CN1881464A - Portable storage device - Google Patents
Portable storage device Download PDFInfo
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- CN1881464A CN1881464A CN 200610106087 CN200610106087A CN1881464A CN 1881464 A CN1881464 A CN 1881464A CN 200610106087 CN200610106087 CN 200610106087 CN 200610106087 A CN200610106087 A CN 200610106087A CN 1881464 A CN1881464 A CN 1881464A
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- circuit substrate
- protecting sheathing
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Abstract
A portable storage device comprises a rectangular cover case having an opening formed on a front side surface; a circuit board which is supported in the cover case in a state of being inserted in the cover case from the opening, and which is provided with a connector terminal section in a front part; and a semiconductor storage device which is mounted on at least one of an upper surface side and a lower surface side of the circuit board and is connected with the connector terminal section, and which stores predetermined data, wherein the cover case has supporting sections which are formed in both right and left side walls of the cover case and which support the circuit board from right and left by elastic force in a state where the circuit board is inserted in the cover case.
Description
Cross reference to related application
The 2006-119243 Japanese patent application that the present invention files an application based on 2005-175025 number of filing an application on June 15th, 2005 with on April 24th, 2006 is also advocated right of priority to it, and the full content of these patented claims is contained in this by reference.
Technical field
The present invention relates to possess and couple together the portable memory of the protecting sheathing that the circuit substrate of the semiconductor storage unit that uses protects being equipped with external unit.
Background technology
The protecting sheathing of existing portable memory, being installed to electronic unit on the circuit substrate etc. with protection in the nature of things is purpose, what use is security, convenience excellent protection shell always.In this existing portable memory, possess: the substrate that is connected with the USB connector plug, be used for the end protective cover that a side is protected below this substrate, the last protective cover that a side is protected above substrate is used for taking in the shell protective cover of USB connector plug; To use protective cover and following protective cover the mode that substrate is clipped in the middle is taken in substrate, and by bolt they are fixed up (for example, logining communique No. 3086524 referring to Japanese Utility Model).
But; in above-mentioned prior art; exist such problem: just such as already explained; owing to need parts more than 2 or 2 at least in the surface of substrate one side and the back side one side; so the installation method of substrate and protecting sheathing (going up protective cover, following protective cover) becomes complicated; the shortening of the set-up time of portable memory can not be realized, in addition, the reduction of the manufacturing cost of portable memory can not be realized.
Summary of the invention
Portable memory of the present invention has:
The side is formed with the protecting sheathing of the rectangle of peristome forwardly;
In above-mentioned protecting sheathing, be supported and be provided with forwardly the circuit substrate of bonder terminal portion with the state that inserts from above-mentioned peristome;
What be installed to upper surface one side of foregoing circuit substrate or lower surface one side is connected, is used for the semiconductor storage unit of store predetermined data on any one and with above-mentioned bonder terminal portion at least;
Wherein, above-mentioned protecting sheathing have be formed at about two sidewalls, be used under the state that is inserted with the foregoing circuit substrate by elastic force from about support the support sector of foregoing circuit substrate.
Description of drawings
Fig. 1 shows the synoptic diagram as the structure of the major part of the protecting sheathing of the portable memory of the embodiment 1 of an embodiment of the invention.
Fig. 2 shows the synoptic diagram as the structure of the major part of the portable memory of the embodiment 1 of an embodiment of the invention.
Fig. 3 shows the synoptic diagram as the structure of the major part of the protecting sheathing of the portable memory of the embodiment 2 of an embodiment of the invention.
Fig. 4 shows the synoptic diagram as the structure of the major part of the portable memory of the embodiment 2 of an embodiment of the invention.
Fig. 5 shows the synoptic diagram as the structure of the major part of the protecting sheathing of the portable memory of the embodiment 3 of an embodiment of the invention.
Fig. 6 shows the synoptic diagram as the structure of the major part of the portable memory of the embodiment 3 of an embodiment of the invention.
Fig. 7 shows the planimetric map as the structure of the major part of the protecting sheathing of the portable memory of the embodiment 4 of an embodiment of the invention.
Fig. 8 shows the synoptic diagram as the structure of the major part of the portable memory of the embodiment 4 of an embodiment of the invention.
Fig. 9 shows the synoptic diagram as the structure of the major part of the portable memory of the embodiment 5 of an embodiment of the invention.
Figure 10 shows the sectional view as the structure of the major part of the portable memory of the embodiment 6 of an embodiment of the invention.
Figure 11 shows the sectional view as the structure of the major part of the portable memory of the embodiment 6 of an embodiment of the invention.
Figure 12 shows the sectional view as the structure of the major part of the portable memory of the embodiment 7 of an embodiment of the invention.
Embodiment
Below, the limit describes using each embodiment of the present invention referring to the drawing limit.In following embodiment, to the situation that be applied to USB storage as portable memory be described especially.
Fig. 1 shows the synoptic diagram as the structure of the major part of the circuit substrate of the portable memory of the embodiment 1 of an embodiment of the invention.
As shown in Figure 1, on upper surface one side of the circuit substrate 1 of the rectangle that the substrate with silicon etc. constitutes and lower surface one side, electronic unit 2 is installed.In this electronic unit 2, comprise and be used for semiconductor storage unit of store predetermined data etc.In addition, electronic unit 2 both can be installed to the state of sealing on the circuit substrate 1, also can carry out molded in the substrate top after being set to electronic unit 2 on the circuit substrate 1.
In the place ahead of circuit substrate 1, be provided with bonder terminal portion 3 as the USB terminal.This bonder terminal portion 3 has substrate 3a and is formed at the metal terminal 3b that this substrate 3a goes up and is connected with semiconductor storage unit.By this bonder terminal portion 3 is connected with the terminal (not shown) of external unit, the transmission that can carry out the predetermined data between semiconductor storage unit and the external unit receives.
In addition, circuit substrate 1 has the width with bonder terminal portion 3 equal extent.
Fig. 2 shows the synoptic diagram as the structure of the major part of the protecting sheathing of the portable memory of the embodiment 1 of an embodiment of the invention.
As shown in Figure 2, protecting sheathing 4 has rectangular shape, and a side is formed with peristome 5 forwardly.This peristome 5 for example forms opening greatlyyer than the bore (height 4.5mm, width 12mm) of bonder terminal portion 3, makes and can insert the circuit substrate 1 with bonder terminal portion 3 when the assembling of portable memory.In addition, protecting sheathing 4 for example can use the parts of plastics, metal etc. to constitute, and can adopt integrated way to form.
In addition, as shown in Figure 2, protecting sheathing 4 also have be formed at about the support sector 6 of two sidewalls.This support sector 6 forms in the following manner: form the otch (cutting れ Write body) of japanese alphabet " コ " shape in the mode of rear side opening on two sidewalls about protecting sheathing 4, make the part of the sidewall of the otch that is formed with this japanese alphabet " コ " shape swing to the inboard of this protecting sheathing 4 and give prominence to.So the result is inserting under the state of circuit substrate 1, support sector 6 by elastic force from about support circuit substrate 1.In other words, protecting sheathing 4 contacts with the sidewall of circuit substrate 1 in the end as the notch portion of support sector 6, and circuit substrate 1 is supported.
In addition; also can on two sidewalls about protecting sheathing 4, be pre-formed the otch of japanese alphabet " コ " shape; in the time of on the position that the circuit substrate 1 that electronic unit 2 is installed is configured to the regulation protecting sheathing 4 in, thereby so that the mode of exerting pressure to circuit substrate 1 inboard is swung to by support sector 6 contacts with circuit substrate 1 and support.
In addition, the width of the end of support sector 6 it is desirable to set to such an extent that the thickness of ratio such as circuit substrate 1 also will be larger about 0.3mm, so that can stably support the end of circuit substrate 1.
Here, Fig. 3 shows the synoptic diagram of structure of major part of the portable memory of embodiments of the invention 1.
The assembling of portable memory 100 is implemented like this: in the relative mode of two sides of circuit substrate 1 and support sector 6, from the peristome 5 of protecting sheathing 4 circuit substrate 1 that the electronic unit 2 that comprises semiconductor storage unit is installed is inserted into the position of regulation from rear one side of this circuit substrate 1.Thus, as shown in Figure 3, can be supported in the protecting sheathing 4, finish portable memory 100 at the following circuit substrate 1 of the state that exposes bonder terminal portion 3.As mentioned above, portable memory 100 can easily be assembled and not need the parts of other bolt etc.
In addition; for example both can become makes circuit substrate 1 stop on the position of the sidewall at the rear that touches protecting sheathing 4; in addition, stop member (not shown) also can be set in the inside of protecting sheathing 4 makes can support the circuit substrate 1 that inserted on the position of regulation.
In addition, also can on the position of the regulation of two sides about circuit substrate 1, form pit and make that support sector 6 is fixing, so that can on the position of the regulation in the protecting sheathing 4, support the circuit substrate 1 of insertion.
As mentioned above; portable memory according to present embodiment; since possess have be used for be inserted with under the state of circuit substrate by elastic force from about support the integrated protecting sheathing of the support sector of circuit substrate; so in the components number that can reduce protecting sheathing; the assembling of portable memory is become easily, can realize the shortening of built-up time and the reduction of manufacturing cost.
Embodiment 2
In embodiment 1; the bonder terminal portion that is arranged on the circuit substrate is comprised that the structure of the housing of USB terminal is described; in the present embodiment, the structure that the protecting sheathing with the part that prolonged the housing that is equivalent to the USB terminal is carried out dual-purpose is described.
Fig. 4 is the synoptic diagram of structure of major part that the portable memory of embodiments of the invention 2 is shown.In addition, those labels identical among the figure, expression structure similarly to Example 1 with embodiment 1.
As shown in Figure 4, directly be provided with metal terminal 3b as bonder terminal portion at the upper surface of circuit substrate 1.In addition, as the part of the housing that is equivalent to the USB terminal, protecting sheathing 4 prolongations are formed with prolongation 7 so that metal terminal 3b is protected.In addition, other structure and embodiment 1 are same.
As mentioned above; portable memory according to present embodiment; since possess have be used for be inserted with under the state of circuit substrate by elastic force from about support the integrated protecting sheathing of the support sector of circuit substrate; so in the components number that can reduce protecting sheathing; the components number of circuit substrate can also be reduced, the shortening of built-up time and the reduction of manufacturing cost can be realized.
Embodiment 3
In embodiment 1 and 2, to support with the end of support sector circuit substrate about the structure of two sides be described, in the present embodiment, will the other structure of the support sector that supports circuit substrate be described.
Fig. 5 shows the synoptic diagram as the structure of the major part of the protecting sheathing of the portable memory of the embodiment 3 of an embodiment of the invention.In addition, Fig. 6 shows the synoptic diagram as the structure of the major part of the portable memory of the embodiment 3 of an embodiment of the invention.In addition, those labels identical among the figure, expression structure similarly to Example 1 with embodiment 1.
As shown in Figure 5; the 6a of support sector forms as follows: forming 2 otch abreast on two sidewalls about protecting sheathing 4a, and with to the side-prominent mode of the inner face one of protecting sheathing 4a to the shaping of pressurizeing of the part of the sidewall that is clipped in the middle by this otch.Therefore, as the material of protecting sheathing 4a, can select the material that is ductile of metal etc.
The assembling of portable memory 100a; similarly to Example 1, can implement as follows: so that two sides of circuit substrate 1 mode relative with the 6a of support sector, one side is inserted into the circuit substrate 1 that the electronic unit 2 that comprises semiconductor storage unit is installed at the peristome 5 of protecting sheathing 4a the position of regulation from the rear.Thus, as shown in Figure 6, can support to finish portable memory 100a in the protecting sheathing 4a at the following circuit substrate 1 of the state that bonder terminal portion 3 is exposed.Similarly to Example 1, assembly portable formula memory storage 100a and do not need the parts of other bolt etc. easily.
In addition; also can form 2 otch in advance abreast on two sidewalls about protecting sheathing 4a; in the time of on the position that the circuit substrate 1 that electronic unit 2 is installed is configured to the regulation protecting sheathing 4 in, to the part of the sidewall that is formed with otch pressurize shaping form the 6a of support sector, contacting to the mode that circuit substrate 1 is exerted pressure and support.
As mentioned above; portable memory according to present embodiment; since possess have be used for be inserted with under the state of circuit substrate by elastic force from about support the integrated protecting sheathing of the support sector of circuit substrate; so in the components number that can reduce protecting sheathing; the assembling of portable memory is become easily, can realize the shortening of built-up time and the reduction of manufacturing cost.
Embodiment 4
In embodiment 1 and 2; structure to following formation support sector is illustrated: forming the otch of japanese alphabet " コ " shape on two sidewalls about protecting sheathing, and making the part of the sidewall of the otch that is formed with this japanese alphabet " コ " shape swing to the inboard of protecting sheathing.In the present embodiment, further support that to being used for the structure of the support sector of circuit substrate describes on desirable position.
Fig. 7 shows the synoptic diagram of structure of major part of protecting sheathing of the portable memory of embodiments of the invention 4.In addition, Fig. 8 shows the synoptic diagram of structure of major part of the portable memory of embodiments of the invention 4.In addition, those labels identical among the figure, expression structure similarly to Example 1 with embodiment 1.
As shown in Figure 7, protecting sheathing 4b have be formed at about the 6b of support sector of two sidewalls.The 6b of this support sector forms in the following manner: be japanese alphabet " コ " shape ground and form otch in the mode of rear one side opening on two sidewalls about protecting sheathing 4b, make the part of the sidewall of the otch that is formed with this japanese alphabet " コ " shape swing to the inboard of this protecting sheathing 4b and give prominence to.In addition, the end of the 6b of this support sector will with part that circuit substrate 1 contacts on, be formed with guide groove 7.This guide groove 7 have can embed and steering circuit substrate 1 about the end for example approximately more than or equal to the width of 0.4mm.In this case, the width of the end of the 6b of support sector for example will be set at approximately more than or equal to 0.6mm.Therefore, when circuit substrate 1 is inserted into the inside of protecting sheathing 4b, can be by the end about guide groove 7 steering circuit substrates 1.And then; under the state of the inside that circuit substrate 1 is inserted into protecting sheathing 4b; elastic force that can be by the 6b of support sector from about support circuit substrate 1, and, can also support circuit substrate 1 can not move up with the sidewall of guide groove 7 at upper and lower for making it.
The assembling of portable memory 100b; similarly to Example 1, can implement like this: so that two sides of circuit substrate 1 mode relative with the 6b of support sector, one side is inserted into the circuit substrate 1 that the electronic unit 2 that comprises semiconductor storage unit is installed at the peristome 5 of protecting sheathing 4b the position of regulation from the rear.Thus, as shown in Figure 8, can support to finish portable memory 100b in the protecting sheathing 4b at the following circuit substrate 1 of the state that bonder terminal portion 3 is exposed.Then, similarly to Example 1, portable memory 100b can easily assemble and not need parts such as other bolt, and can support that with the sidewall of guide groove 7 circuit substrate 1 does not move up and down it more reliably.
As mentioned above; portable memory according to present embodiment; because reduction in shortening that can realize built-up time and manufacturing cost; and owing to also be provided with the guide groove that is used to guide and support circuit substrate in support sector, so can on desirable position, be supported in circuit substrate in the protecting sheathing more reliably.
In addition, in the present embodiment, though be the explanation that the example that uses in the structure of the support sector of embodiment 1 and 2 is carried out, but, structure for the support sector of embodiment 3, can use the structure of present embodiment too, adopt the way of the part formation ditch of two contacts side surfaces about support sector and circuit substrate, can obtain same action effect.
Embodiment 5
In each above embodiment; for forming support sector on two sidewalls about protecting sheathing; from about support the structure of circuit substrate to be illustrated; in the present embodiment, further be used for supporting the structure of the support sector of circuit substrate to describe from above-below direction on the sidewall up and down of protecting sheathing, possessing.In addition, in the present embodiment, though the situation that is applied to embodiment 1 is described,, can use too for other embodiment.
Fig. 9 shows the synoptic diagram of structure of major part of the portable memory of embodiments of the invention 5.In addition, those labels identical among the figure, expression structure similarly to Example 1 with embodiment 1.
As shown in Figure 9, protecting sheathing 4c has at upper side wall and forms the otch of japanese alphabet " コ " shape and the support sector 8 that forms and similarly form the otch of japanese alphabet " コ " shape and the support sector 9 that forms in lower wall.This support sector 8,9, until till being inserted into portable memory 100c in the protecting sheathing 4c, all with two sidewalls up and down of protecting sheathing 4c with in simultaneously and not contacting with electronic unit 2 on the circuit substrate 1.
The assembling of portable memory 100c; at first; similarly to Example 1, one side is inserted into the circuit substrate 1 that the electronic unit 2 that comprises semiconductor storage unit is installed at the peristome 5 of protecting sheathing 4a the position of regulation so that two sides of circuit substrate 1 mode relative with the 6a of support sector is from the rear.
Then, adopt to make support sector 8,9 up and down swing to the inboard of protecting sheathing 4c and outstanding way makes it contact with circuit substrate 1, the elastic force by this support sector 8,9 is from above-below direction support circuit substrate 1.Thus, can finish portable memory 100c in protecting sheathing 4c, supporting circuit substrate 1 under the state that bonder terminal portion 3 is exposed as shown in Figure 9.Similarly to Example 1, assembly portable formula memory storage 100c and do not need the parts of other bolt etc. easily.
In addition, in the present embodiment,, also can support circuit substrate 1 by the electronic unit 2 that is arranged on the circuit substrate 1 though explanation is the structure of directly supporting circuit substrate 1 with support sector 8,9.In this case, it is desirable to electronic unit 2 and support sector's 8,9 insulation.
In addition, in the present embodiment,, also can only use support sector 8 or support sector 9 though explanation is directly to support the structures of circuit substrates 1 from above-below direction with support sector 8,9, promptly only support circuit substrate 1 about face in a side.In addition, support sector 8,9 in order stably to support circuit substrate 1, also can be provided with a plurality of in protecting sheathing 4c.
As mentioned above; portable memory according to present embodiment; then similarly to Example 1; can realize the shortening of built-up time and the reduction of manufacturing cost; and owing on the sidewall up and down of protecting sheathing, also be provided with the support sector that is used on above-below direction, supporting circuit substrate, so can more stably be supported in circuit substrate in the protecting sheathing.
Embodiment 6
In each above embodiment; that describes is forming support sector on two sidewalls about protecting sheathing; from about support the structure of circuit substrate, to be described in the structure that possesses the support ditch that is used for supporting circuit substrate on the rear sidewall of protecting sheathing in the present embodiment.In addition, in the present embodiment, though the situation that is applied to embodiment 1 will be described,,, can use too for other embodiment.
Figure 10 shows the synoptic diagram of structure of major part of the portable memory 100d of embodiments of the invention 6.In addition, those labels identical among the figure, expression structure similarly to Example 1 with embodiment 1.
As shown in figure 10, on the sidewall of the rear of protecting sheathing 4d, be formed with the support ditch 10 that is used for embedding the rear end of circuit substrate 1 and supports.This support ditch 10 has feasible for example about width more than or equal to 0.4mm that can embed circuit substrate 1.This support ditch 10 both can form when the shaping of protecting sheathing 4d, in addition, and also can be after the shaping of protecting sheathing 4d, by formation such as etchings.
As shown in figure 10, because the end at the rear of circuit substrate 1 has been embedded in the support ditch 10, the interior above-below direction of protecting sheathing 4d is stably supported circuit substrate 1 relatively.
In addition, support the cross section of ditch also can form taper.Here, figure 11 illustrates and have the major part of portable memory that the cross section is the support ditch of taper.As shown in figure 11.Even if under the situation of the inside that circuit substrate 1 is inserted into protecting sheathing 4d with the height of stipulating; by circuit substrate 1 being inserted into the depth of the regulation in the protecting sheathing 4d, can be directed to circuit substrate 1 height of regulation with the inwall of the taper of supporting ditch 11.
As mentioned above; portable memory according to present embodiment; can realize the shortening of built-up time and the reduction of manufacturing cost; and owing on the sidewall at the rear of protecting sheathing, also be provided with the support ditch that is used for supporting circuit substrate, so can be supported in circuit substrate in the protecting sheathing in the position of hope more reliably.
Embodiment 7
In embodiment 1, to forming support sector on two sidewalls about protecting sheathing, from about support the structure of circuit substrate to be described.In the present embodiment, especially the structure that possesses memory chip and controller chip as electronic unit on the face of the opposite side of the face that is formed with metal terminal of circuit substrate is described.
In addition, in the present embodiment, though the situation that is applied to embodiment 1 is described,, can use too for embodiment 3.
Figure 12 shows the synoptic diagram of structure of major part of the portable memory of embodiments of the invention 7.In addition, those labels identical among the figure, expression structure similarly to Example 1 with embodiment 1.
As shown in figure 12, directly be provided with metal terminal 3b in upper surface the place ahead of circuit substrate 1.In addition, in lower surface one side of circuit substrate 1, possess to have as electronic unit and be configured on the circuit substrate 1 and carried out the memory chip 2a of lead-in wire bonding and be configured in the controller chip 2b that this memory chip 2a went up and carried out the lead-in wire bonding.In addition, controller chip 2b also can directly be configured to the line lead bonding of going forward side by side on the circuit substrate 1.
These memory chips 2a and controller chip 2b have carried out sealing in lower surface one side of circuit substrate 1 with molded resin 12.
In addition, the outer frame part 3c of bonder terminal portion 3 rearward prolongs and covers all of circuit substrate 1.The inner face of this outer frame part 3c and the lower surface of molded resin 12 are for example by being adhesively fixed with circuit substrate 1 and outer frame part 3c.In addition, can select metal etc. as the material of outer frame part 3c.
So that the mode that expose in the place ahead of bonder terminal portion 3 is inserted protecting sheathing 4 for example shown in Figure 2 to this outer frame part 3c.Thus, can the inside of protecting sheathing 4 by support sector 6 by elastic force from about support to be fixed on the bonder terminal portion 3 of circuit substrate 1 inside.
In addition, also can be directly the inside of protecting sheathing 4 from about omitted the circuit substrate 1 of the outer frame part 3c of bonder terminal portion 3 by the elastic force support by support sector 6.
As mentioned above; portable memory according to present embodiment; since possess have be used for be inserted with under the state of circuit substrate by elastic force from about support the integrated protecting sheathing of the support sector of circuit substrate; so in the components number that can reduce protecting sheathing; the assembling of portable memory is become easily, can realize the shortening of built-up time and the reduction of manufacturing cost.
In addition, in each above embodiment, though be the explanation of carrying out for the situation that upper surface one side and lower surface one side at circuit substrate 1 are provided with the electronic unit 2 that comprises semiconductor storage unit.But the situation that electronic unit is set in upper surface one side or lower surface one side which side can be used.
In addition; in each above embodiment, though being conduct, protecting sheathing carried out the explanation that integrated protecting sheathing carries out; even if form by a plurality of parts under the situation of this protecting sheathing, the assembling of circuit substrate in protecting sheathing become easily.
In addition; in each above embodiment; though illustrate in order stably to support circuit substrate on two sidewalls about protecting sheathing each 2 ground of every side form the example of support sectors; but; also can on two sidewalls about protecting sheathing, every side form 1; perhaps, also can form more than 3 or 3.
Claims (10)
1. portable memory is characterized in that having:
The side is formed with the protecting sheathing of the rectangle of peristome forwardly;
In above-mentioned protecting sheathing, be supported and be provided with forwardly the circuit substrate of bonder terminal portion with the state that inserts from above-mentioned peristome; And
What be installed to upper surface one side of foregoing circuit substrate or lower surface one side is connected, is used for the semiconductor storage unit of store predetermined data on any one and with above-mentioned bonder terminal portion at least;
Wherein, above-mentioned protecting sheathing have be formed at about two sidewalls, be used under the state that is inserted with the foregoing circuit substrate by elastic force from about support the support sector of foregoing circuit substrate.
2. portable memory according to claim 1 is characterized in that: above-mentioned support sector so that above-mentioned protecting sheathing about be formed with the above-mentioned sidewall of otch on two sidewalls a part form to the inner face one side-prominent mode shaping of above-mentioned protecting sheathing.
3. portable memory according to claim 1 and 2 is characterized in that: above-mentioned support sector be formed with when being inserted into the foregoing circuit substrate in the above-mentioned protecting sheathing, be used for guiding and support the foregoing circuit substrate about the guide groove of two sidewalls.
4. portable memory according to claim 1 is characterized in that: above-mentioned protecting sheathing have be formed in upper side wall or the lower wall at least on any one, be used on above-below direction, supporting the support sector of foregoing circuit substrate.
5. portable memory according to claim 1 is characterized in that: the support ditch that is formed with the rear end that is used for supporting the foregoing circuit substrate on the sidewall of the rear of above-mentioned protecting sheathing.
6. portable memory according to claim 1 is characterized in that:
Above-mentioned semiconductor storage unit comprises and is configured in the memory chip that has carried out the lead-in wire bonding on the foregoing circuit substrate and is configured on this memory chip or carried out the controller chip of lead-in wire bonding on the circuit substrate,
Above-mentioned memory chip and above-mentioned controller chip are locked on the foregoing circuit substrate with molded resin.
7. portable memory according to claim 1 is characterized in that: above-mentioned protecting sheathing is made of plastics or metal.
8. portable memory according to claim 7 is characterized in that: above-mentioned protecting sheathing is by one-body molded formation.
9. portable memory according to claim 5 is characterized in that: the cross section of above-mentioned support ditch forms taper.
10. portable memory according to claim 2 is characterized in that: the otch of two sidewalls about above-mentioned protecting sheathing, and carry out notch shape in the mode of rear side opening and become japanese alphabet " コ " shape,
Outstanding mode shaping forms so that be formed with that the part of sidewall of the otch of above-mentioned japanese alphabet " コ " shape is swung to the inboard of above-mentioned protecting sheathing in above-mentioned support sector.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005175025 | 2005-06-15 | ||
| JP175025/2005 | 2005-06-15 | ||
| JP119243/2006 | 2006-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1881464A true CN1881464A (en) | 2006-12-20 |
Family
ID=37519618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610106087 Pending CN1881464A (en) | 2005-06-15 | 2006-06-15 | Portable storage device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1881464A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105427878A (en) * | 2014-09-11 | 2016-03-23 | 株式会社东芝 | USB memory device |
| CN105551515A (en) * | 2014-10-28 | 2016-05-04 | 株式会社东芝 | Semiconductor memory device |
-
2006
- 2006-06-15 CN CN 200610106087 patent/CN1881464A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105427878A (en) * | 2014-09-11 | 2016-03-23 | 株式会社东芝 | USB memory device |
| CN105427878B (en) * | 2014-09-11 | 2018-06-01 | 东芝存储器株式会社 | Usb storage device |
| CN105551515A (en) * | 2014-10-28 | 2016-05-04 | 株式会社东芝 | Semiconductor memory device |
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Open date: 20061220 |