping blade damages.In addition, the short circuit phenomenon on the exposing surface (cross-sections surfaces) of the wiring diagram 3a that can eliminate at flexible distributing board 3.In addition, because step part becomes the gentle slope part, having general flexible skull (not shown) can be with the warpage of this gentle slope part.Like this, the fixing air-tightness of skull.In addition, the surface of module frame 11, nozzle piece 25 and flexible distributing board 3 (except that nozzle 25a adjacent domain) can adopt same material (epoxy resin) to form, and it is roughly consistent that the wettability of any position of nozzle surface can keep.Like this, can improve recording quality and also stablize clean-up performance.
Equally, polyimide resin or the epoxy resin with good hear resistance and ink-resistant property (for example, silicones or acrylic resin) can be used for forming over cap 30.Except thermosetting resin, also can use the UV hardening resin.
As mentioned above, according to present embodiment, the material of nozzle piece 25 can only be used to the part of needs.Therefore, the material cost of the nozzle piece 25 of a jet head 1 and a head module 10 can be lowered to minimum of a value.The cost of the nozzle piece of being produced by the electroforming mode 25 and the area of nozzle piece 25 are roughly proportional.According to present embodiment, the area of nozzle piece 25 is reduced to about 20% of the required area of Japanese patent application No.3608526.Like this, cost can be lowered 80%.
In addition, the size that reduces nozzle piece 25 can reduce defect level in the manufacturing process (for example be out of shape or tear).
In addition, replace the employed jet head of Japanese patent application No.3608526, when a head module 10 breaks down (for example, only a stature chip 20 is not worked), can only replace the head module 10 that breaks down with new head module by using a plurality of head modules 10.Do not need to replace whole jet head 1.
According to present embodiment, when chip 20 was electrically connected to flexible distributing board 3 right overhead, wire bond operation and resin-sealed operation can be omitted.Like this, can reduce manufacturing cost.In addition, by adopting over cap 30 covering nozzles surfaces, can protect the end of nozzle piece 25 and be connected to the end of the flexible distributing board 3 of nozzle surface.Equally, can reduce the height of end step part.Therefore, can avoid the damage of cleaning element (for example roller or scraping blade).Equally, can improve the sealing of skull, therefore, also can keep the high-performance of head.
Further and since the wiring diagram 3a of flexible distributing board 3 to expose the end protected, can avoid being short-circuited.In addition,, then can stablize the injection direction of ink droplet, therefore, reduce the distortion of printable character or the damage of pattern because over cap 30 provides nozzle surface roughly uniform wettability.Equally, become evenly owing to be deposited in the distribution of the China ink amount of nozzle surface, it is stable that clean-up performance becomes.
To those skilled in the art, need based on design and other factors to multiple modification, combination, part combination that the present invention made with change all in the protection domain of independent claims and dependent claims.
The main contents that the present invention comprises relate on June 24th, 2005 to the Japanese patent application JP2005-185282 of Japan Patent office submission and the Japanese patent application JP2005-185284 that submitted to Japan Patent office on June 24th, 2005, and the full content of these applications is introduced herein for your guidance.
Claims (13)
1, a kind of head module comprises:
Chip, it comprises a plurality of energy generating element, gate spacer layers and is arranged on the electrode to be connected with external electric on the semiconductor substrate, described energy generating element is with the predetermined space arrangement of roughly embarking on journey, and described gate spacer layers forms liquid chamber around described energy generating element;
Nozzle piece, it has the nozzle that is formed at wherein;
Wiring plate, its electrode with described chip is electrically connected; And
Module frame, it has a plurality of chip locating holes that are formed on wherein, and the size of each chip locating hole is bigger slightly than described chip, and described chip is arranged in a described chip locating hole;
Wherein, the jet power that utilizes described energy generating element to provide to liquid sprays the liquid in the liquid chamber from nozzle; Described nozzle piece is arranged on the first surface of described module frame, so that nozzle is positioned in described the chip locating hole and make described nozzle piece partly cover described chip locating hole, and the size of described nozzle piece is confirmed as described minimum dimension that the chip locating hole is required of part covering; Described chip is arranged on the second surface of described module frame, so that described chip is positioned in described the chip locating hole and make described energy generating element in the face of corresponding nozzle; The electrode that is arranged on described chip in described the chip locating hole exposes from the part that is not covered by described nozzle piece of described chip locating hole; The electrode of described wiring plate is electrically connected with the electrode of described chip, and described wiring plate is arranged on the first surface of described module frame to cover the electrode that exposes of described chip.
2, head module as claimed in claim 1, wherein, a plurality of described chip serial arrangement are capable to form a chip, and a plurality of described capable being arranged in parallel of chip.
3, head module as claimed in claim 2, wherein, each described chip is capable to be provided with described wiring plate.
4, head module as claimed in claim 1 wherein, further comprises:
Container, its second surface that is arranged at described module frame is to cover all described chip locating holes, and described container is communicated with all liq chamber of described chip.
5, a kind of jet head comprises:
A plurality of head modules, each head module comprise described chip, wherein are formed with nozzle piece, wiring plate and the module frame of nozzle; Described chip comprises a plurality of energy generating element, gate spacer layers and is arranged on the electrode to be connected with external electric on the semiconductor substrate; Described energy generating element is with the predetermined space arrangement of roughly embarking on journey, described gate spacer layers forms liquid chamber around described energy generating element, described wiring plate is electrically connected to the electrode of described chip, described module frame has a plurality of chip locating holes that are formed at wherein, and described chip is arranged in a described chip locating hole; And
Have a framework of head module locating hole, be used to hold a plurality of head modules;
Wherein, the jet power that utilizes described energy generating element to provide to liquid sprays the liquid in the liquid chamber from nozzle; Described nozzle piece is arranged on the first surface of described module frame, so that nozzle is positioned in described the chip locating hole and make described nozzle piece partly cover described chip locating hole, and the size of described nozzle piece is confirmed as described minimum dimension that the chip locating hole is required of part covering; Described chip is arranged on the second surface of described module frame, so that described chip is positioned in described the chip locating hole and make described energy generating element in the face of corresponding nozzle; The electrode that is arranged on described chip in described the chip locating hole exposes from the part that is not covered by described nozzle piece of described chip locating hole; The electrode of described wiring plate is electrically connected with the electrode of described chip, and described wiring plate is arranged on the first surface of described module frame to cover the electrode that exposes of described chip.
6, a kind of liquid-jet device comprises:
A plurality of head modules, each head module comprise described chip, wherein are formed with nozzle piece, wiring plate and the module frame of nozzle; Described chip comprises a plurality of energy generating element, gate spacer layers and is arranged on the electrode to be connected with external electric on the semiconductor substrate; Described energy generating element is with the predetermined space arrangement of roughly embarking on journey, described gate spacer layers forms liquid chamber around described energy generating element, described wiring plate is electrically connected to the electrode of described chip, described module frame has a plurality of chip locating holes that are formed at wherein, and described chip is arranged in a described chip locating hole; And
Have a framework of head module locating hole, be used to hold a plurality of head modules;
Wherein, the jet power that utilizes described energy generating element to provide to liquid sprays the liquid in the liquid chamber from nozzle; Described nozzle piece is arranged on the first surface of described module frame, so that nozzle is positioned in described the chip locating hole and make described nozzle piece partly cover described chip locating hole, and the size of described nozzle piece is confirmed as described minimum dimension that the chip locating hole is required of part covering; Described chip is arranged on the second surface of described module frame, so that described chip is positioned in described the chip locating hole and make described energy generating element in the face of corresponding nozzle; The electrode that is arranged on described chip in described the chip locating hole exposes from the part that is not covered by described nozzle piece of described chip locating hole; The electrode of described wiring plate is electrically connected with the electrode of described chip, and described wiring plate is arranged on the first surface of described module frame to cover the electrode that exposes of described chip.
7, a kind of method of making head module, described head module comprises a chip, has the nozzle piece that is formed at nozzle wherein, be electrically connected to the wiring plate of electrode of described chip and module frame with a plurality of chip locating holes that are formed at wherein, described chip is arranged in a described chip locating hole, described chip comprises a plurality of energy generating element, gate spacer layers and be arranged on the electrode to be connected on the semiconductor substrate with external electric, described energy generating element is with the predetermined space arrangement of roughly embarking on journey, described gate spacer layers forms liquid chamber around energy generating element, wherein provide jet power that the liquid in the liquid chamber is sprayed from nozzle by described energy generating element to liquid, described method comprises operation:
(a) in first temperature environment, engage described nozzle piece to the first surface of described module frame, so that nozzle is positioned in described the chip locating hole, and make described nozzle piece partly cover described chip locating hole;
(b) be lower than in second temperature environment of temperature of first environment in temperature, engage the second surface of described chip to described module frame, so that described chip be positioned in described the chip locating hole, and make described energy generating element in the face of nozzle corresponding with it; And
(c) described wiring plate is installed to the first surface of described module frame, so that the electrode of described wiring plate is electrically connected to the electrode of described chip.
8, a kind of method of making head module, described head module comprises a chip, has the nozzle piece that is formed at nozzle wherein, be electrically connected to the wiring plate of electrode of described chip and module frame with a plurality of chip locating holes that are formed at wherein, described chip is arranged in a described chip locating hole, described chip comprises a plurality of energy generating element, gate spacer layers and be arranged on the electrode to be connected on the semiconductor substrate with external electric, described energy generating element is with the predetermined space arrangement of roughly embarking on journey, described gate spacer layers forms liquid chamber around energy generating element, wherein provide jet power that the liquid in the liquid chamber is sprayed from nozzle by described energy generating element to liquid, described method comprises operation:
(a) in first temperature environment, the engagement nozzle sheet is to the first surface of module frame, so that nozzle is positioned in the chip locating hole, and makes nozzle piece partly cover a chip locating hole;
(b) be lower than in second temperature environment of temperature of first environment in temperature, the engagement head chip is to the second surface of module frame, so that a chip is positioned in the chip locating hole, and enables volume production and gives birth to component side pair nozzle corresponding with it;
(c) the installation wiring plate is to the first surface of module frame, so that the electrode of wiring plate is electrically connected the electrode of chip to the end; And
(d) covering joins the end of the nozzle piece and the wiring plate of module frame to.
9, the manufacture method of head module as claimed in claim 8, wherein, operation (d) comprises by applying sticker to surface resin film, joins resin molding to other zone of the nozzle piece except that nozzle and nozzle near zone, the first surface of module frame and the wiring plate part overlapping with module frame.
10, the manufacture method of head module as claimed in claim 8, wherein, operation (d) comprises and applies other zone, the first surface of module frame and with the module frame overlapping wiring plate part of resin material to nozzle piece except that nozzle and nozzle near zone.
11, the manufacture method of head module as claimed in claim 8 wherein, further comprises operation:
(e) at second surface one container is installed, to cover all described chip locating holes, described container is communicated with the liquid chamber of all chips.
12, a kind of method of making jet head, described jet head comprises a plurality of head modules and has the head module locating hole holding a framework of a plurality of head modules, and each head module comprises a chip, wherein is formed with nozzle piece, wiring plate, module frame and the container of nozzle; Described chip comprises a plurality of energy generating element, gate spacer layers and is arranged on the electrode to be connected with external electric on the semiconductor substrate; Described energy generating element is with the predetermined space arrangement of roughly embarking on journey, described gate spacer layers forms liquid chamber around described energy generating element, described wiring plate is electrically connected to the electrode of described chip, described module frame has a plurality of chip locating holes that are formed at wherein, described chip is arranged in a described chip locating hole, described container is arranged to cover all chip locating holes, described container is communicated with the liquid chamber of all chips, wherein provide jet power that the liquid in the liquid chamber is sprayed from nozzle by described energy generating element to liquid, described method comprises operation:
(a) in first temperature environment, the engagement nozzle sheet is to the first surface of module frame, so that nozzle is positioned in the chip locating hole, and makes nozzle piece partly cover a chip locating hole;
(b) be lower than in second temperature environment of temperature of first environment in temperature, the engagement head chip is to the second surface of module frame, so that a chip is positioned in the chip locating hole, and enables volume production and gives birth to component side pair nozzle corresponding with it;
(c) the installation wiring plate to the first surface of module frame so that the electrode of wiring plate is electrically connected the electrode of chip to the end;
(d) covering joins the end of the nozzle piece and the wiring plate of module frame to;
(e) on the second surface of module frame, container is installed, to form head module; And
(f) in the head module locating hole of a framework, a plurality of head modules are set.
13, a kind of method of making liquid-jet device, liquid-jet device comprises a plurality of head modules and has the head module locating hole holding a framework of a plurality of head modules, and each head module comprises a chip, wherein is formed with nozzle piece, wiring plate, module frame and the container of nozzle; Described chip comprises a plurality of energy generating element, gate spacer layers and is arranged on the electrode to be connected with external electric on the semiconductor substrate; Described energy generating element is with the predetermined space arrangement of roughly embarking on journey, described gate spacer layers forms liquid chamber around described energy generating element, described wiring plate is electrically connected to the electrode of described chip, described module frame has a plurality of chip locating holes that are formed at wherein, described chip is arranged in a described chip locating hole, described container is arranged to cover all chip locating holes, described container is communicated with the liquid chamber of all chips, wherein provide jet power that the liquid in the liquid chamber is sprayed from nozzle by described energy generating element to liquid, described method comprises operation:
(a) in first temperature environment, the engagement nozzle sheet is to the first surface of module frame, so that nozzle is positioned in the chip locating hole, and makes nozzle piece partly cover a chip locating hole;
(b) be lower than in second temperature environment of temperature of first environment in temperature, the engagement head chip is to the second surface of module frame, so that a chip is positioned in the chip locating hole, and enables volume production and gives birth to component side pair nozzle corresponding with it;
(c) the installation wiring plate to the first surface of module frame so that the electrode of wiring plate is electrically connected the electrode of chip to the end;
(d) covering joins the end of the nozzle piece and the wiring plate of module frame to;
(e) at the second surface of module frame described container is installed, to form head module; And
(f) in the head module locating hole of a framework, a plurality of head modules are set.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP185282/05 | 2005-06-24 | ||
| JP2005185284A JP2007001192A (en) | 2005-06-24 | 2005-06-24 | Manufacturing method for head module, manufacturing method for liquid delivering head, and manufacturing method for liquid delivering apparatus |
| JP185284/05 | 2005-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1883950A true CN1883950A (en) | 2006-12-27 |
Family
ID=37582301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610106488 Pending CN1883950A (en) | 2005-06-24 | 2006-06-26 | Head module, liquid ejection head, liquid ejection apparatus, and method of fabricating head module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007001192A (en) |
| CN (1) | CN1883950A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101607478B (en) * | 2008-06-16 | 2011-08-24 | 佳能株式会社 | Liquid ejection recording head |
| CN102310646A (en) * | 2010-07-07 | 2012-01-11 | 佳能株式会社 | Liquid discharge head and method of producing liquid discharge head |
| CN103009811A (en) * | 2011-09-27 | 2013-04-03 | 精工电子打印科技有限公司 | Liquid jet head and liquid jet apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4976364B2 (en) * | 2008-12-04 | 2012-07-18 | エスアイアイ・プリンテック株式会社 | Liquid ejecting head and liquid ejecting apparatus |
-
2005
- 2005-06-24 JP JP2005185284A patent/JP2007001192A/en active Pending
-
2006
- 2006-06-26 CN CN 200610106488 patent/CN1883950A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101607478B (en) * | 2008-06-16 | 2011-08-24 | 佳能株式会社 | Liquid ejection recording head |
| CN102310646A (en) * | 2010-07-07 | 2012-01-11 | 佳能株式会社 | Liquid discharge head and method of producing liquid discharge head |
| US8840226B2 (en) | 2010-07-07 | 2014-09-23 | Canon Kabushiki Kaisha | Liquid discharge head and method of producing liquid discharge head |
| CN103009811A (en) * | 2011-09-27 | 2013-04-03 | 精工电子打印科技有限公司 | Liquid jet head and liquid jet apparatus |
| CN103009811B (en) * | 2011-09-27 | 2015-10-14 | 精工电子打印科技有限公司 | Jet head liquid and liquid injection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007001192A (en) | 2007-01-11 |
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