CN1867213A - Organic electroluminescent element and its cover board and cover board manufacturing method - Google Patents

Organic electroluminescent element and its cover board and cover board manufacturing method Download PDF

Info

Publication number
CN1867213A
CN1867213A CN 200510071126 CN200510071126A CN1867213A CN 1867213 A CN1867213 A CN 1867213A CN 200510071126 CN200510071126 CN 200510071126 CN 200510071126 A CN200510071126 A CN 200510071126A CN 1867213 A CN1867213 A CN 1867213A
Authority
CN
China
Prior art keywords
substrate
organic electroluminescent
cover plate
electroluminescent device
desiccant layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200510071126
Other languages
Chinese (zh)
Inventor
官永佳
戴伟仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chunghwa Picture Tubes Ltd
Original Assignee
Chunghwa Picture Tubes Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chunghwa Picture Tubes Ltd filed Critical Chunghwa Picture Tubes Ltd
Priority to CN 200510071126 priority Critical patent/CN1867213A/en
Publication of CN1867213A publication Critical patent/CN1867213A/en
Pending legal-status Critical Current

Links

Images

Abstract

The invention relates to a method for producing the cover plate of organic electroluminescence element, which comprises following steps: first, providing base plate with a joint surface; forming liquid drying agent layer on the base plate; the joint surface is around the liquid drying agent layer; then solidifying the liquid drying agent layer into drying agent layer; then cleaning the joint surface. Therefore, the invention can reduce the contaminants on the joint surface. And the invention also discloses an organic electroluminescence element and relative cover plate.

Description

The manufacture method of organic electroluminescent device and cover plate thereof and its cover plate
Technical field
The present invention relates to a kind of light-emitting component, and particularly relate to the manufacture method of a kind of organic electroluminescent device and cover plate and its cover plate.
Background technology
Organic electroluminescent device is the element that a kind of self-luminous characteristic of utilizing organic functions material (organic functionalmaterial) reaches display effect, wherein the molecular weight according to the organic functions material is divided into micromolecule organic electroluminescent device (Small Molecule OELD, SM-OELD) with high molecule electroluminescent element (Polymer Electro-Luminescent Device, PELD) two big classes.Both ray structures are made of pair of electrodes and organic functions material layer.When applying direct voltage, organic functional material layer is injected from anode (anode) in the electricity hole, and electronics injects organic functional material layer from negative electrode (cathode), because the potential difference that extra electric field caused makes two kinds of carriers of electric hole and electronics (carrier) move in the organic functions material layer and produces radiativity to combine (Radiative Recombination).Part can be excited the organic functions material molecule in conjunction with the energy of being emitted by electronics electricity hole again and form single excite state molecule.When single excite state molecule releases energy when getting back to ground state, wherein a certain proportion of energy can be emitted and luminous in the mode of photon, and this is the principle of luminosity of organic electroluminescent device.
Because the organic functions material layer is easily because steam and therefore deterioration can form desiccant layer usually on the cover plate of organic electroluminescent device.Briefly, the generation type of the cover plate of organic electroluminescent device for example is to form the liquid desiccant layer in a plurality of grooves of substrate, solidifies liquid desiccant layer then, to form desiccant layer.It should be noted that the employed solvent of liquid desiccant layer (solvent) not only can also can remain on the composition surface of cover plate attached to the inwall of equipment in the process of solidifying liquid desiccant layer.Yet the solvent that is positioned on the cover plate composition surface will make the bond strength of cover plate and device substrate descend.In other words, through after the cover plate technology of certain number of times, just must clean equipment.
Summary of the invention
In view of this, purpose of the present invention just provides a kind of manufacture method of organic electroluminescent device cover plate, to reduce the number of times of cleaning curing apparatus.
In addition, a further object of the present invention just provides a kind of organic electroluminescent device cover plate, and it has the efficient of preferable absorption steam.
In addition, another purpose of the present invention just provides a kind of organic electroluminescent device, has preferable bond strength between its cover plate and the device substrate.
Based on above-mentioned purpose or other purpose, the present invention proposes a kind of manufacture method of organic electroluminescent device cover plate, and it comprises the following steps.At first, provide substrate, and this substrate has the composition surface.Form liquid desiccant layer (liquid desiccant layer) in the groove of substrate, wherein the composition surface is positioned at around the liquid desiccant layer.Then, the liquid desiccant layer is solidified into desiccant layer (desiccantlayer).Then, the composition surface of clean substrate.
Above-mentioned after the composition surface of clean substrate, the angle of wetting on composition surface (wetting angle) is less than 35 degree, and desiccant layer has rough surface.In addition, the composition surface of liquid desiccant layer of above-mentioned curing and clean substrate is on-the-spot technology (in-situ process).
The method on the composition surface of above-mentioned clean substrate for example is to use plasma or excimer laser.In addition, plasma for example is oxygen gas plasma, nitrogen gas plasma or argon plasma.In addition, excimer laser for example is ultraviolet light excimer laser (UV excimer).
Based on above-mentioned purpose or other purpose, the present invention proposes a kind of organic electroluminescent device cover plate, and it comprises substrate and desiccant layer, and wherein substrate has the composition surface.Desiccant layer is arranged on the substrate, and the composition surface is positioned at around the desiccant layer, and desiccant layer has rough surface.
The angle of wetting on above-mentioned composition surface is less than 35 degree.In addition, aforesaid substrate also can have a plurality of grooves, and desiccant layer is arranged in these grooves.The material of substrate for example is glass or metal.In addition, the material of desiccant layer for example is barium monoxide, calcium oxide, barium sulfate or calcium sulfate.
Based on above-mentioned purpose or other purpose, the present invention proposes a kind of organic electroluminescent device, and it comprises first substrate, cover plate and fluid sealant, wherein has element layer on the surface of first substrate.Cover plate is arranged on first substrate, and the cladding element layer.In addition, cover plate comprises second substrate and desiccant layer, and wherein second substrate has the composition surface.Desiccant layer is arranged on second substrate, and the composition surface is positioned at around the desiccant layer, and desiccant layer has rough surface.In addition, fluid sealant is arranged between the composition surface of first substrate and cover plate.
The angle of wetting on above-mentioned composition surface is less than 35 degree.In addition, second substrate also can have groove, and desiccant layer is arranged in the groove.The material of second substrate for example is glass or metal.In addition, the material of desiccant layer for example is barium monoxide, calcium oxide, barium sulfate or calcium sulfate.Above-mentioned fluid sealant for example is optic-solidified adhesive or heat-curable glue.
Based on above-mentioned, owing to carry out clean for the composition surface of cover plate, so have preferable bond strength between cover plate and the fluid sealant.In addition, desiccant layer has rough surface, so the efficient of desiccant layer absorption steam is preferable.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A to 1E is depicted as the schematic diagram according to the organic electroluminescent device manufacture method of preferred embodiment of the present invention.
Figure 2 shows that generalized section according to the organic electroluminescent device of another preferred embodiment of the present invention.
The main element description of symbols
10,20: organic electroluminescent device
100,400: the organic electroluminescent device cover plate
110,200,410: substrate
110a, 410a: composition surface
110b: groove
120: desiccant layer
210: element layer
300,500: fluid sealant
Embodiment
Figure 1A to 1E is depicted as the schematic diagram according to the manufacture method of the organic electroluminescent device of preferred embodiment of the present invention.Please earlier with reference to Figure 1A, the manufacture method of the organic electroluminescent device cover plate of present embodiment comprises the following steps.At first, provide substrate 110, and the material of substrate 110 for example is glass or metal.In addition, substrate 110 has composition surface 110a and a plurality of groove 110b, wherein composition surface 110a be positioned at these grooves 110b around.It should be noted that, before carrying out the following step, can also carry out cleaning procedure to substrate 110 earlier, wherein cleaning procedure for example is that substrate 110 is carried out wet type cleaning process, vacuum drying process and dry cleaning technology successively, and wherein dry cleaning technology for example is to use oxygen gas plasma or excimer laser.
Then, in the groove 110b of substrate 110, form the liquid desiccant layer.For example, in the mode of splashing into liquid desiccant is coated in the groove 110b, and liquid desiccant will diffuse in the whole groove 110b, to form the liquid desiccant layer.In addition, the composition of liquid desiccant comprises solute and solvent, and wherein solvent can be an organic solvent, and solute for example is barium monoxide, calcium oxide, barium sulfate or calcium sulfate.
Please refer to Figure 1B, the liquid desiccant layer is solidified into desiccant layer 120.More specifically, because the boiling point of the organic solvent of liquid desiccant is lower usually, therefore after heating, in groove 110b, just can form desiccant layer 120.At this moment, desiccant layer 120 has smooth surface.Organic solvent that it should be noted that liquid desiccant also can remain on the 110a of composition surface.
Please refer to Fig. 1 C,, carry out cleaning procedure, removing the residue of composition surface 110a, and finish the preliminary making of cover plate 100 for substrate 110 in order to remove the residue on the 110a of composition surface.For example, use plasma or excimer laser cleaning composition surface 110a, wherein plasma for example is oxygen gas plasma, nitrogen gas plasma, argon plasma or other suitable plasma.In addition, excimer laser for example is ultraviolet light excimer laser (UV excimer) or other suitable excimer laser.
After cleaning composition surface 110a, the angle of wetting of composition surface 110a usually can be less than 35 degree.It should be noted that present embodiment does not limit only cleans composition surface 110a.In order to simplify technology, plasma or excimer laser are normally bombarded for whole base plate 110, and the desiccant layer 120 that therefore originally has smooth surface will have rough surface.It should be noted that compared to known technology because desiccant layer 120 has rough surface, so the efficient of desiccant layer 120 absorption steam is preferable.In addition, the surface roughness of desiccant layer 120 is big more, and the efficient that desiccant layer 120 absorbs steam is also just good more.
In addition, the step of solidifying the step of liquid desiccant layer and clean substrate 110 is not limited in the different chamber (chamber) carries out, and solidifies the step of liquid desiccant layer and the step of clean substrate 110 also can be to carry out in same chamber.In other words, solidifying the step of liquid desiccant layer and the step of clean substrate 110 also can be to be on-the-spot technology (in-situ process).
Please refer to Fig. 1 D, substrate 200 is provided, and on substrate 200, formed the element layer 210 of a plurality of islands.Then, on the composition surface of cover plate 100 110a or substrate 200, form fluid sealant 300 earlier, and fluid sealant 300 for example is optic-solidified adhesive or heat-curable glue.Then, cover plate 100 is covered on the substrate 200, and fluid sealant 300 is between the composition surface of cover plate 100 110a and substrate 200.Then, solidify fluid sealant 300.More specifically, according to the kind of fluid sealant 300, curing mode can be divided into irradiation reaction light source and heating dual mode, and wherein reacting light source for example is ultraviolet light.
Please refer to Fig. 1 E, the formed structure of above-mentioned technology can be applied to display of organic electroluminescence.Yet, after solidifying fluid sealant 300, also carry out cutting technique, to form a plurality of organic electroluminescent devices 10.Because the composition surface 110a of cover plate 100 through clean, therefore compared to known technology, is difficult for producing between the fluid sealant 300 of present embodiment and the cover plate 100 peeling off.In other words, has preferable bond strength between the fluid sealant 300 of present embodiment and the cover plate 100.It should be noted that because desiccant layer 120 has rough surface, so the efficient of desiccant layer 120 absorption steam is preferable.In addition, owing to directly composition surface 110a is carried out clean, so the shutdown number of times of curing apparatus just can reduce.
Figure 2 shows that generalized section according to the organic electroluminescent device of another preferred embodiment of the present invention.Please refer to Fig. 2, Fig. 2 is similar to Fig. 1 E, and its difference is: in the organic electroluminescent device 20 of Fig. 2, substrate 410 does not have groove.In other words, cover plate 400 is dull and stereotyped.In the present embodiment, after forming desiccant layer 120, also the composition surface 410a for substrate 410 carries out cleaning procedure.In addition, fluid sealant 500 is arranged between the composition surface 410a and substrate 200 of substrate 410.In addition, not only as the usefulness of sealing, also the usefulness of substrate 200 and cover plate 400 is separated in conduct to fluid sealant 500.In other words, fluid sealant 500 is also as the usefulness of sept (spacer).
In sum, the manufacture method of organic electroluminescent device of the present invention and cover plate thereof and its cover plate has following advantage at least:
One,, has preferable bond strength between cover plate of the present invention and the fluid sealant compared to known technology.
Two, compared to known technology, because desiccant layer has rough surface, so the efficient of desiccant layer absorption steam is preferable.In other words, organic electroluminescent device of the present invention has better reliability degree.
Three, the present invention and existing processes compatibility, therefore need not increase extra process equipment just can produce the organic electroluminescent device with preferable reliability.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any one of ordinary skill in the art, without departing from the spirit and scope of the present invention; when can doing a little change and improvement, so protection scope of the present invention is as the criterion when looking the claim person of defining.

Claims (18)

1. the manufacture method of an organic electroluminescent device cover plate is characterized in that comprising:
Substrate is provided, and this substrate has the composition surface;
Form the liquid desiccant layer on this substrate, wherein this composition surface is positioned at around this liquid desiccant layer;
This liquid desiccant layer is solidified into desiccant layer; And
Clean this composition surface of this substrate.
2. the manufacture method of organic electroluminescent device cover plate according to claim 1 is characterized in that after this composition surface of this substrate of cleaning the angle of wetting on this composition surface (wetting angle) is less than 35 degree.
3. the manufacture method of organic electroluminescent device cover plate according to claim 1 is characterized in that this desiccant layer has rough surface after this composition surface of this substrate of cleaning.
4. the manufacture method of organic electroluminescent device cover plate according to claim 1, it is characterized in that solidifying this liquid desiccant layer is on-the-spot technology (in-situprocess) with this composition surface of cleaning this substrate.
5. the manufacture method of organic electroluminescent device cover plate according to claim 1, the step that it is characterized in that cleaning this composition surface of this substrate comprise uses plasma or excimer laser.
6. the manufacture method of organic electroluminescent device cover plate according to claim 5 is characterized in that this plasma is oxygen gas plasma, nitrogen gas plasma or argon plasma.7. the manufacture method of organic electroluminescent device cover plate according to claim 5 is characterized in that this excimer laser comprises ultraviolet light excimer laser (UV excimer).
8. organic electroluminescent device cover plate is characterized in that comprising:
Substrate has the composition surface; And
Desiccant layer be arranged on this substrate, and this composition surface is positioned at around this desiccant layer, and this desiccant layer has rough surface.
9. organic electroluminescent device cover plate according to claim 8, the angle of wetting that it is characterized in that this composition surface is less than 35 degree.
10. organic electroluminescent device cover plate according to claim 8 is characterized in that this desiccant layer has rough surface.
11. organic electroluminescent device cover plate according to claim 8 it is characterized in that this substrate has a plurality of grooves, and this desiccant layer is arranged in the above-mentioned groove.
12. organic electroluminescent device cover plate according to claim 8 is characterized in that the material of this substrate comprises glass or metal.
13. organic electroluminescent device cover plate according to claim 8 is characterized in that the material of this desiccant layer comprises barium monoxide, calcium oxide, barium sulfate or calcium sulfate.
14. an organic electroluminescent device is characterized in that comprising:
First substrate has element layer on this first substrate surface;
Cover plate is arranged on this first substrate, and covers this element layer, and this cover plate comprises:
Second substrate has the composition surface;
Desiccant layer be arranged on this second substrate, and this composition surface is positioned at around this desiccant layer, and this desiccant layer has rough surface; And
Fluid sealant is arranged between this composition surface of this first substrate and this cover plate.
15. organic electroluminescent device according to claim 14, the angle of wetting that it is characterized in that this composition surface is less than 35 degree.
16. organic electroluminescent device according to claim 14 it is characterized in that this second substrate has groove, and this desiccant layer is arranged in this groove.
17. organic electroluminescent device according to claim 14 is characterized in that the material of this second substrate comprises glass or metal.
18. organic electroluminescent device according to claim 14 is characterized in that the material of this desiccant layer comprises barium monoxide, calcium oxide, barium sulfate or calcium sulfate.
19. organic electroluminescent device according to claim 14 is characterized in that sealing glue comprises optic-solidified adhesive or heat-curable glue.
CN 200510071126 2005-05-20 2005-05-20 Organic electroluminescent element and its cover board and cover board manufacturing method Pending CN1867213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510071126 CN1867213A (en) 2005-05-20 2005-05-20 Organic electroluminescent element and its cover board and cover board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510071126 CN1867213A (en) 2005-05-20 2005-05-20 Organic electroluminescent element and its cover board and cover board manufacturing method

Publications (1)

Publication Number Publication Date
CN1867213A true CN1867213A (en) 2006-11-22

Family

ID=37426049

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510071126 Pending CN1867213A (en) 2005-05-20 2005-05-20 Organic electroluminescent element and its cover board and cover board manufacturing method

Country Status (1)

Country Link
CN (1) CN1867213A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102164471A (en) * 2010-02-22 2011-08-24 旭达精密工业股份有限公司 Shield structure capable of resisting electromagnetic interference or used for static conduction and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102164471A (en) * 2010-02-22 2011-08-24 旭达精密工业股份有限公司 Shield structure capable of resisting electromagnetic interference or used for static conduction and manufacturing method thereof

Similar Documents

Publication Publication Date Title
US6383664B2 (en) Electroluminescent or photocell device having protective packaging
US8029684B2 (en) Self-emission panel and method of manufacturing the same
CN1509125A (en) Substrate manufacturing method, method for manufacturing organic electroluminescent display device and the device thereof
US7990055B2 (en) Electroluminescent arrangement having detached electrode and method of fabricating the same
JP2006286266A (en) Manufacturing method of luminescent panel, manufacturing method of display panel and display panel
KR100992141B1 (en) Ogranic light emitting display
CN101794866A (en) Packaging cover plate and method for packaging OLED device by using cover plate
JP2012000546A (en) Method for producing gas-barrier film and organic electronic device
CN1867213A (en) Organic electroluminescent element and its cover board and cover board manufacturing method
CN1893747A (en) Organic electric-excitation illuminating display module and making method therefor
JP5552979B2 (en) Method for producing gas barrier film, organic electronic device having the gas barrier film
KR100397785B1 (en) Method for encapsulating in organic electroluminescent display
US7026186B2 (en) Method for producing polymer-free area on a substrate
CN1291504C (en) Organic LED with hydrophobic film and its manufacture
US20070046198A1 (en) Organic electroluminescent device, cover plate of organic electroluminescent device, and method for fabricating cover plate
CN1665354A (en) Manufacturing method of organic electroluminescent element, film removal equipment, and wiping arrangement
US20050185336A1 (en) [film removing equipment, erasing device and method of fabricating organic electro-luminescent device]
CN103337596A (en) Organic light-emitting diode packaging structure and production method thereof
JP5338446B2 (en) Organic electroluminescence device and sealing method thereof
WO2023112843A1 (en) Method for sealing organic el element, organic el element, organic el device and device for vehicles
WO2015133286A1 (en) Sealing method for functional elements, and functional element sealed by said sealing method
CN2613053Y (en) Organic LED with water removing film
KR100623704B1 (en) method for fabricating Organic light emission device panel
KR100444261B1 (en) Method for encapsulating Organic Electro Luminescence Display element
CN2655427Y (en) Organic LED with dehumidifying film

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication