CN1827557A - Method for welding ceramic cartridge - Google Patents

Method for welding ceramic cartridge Download PDF

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Publication number
CN1827557A
CN1827557A CN 200510037879 CN200510037879A CN1827557A CN 1827557 A CN1827557 A CN 1827557A CN 200510037879 CN200510037879 CN 200510037879 CN 200510037879 A CN200510037879 A CN 200510037879A CN 1827557 A CN1827557 A CN 1827557A
Authority
CN
China
Prior art keywords
ring
welding
sealing
weld
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200510037879
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Chinese (zh)
Inventor
陆建民
徐国民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGYIN JIUHUA GROUP CO Ltd
Original Assignee
JIANGYIN JIUHUA GROUP CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGYIN JIUHUA GROUP CO Ltd filed Critical JIANGYIN JIUHUA GROUP CO Ltd
Priority to CN 200510037879 priority Critical patent/CN1827557A/en
Publication of CN1827557A publication Critical patent/CN1827557A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a method of welding ceramic shell. The method includes: (1) putting a seal ring and a dip copper billet into a welding die and adding silver and brazing welding materials in the weld of the seal ring and the dip copper; (2) putting the welding die into the welding stove and welding them at the temperature of 800-900 DEG C; (3) putting the welded the seal ring and the dip copper with a ceramic ring, a flange loop and a gate lead tube into the welding die and adding silver and brazing welding materials in the weld of them; (4) putting the welding die filled with the welding materials said in step (3) into the welding stove and welding them at the temperature of 800-900 DEG C. The invention has an advantage of that it can guarantee the invariability of the smoothness and the depth of parallelism of the welded dip copper.

Description

Method for welding ceramic cartridge
One, technical field
The present invention relates to a kind of method for welding ceramic cartridge, especially super high power high vacuum method for welding ceramic cartridge.
Two, technical background
At present the welding process of super high power high vacuum ceramic cartridge is that welding process is about to ceramic ring, sealing-ring, flange circle, gate lead pipe and presses down copper billet pack into together in the weld mold, add silver-copper brazing alloy at ceramic ring and sealing-ring, ceramic ring and flange circle, ceramic ring and gate lead pipe and sealing-ring and the weld that presses down copper billet, again weld mold is put into the temperature of soldering furnace about 850 ℃ and welded.Because ceramic ring and sealing-ring and the thermal expansivity that presses down copper billet differ greatly, press down copper billet after making welding cool off and be difficult to discharge its internal stress, the planeness and the parallelism that press down copper billet are changed, cause press down the copper billet planeness and parallelism overproof.And ceramic cartridge is an important component part of semiconducter device, and it is not only protecting semi-conductive chip to avoid the pollution of outside hostile environment, and electricity, thermal characteristics and the reliability of device all played very important effect.Therefore the planeness on shell oxygen-free copper block surface and parallelism directly affect the pressure drop and the thermal resistance value that contact effect and copper billet surface of tube core in shell and the semiconducter device.
Three, technology contents
At above-mentioned shortcoming, the objective of the invention is to change a kind of method for welding ceramic cartridge, the planeness and the parallelism that press down copper billet after guaranteeing to weld do not change.
Technology contents of the present invention is, a kind of method for welding ceramic cartridge, and its welding step is as follows:
(1), and adds silver-copper brazing alloy at sealing-ring and the weld that presses down copper earlier with sealing-ring with press down copper billet and pack into together in the weld mold;
(2) weld mold that will be placed with sealing-ring and press down copper billet is packed into and is welded in 800~900 ℃ temperature in the soldering furnace;
(3) will weld good sealing-ring and press down copper billet and ceramic ring, flange circle, gate lead pipe and pack in the weld mold, and at the weld adding silver-copper brazing alloy of sealing-ring, flange circle, gate lead pipe and ceramic ring;
(4) weld mold that will be placed with ceramic ring, flange circle, gate lead pipe, sealing-ring and press down copper billet is put into soldering furnace and is welded 800~900 ℃ temperature.
The advantage that the present invention is compared with prior art had is:
1, owing to adopted the method for secondary welding, after the ceramic cartridge welding, the planeness and the parallelism that press down copper billet do not change.
2, owing to adopted the method for secondary welding, after the ceramic cartridge welding, significantly the stress of sealing of the low Ceramic-to-Metal of degree of falling makes big specification shell leak rate≤1 * 10 -9Pam 3/ s.
3, guaranteed interior high process one-time-reach-place, avoided owing to copper billet planeness and the parallelism off-gage phenomenon that size is brought corrected in shaping.
Four: specific embodiment
Example 1:3 inch ceramic cartridge is when welding
1,, and adds silver-copper brazing alloy at sealing-ring and the weld that presses down copper earlier with sealing-ring with press down copper billet and pack into together in the weld mold;
2, the weld mold that will be placed with sealing-ring and press down copper billet is packed into and is welded in 845~855 ℃ temperature in the soldering furnace;
3, will weld good sealing-ring and press down copper billet and ceramic ring flange circle, gate lead pipe are packed in the weld mold, and at the weld adding silver-copper brazing alloy of sealing-ring, flange circle, gate lead pipe and ceramic ring;
4, the weld mold that will be placed with ceramic ring, flange circle, gate lead pipe, sealing-ring and press down copper billet is packed into and is welded in 845~855 ℃ temperature in the soldering furnace.
Example 2:5 inch ceramic cartridge is when welding
1,, and adds silver-copper brazing alloy at sealing-ring and the weld that presses down copper earlier with sealing-ring with press down copper billet and pack into together in the weld mold;
2, the weld mold that will be placed with sealing-ring and press down copper billet is packed into and is welded in 845~855 ℃ temperature in the soldering furnace;
3, will weld good sealing-ring and press down copper billet and ceramic ring, flange circle, gate lead pipe are packed in the weld mold, and at the weld adding silver-copper brazing alloy of sealing-ring, flange circle, gate lead pipe and ceramic ring;
4, the weld mold that will be placed with ceramic ring, flange circle, gate lead pipe, sealing-ring and press down copper billet is packed into and is welded in 845~855 ℃ temperature in the soldering furnace.

Claims (2)

1, a kind of method for welding ceramic cartridge, its welding step is as follows:
(1), and adds silver-copper brazing alloy at sealing-ring and the weld that presses down copper earlier with sealing-ring with press down copper billet and pack into together in the weld mold;
(2) weld mold that will be placed with sealing-ring and press down copper billet is packed into and is welded in 800~900 ℃ temperature in the soldering furnace;
(3) will weld good sealing-ring and press down copper billet and ceramic ring, flange circle, gate lead pipe and pack in the weld mold, and at the weld adding silver-copper brazing alloy of sealing-ring, flange circle, gate lead pipe and ceramic ring;
(4) weld mold that will be placed with ceramic ring, flange circle, gate lead pipe, sealing-ring and press down copper billet is put into soldering furnace and is welded 800~900 ℃ temperature.
2, method for welding ceramic cartridge according to claim 1, it is characterized by packs the weld mold that is placed with sealing-ring and press down copper billet into welds in 845~855 ℃ temperature in the soldering furnace; The weld mold that is placed with ceramic ring, flange circle, gate lead pipe, sealing-ring and presses down copper billet is put into soldering furnace to be welded 845~855 ℃ temperature.
CN 200510037879 2005-02-28 2005-02-28 Method for welding ceramic cartridge Pending CN1827557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510037879 CN1827557A (en) 2005-02-28 2005-02-28 Method for welding ceramic cartridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510037879 CN1827557A (en) 2005-02-28 2005-02-28 Method for welding ceramic cartridge

Publications (1)

Publication Number Publication Date
CN1827557A true CN1827557A (en) 2006-09-06

Family

ID=36946142

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510037879 Pending CN1827557A (en) 2005-02-28 2005-02-28 Method for welding ceramic cartridge

Country Status (1)

Country Link
CN (1) CN1827557A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106238850A (en) * 2016-08-31 2016-12-21 浙江长兴电子厂有限公司 A kind of welding procedure of ceramic insulator metal shell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106238850A (en) * 2016-08-31 2016-12-21 浙江长兴电子厂有限公司 A kind of welding procedure of ceramic insulator metal shell

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
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