CN1848030A - Method of making RF module on computer mainboard - Google Patents
Method of making RF module on computer mainboard Download PDFInfo
- Publication number
- CN1848030A CN1848030A CNA2005100650975A CN200510065097A CN1848030A CN 1848030 A CN1848030 A CN 1848030A CN A2005100650975 A CNA2005100650975 A CN A2005100650975A CN 200510065097 A CN200510065097 A CN 200510065097A CN 1848030 A CN1848030 A CN 1848030A
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- circuit
- hole
- radio frequency
- daughter board
- wireless radio
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Abstract
The method of integrating RF module for treating analog radio signal onto a computer mainboard includes making the RF module integrally on one circuit board, forming at least one through hole in the margin of the circuit board, fixing the circuit board onto the computer mainboard in surface mounting mode, and filling the through hole with conducting material for connection between the circuit in the circuit board to the circuit in the mainboard.
Description
Technical field
The invention relates to the associated methods of a kind of wireless radio frequency modules and computer main frame panel, particularly relevant for a kind of method with wireless radio frequency modules and computer main frame panel integration and making.
Background technology
Along with the prosperity day by day of mechanics of communication, can be also more and more as the system of communication platform.The telegram and the telephone system of circuit switching formula (circuit-switch) before the earliest to the information network system of packet-switched formula (packet-switch) now, all can reach the purpose of data communication.Wherein among the environment of information network, department of computer science is unified to being one of most important data access platform, so present general computer system most likely is equipped with the module of access the Internet data.
The access method of internet data can be divided into many levels, and wherein the most beneath (or the most preliminary) level is the acquisition of analog signal.For example often be used to set up wired local area network (wire localarea network, Ethernet LAN) (Ethernet) system, transmitted on its physical circuit be through the coding after analog electronic signal.Therefore when a computer system desire receives from the data on the Ethernet, must be earlier through an analog signal processing module, be so-called Physical layer (physical layer), receive these simulation electronic signals, again these simulation electronic signals are converted to numerical data and the digital data processing circuit transferred in the computer system carries out all subsequent treatment.Same, when the computer system desire transmits numerical data through Ethernet, also must utilize the analog signal processing module that digital data conversion is the simulation electronic signal earlier, these simulation electronic signals are transmitted on physical circuit.This shows that if will make computer system have the function of data communication, the processing module of analog signal is indispensable.
With the WLAN of day by day popularizing at present (its communication standard for example is standards such as IEEE 802.11 a/b/g/n), it equally is the physical transfer of carrying out data signals with simulated mode, but different be that it is to replace wired simulation electronic signal to transmit in air with wireless simulation electric wave signal.Therefore, in the middle of computer system, just need a wireless radio frequency modules and handle these simulation electric wave signals.
The Integration Design of circuit system is a trend of circuit design now, and for example the unit such as display card, sound card and cable network card in the computer system often are integrated and are produced on the computer main frame panel at present.But when the desire of the wireless radio frequency modules in the radio network unit combines with computer main frame panel, but can run into some problems, comprise that the analog signal in the middle of the wireless radio frequency modules very easily is subjected on the computer main frame panel and the interference of the digital signal of other digital units, and significantly reduce problem such as wireless radio frequency modules operating efficiency.
Traditional way is with whole radio network unit at present, wireless radio frequency modules and digital signal processing module have been comprised, together be produced on the adapter, the standard interface that this wireless network adapter sees through as mini PCI and so on again is connected with computer main frame panel, wherein between wireless radio frequency modules and digital signal processing module, can be provided with quarantine measures, to reduce the interference of other digital units signal.And above-mentioned radio network unit method for making has some shortcomings, for example can need higher cost and bigger volume.Because wireless radio frequency modules and digital signal processing module together be produced on need the quarantine measures that add on the adapter, and the standard interface of linking up with computer main frame panel, so need higher cost.In addition, also because standard interface has been arranged, be difficult to dwindle the volume of whole radio network unit, this is an adverse factors in the computer system of miniaturization.
To sum up discuss as can be known, how with radio network unit with the computer main frame panel integration and making, and a kind of method that can effectively avoid the wireless radio frequency modules in the radio network unit disturbed by other digital circuit can be provided, and is present epochmaking trend and problem.
Summary of the invention
Therefore fundamental purpose of the present invention is providing a kind of in computer system, the integration and making method of wireless radio frequency modules and motherboard exactly.
Another object of the present invention is providing a kind of in computer system exactly, the method for avoiding wireless radio frequency modules disturbed by other digital circuit.
A further object of the present invention is providing a kind of in computer system exactly, reduces the method for the manufacturing cost of wireless radio frequency modules.
Another purpose of the present invention is providing a kind of in computer system exactly, but elasticity is changed the method for wireless radio frequency modules kind.
For reaching above-mentioned purpose of the present invention, method proposed by the invention can be earlier be produced on the circuit daughter board wireless radio frequency modules is whole.The edge designs of this circuit daughter board has at least one through hole, and wireless radio frequency modules is desired can extend to these through holes in order to the circuit that is connected with the circuit of circuit substrate always.Then, the circuit daughter board is fixed on the circuit substrate, below through hole, can have the line contacts that the circuit substrate desire is connected with wireless radio frequency modules this moment, in through hole, fill conductor material the circuit of wireless radio frequency modules and circuit substrate is connected to each other.
Description of drawings
For above and other objects of the present invention, feature, advantage and embodiment can be become apparent, appended graphic being described in detail as follows:
Fig. 1 is the circuit substrate synoptic diagram of an embodiment according to the invention.
Fig. 2 is the method flow diagram of an embodiment according to the invention.
The primary clustering symbol description
102: circuit substrate 104: digital circuit
106: circuit 108: contact
110: digital signal processing module 112: the circuit daughter board
114: wireless radio frequency modules 116: circuit
118: through hole 202-208: step
Embodiment
The radio network unit of use in computer system can be divided into two parts haply, and one is the wireless radio frequency modules in order to the treatment of simulated signal, and another is in order to handle the digital signal processing module of digital signal.And one of purpose of the present invention is to wish that these two modules can together integrate manufacturing with computer main frame panel.This can not cause too big difficulty concerning the digital signal processing module, but can make wireless radio frequency modules be subjected to the interference of digital signal easily concerning wireless radio frequency modules, and reduces operating efficiency.Therefore, key concept of the present invention is earlier wireless radio frequency modules to be produced on the isolated area, this isolated area and computer main frame panel is linked together again, and makes wireless radio frequency modules be difficult for being disturbed by the digital circuit on the computer main frame panel.
Fig. 1 shows to utilize and meets computer main frame panel and the wireless radio frequency modules synoptic diagram that one of this method embodiment made comes out.Circuit substrate 102 wherein is common system host board in general computer system, and common for example is printed circuit board (PCB) (printed circuit board, PCB).Can design and produce digital circuit unit miscellaneous on the circuit substrate 102, for example central control unit and internal storage location or the like are referred to as digital circuit 104 at this with all digital circuit units on the circuit substrate 102.It should be noted that especially, because the digital signal processing module 110 in the radio network unit can be easily with circuit substrate 102 on other digital circuit unit together be produced on the circuit substrate 102, so in the middle of digital circuit 104, in fact also comprised the digital signal processing module 110 in the radio network unit.And being digital signal processing modules 110 in digital circuit 104, circuit 106 extends out, in order to the circuit of doing to be connected with the following wireless radio frequency modules of introducing, its end also have in order to the contacted contact of the circuit of wireless radio frequency modules (pad) 108.
Wireless radio frequency modules 114 then is discussed.Because the wireless radio frequency modules 114 in the radio network unit above-mentioned can not together be produced on the motherboard as digital signal processing module 110, so wireless radio frequency modules is designed and produced on a circuit daughter board 112 in advance, this circuit daughter board 112 can equally with circuit substrate be printed circuit board (PCB) (PCB), but area gets little than circuit substrate 102.The assembly that has comprised all treatment of simulated wireless network electric signals in the middle of the wireless radio frequency modules 114, for example wireless transceiver (transceiver), low noise amplifier (low noise amplifier, LNA), (power amplifier is PA) and in order to antenna terminal (antenna connector) of being connected with the electric wave antenna or the like for power amplifier.With present general wireless network standards, wireless radio frequency modules 114 can be handled the simulation electronic signal that frequency is 2.4GHz or 5GHz etc.
Same, the circuit 116 on the circuit daughter board 112 is to extend from wireless radio frequency modules 114, in order to the circuit of doing to be connected with digital signal processing module 110, its end can extend to till the through hole 118 at circuit daughter board 112 edges always.These through holes 118 are positioned at the edge of circuit daughter board 112.The through hole 118 that is illustrated among Fig. 1 is formed breach on the edge of circuit daughter board 112, can be considered an open semicircle hole, and through hole 118 also can be a closed circular opening near circuit daughter board 112 edges certainly.In addition, can be at the material of the inner edge degree last layer of these through holes 118 such as Copper Foil and so on, to increase electric conductivity and the metal adhesion in the through hole 118.
In order to reach the purpose that wireless radio frequency modules 114 and circuit substrate 102 are combined, circuit daughter board 112 must be fixed on the circuit substrate 102.Be that (surface mount design, mode SMD) is fixed on circuit daughter board 112 on the surface of circuit substrate 102 with general mounted on surface design in the present embodiment.Then unqualified as for being fixed on circuit substrate 102 lip-deep which position.Unique it should be noted that when circuit daughter board 112 is placed the top of circuit substrate, the position of the through hole 118 on the circuit daughter board 112 must be positioned at the top of contact 108, is beneficial to being connected of circuit 108 and circuit 118.
Circuit daughter board 112 can be packed into conductor material, for example employed in the present embodiment tin after interosculating with circuit substrate 102 in through hole 118.At this moment, conductor materials in the through hole 118 just can connect circuit 106 on the circuit substrate 102 and the circuit 116 on the circuit daughter board 112, that is to say, digital signal processing module 110 on the circuit substrate 102 can be led to again with circuit daughter board 112 and be merged the radio network unit that becomes on the circuit substrate 102, and the operation of wireless radio frequency modules 114 also is difficult for being disturbed by the digital circuit on the circuit substrate 102 104.In addition, when this computer system desire changes the operation frequency of radio network unit, only need to change circuit daughter board 112 and get final product together with radio-frequency module 114, very convenient.
Comprehensive the above, in Fig. 2, represented the method flow diagram of an embodiment according to the invention.In step 202, can be earlier other digital units of digital signal processing module in the radio network unit and computer system be together designed and produced on a circuit substrate, and the circuit that the digital signal processing module is desired to be connected with wireless radio frequency modules in the radio network unit extends out, and terminal also design of each bar circuit has a contact.In step 204, wireless radio frequency modules in the radio network unit is designed to be produced on the circuit daughter board, the edge of this circuit daughter board has the design of through hole, and each bar circuit that wireless radio frequency modules is desired to be connected with the digital signal processing module of radio network unit all can extend to till the through hole separately always.Among step 206, utilized technique for fixing that circuit daughter board and circuit substrate are combined as mounted on surface design and so on, wherein, the position of the through hole of circuit daughter board must be positioned at the top of the contact of circuit substrate.Among step 208, but the material of electric conductivity is filled among the through hole, make packing material contact contact on the circuit substrate and the wireless radio frequency modules circuit on the circuit daughter board simultaneously, to finish the connection of wireless radio frequency modules and digital signal processing module.
Though the present invention with a preferred embodiment openly as above; right its is not in order to qualification the present invention, any insider, without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (18)
1. method for making with motherboard of a radio network unit comprises:
One circuit substrate and a circuit daughter board are provided;
Make a digital signal processing module and at least one contact on this circuit substrate, wherein the circuit of this digital signal processing module can extend to this contact;
Make a wireless radio frequency modules and at least one through hole on this circuit daughter board, wherein the circuit of this wireless radio frequency modules can extend to this through hole;
Fix this circuit daughter board on the surface of this circuit substrate, wherein this through hole position is above this contact; And
Fill a conductor material among this through hole, make this conductor material can contact this through hole and this contact simultaneously, make the circuit of this wireless radio frequency modules and the circuit of this digital signal processing module electrically connect.
2. method according to claim 1, wherein this wireless radio frequency modules comprises a wireless transceiver, a low noise amplifier, a power amplifier and an antenna terminal.
3. method according to claim 1, wherein this wireless radio frequency modules can be handled the simulation electronic signal that frequency is 2.4GHz or 5GHz.
4. method according to claim 1, wherein this circuit substrate is a printed circuit board (PCB).
5. method according to claim 1, wherein this circuit daughter board is a printed circuit board (PCB).
6. method according to claim 1, wherein the form of this through hole is the semicircle shape breach of position at this circuit daughter board edge, or is the hole of position on this circuit daughter board.
7. method according to claim 1, wherein the edge of this through hole is coated with Copper Foil.
8. method according to claim 1, wherein this fixing step is to reach with the method for general mounted on surface design.
9. method according to claim 1, wherein this conductor material is a tin.
10. motherboard with a radio network unit comprises:
One circuit substrate;
One digital signal processing module designs and produces on this circuit substrate;
At least one contact is formed on this circuit substrate, and wherein the circuit of this digital signal processing module can extend to this contact;
One circuit daughter board is fixed on the surface of this circuit substrate;
One wireless radio frequency modules designs and produces on this circuit daughter board; And
At least one through hole, be formed on this circuit daughter board and be positioned at the top of this contact, wherein the circuit of this wireless radio frequency modules can extend to this through hole, among this through hole and be filled with a conductor material, make this conductor material can contact this through hole and this contact simultaneously, make the circuit of this wireless radio frequency modules and the circuit of this digital signal processing module electrically connect.
11. motherboard according to claim 10, wherein this wireless radio frequency modules comprises a wireless transceiver, a low noise amplifier, a power amplifier and an antenna terminal.
12. motherboard according to claim 10, wherein this wireless radio frequency modules can be handled the simulation electronic signal that frequency is 2.4GHz or 5GHz.
13. motherboard according to claim 10, wherein this circuit substrate is a printed circuit board (PCB).
14. motherboard according to claim 10, wherein this circuit daughter board is a printed circuit board (PCB).
15. motherboard according to claim 10, wherein the form of this through hole is a semicircle shape breach that is positioned at this circuit daughter board edge, or for being positioned at the hole on this circuit daughter board.
16. motherboard according to claim 10, wherein the edge of this through hole is coated with Copper Foil.
17. motherboard according to claim 10 wherein is that general mounted on surface designing technique is fixed together between this circuit substrate and this circuit daughter board.
18. motherboard according to claim 1, wherein this conductor material is a tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100650975A CN1848030A (en) | 2005-04-14 | 2005-04-14 | Method of making RF module on computer mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100650975A CN1848030A (en) | 2005-04-14 | 2005-04-14 | Method of making RF module on computer mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1848030A true CN1848030A (en) | 2006-10-18 |
Family
ID=37077619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100650975A Pending CN1848030A (en) | 2005-04-14 | 2005-04-14 | Method of making RF module on computer mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1848030A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012167465A1 (en) * | 2011-07-04 | 2012-12-13 | Huawei Technologies Co., Ltd. | Coupling arrangement |
-
2005
- 2005-04-14 CN CNA2005100650975A patent/CN1848030A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012167465A1 (en) * | 2011-07-04 | 2012-12-13 | Huawei Technologies Co., Ltd. | Coupling arrangement |
| US9252474B2 (en) | 2011-07-04 | 2016-02-02 | Huawei Technologies Co., Ltd. | Coupling arrangement |
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