CN1825621A - Organic electroluminesent panel - Google Patents

Organic electroluminesent panel Download PDF

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Publication number
CN1825621A
CN1825621A CN 200610005023 CN200610005023A CN1825621A CN 1825621 A CN1825621 A CN 1825621A CN 200610005023 CN200610005023 CN 200610005023 CN 200610005023 A CN200610005023 A CN 200610005023A CN 1825621 A CN1825621 A CN 1825621A
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China
Prior art keywords
conductive layer
substrate
organic electroluminescence
electroluminescence panel
electrically connected
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CN 200610005023
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Chinese (zh)
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CN100463211C (en
Inventor
李信宏
吴冠龙
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AU Optronics Corp
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AU Optronics Corp
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Abstract

The invention is an organic electroluminescence panel with two opposite substrates, where the first substrate is provided with a first conductive layer and a pixel array, the second substrate is arranged on the pixel array and the bottom surface of the second substrate is provided with a second conductive layer, the pixel array comprises plural organic luminous diodes connected with the first conductive layer, the second conductive layer is connected to the first conductive layer and connected through the first conductive layer to a voltage source.

Description

Organic electroluminescence panel
Technical field
The present invention relates to a kind of organic electroluminescence panel, particularly relate to a kind of organic electroluminescence panel with even drive current.
Background technology
Organic electroluminescence panel is light-emitting component with the Organic Light Emitting Diode.Organic Light Emitting Diode is a kind of element of current drives, and its luminosity is along with the electric current by Organic Light Emitting Diode changes.Therefore, the electric current of controlling accurately by Organic Light Emitting Diode is the developing important topic of organic electroluminescence panel.
Please refer to Figure 1A-Figure 1B, Figure 1A is the circuit diagram of existing active organic electroluminescent panel pixels array, and Figure 1B is the plane graph of arbitrary pixel among Figure 1A.Each pixel 10 comprises an Organic Light Emitting Diode 11, a switching transistor 12, a driving transistors 13, a data wire 14 and one scan line 15, a power line 16 and an electric capacity 17, annexation is each other known by these those skilled in the art, does not repeat them here.
In the pel array all driving transistors 13 all with its source electrode or drain electrode wherein an end be connected to a common display voltage source V DDShow current potential to obtain one, the other end then is connected to Organic Light Emitting Diode 11.One end of Organic Light Emitting Diode 11 is connected with driving transistors 13, other end ground connection or be connected to a reference voltage source Vss to obtain a reference potential.Show the size of current of the difference of current potential and reference potential and the data voltage that data wire 14 is imported common influence passing through Organic Light Emitting Diode 11, control its brightness by this.
Generally speaking, reference potential is a certain value, therefore show current potential stability influence both differences.Yet, as display voltage source V DDThe electric current of being imported flow through on the substrate power line 16 and when arriving pixels in different positions, be subjected to the influence of power line 16 materials, thickness and current delivery path and distance, can produce different voltage drop (IR drop).Thus, the current potential and the display voltage source V of actual input pixel will be made DDThe current potential difference of output, and the current unevenness that the Organic Light Emitting Diode 11 in each pixel that causes passes through is even, makes brightness be difficult to control.
In order to address the above problem, existing way is that the plain conductor of substrate is thickeied to reduce the inhomogeneous of size of current.For example thicken power line 16 so that the electric current of input driving transistors 13 source electrodes or drain electrode is more stable.
Please refer to Fig. 1 C, be the A-A profile among Figure 1B.Substrate 130 tops have resilient coating 131; for example: structures such as silicon nitride or silica, grid oxic horizon 132, dielectric layer 133, metal level 134, protective layer 135 and flatness layer 136; wherein metal level 134 is driving transistors 13 sources/drain metal, and its thickness increase reaches 6000 .
Please refer to Fig. 1 D, be the demonstration current potential uniformity of panel and the graph of a relation of metal layer thickness.The longitudinal axis of Fig. 1 D is for showing the current potential uniformity (%), and transverse axis is metal layer thickness ().The opinion with mean value when metal level 134 thickness increase to 6000 by 2000 , shows that the uniformity of current potential is increased to 88% by 78% approximately.Therefore adding thick metal layers can reduce electrical impedance, to reduce the voltage drop that shows the current potential transmittance process.
Yet the thickening plain conductor no doubt can address the above problem, but also causes following point simultaneously: the process time and the cost that one, increase physical vapour deposition (PVD) (PVD) and etch process; Two, owing to the tin indium oxide (ITO) and the protective layer 135 that still have back technology, more to ladder covering (Step Coverage) Capability Requirement of back technology, maybe need use flatening process; Three, expose morely owing to the thickness increase causes the sidewall of metal level 134 to fail fully to be covered by back technology, be easy to generate corrosion phenomenon; Four, mechanical stress is stronger, is easy to generate the problem of peeling off.
Summary of the invention
The object of the present invention is to provide a kind of organic electroluminescence panel, not only can solve aforementioned variety of issue, and can avoid the drive current of Organic Light Emitting Diode influenced by voltage drop and along with the conduction variable in distance.
Organic electroluminescence panel of the present invention has two opposing substrates.First substrate is provided with one first conductive layer and a pel array.Second substrate is positioned on this pel array, and its lower surface is provided with one second conductive layer.Pel array comprises that a plurality of Organic Light Emitting Diodes are electrically connected with first conductive layer and second conductive layer.Second conductive layer is electrically connected to first conductive layer, is electrically connected to a voltage source by first conductive layer again.Thus, can select the less path of an impedance by first conductive layer and second conductive layer by the electric current of voltage source output and conduct to arbitrary pixel in this pel array, the current potential of actual input pixel and the current potential that exports in the display voltage source are reached unanimity.
Second conductive layer and first conductive layer are made in can be avoided on the different substrate because of thickening first conductive layer, and power line etc. for example, the etching that is caused, ladder such as cover, easily peel off at shortcoming.Second conductive layer can adopt conductivity than the material of first good conductivity to provide current delivery to the Organic Light Emitting Diode far away apart from voltage source.Therefore, the technology that can simplify reaches purpose of the present invention.
Description of drawings
Figure 1A is the circuit diagram of existing active organic electroluminescent panel pixels array;
Figure 1B is the plane graph of arbitrary pixel among Figure 1A;
Fig. 1 C is the A-A profile among Figure 1B;
Fig. 1 D is the demonstration current potential uniformity of panel and the graph of a relation of metal layer thickness;
Fig. 2 is the view in appearance of organic electroluminescence panel of the present invention;
Fig. 3 is the B-B profile of organic electroluminescence panel of the present invention;
Fig. 4 is second preferred embodiment of the present invention;
Fig. 5 is the 3rd preferred embodiment of the present invention;
Fig. 6 is according to the pixel cell plane graph of organic electroluminescence panel of the present invention;
Fig. 7 A-7C is various contact mats with island structure;
Fig. 8 A-8B is the plane graph of contact mat distributed areas;
Fig. 9 A-9B is the plane graph of the second conductive layer distributed areas; And
Figure 10 has electromechanics to swash display floater according to of the present invention, and it shows current potential uniformity improvement situation.
The simple symbol explanation
10 pixel cells, 200 organic electroluminescence panels
11 Organic Light Emitting Diodes, 210 first substrates
12 switching transistors, 212 first conductive layers
13 driving transistorss, 214 pel arrays
130 substrates, 216 Organic Light Emitting Diodes
131 resilient coatings, 218 voltage sources
132 grid oxic horizons, 220 second substrates
133 dielectric layers, 222 second conductive layers
134 metal levels, 230 bonding zones
135 protective layers, 231 packaging plastics
136 flatness layers, 240 flexible circuit boards
14 data wires, 260 contact mats
15 scan lines 261 the 3rd conductive layer
16 power lines, 2,161 first electrodes
17 electric capacity, 2162 organic layers
262 insulation projections, 2,163 second electrodes
300 pixel cells
Embodiment
Now cooperate icon that organic electroluminescence panel of the present invention is described in detail in detail, and enumerate the preferred embodiment explanation.
Please refer to Fig. 2, be the view in appearance of organic electroluminescence panel of the present invention.Organic electroluminescence panel 200 has one first substrate 210 and one second substrate 220.One bonding zone 230 is arranged for this two substrates 210 and 220 pairs of subsides between first substrate 210 and second substrate 220.First substrate 210 is positioned at second substrate, 220 belows among Fig. 2, and is overlapped in a flexible circuit board 240.Second substrate 220 can be used as a cap to protect the circuit structure on first substrate 210.
Please refer to Fig. 3, be the B-B profile of organic electroluminescence panel 200.The upper surface of first substrate 210 is provided with one first conductive layer 212 and a pel array 214.Second substrate 220 places on the pel array 214, and its lower surface has one second conductive layer 222, and it is electrically connected on first conductive layer 212.Pel array 214 comprises a plurality of Organic Light Emitting Diodes 216, and it is electrically connected to first conductive layer 212.First conductive layer 212 is electrically connected to a voltage source 218 with flexible circuit board 240 again.So, can be by the current signal of voltage source 218 input by selecting the less path of resistance to be passed to arbitrary Organic Light Emitting Diode 216 in the pel array 214 in first conductive layer 212 or second conductive layer 222.
As shown in Figure 3, first electrode 2161 of Organic Light Emitting Diode 216 is electrically connected on the driving transistors (not icon) of pixel, further be electrically connected on first conductive layer 212 again to accept electric current from voltage source 218, then on first electrode 2161, form organic layers 2162 such as hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and electron injecting layer in regular turn, above those organic layers 2162, form second electrode 2163 at last.The material of each organic layer 2162 can not repeat them here with reference to the documents made public of correlative technology field.In an active panel, pel array 214 comprises that also many thin-film transistors (not icon) are with switch element or driving element as Organic Light Emitting Diode 216.
Among Fig. 3, first conductive layer 212 and second conductive layer 222 can be that directly to contact or see through indirectly a contact mat 260 bonding and be electrically connected to each other.First conductive layer 212 and second conductive layer, 222 materials may be the mixture of tin indium oxide, aluminium, chromium, titanium, molybdenum, silver, copper or above-mentioned substance.Contact mat 260 can be arranged at the lower surface of first substrate, 210 upper surfaces or second substrate 220, and its material can be mixture (sealing glue with conductive ball), elargol (silver paste), scolding tin (solder) or the anisotropic conductive film (ACF) etc. of viscose glue and conduction material.In the present embodiment, the material of contact mat 260 is one to contain the packaging plastic of Metal Ball, has encapsulation two substrates 210 and 220 and the function of conducting first conductive layer 212 and second conductive layer 222 concurrently.
Please refer to Fig. 4, be second preferred embodiment of the present invention.Two substrates 210 and 220 edges bind with a packaging plastic 231.Contact mat 260 is positioned at packaging plastic 231 inboards, is mainly used in conducting two conductive layers 212 and 222, so not necessarily have the function of encapsulation two substrates 210 and 220 concurrently.In the present embodiment, the material of contact mat 260 can be selected the spheroid or the anisotropic conductive film (ACF) of elargol (silver paste), scolding tin (solder) manufacturing for use, does not need to mix with viscose glue.
Please refer to Fig. 5, be the 3rd preferred embodiment of the present invention.Contact mat 260 is that one the 3rd conductive layer 261 coats an insulation projection 262 formed island structures.The 3rd conductive layer 261 materials may be the mixture of tin indium oxide, aluminium, chromium, titanium, molybdenum, silver, copper, palladium or above-mentioned material.Insulation projection 262 can be made up of organic resin, hard resin or soft resin that optical activity is revolved in sense.In the present embodiment, first conductive layer 212, second conductive layer 222 and the 3rd conductive layer 261 are made with different materials, and insulation projection 262 is formed on first conductive layer 212.Yet, the 3rd conductive layer 261 and first conductive layer 212, or with second conductive layer 222 may be one also, please refer to Fig. 7 A-7C.
Please refer to Fig. 6, according to the pixel cell plane graph of organic electroluminescence panel of the present invention.Particularly, above-mentioned first conductive layer 212 is a power line 16 in the pixel cell 300, and its thickness range is approximately greater than 100 , and less than 6000 .In the present invention, power line 16 is connected to contact mat 260.Fig. 6 has also shown driving transistors 13, power line 16 and contact mat 260 three-element annexations, and possible contact mat 260 patterns please refer to Fig. 3, Fig. 4, Fig. 5 and figure below 7A-7C.
Please refer to Fig. 7 A-7C, be various contact mats with island structure.Please comparison diagram 5, when the 3rd conductive layer 261 is formed in one to make with technology and commaterial with first conductive layer 212, then form structure as Fig. 7 A.At this moment, the root of insulation projection 262 directly is formed on first substrate 210, and the 3rd conductive layer 261 has also connected voltage source and Organic Light Emitting Diode simultaneously except connecting second conductive layer 222.
When the 3rd conductive layer 261 and second conductive layer 222 are formed in one, then form structure as Fig. 7 B.At this moment, the root of insulation projection 262 is arranged at second substrate, 220 lower surfaces, and the 3rd conductive layer 261 has the function of second conductive layer 222 among Fig. 5 simultaneously.
Among Fig. 7 C, each contact mat comprises two island structures, and the root of this two island structure is arranged at first substrate, 210 upper surfaces and second substrate, 220 lower surfaces respectively, and the relatively also contact of the top of this two island structure.Two contacted the 3rd conductive layers 261 have replaced first conductive layer 212 and second conductive layer 222 among Fig. 5 respectively so, up and down.
Please refer to Fig. 8 A-8B, be the plane graph of contact mat distributed areas.Among Fig. 8 A, the outer rim of two substrates 210 and 220 overlapping regions is a bonding zone 230.Contact mat 260 is located at bonding zone 230 inboards and is banded active region 202 around panel 200.Among Fig. 8 B, a plurality of contact mats 260 are arranged in the active region 202 independently.First substrate 210 all should be provided with contact mat 260 near a side of voltage source and than the side away from voltage source, so can make electric current via the contact mat 260 of near-end up by way of in second substrate 220, get back to target Organic Light Emitting Diode on first substrate 210 by long-range contact mat 260 again.
Please refer to Fig. 9 A-9B, is the plane graph of the second conductive layer distributed areas.Fig. 9 A shows that second conductive layer, 222 holomorphisms are formed on cap or aforesaid second substrate 220.Fig. 9 B shows that second conductive layer 222 through patterning, for example forms a winding displacement (bus line) pattern.Second conductive layer, 222 thickness ranges are more than 2000 , and it can use electroplating technology to be made on the cap in advance.
Subsidiary one carries ground, and the welcome combination in the material of the above various contact mat 260, pattern and position applies on the organic electroluminescence panel 200.Preferably, the resistance of second conductive layer, 222 materials is less than the resistance of first conductive layer, 212 materials.
Please refer to Figure 10, have electromechanics to swash display floater according to of the present invention, it shows current potential uniformity improvement situation.The longitudinal axis of Figure 10 is for showing the current potential uniformity (%), and transverse axis is represented three groups of operating conditions.The I set condition is SD:Ti/Al/Ti=500 /2000 /1000 ; The II set condition is SD:Ti/Al/Ti=500 /4000 /1000 ; The III set condition is SD:Ti/Al/Ti=500 /2000 /1000 , and makes the conductive layer of 2000 on upper substrate or cap.The aforesaid operations condition represents that with SD one is connected to the plain conductor of source/drain, and it is the composite bed of three-layer metal Ti/Al/Ti.Relatively I, II organize operating condition, and the plain conductor that thickens source/drain can increase the uniformity that shows current potential, but the described every shortcoming of prior art is arranged.Relatively I, III set condition are not thickeied the plain conductor of source/drain, and make the conductive layer of 2000 on cap, prove that structure of the present invention can make uniformity optimization that shows current potential and easier making.
When the present invention and prior art compare mutually, have more and get row characteristic and advantage ready:
1. the thickness of first conductive layer can reduce.
2. the thickness of second conductive layer without limits.
3. increase the uniformity of brightness.
Above-listed detailed description specifies at the preferred embodiment of the present invention, and only the foregoing description is not in order to limiting claim of the present invention, does not allly break away from the equivalence that skill spirit of the present invention does and implements or change, all should be contained in the claim of the present invention.

Claims (10)

1. organic electroluminescence panel comprises:
First substrate;
First conductive layer is arranged on this first substrate;
Pel array is positioned on this first substrate, and comprises that a plurality of Organic Light Emitting Diodes are electrically connected with this first conductive layer;
Second substrate is arranged on this pel array;
Second conductive layer is arranged at the lower surface of this second substrate, and is electrically connected with this first conductive layer; And
Voltage source is electrically connected on this first conductive layer.
2. organic electroluminescence panel as claimed in claim 1, wherein this pel array comprises a plurality of thin-film transistors, and it is electrically connected on those Organic Light Emitting Diodes.
3. organic electroluminescence panel as claimed in claim 1 also comprises contact mat, its between this first substrate and this second substrate to be electrically connected this first conductive layer and this second conductive layer.
4. organic electroluminescence panel as claimed in claim 3, wherein this contact mat comprises the 3rd conductive layer of coated insulation projection.
5. organic electroluminescence panel as claimed in claim 3, wherein this contact mat comprises two island structures, the root of this two island structure is arranged at this second base lower surface and this first upper surface of base plate respectively, and the relatively also contact of the top of this two island structure.
6. the described organic electroluminescence panel of claim 1, wherein this first conductive layer directly is contacted with second conductive layer.
7. organic electroluminescence panel comprises:
Substrate;
First conductive layer is arranged on this substrate;
Pel array is positioned on this substrate, and comprises that a plurality of Organic Light Emitting Diodes are electrically connected with this first conductive layer;
Cap is arranged on this pel array;
Second conductive layer is arranged at the surface of this cap, and is electrically connected on a plurality of contact mats, and wherein those contact mats are electrically connected on this first conductive layer.
8. organic electroluminescence panel as claimed in claim 7, wherein this pel array comprises a plurality of thin-film transistors, and it is electrically connected on those Organic Light Emitting Diodes.
9. organic electroluminescence panel as claimed in claim 7, wherein each above-mentioned contact mat comprises two island structures, the root of this two island structure is arranged at respectively on this cap lower surface and this substrate, and the relatively also contact of the top of this two island structure.
10. organic electroluminescence panel as claimed in claim 7, wherein this contact mat comprises the 3rd conductive layer of coated insulation projection.
CNB2006100050237A 2006-01-18 2006-01-18 Organic electroluminesent panel Active CN100463211C (en)

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Application Number Priority Date Filing Date Title
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CN100463211C CN100463211C (en) 2009-02-18

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458546A (en) * 2012-06-04 2013-12-18 力志国际光电股份有限公司 Lighting panel
US9472786B2 (en) 2012-12-04 2016-10-18 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3501155B1 (en) * 2002-07-03 2004-03-02 富士電機ホールディングス株式会社 Organic EL display and manufacturing method thereof
KR100591798B1 (en) * 2003-06-27 2006-06-20 엘지.필립스 엘시디 주식회사 active matrix Organic Electro luminescence Device panel

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458546A (en) * 2012-06-04 2013-12-18 力志国际光电股份有限公司 Lighting panel
CN103458546B (en) * 2012-06-04 2015-09-16 力志国际光电股份有限公司 lighting panel
US9472786B2 (en) 2012-12-04 2016-10-18 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
US9997740B2 (en) 2012-12-04 2018-06-12 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same

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