CN1859827A - Method for preventing golden finger and base board from pollution - Google Patents
Method for preventing golden finger and base board from pollution Download PDFInfo
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- CN1859827A CN1859827A CN 200510067999 CN200510067999A CN1859827A CN 1859827 A CN1859827 A CN 1859827A CN 200510067999 CN200510067999 CN 200510067999 CN 200510067999 A CN200510067999 A CN 200510067999A CN 1859827 A CN1859827 A CN 1859827A
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- resistant film
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Abstract
The present invention provides golden finger and base plate antipollution method. It features utilizing heat resisting and having hypertonic plastic material, rubber and silica gel etc material, covering heat resisting to 300 degree centigrade film before entering high temperature soldering lead, adhering on circuit base plate by utilizing material high-tension effect, because of capillarity and atmospheric pressure capable of making film effectively sealing building with base plate, thereby without making contamination in soldering lead or electroplating process, and easy clearing and reusable.
Description
Technical field
Technology under the present invention provides a kind of golden finger or the antipollution method of substrate; utilization can be with the material of arts demand adjustment; with have the moulding of high-tension, rubber, silica gel material, can heat-resisting film to 300 ℃ of high temperature; being coated on before circuit board enters high temperature scolding tin needs the protection part, and fitting effectively reaches preventing polluting effect.
Background technology
In the present technology of prior art printed circuit board (PCB) and golden finger; the main bottleneck of the acceptance rate of product be to be subject in the scolding tin process to weld or when crossing tin the scolding tin recrement of unexpected splash pollute; the acceptance rate that influences product is very big; general golden finger bonds to scolding tin or conductive materials if having to be stained with; just damage fully; its prevention method has the chemical adhesive tape of use and semisolid chemical solution etc. at present; to use chemical adhesive tape; but only can use by single; though heat resistant adhesive tape can bear 185～200 ℃ of scolding tin temperature; though can prevent scolding tin improper be stained with glutinous; but the chemical viscose that adhesive tape uses; then easily at high temperature produce chemical change or softening produce be stained with glutinous; very and influence adhesive tape itself and produce distortion; cause hide worn-out bad or remove difficult; and after removing, still have and be stained with glutinous phenomenon; regular meeting is in the processing substrate process; the tool stickiness carries on as before; and cause secondary pollution; the stability of influence (golden finger) circuit own and the yield of product are very huge; and different states is essential gets rid of (the too much or adhesive tape distortion as viscose because of often having on operating; or the improper necessary horse back of glutinous foreign material of being stained with is got rid of; just can carry out next flow process); therefore often need with artificial interventional procedure; goods batch therefore can't be smooth and easy; very inconvenience, and start again after affixing to remove, though adhesive tape can be high temperature resistant; but still have chemical reaction or ruckbildung through behind the high temperature, tear off the problem that still has.And this traditional chemical stickiness adhesive tape is pasted and is difficult for and must tears repeatedly and close correction, and glutinous place is stained with in the not coating that had before departed from after therefore revising, and in technology, can be stained with glutinous other impurity at any time, produces many problems; Moreover adhesive tape only can use by single, because heat resistant adhesive tape is the consumptive material of high unit price, therefore make cost high, it is very huge to influence competitiveness, adhesive tape working costs in addition, must bind by manual synchronizing, accuracy and speed can't promote, form a big bottleneck of present stage seal circuit board technology, the fear essence of the scholar who much has the inclination exhausts worry to be desired to be improved and do not know the right way, in the soldering-inhibiting method as patent application case number 090122192 printed circuit board (PCB), anti-welding material is to invest on the circuit board with semisolid chemical material, through baking-curing, to remove through the chemicals etching again, technological operation is complicated, for easy substrate and golden finger technology, consuming time bothersome, can't effectively lower cost of manufacture, really be that industry one perplexs greatly.
Therefore, how to provide a kind of operation simple and easy, can be precisely also reusable fast, effectively reduce cost of manufacture, and significantly promote the golden finger and the antipollution method of substrate of product fine rate, be for exciting this case inventor's invention motivation place.
Summary of the invention
See also shown in Figure 1ly, the invention provides the antipollution method of a kind of golden finger and substrate, for solving above-mentioned prior art problems, the present invention uses following method, comprising:
Prepare a heat-resistant film, it can adjust its material with arts demand, generally be make with materials such as plastics with high-tension, rubber, silica gel, can heat-resisting films to 300 ℃ of degree high temperature, being coated on before circuit board enters high temperature scolding tin needs the protection part.The height extension power of material itself, high absorption affinity, high-tension and cohesive force effect, it is fitted on the circuit substrate, can make the effective sealing paste of film be combined on the substrate (i.e. step 1) among the figure, effect with difficult drop-off, and the practice of the present invention is to stamp basic diagram and put hole (step 2) afterwards on substrate, (step 3) is pressed the place punching that the foregoing circuit version needs scolding tin to get heat-resistant film again, heat-resistant film is loaded onto the geometrical clamp (step 4) of template (workbench), and the circuits plate (step 5) covers heat-resistant film again and (revises this heat-resisting anti-welding film (step 7) of location after the step 6) in workbench, flatten heat-resistant film and (cross tin stove (step 9) after the step 8), remove the dregs (step 10) of welding again, pick up heat-resistant film (step 11), check that simultaneously heat-resistant film has or not damage (step 12), then do not reply the 4th step if there is the mutilator, if the mutilator replys the 1st step;
Another embodiment of the present invention is to get geometrical clamp (step 13) on the heat-resistant film, put substrate (step 14), heat-resistant film is flattened in pin part (step 15) (get rid of unnecessary air and get final product complete driving fit), dregs (step 17) after imposing tin (step 16) and removing tin, pick up heat-resistant film (step 18), check that simultaneously heat-resistant film has or not damage (step 19) and do not reply the 2nd step if there is the mutilator, have damage then to change heat-resistant film.
Wherein aforementioned heat-resistant film can repeat processing and use, and makes different circuit diagram hole or pin hole respectively, earlier after fit, flatten, cross tin (scolding tin or etching), remove, pick up old film, changes the film in novel circuit figure hole again, repeatedly repeats previous technology.And wherein antipollution heat-resistant film can be fitted with artificial or machine.
Description of drawings
Fig. 1 is used for antipollution flow chart () for heat-resistant film of the present invention;
Fig. 2 is used for antipollution flow chart (two) for heat-resistant film of the present invention;
Fig. 3 is heat-resistant film of the present invention and golden finger and baseplate-laminating one figure;
Fig. 4 is heat-resistant film of the present invention and golden finger and baseplate-laminating two figure;
Fig. 5 is heat-resistant film of the present invention and golden finger and baseplate-laminating three figure;
Fig. 6 is heat-resistant film of the present invention and golden finger and baseplate-laminating four figure.
Drawing reference numeral: substrate 1; Basic diagram and some hole 2; Get heat-resistant film 3; Heat-resistant film is loaded onto the geometrical clamp 4 of template (workbench); The circuits plate is in workbench 5; Heat-resistant film 6; Ground floor protection heat-resistant film 60; Second layer protection heat-resistant film 601; Block heat-resistant film 61,62,64,63,65; Revise the heat-resisting anti-welding film 7 in location; Flatten heat-resistant film 8; Cross tin stove 9; Remove the dregs 10 of welding; Pick up heat-resistant film 11; Check that heat-resistant film has or not damage 12; Get geometrical clamp 13 on the heat-resistant film; Put substrate 14; Heat-resistant film flattens in pin part 15; Cross tin 16; Removed the dregs 17 behind the tin; Pick up heat-resistant film 18; Check that heat-resistant film has or not damage 19; No mutilator replys second step 20; The mutilator changes heat-resistant film 21; Golden finger 22; Electronic building brick 23,24; Double layer substrate 25.
Embodiment
See also as Fig. 3, Fig. 4, Fig. 5 and shown in Figure 6, the present invention provides the method for a kind of golden finger and substrate antipollution, and preferred forms of the present invention comprises:
Get a heat-resistant film, this film is the high-tension heat proof material, this heat-resistant film can be coated on golden finger and the substrate 1, and this heat-resistant film and golden finger and substrate are fitted mutually and formed the thermal insulation protection mould, borrows absorption applying effect reduction electronic building brick damage and scolding tin recrement to pollute;
Block heat-resistant film 61,62,64,63,65 for setting up block at interval separately in golden finger 22 surfaces, with septal area piece between block heat-resistant film 61,62,63,64,65 difference coating golden fingers 22 surfaces, separates protection in order to set up conformable region separately;
The golden finger and the substrate that have electronic building brick as the aforementioned, its electronic building brick places between heat-resistant film and golden finger and the substrate, the heat-resistant film of 23 coatings of this electronic building brick is a ground floor protection heat-resistant film 60, wherein the not coating part electronic building brick 24 of this ground floor protection heat-resistant film 60 can be provided with second layer protection heat-resistant film 601, to reach the effect that double layer substrate 25 and electronic building brick 23,24 layering coatings are fitted.
For making the present invention more show its progressive and practicality, hereby its advantage is listed below:
1, heat-resistant film has high absorption affinity, high-tension and cohesive force effect.
2, heat-resistant film is reusable reaches more than 200 times the tool practicality.
3, do not bind the tool progressive by chemicals.
4, easy and simple to handle, mechanically fixing operation.
Claims (12)
1, the antipollution method of a kind of golden finger and substrate, utilize heat-resisting and have the heat-resisting film that plastics, the rubber material of high-tension are made to 300 ℃ of high temperature, being coated on before circuit board enters high temperature scolding tin welding needs the protection part, is fitted on the circuit substrate by the high-tension effect of material itself;
It is characterized in that this method step is as follows: get a heat-resistant film, after substrate is stamped basic diagram and some hole, this heat-resistant film is pressed the place punching that the circuit version needs scolding tin, and this heat-resistant film is loaded onto the geometrical clamp of template (workbench), and the circuits plate is revised the heat-resisting anti-welding film in location after workbench covers heat-resistant film again, cross solder furnace after flattening heat-resistant film, remove the dregs of welding again, pick up heat-resistant film.
2, the antipollution method of golden finger as claimed in claim 1 and substrate, after it is characterized in that aforesaid heat-resistant film coating, can get on the heat-resistant film geometrical clamp again and put substrate, the heat-resistant film pressing is partly imposed scolding tin at pin, and removed dregs behind the tin, pick up heat-resistant film after scolding tin and the dregs after removing welding pick up heat-resistant film.
3, the antipollution method of golden finger as claimed in claim 1 and substrate is characterized in that plastics, the rubber material of aforesaid heat-resistant film has high absorption affinity, high-tension and cohesive force effect.
4, the antipollution method of golden finger as claimed in claim 1 and substrate, but it is characterized in that the moulding of this heat-resistant film, silicon, rubber material heatproof are 300 degree high temperature.
5, the antipollution method of golden finger as claimed in claim 1 and substrate, it is characterized in that aforementioned heat-resistant film can repeat processing and use, make different circuit diagram hole or pin hole respectively, earlier after fit, flatten, cross tin (scolding tin), remove, pick up old film, change the film in novel circuit figure hole again, repeatedly repeat previous technology.
6, the antipollution method of golden finger as claimed in claim 1 and substrate is characterized in that aforementioned antipollution heat-resistant film can cut into different shapes, is fitted in respectively on the substrate or golden finger that must protect.
7, the antipollution method of golden finger as claimed in claim 1 and substrate is characterized in that aforementioned anti-pollution heat-resistant film, can print different circuits or pin hole simultaneously, with desired height, and the storehouse mode, adhesive substrates again through tin or subsides seal, and can repeat to apply.
8, the antipollution method of golden finger as claimed in claim 1 and substrate is characterized in that antipollution heat-resistant film can be used artificial or machine is fitted.
9, the antipollution method of golden finger as claimed in claim 1 and substrate, it is characterized in that aforementioned antipollution heat-resistant film can adapt to substrate interpolation different medium and repeat to apply, make different circuit diagram hole or pin hole respectively, earlier after fit, flatten, cross tin (scolding tin or etching), remove, pick up old film, change the film in novel circuit figure hole again, repeatedly repeat previous technology.
10, the antipollution method of golden finger as claimed in claim 1 and substrate; it is characterized in that aforementioned heat-resistant film can be coated on golden finger and the substrate; this heat-resistant film and golden finger and substrate are fitted mutually and are formed the thermal insulation protection mould, borrow absorption applying effect reduction electronic building brick damage and scolding tin recrement to pollute.
11, the antipollution method of golden finger as claimed in claim 1 and substrate; it is characterized in that this block heat-resistant film; provide this golden finger surface to set up block at interval separately, use the block heat-resistant film interval block on coating golden finger surface respectively, in order to set up the conformable region insulation blocking separately.
12, the antipollution method of golden finger as claimed in claim 1 and substrate, it is characterized in that the electronic building brick on this golden finger and the substrate places between heat-resistant film and golden finger and the substrate, the heat-resistant film of this electronic building brick institute coating is a ground floor protection heat-resistant film, and the not coating part electronic building brick of this ground floor protection heat-resistant film can be provided with second layer protection heat-resistant film, to reach double layer substrate and electronic building brick layering coating applying effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510067999 CN1859827A (en) | 2005-04-30 | 2005-04-30 | Method for preventing golden finger and base board from pollution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510067999 CN1859827A (en) | 2005-04-30 | 2005-04-30 | Method for preventing golden finger and base board from pollution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1859827A true CN1859827A (en) | 2006-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510067999 Pending CN1859827A (en) | 2005-04-30 | 2005-04-30 | Method for preventing golden finger and base board from pollution |
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| CN (1) | CN1859827A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494955B (en) * | 2009-02-25 | 2011-03-23 | 深圳市华丰电器器件制造有限公司 | Method for printing ripping blue glue on gold finger tin-spraying plate |
| CN103372702A (en) * | 2012-04-18 | 2013-10-30 | 珠海格力电器股份有限公司 | Welding auxiliary device |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
| CN105667107A (en) * | 2016-01-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Method for preventing golden fingers from being stained by tin |
| WO2019128282A1 (en) * | 2017-12-29 | 2019-07-04 | 京信通信系统（中国）有限公司 | Tin printing jig and tin printing method |
| CN113579405A (en) * | 2021-08-13 | 2021-11-02 | 格力大松（宿迁）生活电器有限公司 | Gold finger anti-pollution device |
-
2005
- 2005-04-30 CN CN 200510067999 patent/CN1859827A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494955B (en) * | 2009-02-25 | 2011-03-23 | 深圳市华丰电器器件制造有限公司 | Method for printing ripping blue glue on gold finger tin-spraying plate |
| CN103372702A (en) * | 2012-04-18 | 2013-10-30 | 珠海格力电器股份有限公司 | Welding auxiliary device |
| CN103372702B (en) * | 2012-04-18 | 2016-03-16 | 珠海格力电器股份有限公司 | Welding auxiliary device |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
| CN105667107A (en) * | 2016-01-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Method for preventing golden fingers from being stained by tin |
| WO2019128282A1 (en) * | 2017-12-29 | 2019-07-04 | 京信通信系统（中国）有限公司 | Tin printing jig and tin printing method |
| CN113579405A (en) * | 2021-08-13 | 2021-11-02 | 格力大松（宿迁）生活电器有限公司 | Gold finger anti-pollution device |
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