CN1833319A - Electronic module composing of components with cascade and interconnect, and corresponding component, method, assembly devices and assembly machine thereof - Google Patents
Electronic module composing of components with cascade and interconnect, and corresponding component, method, assembly devices and assembly machine thereof Download PDFInfo
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- CN1833319A CN1833319A CN 200480022769 CN200480022769A CN1833319A CN 1833319 A CN1833319 A CN 1833319A CN 200480022769 CN200480022769 CN 200480022769 CN 200480022769 A CN200480022769 A CN 200480022769A CN 1833319 A CN1833319 A CN 1833319A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
- Battery Mounting, Suspending (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
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Abstract
The invention relates to an electronic module. The inventive module is characterised in that it consists of at least two stacked components, each of said components comprising a plurality of portions of track along at least one of the edges thereof. The invention also relates to the assembly means which are used to provide electrical connections between the track portions of at least two components.
Description
1. technical field
The present invention relates to the manufacturing and the assembling field of the electronic component of module (component assembly) form.
The invention particularly relates to radio communication field, or rather, digital radio terminal field just relates to radio telephone and maybe can for example be installed in machine or the automobile by the various device or the device of radio communications system switching signal.
Especially, the present invention relates to make the module that is used for these terminals, especially, optimize the form, fit, and function of these modules as required.
2. background technology
Hereinafter, we especially illustrate the situation of radio communication equipment.But, obviously, the present invention is not limited to this specific application, but can also be applied to many other fields, for example be applied to microcomputer and multimedia terminal, especially portable, be applied to industrial equipment or automobile, and the interesting all situations of each purpose that more generally is applied to hereinafter enumerate.
2.1. the equipment of forming by element
Usually, most of radio communication equipments comprise the one group of electronic component that is installed on the printed circuit.The purpose of the element that these are different is to guarantee various necessary function, from receiving a RF signal up to producing an audio signal (under wireless telephonic situation), perhaps conversely.In these functions some are simulated, and other are digital.
Making these radio communication equipments is important subject.In fact, we make every effort to reach at least three purposes that are difficult to be in harmonious proportion: microminiaturized equipment, increase and matching feature, simplification circuit.We especially know: different elements being installed on the printed circuit is a suitable complicated operations, because microminiaturized requirement, a large amount of elements have to be disposed in a more and more narrower and small surface.
The design of these systems thereby be complicated because it also must be normally link together from the various elements in various sources, and must make their common operations by the characteristic of observing each element.In addition, after all element has assembled, also need normally very long and complicated calibration and test phase, to guarantee the good operation of equipment.
At last, although some size of component has reduced, integral body also takies certain area, and this area is difficult to reduce.
2.2. the equipment of forming by module
The holder of present patent application proposes more a kind of method of slowing down in these disadvantages, and this method is whole or most of functions of a radio communication equipment are merged in the single module.
A kind of such module presents the shape of single machine box, and this machine box preferably shields, and this single machine box can directly be installed by equipment manufacturers, and needn't have a large amount of elements.
In fact, this module (being also called " macroelement " sometimes) is made of a plurality of elements that merge on a substrate, so that install as parts.It comprises each element and necessary each basic software of operation that uses the radio telecommunication terminal of radio frequency.Thereby no longer include complicated design procedure, and the coming into force of design.Only need to reserve a required position of module.
Such module thereby allow easily, apace, optimally is installed in component assembly in the wireless terminal (mobile phone, modulator-demodulator or utilize any other application of a wireless standard).
In addition, because component assembly has merged various basic functions and has been designed to an integral body, the problem of calibration and test has just no longer similarly existed, and perhaps, is to have simplified widely at least.
Therefore, the module that the holder issued of present patent application goes up and all tests on software (software) at the major part in the network that will use it later in the above at hardware (hardware).In addition, this module has advantageously comprised the superiority (to all merged functions, being managed the problem of corresponding industrial property right aspect by module makers) and the technical assistance of industrial property aspect.
2.3. the disadvantage of prior art
Although these undeniable advantages are arranged, this technology has some disadvantages.At first, this module has certain volume, because it wants to merge all functions.Therefore sometimes be difficult to it is installed in the equipment of some reductions or original size.
This bigger volume and corresponding weight also may have problems on automated assembly line, and these automated assembly lines are not to prepare to be used for such module.
A plurality of elements that some manufacturer proposes to be welded to one another stack.But this only changes into crowded on the plane crowded on the thickness, does not solve other any disadvantage.
Therefore, make the module more complicated, because necessary integrated all functions are for example supposed full-shield, especially because there is the RF Signal Processing.For example, not too easily memory and it are combined usually.
At last, always do not adapt to the demand of some radio communication equipment manufacturer based on the structure that merges repertoire, in these demands certain some, these manufacturers may wish to use by themselves exploitation, or the function that is provided by the third party.Otherwise they may not want those for the unnecessary function of the application of being considered (for example, needn't provide multimedia processing apparatus in the application of a remote control of machine, and in radio telephone, this application but being desirable).
3. purpose of the present invention
The objective of the invention is to slow down these disadvantages of prior art.
Or rather, an object of the present invention is to provide a kind of technology of allowing the design and the manufacturing of optimal module, especially be radio communication equipment, especially allow the benefit of bringing by the module of present patent application holder proposition keeping, and in the disadvantage of the system that avoids traditional a plurality of elements of use, further with the equipment microminiaturization.
Therefore, an object of the present invention is to provide a kind of such technology, this technology allows that the manufacturer of radio communication or miscellaneous equipment easily designs such equipment, and these equipment also are easy to install, and is easy to calibration and/or test.
Therefore, the purpose of this invention is to provide a kind of such technology, this technology is simplified the installation and the assembling of module widely by a series widely is provided.In fact, another object of the present invention be exactly allow provide various widely, allow the series that adapts to client's needs, and allow that where necessary the client uses commercial element for some aspect.
Another object of the present invention also provides a kind of such technology, this technology provides good signal to handle quality, especially good opposing is because noise and the interference capability that the RF signal produces, and easy to usely resemble memory and the such dedicated element of microprocessor, and needn't increase complexity on the printed circuit and crowded.
The purpose of this invention is to provide a kind of such technology, this technology allow radio communication or other equipment fast, cheaply the assembling.
Therefore, another object of the present invention provides a kind of allow reduction design, assembling, the such technology of maintenance cost.
A further object of the invention is simplified adjustment and upgrading to the device that is used exactly, and to the management of spare part.
4. principal character of the present invention
These purposes, as other purpose that more clearly occurs hereinafter, realize by an electronic module that constitutes by at least two superimposed elements, each of described element has a plurality of along its rail portion at least on one side separately, being electrically connected between the rail portion of at least two elements of some assembling devices assurances.According to the present invention, described assembling device comprises a sleeve that is configured in the flexible material that is used for fettering described element, and at least a portion of the periphery of each described element all has first jag, each groove of these first jags and/or each projection are all corresponding with one of described rail portion, are suitable for cooperating with having with an electric connecting part that is built on second jag in the described sleeve in the cross section of the described first jag complementation.
So with regard to simply and effectively obtained one be ready to operable, cheaply, not too heavy module.According to each favourable aspect of describing later, this method is also allowed operation that the assembler that easily changes product line, simplification and this module of optimization will carry out, is maintained easily, or the like.
The pliability of sleeve allows and firmly introduces element that these elements can be fixed effectively, owing to there is complementary jag (these jags also are convenient to assembling and are isolated track).For example by provide one as the mistake proofing mark, than other all big or variform jag, also avoid element to be installed on the incorrect direction easily.Therefore, no matter be automation assembling or artificial assembling, simply and effectively load module.
Ensure that parts that are electrically connected between the element can be integrated on the assembling device form of the strip conductor on the sleeve (for example with), or occur with one or more forms by the fixing separate piece of sleeve.
Advantageously, on each of described element, identical rail portion is optionally distributed to identical signal, superposes according to random order so that allow the element of any amount.
This allows according to user's hope and makes up available element, and has no particular limits.Where necessary, the user can also use to some function and use commercial element.In this case, module does not comprise these functions.Thereby make it adapt to needs admirably.
Preferentially, described rail portion and the described stack axis that almost is parallel to described element that is electrically connected.
In other words, be according to implementing to connect, rather than be parallel to carrier resembling traditionally perpendicular to the axis of carrier (printed circuit, master card, application card or other).
For example, described rail portion can have the cross section of circular arc.Certainly many other shapes also can be considered.
Preferentially, described rail portion is distributed on four limits of square or rectangular element.
Certainly, element can also have other shape, and rail portion also can irregularly distribute.Equally, the shape and size of rail portion also needn't be all identical.
In addition, according to a favourable aspect of the present invention, described assembling device is dismountable.
This especially allows and is convenient to safeguard, and makes maintenance more efficient.
According to a preferred plan of the present invention, the described sleeve that is used to fetter described element is made of elastomeric material or polymer.
Advantageously, the bottom component at least of described module is designed to the surface and is embedded on the carrier.It especially can be designed as according to BGA or LGA technology and is embedded on the carrier.
Preferentially, all elements are all allowed the transfer of such surface, on the one hand in order to allow with any assembled in sequence, on the other hand in order to make the independent test to each element become possibility.
According to a special feature of the present invention, in the described element at least two also its surface one of at least on have connection, allow to guarantee being electrically connected between them.
This allows the raising quality of connection, or provides additional connection between any two at element.
According to another implementation of the invention, can assign to advantageously implement with the module transfer on carrier by the extension that ensures the electric connecting part that is electrically connected between the described element.
In this case, be that assembling device has the transfer device.
Described element especially can belong to the group that comprises following element:
-radio frequency processing element;
-Base-Band Processing element;
-microprocessor;
-multimedia treatment element;
-memory;
-output control device,
An or combination or a part of at least two in these elements.
According to the aspect of the best of the present invention, such module is used to equip a radiotelephone installation.
The invention still further relates to the composed component of such module.In these elements each all has a plurality of along its rail portion at least on one side, so that being electrically connected between the rail portion of at least two elements of dismountable assembling device guarantee, to constitute described module, and, at least at least a portion of the periphery of each element has jag, and each groove of these jags and/or projection are all corresponding with one of each rail portion.
Each of described element all preferentially comprises at least one in the device that belongs to a group, and this group comprises:
-radio frequency handling device;
-base band processing device;
-microprocessor;
-multimedia processing apparatus;
-memory;
-output control device,
An or combination or a part of at least two in these devices.
The invention still further relates to a kind of assembly method of such electronic module, this method especially comprises the steps:
-obtaining at least two elements, these two elements have first jag on its peripheral at least a portion, and each groove of these jags and/or projection are all corresponding with a rail portion;
-according to the stack axis described element that superposes;
-utilize assembling device that described element is connected, this assembling device is made of the sleeve of a flexible material, this sleeve has second jag with the described first jag complementation, each second jag has the electric connecting part that is electrically connected between the rail portion of at least two elements of a guarantee, to form described module.
According to a particular embodiment of the present invention, described stack step and Connection Step can be implemented simultaneously by means of described sleeve.
Advantageously, described sleeve is cut apart in a prefabricated tube according to the needed thickness of described module.
Preferentially, this method comprises a preliminary step of selecting at least two elements that will assemble at least from a set that comprises three class available components.
It can also advantageously comprise at least one the step in the described element of independent test in advance.This test can also be at subelement.
Advantageously, this method comprises one subsequently with the step of described module transfer on printed circuit, and stacked bottom component and/or described assembling device all are equipped with the transfer device.Especially, described transfer device can be allowed the transfer of BGA and LGA type.
The invention still further relates to the method to a kind of maintenance of such electronic module, this method especially comprises the steps:
-with described module sealing-off;
-by dismounting or taking-up assembling device, thus the element that will constitute described module unclamps.
-overhaul at least one in the described element independently, and/or replace in the described element at least one;
-according to the stack axis, described element is superposeed again;
-utilize assembling device that described element is connected, this assembling device is made of the sleeve of a flexible material, this sleeve has second jag with the described first jag complementation, each second jag has the electric connecting part that is electrically connected between the rail portion of at least two elements of a guarantee, to form described module again.
We recognize: an independent element being taken measures, for example replace it, is possible therefore, also is easy.
The invention still further relates to a foregoing electronic module assembling device.Such assembling device comprises a sleeve that is made of flexible material, this sleeve is allowed at least two superimposed elements of connection, each superimposed elements have some and a plurality of along its corresponding first jag of rail portion at least on one side, described sleeve has second jag of some cross sections and the described first jag complementation
And comprising the electric connecting part that some can cooperates with each groove of each element and projection, one of described rail portion that is electrically connected between each groove and protruding and the rail portion that is used to allow at least two elements is corresponding.
Advantageously, these assembling devices are roughly cut apart in one section tube according to the thickness of corresponding module.
Under a particular embodiment, described conductive component has some and allows described module is connected an elongated portion on the carrier.
At last, the invention still further relates to the machine of a this electronic module of assembling, this machine comprises according to the stack axis will having separately along the device of at least two elements stacks of its a plurality of rail portion at least on one side, with the device that described element is connected with assembling device, this assembling device also ensures being electrically connected between the rail portion of at least two elements, to form described module
Described assembling device comprises a sleeve of realizing with the flexible material that is used to fetter described element.
At least a portion of the periphery of each described element all has first jag, each groove of these jags and/or each projection are all corresponding with one of described rail portion, are suitable for cooperating with an electric connecting part of realizing on second jag cross section and that form in described sleeve that has with the described first jag complementation.
5. description of drawings
One read subsequently to a preferred forms of the present invention with to the description of each accompanying drawing, other features and advantages of the present invention will more clearly display, this preferred forms provides as descriptive and nonrestrictive simple case.In each accompanying drawing:
-Fig. 1 has described according to the module in the assembling process of the present invention, and it comprises four elements;
-Fig. 2 has showed module among Fig. 1, that assembled with a sleeve according to the present invention;
-Fig. 3 has showed the sleeve among Fig. 2;
-Fig. 4 with block diagram illustrations according to an example of module of the present invention, and the necessity between the element connects;
-Fig. 5 has described an element that is equipped with the contact that is used for transfer (report) and test;
-Fig. 6 A and 6B have showed two modification according to component outline of the present invention edge;
-Fig. 7 is the block diagram of a simplification, this schematic diagram shows the key step of I﹠ M according to module of the present invention.
6. embodiment
6.1. prompting to the principle of the invention
The present invention thereby proposed a new method for making electronic module especially, but is not limited only to, and is used for wireless telephonic electronic module.
According to the present invention, module is made of a plurality of (two) stacked element at least, preferentially is connected in non-irreversible mode then, safeguards so that simplify where necessary.
Be noted that in particular cases each element can also use (promptly being independent of module) by the unit as traditional element at some.
According to the present invention, being electrically connected along the limit of element between the various elements of composition module implemented, and extends (that is, if the module mosaic surface is a level, the axis that superposes so is exactly vertically) according to the direction that approximately is parallel to element stack axis.
In order to constitute a single module, provide some jockeys to be assembled in together to keep these elements.These assembling devices also ensure being electrically connected between the element, or have ensured keeping of these connections at least.According to the present invention, this relates to a flexible sleeve that can have current-carrying part.According to a modification, this pliability sleeve is being inlayed (rapporter) conductive component and it is held in place.
6.2. element
Fig. 1 has showed according to of the present invention a, module in assembling process just.It comprises four simple overlapped elements 11,12,13,14.
As shown in Figure 1, all these component shapes are identical, are like this on the XY plane at least.This is for allowing that correct assembling is necessary.
Be noted that opposite is that if desired, the thickness of each element can differ from one another.
But, we will notice: we it is contemplated that and use a undersized element, and this element is embedded in the ring of other element-external so, and keep necessary electrical continuity (can also with suitable pad system).
On the limit of each element in element 11 to 14, stipulated electric connecting part 15,16.We know a conductive component is embedded in according to the Z axle just will be enough between parts 15 and 16 guarantee that one is electrically connected.
In order to allow with the random order assembling and select element arbitrarily that 15,16,17 each parts all must be connected to same signal, and no matter are what elements.
We will notice: this means that also a specific element may comprise a link that links to each other with its own no signal.For example, may must come Connection Element 11 and 14, and element 12 does not need same signal by link 15 and 17.Yet it must comprise link 17, to guarantee electrical continuity.
According to the execution mode that Fig. 1 describes, each element all has some saw-tooth grooves on its every limit, makes it present the appearance of stamp.Such as explained below, this shape is adapted to use a branch sleeve very much.
But, certainly, other shape also can be considered.For example, jag can lobed cross section, as describing among Fig. 6 A, rather than depression, as showing among Fig. 1.Certainly, in both cases, each connects jag, part therebetween for example, and the coupling part that all has a conduction, and, between two jags, an isolated part is arranged.
In addition, jag not necessarily will form a circular arc.Its cross section can be determined a parabolic arc, triangle, a rectangle or more generally be a shape arbitrarily.
Be electrically connected by friction and obtain.Reach for convenience and optimize contact, can consider track is prolonged (62) in the upper and lower surface of element.
Replenish a bit, some element may have special-purpose link (for example element communication in order to make two should always exist) on the surface at least.Certainly, no longer include the possibility of stack in any order in this case.
In addition, we will notice the link that needn't distribute on the whole width on all a limits or limit.Equally, with described different, also parts that needn't be all are all identical.For example we can provide a link large-sized, that reinforced insulation is arranged for radiofrequency signal.
This different shape can also be used as a mistake proofing mark, with convenient stack.
For example, element 11 to 14 can be:
-radio frequency processing element;
-Base-Band Processing element;
-microprocessor;
-multimedia treatment element;
-memory;
-......
Certainly, can also provide some to merge the element of several elements of enumerating below with multicomponent parts (for example making) form with reconstructed model.All right, for example, provide a building-blocks that has ensured whole radio frequencies and Base-Band Processing function.
6.3. assembling device
For the various elements in the connection layout 1 11 to 14, we use a sleeve 31 as assembling device, as shown in Figure 3.Fig. 2 has shown corresponding assembling with regard to it, and sleeve 31 be cut open only be for the explanation reason.
This sleeve 31 thereby formed a ring, side has strip conductor 32 within it, and this strip conductor has and is used for the profile that the link 15 to 17 with element is complementary, as shown in Figure 2.
This sleeve 31 thereby guaranteed a dual function promptly carries out being electrically connected and keeping various combination of elements shapes between the various elements.We have obtained an independent module thus, and it can be used as an integral body and transfers like a cork on the printed circuit or on similar parts.
This sleeve can for example be made of the elastomeric material that has conductive component 32, and this conductive component for example is to make according to the connector technology that is called " striped " (" z é bra ").It can also be made by polymer, for example LCP or other type, grouting or cast.
According to a modification, conductive component 32 can be independent of sleeve 31, and is embedded in the groove of being determined by jag, and is fixing by sleeve 31 then, so sleeve 31 has only the function that keeps assembling.
Advantageously, the material that constitutes sleeve is with the tubular supply, and people cut into a section 31 according to the size of hope.This allows the size of easily adjusting sleeve when needed according to the element that is held.
In addition, therefore the manufacturing of this sleeve has also made things convenient for.
We will notice that also assembling device can be equipped with screening arrangement, to guarantee the radio frequency isolation of element.
6.4. module
The integral body that is assembled of Fig. 2 has just constituted a module of all set transferring on the carrier.
The advantage of having enumerated of the module of this is module integrated known type, and the new advantage relevant with manufacture with the structure of this module will be as will more clearly manifesting hereinafter.
Just as already noted, the present invention allows that as required (the desirable function of the equipment that is developed) and/or assembler's hope (he may wish to use an independently professional component, for example for memory) implements element assembling.
Fig. 4 schematically illustrates the example of one 6 element assembling, and these 6 elements are used for constituting one and comprise a third generation radio telephone module needed basic element of character, single.
This module thereby comprise following 6 elements:
-Base-Band Processing element 41;
-radio frequency processing element 42;
-memory 43;
-multimedia processor 44 (being called " companion chip (companion chip) ");
-one dedicated processes element 45;
-one power control member 46.
Just as already noted, we will notice that the connection between the various elements that ensured by the connection of Z-direction is allowed and interconnect various elements like a cork, whatsoever order.For example, power control member 66 is communicated by letter with preceding four elements 61 to 64.On the other hand, 65 of 3G elements are communicated by letter with radio-frequency (RF) component 62 with baseband element 61.
6.5. the transfer of module
For example, can utilize conventional art according to module of the present invention, for example BGA and LGA transfer the surface at printed circuit.For this reason, as shown in Figure 5, bottom component (51) (thereby promptly being positioned at the element that bottom contacts with printed circuit) has a plurality of contacts 52, and these contacts allow that carrying out CMS in a conventional manner transfers.
In order to keep the possibility of stack in any order, each element preferably has a similar combination of this contact 52.These contacts link to each other with each link 53 (each jag) in this case, i.e. respectively.
These contacts 52 also have another significant advantage.In fact, they allow and test each element independently, perhaps, where necessary, part of detecting combination of elements independently.This is because as explained hereunder, and technology of the present invention allows and dismantle each element safeguarding, and more meaningful.
According to another kind of scheme, can directly realize by vertical connection from module according to the present invention to the connection the printed circuit.For example, the conductive component of sleeve can correspondingly prolong, and transfers so that allow on printed circuit or on any carrier that other is reequiped.
6.6. I﹠ M method
As beginning to display, technology of the present invention is allowed very simply and effectively I﹠ M method of application.Therefore, an example has been described simply in Fig. 7.
Assembling 71 at first comprises a step that obtains element 711.Because in fact unique restriction is the shape and the structure of conductive component on each limit of element, these elements are certainly from a plurality of sources.For example, can consider that a special manufacturer of memory provides memory element, is made by another supplier and more be exclusively used in wireless telephonic parts.
If necessary, each element can be by independent test 712.Just as mentioned above, it is convenient that the contact that exists on each element makes it.Can also be independent of a part of element of other element ground test.
The various elements that are received are applied (713) then, next just connect (714) with a sleeve.Between these two steps, if necessary, it is also conceivable that an arrangement is used for the step (if this sleeve itself does not comprise such parts) with the interconnective conductive component of various elements.
Under a favourable execution mode of the present invention, we are by obtaining sleeve according to prefabricated tube of necessary thickness cutting.
In some cases, overlap-add operation 713 and attended operation 714 can be implemented with the form of same operation, so each element is laminated in this sleeve inner.So we have had one to be ready to operable module, we can for example use BGA and LGA with known mode itself, transfer (715) it.
So equipment is ready to and can have moved.
Under the shutdown situation, can implement upkeep operation 72 owing to fault or in order to upgrade (for example, replace an element with the better redaction of performance, or replace another) with a bigger memory of capacity.
For this reason, at first should be with module sealing-off (721).
Dismantle each element by withdrawing from sleeve simply then.So can directly dispose each (soldered because they do not have, as also not connected) in the element so that the alternate manner between them is fastened.
So can implement maintenance, the test of any kind in the element each, or the like, and replace some in the element.
At this, we will notice one of main advantages of the present invention, and Here it is when independent parts (element) when fault is arranged, and needn't replace whole module.Have only this trouble unit (element) to be replaced, other element can be retained.
Then (724) have been ressembled and reinstalled to module just according to the same steps as of doing in installation process 71.
Above-mentioned installation method can utilize a special use to put together machines and implement, and this special use puts together machines and comprises as in the lower member at least some:
-device that a set of pieces is superposeed successively;
-in a prefabricated tube according to the device of desirable size cutting sleeve;
-with this jacket casing on laminates, or laminates is introduced the device of sleeve inner;
The device of-transfer conventional module itself.
Such machine is fairly simple, and especially has and need not the advantage that special transformation just is adapted to implement the complete series module, because external shape and being electrically connected by once and for all has been determined.
We will notice that also the simplicity of enforcement also allows hand assembled, and this is especially meaningful for maintenance.
6.7. further feature and advantage
Method of the present invention allows that the form with single standard proposes a very widely module Series. Each client can select its desirable element, can also the Application standard element. In addition, all modification of element and combination all are possible.
On the other hand, for the client, select to have simplified widely. No matter how module consists of, For interconnective interface, only there is unique a kind of die cavity. Equally, module takies together The surface of sample only has the thickness can be different.
By allowing dismounting and after repairing, reinstalling this module, allow and only replace an element Rather than whole module, allow be various modules single manufacturing of serial application and Installation method, the present invention also allows greatly and reduces cost.
In addition, solution of the present invention allows that obtaining one reduces for known technology Volume.
Claims (27)
1. electronic module that is made of at least two superimposed elements Yi Bian each of described element has a plurality of rail portion and a plurality of assembling device at least along it, is used to ensure being electrically connected between the rail portion of at least two elements,
It is characterized in that: described assembling device comprises a sleeve that is used to fetter described element of realizing with flexible material,
Be: at least a portion of the periphery of each described element all has first jag, each groove of these jags and/or each projection are all corresponding with one of described rail portion, are suitable for cooperating with an electric connecting part of realizing on second jag cross section and that form in described sleeve that has with the described first jag complementation.
2. according to the electronic module of claim 1, it is characterized in that: on each of described element, identical rail portion is optionally distributed to identical signal, superposes according to random order so that allow the element of any amount.
3. according to electronic module any in claim 1 and 2, it is characterized in that: described rail portion and the described stack axis that is roughly parallel to described element that is electrically connected extend.
4. according to electronic module any in the claim 1 to 3, it is characterized in that: described rail portion has the cross section of circular arc.
5. according to electronic module any in the claim 1 to 4, it is characterized in that: described rail portion is distributed on four limits of square or rectangular element.
6. according to electronic module any in the claim 1 to 5, it is characterized in that: described assembling device is dismountable.
7. according to electronic module any in the claim 1 to 6, it is characterized in that: described sleeve is made of elastomeric material or polymer.
8. according to electronic module any in the claim 1 to 7, it is characterized in that: the bottom component at least of described module is designed to the surface and is embedded on the carrier.
9. electronic module according to Claim 8, it is characterized in that: the bottom component at least of described module is designed to be embedded on the carrier according to BGA or LGA technology.
10. according to electronic module any in the claim 1 to 9, it is characterized in that: in the described element at least two also its surface one of at least on have connection, to guarantee being electrically connected between them.
11. the electronic module according to any in the claim 1 to 10 is characterized in that: it assigns to realize by the extension that ensures the electric connecting part that is electrically connected between the described element to the transfer on the carrier.
12. the electronic module according to any in the claim 1 to 11 is characterized in that: described element belongs to a group that comprises following element:
-radio frequency processing element;
-Base-Band Processing element;
-microprocessor;
-multimedia treatment element;
-memory;
-output control device,
Or at least two combination in a part or these elements.
13. the electronic module according to any in the claim 1 to 12 is characterized in that: it is used to equip a radiotelephone installation.
14. one kind is used for constituting an element according to any one electronic module of claim 1 to 13, it is characterized in that: it has a plurality of along its rail portion at least on one side, so that being electrically connected between the rail portion of at least two elements of dismountable assembling device assurance, to constitute described module
Be: at least a portion of the periphery of each described element has jag, and each groove of these jags and/or projection are all corresponding with one of described rail portion.
15. the element according to claim 14 is characterized in that: it guarantees to belong in the device of a group at least one, and this group comprises:
-radio frequency handling device;
-base band processing device;
-microprocessor;
-multimedia processing apparatus;
-memory;
-output control device,
An or combination or a part of at least two in these devices.
16. method according to electronic module any in the claim 1 to 13 of an assembling, it is characterized in that: it comprises the steps:
-obtaining at least two elements, these two elements have first jag on its peripheral at least a portion, and each groove of these jags and/or projection are all corresponding with a rail portion;
-according to the stack axis described element that superposes;
-utilize assembling device that described element is connected, this assembling device is made of the sleeve of a flexible material, this sleeve has second jag with the described first jag complementation, each second jag has the electric connecting part that is electrically connected between the rail portion of at least two elements of a guarantee, to form described module.
17. the assembly method according to claim 16 is characterized in that: described stack step and Connection Step are implemented simultaneously by means of described sleeve.
18. the assembly method according to any in claim 16 and 17 is characterized in that: described sleeve is cut in a prefabricated tube according to the needed thickness of described module.
19. the assembly method according to any in the claim 16 to 18 is characterized in that: it comprises a preliminary step of selecting at least two elements that will assemble at least from a set that comprises three class available components.
20. the assembly method according to any in the claim 16 to 19 is characterized in that: it comprises at least one the step in the described element of independent test in advance.
21. the assembly method according to any in the claim 16 to 20 is characterized in that: it comprises that subsequently one is passed to step on the printed circuit with described module, and stacked bottom component and/or described assembling device all are equipped with the transfer device.
22. the assembly method according to claim 21 is characterized in that: described transfer device is allowed the transfer of BGA and LGA type.
23. safeguard the method according to electronic module any in the claim 1 to 13 for one kind, it is characterized in that: it comprises the steps:
-with described module sealing-off;
-by dismounting or taking-up assembling device, thus the element that will constitute described module unclamps.
-overhaul at least one in the described element independently, and/or replace in the described element at least one;
-according to the stack axis, described element is superposeed again;
-utilize assembling device that described element is connected, this assembling device is made of the sleeve of a flexible material, this sleeve has second jag with the described first jag complementation, each second jag has the electric connecting part that is electrically connected between the rail portion of at least two elements of a guarantee, to form described module again.
24. assembling device that is used for according to any one electronic module of claim 1 to 13, it is characterized in that: it comprises a sleeve of being made by flexible material, this sleeve is allowed at least two superimposed elements of connection, each superimposed elements have some and a plurality of along its corresponding first jag of rail portion at least on one side, described sleeve has second jag of some cross sections and the described first jag complementation
And comprise that some are suitable for the electric connecting part that corresponding each groove of one of described rail portion with each element and projection are cooperated, be used to allow being electrically connected between the rail portion of at least two elements.
25. the assembling device according to claim 24 is characterized in that: it roughly is cut in one section tube according to the thickness of corresponding module.
26. the assembling device according to claim 25 is characterized in that: described conductive component has some and allows described module is connected an elongated portion on the carrier.
27. an assembling is according to the machine of electronic module any in the claim 1 to 13, it is characterized in that: it comprises according to the stack axis will having separately along the device of at least two elements stacks of its a plurality of rail portion at least on one side, with the device that described element is connected with assembling device, this assembling device also ensures being electrically connected between the rail portion of at least two elements, to form described module
Described assembling device comprises a sleeve of realizing with the flexible material that is used to fetter described element,
At least a portion of the periphery of each described element all has first jag, each groove of these jags and/or each projection are all corresponding with one of described rail portion, are suitable for cooperating with an electric connecting part of realizing on second jag cross section and that form in described sleeve that has with the described first jag complementation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0309841 | 2003-08-11 | ||
| FR0309841A FR2858912B1 (en) | 2003-08-11 | 2003-08-11 | ELECTRONIC MODULE FORMED OF STACKED AND SOLIDARIZED COMPONENTS, COMPONENT, METHOD, MEANS OF ASSEMBLY AND ASSEMBLY MACHINE |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1833319A true CN1833319A (en) | 2006-09-13 |
Family
ID=34112720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480022769 Pending CN1833319A (en) | 2003-08-11 | 2004-08-11 | Electronic module composing of components with cascade and interconnect, and corresponding component, method, assembly devices and assembly machine thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1833319A (en) |
| FR (1) | FR2858912B1 (en) |
| WO (1) | WO2005018290A2 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4734825A (en) * | 1986-09-05 | 1988-03-29 | Motorola Inc. | Integrated circuit stackable package |
| US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
| US5266833A (en) * | 1992-03-30 | 1993-11-30 | Capps David F | Integrated circuit bus structure |
| US5675180A (en) * | 1994-06-23 | 1997-10-07 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments |
| RU2119276C1 (en) * | 1997-11-03 | 1998-09-20 | Закрытое акционерное общество "Техно-ТМ" | Three-dimensional flexible electronic module |
| US6308095B1 (en) * | 1999-02-12 | 2001-10-23 | Cardiac Pacemakers, Inc. | System and method for arrhythmia discrimination |
| JP2000243900A (en) * | 1999-02-23 | 2000-09-08 | Rohm Co Ltd | Semiconductor chip, semiconductor device using it, and manufacture of semiconductor chip |
-
2003
- 2003-08-11 FR FR0309841A patent/FR2858912B1/en not_active Expired - Fee Related
-
2004
- 2004-08-11 CN CN 200480022769 patent/CN1833319A/en active Pending
- 2004-08-11 WO PCT/FR2004/002134 patent/WO2005018290A2/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| FR2858912B1 (en) | 2006-12-01 |
| WO2005018290A2 (en) | 2005-02-24 |
| WO2005018290A3 (en) | 2005-12-01 |
| FR2858912A1 (en) | 2005-02-18 |
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