CN1842393A - Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate - Google Patents

Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate Download PDF

Info

Publication number
CN1842393A
CN1842393A CNA2004800246769A CN200480024676A CN1842393A CN 1842393 A CN1842393 A CN 1842393A CN A2004800246769 A CNA2004800246769 A CN A2004800246769A CN 200480024676 A CN200480024676 A CN 200480024676A CN 1842393 A CN1842393 A CN 1842393A
Authority
CN
China
Prior art keywords
laser beam
deflection
light emitter
deflector plate
lasing light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004800246769A
Other languages
Chinese (zh)
Other versions
CN100496856C (en
Inventor
埃迪·鲁兰茨
斯特凡·迪特里赫
汉斯·J·梅尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1842393A publication Critical patent/CN1842393A/en
Application granted granted Critical
Publication of CN100496856C publication Critical patent/CN100496856C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

The device for material processing comprises a laser source (1), for the generation of a laser beam (11), a deflecting unit (2), arranged in the beam path of the laser beam (11) with at least two mirrors (35,45), which may pivot about mirror axes (38,48), forming an angle with each other, and a focussing unit in the form of a lens (5). The drive units for the deflecting unit (2) are each formed by piezoelectric deflector plates (3,4), comprising polarised regions, alternately opposed by means of domain inversion, such that, on application of voltages with alternately opposed polarities, a torsion may be exerted on the free end (35,45) of each deflector plate and hence the mirror axis (38, 48). Substrates (6) such as electrical circuit substrates and circuit boards can thus be processed at extremely high rate and very accurately.

Description

Be used for by by comprising piezoelectric deflector plate
The device of the laser beam rapidoprint of deflection unit guiding
Technical field
The present invention relates to a kind of device that is used for by the laser beam rapidoprint, comprising:
The lasing light emitter of-emission laser beam,
-being arranged on the deflection unit in the light path of this laser beam, this deflection unit has at least two minute surfaces in the light path relative, that be successively set on laser beam, and these minute surfaces can wind axis of reflection rotation each other in certain angle by driver element respectively, and
-image-generating unit, this image-generating unit correspondingly focus on laser beam the position of being determined by deflection unit of workpiece.
Background technology
For example in DE10145184A1, described a kind of such device, wherein be particularly related in circuit board and hole.Equally, also this device can be used in electronics industry material being carried out structuring, finishing, mark, welding, soldering and cutting.In addition, the speed of this materials processing and precision are subjected to the restriction of beam deflection technique.For the substrate place that can be fixed on the machine table at the specific relative position place between the optical system of laser instrument and serial connection, on the other hand on the one hand processes big as far as possible surf zone, deflection unit is necessary can be with very big angle of laser beam deflection.Therefore, it is low as far as possible that the amount of exercise of the substrate on the machine table should keep, to guarantee economic operation.Therefore, in this device, use traditional deflection unit at present with Galvo motor.Typically, these motors have the deflection optical angle up to ± 25 °.Yet the attainable deflection speed of Galvo motor is suppressed or limiting factor-as the inertia of magnetic saturation, mirror quality etc.-restriction.Reduce if do not want to tolerate precision, in the Galvo motor, because their structure and mode of operation can not further improve speed and power above current possible values.
Though advised using typical piezoelectric element to come deflection or laser beam.But, in when waiting until high angular speed and angular acceleration, these piezoelectric elements are only realized little deflection angle, are typically ± 2 ° to ± 5 °.
Yet, a kind of device that uses the piezoelectric board deflected beam is also disclosed among the DE10031877C1, wherein the end that does not have electrode of piezoelectric board is used for deflected beam as reflecting segment.The document has also been described, and obtains to have the adjacent piezoelectricity scope of relative spontaneous polarization by so-called territory counter-rotating (domain inversion).
Summary of the invention
A kind of device that is used for rapidoprint that the purpose of this invention is to provide type noted earlier, be used in particular for the processing circuit substrate, wherein deflection unit can be realized the deflection angle of the same levels that can realize with the Galvo motor, but has higher deflection speed and identical at least precision.
According to the present invention, this purpose is to realize like this, promptly form the driver element of deflection unit respectively by piezoelectric deflector plate, this piezoelectric deflector plate is at one end clamped, and has reflecting segment minute surface, that do not have electrode of support at its free end, wherein deflecting plates comprises the zone with relative polarization direction alternately like this by the territory counter-rotating respectively, make that the corresponding free end that causes the corresponding deflection plate is around reversing along the torsional axis of its longitudinal extension by minute surface in the time will having that alternately the voltage of polarization is applied to each zone.
The present invention utilizes such understanding, in the piezoelectric board that the territory counter-rotating of promptly describing in by DE10031877C1 obtains, can obtain than high a lot of deflection angle in the traditional piezoelectric elements by reversing.Thus, this deflecting plates can also be used in the laser device economically, is used for processing circuit board, wherein by this way can the big relatively machining area of high-speed, high precision ground processing.Therefore, by Focused Optical system suitable, for example telecentric iris, the laser beam of deflection can fully accurately be positioned on the object that will process.Compare with traditional Galvo motor, the advantage of this torsional deflection device is, can obtain very high speed when high accuracy very, and needn't be tolerated in the light-beam position skew that may occur in the curved deflector device.
Torsional deflection device used according to the invention is realized ± 20 ° to ± 25 ° deflection optical angle.Advantage with respect to the Galvo deflector is that especially high reached speed one this speed may realize in laser drill, structuring, finishing and mark or spike etc.And deflection unit according to the present invention is anti-by mechanical friction and/or the wearing and tearing that caused by heating, and this for example often occurs in the Galvo motor.
Preferably, two torsional deflection devices are set up each other at an angle of 90.This means, first deflecting element passes through its torsional axis perpendicular cuts from the light beam of lasing light emitter incident and the finished surface of workpiece, second deflecting element comprises torsional axis, and this torsional axis limits the plane of the processing plane that is parallel to workpiece with the light beam that penetrates from lasing light emitter.
And in a kind of preferred implementation, deflecting plates comprises a plurality of territories of extension, parallel adjacent setting in the vertical respectively, and these territories have the deflection of relative orientation alternately, and by the relative voltage pressurization that replaces.
In another embodiment according to apparatus of the present invention, piezoelectric deflector plate scribbles the coating that has with the albedo of the predetermined wavelength coupling of the laser beam for the treatment of deflection respectively in its minute surface scope.And reflecting segment also can have reflecting surface at itself and minute surface opposing backside surface, and this reflecting surface is used for deflection control light beam.These reflecting surfaces also can be adjusted to adapt to the wavelength of controlling light beam in its coating especially.
Particularly advantageously be, the present invention and laser wave use jointly, and this laser wave reaches＞the high impulse frequency of 200kHz or preferred＞500kHz, and in these high-frequencies, have very narrow pulse width, for example＜and 20ns, preferred＜5ns.Like this, can considerably simplify the process of utilizing laser instrument; In many application, only in this way could process very at high speed.
By the fast-response time of deflection unit used according to the invention and very high realized speed, if for example laser instrument provides different pulse frequencies, then pulse train can change according to layout (layout).Thus, pulse overlap and laser instrument layout are irrelevant, that is, when utilizing laser instrument to carry out structuring, the pulse overlap of two continuous impulses can be held identical all the time, and whether show straight line with laser instrument or sharp curve is irrelevant.
And, when laser drill, different boring methods-as trepan, auger or so-called punching-can mutually combine or superpose no problem so that ideally with Load Distribution to the hole that will bore.
Description of drawings
By embodiment the present invention is described in more detail with reference to the accompanying drawings, wherein
The basic structure that accompanying drawing 1 is represented according to device of the present invention, and
The piezoelectric deflector plate of accompanying drawing 2 expression designs according to the present invention.
The specific embodiment
The processing unit (plant) that schematically shows in the accompanying drawing 1 comprises lasing light emitter 1, the laser beam 11 of lasing light emitter is deflected by having two piezoelectric deflector plates 3 in two planes that are perpendicular to one another and 4 deflection unit 2, and deflect into the surface of substrate 6 by telecentric iris (F-Theta) lens 5, substrate is fixed on the machine table 7, and can by machine table, at least on two horizontal directions-but preferably also on vertical direction with respect to laser instrument and radio optics (not shown)-be adjusted.
Laser Slabs 3 and 4 is clipped in respectively on the supporting walls 21 or 22 end 31 or 41 of deflection unit regularly. Mid portion 32 or 42 comprises the territory that replaces relative deflection, and these territories cause reversing of piezoelectric board when applying specific voltage.The corresponding free end 35 or 45 of each piezoelectric board does not have electrode, but has reflecting layer 36 or 46 respectively, to form mirror surface.Wherein, the adaptation Wavelength of Laser is adjusted in reflecting layer 36 or 46, to obtain best reflection.
Accompanying drawing 2 is schematically represented the structure of piezoelectric board 3 in more detail by example.The mid portion 32 of piezoelectric board 3 comprises territory 33 and 34 a plurality of strips, that extend side by side on the whole length of this mid portion 32, these territories with its spontaneous polarization are alternately adjusted by the territory counter-rotating, make their y alternately relative with the z axle.Each territory 33 or 34 has electrode 37 respectively at upside and downside.These electrodes are alternately applied equally with relative voltage.Because the end of piezoelectric board 31 is clamped regularly, so alternate voltages is being applied to each territory 33 or at 34 o'clock, piezo-electric effect causes the free end of this mid portion 32 to reverse.Do not have the link 35 of piezoelectric electrode to be subjected to identical twist motion, but self is not out of shape.Therefore, the laser beam 11 that incides the point 13 of minute surface 36 can be by deflection exactly, and skew do not occur.Only need guarantee that torsional axis 38 is in reflecting layer 36, and laser beam 11 is deflected on this torsional axis exactly.
Realized with reference to the accompanying drawings the function of 1 whole device thus.Laser beam 11 is deflected on the point 13 of piezoelectric board 3.It is reflected therefrom, and when deflecting reflection end 35, laser beam moves on the line 14 on the reflecting layer 46 of piezoelectric board 4, and this line is again on the torsional axis 48 of piezoelectric board 4.Therefrom, by reversing of piezoelectric board 4, laser beam can be deflected in the lens 5 on each point in zone 15, and by this lens imaging to the corresponding region 16 of substrate 6.
And, as shown in Figure 2, also can be coated with reflecting layer 39 with minute surface opposing backside surface with reflecting layer 36, so that for example light beam or control laser beam are controlled in deflection, and detect corresponding light-beam position by unshowned sensor array.

Claims (8)

1. device that is used for by the laser beam rapidoprint comprises:
The lasing light emitter (1) of emission laser beam (11),
Be arranged on the deflection unit (2) in the light path of described laser beam (11), have at least two minute surfaces (36 in the light path relative, that be successively set on described laser beam (11); 46), wherein said minute surface can rotate by means of the axis of reflection (38,48) that driver element (3,4) winds each other in certain angle respectively, and
Image-generating unit (5), described image-generating unit focus on described laser beam on the position of being determined by deflection unit of workpiece (6),
It is characterized in that the driver element (3,4) of described deflection unit (2) is formed by piezoelectric deflector plate respectively, described piezoelectric deflector plate at one end (31,41) is clamped, and has support minute surface (36 at its free end, reflecting segment 46), that do not have electrode (35,45)
Wherein said deflecting plates (3,4) comprise zone (33 respectively by the territory counter-rotating with relative polarization direction alternately, 34), make and be applied to each zone (33 at the voltage that will have alter polarity, 34) time, the corresponding free end that causes corresponding deflection plate (3,4) is around reversing along the torsional axis (38,48) of its longitudinal extension by the plane of reflection.
2. device according to claim 1 is characterized in that, described deflecting plates (3,4) has a plurality of territories that are arranged side by side that extend longitudinally, parallel (33,34) respectively, and described territory has and replaces relative polarization, and is applied in to replace relative voltage.
3. device according to claim 1 and 2, it is characterized in that, first deflecting element with its torsional axis (38) perpendicular cuts from the light beam (11) of described lasing light emitter incident and the finished surface of workpiece, second deflecting element (4) has torsional axis (48), and described torsional axis (48) defines the plane of the processing plane that is parallel to described workpiece with the light beam (11) from described lasing light emitter (1) incident.
4. according to each described device in the claim 1 to 3, it is characterized in that the minute surface of described deflecting plates (3,4) has respectively and the Wavelength matched coating for the treatment of the laser beam (11) of deflection.
5. according to each described device in the claim 1 to 4, it is characterized in that described reflecting segment (35,45) also has reflecting surface (39,49) respectively on itself and described minute surface (36,46) opposing backside surface, described reflecting surface is used for deflection control light beam.
6. device according to claim 5 is characterized in that, the reflecting surface at the described back side has the Wavelength matched coating (39,49) with described control light beam.
7. according to each described device in the claim 1 to 6, it is characterized in that setting can produce pulse frequency greater than 200kHz and the pulse width lasing light emitter (1) less than the laser beam of 20ns.
8. device according to claim 7 is characterized in that, described lasing light emitter produces pulse frequency greater than 500kHz and the pulse width laser beam less than 5ns.
CNB2004800246769A 2003-11-27 2004-10-27 Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate Expired - Fee Related CN100496856C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10355416.5 2003-11-27
DE10355416 2003-11-27

Publications (2)

Publication Number Publication Date
CN1842393A true CN1842393A (en) 2006-10-04
CN100496856C CN100496856C (en) 2009-06-10

Family

ID=34625299

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800246769A Expired - Fee Related CN100496856C (en) 2003-11-27 2004-10-27 Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate

Country Status (3)

Country Link
JP (1) JP2007512558A (en)
CN (1) CN100496856C (en)
WO (1) WO2005051591A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102311220A (en) * 2010-07-05 2012-01-11 三星移动显示器株式会社 Bombardment with laser beams device and the base plate seals device that comprises the bombardment with laser beams device
CN107000122A (en) * 2014-10-20 2017-08-01 百超激光股份公司 Processing head and Laser Processing machinery for laser machining machinery
CN113924184A (en) * 2019-06-07 2022-01-11 百超激光有限公司 Machining device for laser machining a workpiece and method for laser machining a workpiece

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
DE102017002866A1 (en) * 2017-03-24 2018-09-27 Blickfeld GmbH Scanner with two sequential scan units

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179270A (en) * 1984-09-26 1986-04-22 Olympus Optical Co Ltd Piezoelectric type displacement device
JP2601698B2 (en) * 1988-08-30 1997-04-16 株式会社小松製作所 Laser scanner rotation detection mechanism
JPH02224286A (en) * 1988-09-29 1990-09-06 Komatsu Ltd High-speed and high-precision scanner system
JP3210982B2 (en) * 1993-05-28 2001-09-25 オムロン株式会社 Optical scanning device, optical sensor device, code information reading device, and POS system using the optical scanning device
DE4332966A1 (en) * 1993-09-28 1995-03-30 Philips Patentverwaltung Torsion actuator and a method for its production
DE19630350C2 (en) * 1996-07-26 1998-08-20 Siemens Ag Ultrasonic transducer
DE10193737B4 (en) * 2000-08-29 2009-07-30 Mitsubishi Denki K.K. Laser processing device
DE10145184B4 (en) * 2001-09-13 2005-03-10 Siemens Ag Method for laser drilling, in particular using a shadow mask

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102311220A (en) * 2010-07-05 2012-01-11 三星移动显示器株式会社 Bombardment with laser beams device and the base plate seals device that comprises the bombardment with laser beams device
CN102311220B (en) * 2010-07-05 2015-10-14 三星显示有限公司 Bombardment with laser beams device and the base plate seals device comprising bombardment with laser beams device
CN107000122A (en) * 2014-10-20 2017-08-01 百超激光股份公司 Processing head and Laser Processing machinery for laser machining machinery
CN107000122B (en) * 2014-10-20 2020-07-10 百超激光股份公司 Machining head for laser machining machine and laser machining machine
US11135676B2 (en) 2014-10-20 2021-10-05 Bystronic Laser Ag Machining head for laser machining machine, and laser machining machine
CN113924184A (en) * 2019-06-07 2022-01-11 百超激光有限公司 Machining device for laser machining a workpiece and method for laser machining a workpiece
CN113924184B (en) * 2019-06-07 2023-12-29 百超激光有限公司 Machining device for laser machining a workpiece and method for laser machining a workpiece

Also Published As

Publication number Publication date
JP2007512558A (en) 2007-05-17
WO2005051591A1 (en) 2005-06-09
CN100496856C (en) 2009-06-10

Similar Documents

Publication Publication Date Title
JP4459530B2 (en) Laser processing equipment
EP2076354B1 (en) System for employing scanners in an x-y high speed drilling system
KR100691924B1 (en) A material machining apparatus and method
US4838631A (en) Laser beam directing system
CN102066037B (en) For compensating the method and apparatus from axle focal spot distortion
JP4820071B2 (en) Multi-beam micromachining system and method
US9691923B2 (en) Apparatus for and method of forming plural groups of laser beams using two rotating diffractive optical elements
US20050017156A1 (en) High-speed, precision, laser-based method and system for processing material of one or more targets within a field
US20120132629A1 (en) Method and apparatus for reducing taper of laser scribes
JP2003053576A (en) Method and device for laser beam machining
KR20020033205A (en) Method and apparatus for laser drilling
CN108581182A (en) Laser processing device and method
CN1612793A (en) Method for laser machining a workpiece with laser spot enlargement
CN100496856C (en) Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate
KR20070018761A (en) Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate
KR102665093B1 (en) Optics and method for providing two offset laser beams
JP3682295B2 (en) Laser processing equipment
JP2005262219A (en) Laser beam machining apparatus and laser beam drawing method
JP2006224142A (en) Laser scanner and laser marking apparatus, and laser marking method
JP2010023100A (en) Laser beam machining apparatus and laser beam machining method
JP2004167545A (en) Multi-axes laser beam machining apparatus and machining method
CN209911649U (en) Galvanometer scanning device and system
KR100942085B1 (en) Shape variable mirror and laser processing apparatus using a shape variable mirror
CN113102879A (en) Laser processing device and laser processing method
JP4505854B2 (en) Laser processing equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1091779

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1091779

Country of ref document: HK

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090610

Termination date: 20121027