CN1835202A - Rotary table device using multi-group clips for retaining wafers - Google Patents
Rotary table device using multi-group clips for retaining wafers Download PDFInfo
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- CN1835202A CN1835202A CN 200510055328 CN200510055328A CN1835202A CN 1835202 A CN1835202 A CN 1835202A CN 200510055328 CN200510055328 CN 200510055328 CN 200510055328 A CN200510055328 A CN 200510055328A CN 1835202 A CN1835202 A CN 1835202A
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Abstract
The invention discloses device of using multiple sets of clamping finger to grasp wafer. Using more than two sets of clamping finger to grasp wafer in turn at different phases makes possible to etch metal or photo-resist under clamping fingers completely or cleanout residual of metal or photo-resist under clamping fingers fully. Multiple sets of clamping finger are setup on chuck. Movable clamping finger can grasp or loosen wafer. When rotated wafer is etched, each set of clamping finger grasps wafer for a period of time, and waits for loosening wafer till another set of clamping finger grasps the wafer. Thus, metal or photo-resist under previous set of clamping fingers can be etched or cleaned out. Therefore, each part of wafer can be etched or cleaned out.
Description
Technical field
The invention relates to the device of a kind of rotary machine with the multi-clamping finger holding chip, particularly a kind of folder finger wheel stream holding chip that when metal tears method (metal lift-off) or clean wafers off, utilizes more than two groups, in order to avoid metal can not tear off because of folder refers to the clamping part, or there is impurity to residue on the wafer when cleaning, to increase the complete of manufacturing process, promote the completeness and the reliability that tear off or clean.
Background technology
Amass in little shadow (lithography) in the circuit manufacturing process and etching (etching) manufacturing process and be sprayed on the wafer surface of rotation (spin) board to remove 1 in the metal pattern (pattren) partly with chemical agent, be called the method for tearing off (lift-off), or for cleaning the photoresist on back (developed) wafer that develops.Wafer places on the pedestal (chuck), and the mode of general fixing wafer has multiple.As shown in Figure 1, to be prior art refer to wafer is retained on schematic diagram on the pedestal with folder Fig. 1.Shown in Fig. 1 (A), wafer 101 on pedestal 103 is referred to 102-1 by one group of folder, 102-2,102-3 clamps, and shown in Fig. 1 (B), Fig. 1 (B) is the profile along the A-A ' line of Fig. 1 (A), wafer 101 places on the pedestal 103, for folder refers to 102-1,102-2 clamps, and folder refers to removable to clamp or to unclamp wafer.Pedestal 103 rotation then, wafer 101 are held on the position and are unlikely to get loose and leave pedestal 103, can spray chemical agent or pure water 106 and carry out etching and tear the part that should tear off in the metal pattern on the wafer off; Or clean.In case but etching is over, folder refers to 102-1, and the metal of the wafer surface 102-2,102-3 under is because of being lived by the folder finger pressure, and the metal that chemical agent can not the contact wafer surface causes kish under folder refers to, its shape refers to consistent with folder.If clean the photoresist that develops, then the residual photoresistor agent forms serious pollution when wafer enters high temperature furnace, makes and forms defective (defect) on the wafer.The mode of another fixing wafer is that the contact block that utilizes folder to refer to contacts with holding chip with wafer as Fig. 1 (C) and (D), can carry out etching or clean wafers from the upper surface of wafer and the lower surface sprinkling chemical agent or the pure water (pure water) of wafer.The schematic diagram of the contact block clamping that Fig. 1 (C) is referred to by folder for wafer.Wafer 101 is clamped by the contact block 104 that folder refers to, can carry out etching or cleaning from the upper surface sprinkling chemical agent or the pure water 106 of wafer, and lower surface sprinkling chemical agent or the pure water 108 from wafer carries out etching or cleaning simultaneously.But also kish or photoresist on surface that wafer contacts with contact block, its shape is consistent with contact block.Cause etching not exclusively or clean not exclusively to form and pollute.
For improving this shortcoming, generally use the pedestal of vacuum hold instead.On pedestal, there are vacuum groove and pipeline to pass to vacuum pump, make in the groove and form vacuum and retaining wafer.But this kind sticking mode also has its shortcoming.Vacuum expendable pattern when instant cut-off, wafer certainly will fly away from pedestal and breakage.If have pollution, vacuum not to form wafer is flown away from the pedestal again.Another shortcoming of this method is that equipment cost is higher.
Another is improved one's methods to utilizing the static retaining wafer on pedestal, high-voltage DC power supply formation magnetic field is arranged under pedestal and hold wafer, but outage is also arranged and undermine wafer, and static also has suction to metal or photoresistance, causing to remove not exclusively has residual formation defective and pollution.
Therefore, prior art can't provide really holding chip, and the metal on the etched wafer or thoroughly clean the device of photoresistance fully makes manufacturing process leave a big leak again.Therefore one demand is arranged, can clamp wafer really and can tear metal film not fully off when metal on etched wafer or cleaning photoresistance, thoroughly clean up the device of the photoresistance on the wafer, to improve reliability of process.
Summary of the invention
Purpose of the present invention is providing the device of a kind of rotary machine with the multi-clamping finger holding chip, utilizing the folder more than two groups to refer on one pedestal, the edge of holding chip makes the metal film that presss from both sides under referring to also etched stage by stage when etching or cleaning, makes metal film etching fully.
An of the present invention purpose reaches the purpose of thorough removing in that the photoresistance that presss from both sides under referring to also is cleaned.
For reaching above-mentioned purpose and other purpose, first viewpoint of the present invention is instructed the device of a kind of rotary machine with the multi-clamping finger holding chip, utilize two groups of above folders to refer to that (clamping finger) is at the different phase holding chip, folder refers to that down metal or photoresistance can complete etchings or cleaning and reduce residually when making etching, comprises at least: a spin stand platform (chuck).Can be along a rotation, spray on the wafer surface for putting wafer or the preset chemical agent to carry out etching or cleaning.Multi-clamping finger, every group has a plurality of folders and refers to that be fixed on the spin stand platform, may command is with the engaging wafer or unclamp wafer.Every group of folder refers to holding chip a period of time in the wafer spin etch, wait for another group folder refer to clamp wafer after the beginning unclamp wafer, press from both sides the metal under referring to or clean last group of photoresistance that presss from both sides under referring to carry out last group of etching, change one group of folder again and refer to holding chip, be held the time that partly is exposed to etching solution to increase wafer.
Above and other purpose of the present invention and advantage with reference to following with reference to icon and most preferred embodiment explanation and easilier understand fully.
Description of drawings
To be prior art refer to the schematic diagram of holding chip with folder to Fig. 1,
Fig. 2 shows according to one embodiment of the invention with two groups of clampings schematic diagram of the phase I of holding chip stage by stage.
Fig. 2 (A) is retained on vertical view on the pedestal for referring to folder with wafer.
Fig. 2 (B) is the profile along the A-A ' line of Fig. 2 (A).
Fig. 2 (C) is the profile along the B-B ' line of Fig. 2 (A).
Fig. 2 (D) is the contact block that refers to the folder vertical view with the wafer fixing.
Fig. 2 (E) is the profile along the A-A ' line of Fig. 2 (D).
Fig. 2 (F) is the profile along the B-B ' line of Fig. 2 (D).
Fig. 3 shows according to one embodiment of the invention and refers to the schematic diagram of the second stage of holding chip stage by stage with two groups of folders.
Fig. 3 (A) is retained on vertical view on the pedestal for referring to folder with wafer.
Fig. 3 (B) is the profile along the A-A ' line of Fig. 3 (A).
Fig. 3 (C) is the profile along the B-B ' line of Fig. 3 (A).
Fig. 3 (D) is the contact block that refers to the folder vertical view with the wafer fixing.
Fig. 3 (E) is the profile along the A-A ' line of Fig. 3 (D).
Fig. 3 (F) is the profile along the B-B ' line of Fig. 3 (D).
[primary clustering symbol description]
101 wafers, 102 folders refer to
103 pedestals, 104 contact blocks
106 chemical agents or pure water 108 chemical agents or pure water
201 wafers
202-1,202-2,202-3,202-4 folder refer to
202 '-1,202 '-2,202 '-3,202 '-4 folders refer to
203-1,203-2,203-3,203-4 folder refer to
203 '-1,203 '-2,203 '-3,203 '-4 folders refer to
204 pedestals
206,208 chemical agents or pure water
Embodiment
With reference to figure 2, Fig. 2 shows according to one embodiment of the invention and refers to the schematic diagram of the phase I of holding chip stage by stage with two groups of folders.Fig. 2 (A) is retained on vertical view on the pedestal for referring to folder with wafer.Wafer 201 is to utilize the 1st group of folder to refer to that 202-1,202-2,202-3,202-4 clamp to carry out etching at etched preceding half section, the metal film that presss from both sides this moment under referring to refers to that because of being subjected to folder 202-1,202-2,202-3 hide, can not contact etch liquid, thereby still stay on the wafer 201.
Fig. 2 (B) is the profile along Figure 1B-B ' line, brilliant Figure 20 1 places on the pedestal (chuck) 204 with mechanical arm, pedestal is rotatable wafer holder, generally with the stainless steel manufacturing, then, the control folder refers to that 202-1,202-2,202-3,203-4 descend to clamp wafer, and folder refers to that 202-1,202-2,202-3,203-4 are fixed on the pedestal 204, together rotate with pedestal and wafer, with chemical agent 206 from the wafer surface sprinkling to carry out etching.Other the 2nd group of folder refers to that 203-1,203-2,203-3,203-4 then rise not holding chip, shown in Fig. 2 (C).Folder refers to also to make it outwards leave wafer surface, sprays downwards in order to chemical agent.Fig. 2 (D) is the contact block that refers to the folder vertical view with the wafer fixing.Wafer 201 is to utilize the 1st group of folder to refer to that 202 '-1,202 '-2,202 '-3,202 '-4 clamp shown in the wafer map 2 (E) at etched preceding half section.Other the 2nd group of folder refers to that 203 '-1,203 '-2,203 '-3,203 '-4 are left wafer, shown in Fig. 2 (F).Spray to carry out etching with the upper surface and the lower surface of chemical agent 206,208 from wafer, the metal film of wafer refers to that because of being subjected to folder 202 '-1,202 '-2,202 '-3,202 '-4 hide on the contact block at this moment, can not contact etch liquid, thereby still stay on the wafer 201.
Please refer to Fig. 3.Fig. 3 shows according to one embodiment of the invention and refers to the schematic diagram of the second stage of holding chip stage by stage with two groups of folders.Fig. 3 (A) is retained on vertical view on the pedestal for referring to folder with wafer.After etching a period of time, for example after the etching period of half, pedestal 204 continues rotation, and the 2nd group of folder refers to that 203-1,203-2,203-3,203-4 clamp wafer 201 downwards, again the 1st group of folder referred to that folder refers to rise or leave wafer surface, carries out the etching of second half section again.The metal film etching that is subjected to the 1st group of folder to refer to that 202-1,202-2,202-3,202-4 hide with the phase I etching time is removed.Fig. 3 (B) is the profile along Fig. 3 A-A ' line.Fig. 3 (B) shows that the 1st group of folder refers to that 202-1,202-2,202-3,202-4 leave the situation of wafer.This moment, chemical agent 206 was removed from the metal film etching that the wafer surface sprinkling is subjected to the 1st group of folder to refer to that 202-1,202-2,202-3,202-4 hide when being etched with the phase I etching.And Fig. 3 (C) is the profile along the B-B ' line of Fig. 3 (A), shows that the 2nd group of folder refers to that 203-1,203-2,203-3,203-4 clamp the situation of wafer 201.With chemical agent 206 from the wafer surface sprinkling to carry out etching.Fig. 3 (D) is the contact block that refers to the folder vertical view with the wafer fixing.Wafer 201 is to utilize the 2nd group of folder to refer to that 203 '-1,203 '-2,203 '-3,203 '-4 clamp to carry out etching, shown in Fig. 2 (E) in the etched second half section.And the phase I is subjected to folder to refer to 202 '-1,202 '-2,202 '-3,203 '-4 metal films that hide, and because of folder refers to that 202 '-1,202 '-2,202 '-3,203 '-4 leave wafer 201 contact etch liquid, thereby fully the metal film etching is removed.
As mentioned above, during etching or be to refer to holding chip successively when cleaning, make folder refer to that metal down or photoresistance can or remove by complete etching, can promote the complete and reliability of manufacturing process with two groups of folders.The phase I clean finish after, can not stop the rotation and earlier the 2nd group of folder referred to descend and clamp wafer, rise the 1st group of folder again to refer to that so promptly needn't stop the rotation, wafer is also unlikely to be flown away from.
Another embodiment of the present invention, the group number that folder refers to is not limited to two groups, and can be many groups, for example two groups, three groups, four groups ..., the time of each group holding chip is shortened, the shielded time of metal under it or photoresistance is shorter, and etching is promptly more thorough.
By the detailed description of above preferable specific embodiment, be to wish know more the feature of describing this creation, and be not to come category of the present invention is limited with above-mentioned disclosed preferred embodiments with spiritual.Opposite, its objective is that hope can contain in the patent category of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (6)
1. a rotary machine utilizes two groups of above folders to refer at the different phase holding chip with the device of multi-clamping finger holding chip, and folder refers to that metal down or photoresistance can finish preceding total eclipse quarter or cleaning and reduce residually, comprise at least when making etching:
One spin stand platform can be along a rotation, spray on the wafer surface for putting wafer or the preset chemical agent to carry out etching or cleaning;
Multi-clamping finger, every group has a plurality of folders and refers to, be fixed on the spin stand platform, may command is with the engaging wafer or unclamp wafer, every group of folder refers to holding chip a period of time in the wafer spin etch, waits for that another group clamping clamps behind the wafer beginning and unclamp wafer, refers to metal down or cleans last group of photoresistance that presss from both sides under referring to carry out last group of folder of etching, change one group of folder again and refer to holding chip, be held the time that partly is exposed to etching solution to increase wafer.
2. device as claimed in claim 1 is characterized in that, multi-clamping finger is at least two groups.
3. device as claimed in claim 1 is characterized in that, this multi-clamping finger is controlled to move up and down with holding chip on pedestal.
4. device as claimed in claim 1 is characterized in that, this multi-clamping finger can outwards leave pedestal and spray in order to etching solution.
5. device as claimed in claim 1 is characterized in that, is etched to a stage first group of folder and refers to not unclamp as yet, second group of folder refers to promptly descend and clamps wafer, after wafer was clamped in second group of clamping, first group of folder referred to leave wafer in rising, with the etching of carrying out second stage spin etch needn't be stopped.
6. device as claimed in claim 1 is characterized in that, is etched to a stage, and first group of folder refers to not unclamp as yet, the rotation of the pedestal that stops earlier, and after changing second group of folder and referring to holding chip, first group of folder refers to rise and leaves the spin etch that wafer stage continues second stage again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510055328 CN1835202A (en) | 2005-03-15 | 2005-03-15 | Rotary table device using multi-group clips for retaining wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510055328 CN1835202A (en) | 2005-03-15 | 2005-03-15 | Rotary table device using multi-group clips for retaining wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1835202A true CN1835202A (en) | 2006-09-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510055328 Pending CN1835202A (en) | 2005-03-15 | 2005-03-15 | Rotary table device using multi-group clips for retaining wafers |
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| CN (1) | CN1835202A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569150A (en) * | 2012-02-23 | 2012-07-11 | 北京七星华创电子股份有限公司 | Device and method for clamping easily cleaned thin-walled disc |
| CN116864425A (en) * | 2023-09-05 | 2023-10-10 | 山东汉旗科技有限公司 | Wafer cleaning and drying device |
-
2005
- 2005-03-15 CN CN 200510055328 patent/CN1835202A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569150A (en) * | 2012-02-23 | 2012-07-11 | 北京七星华创电子股份有限公司 | Device and method for clamping easily cleaned thin-walled disc |
| CN102569150B (en) * | 2012-02-23 | 2014-12-10 | 北京七星华创电子股份有限公司 | Device and method for clamping easily cleaned thin-walled disc |
| CN116864425A (en) * | 2023-09-05 | 2023-10-10 | 山东汉旗科技有限公司 | Wafer cleaning and drying device |
| CN116864425B (en) * | 2023-09-05 | 2023-12-29 | 山东汉旗科技有限公司 | Wafer cleaning and drying device |
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