CN1825133A - Sensor including lead frame and method of forming sensor including lead frame - Google Patents

Sensor including lead frame and method of forming sensor including lead frame Download PDF

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Publication number
CN1825133A
CN1825133A CNA2006100094589A CN200610009458A CN1825133A CN 1825133 A CN1825133 A CN 1825133A CN A2006100094589 A CNA2006100094589 A CN A2006100094589A CN 200610009458 A CN200610009458 A CN 200610009458A CN 1825133 A CN1825133 A CN 1825133A
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CN
China
Prior art keywords
lead
teat
resin mold
wire
basal surface
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CNA2006100094589A
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Chinese (zh)
Inventor
白坂健一
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Yamaha Corp
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Yamaha Corp
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Publication of CN1825133A publication Critical patent/CN1825133A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported on the stage, a modified connection lead structure that supports the stage, and at least one projecting part extending from the stage in a first direction that tilts from the first and second planes. The at least one projecting part has a top portion that is higher in level than the bottom surfaces.

Description

Comprise lead frame sensor and and forming method thereof
Technical field
The method that present invention relates in general to comprise the sensor of lead frame and form the sensor that comprises lead frame.
The present invention requires the Japanese patent application No.2005-50879 that submits on February 25th, 2005 and the right of priority of the Japanese patent application No.2005-93636 that submits on March 29th, 2005, and their full content is by with reference to incorporating into here.
Background technology
In order to describe the state of the technical field that the present invention relates to more fully, the full content of following whole patents of quoting in this application or pointing out, patented claim, patent publications, scientific paper etc. is incorporated into here by reference.
In recent years, constantly requirement is integrated with the GPS (GPS) of the information of indicating relevant customer location with the end device such as mobile phone etc.The GPS function can realize by using such as the sensor that is used for sensing or measure physical quantities of magnetic sensor or acceleration sensor.Be integrated in the magnetic sensor sensing in the end device or measure the terrestrial magnetic field, with position angle or the direction in the three dimensions of sensing or measuring terminals device.Be integrated in the acceleration sensor sensing in the end device or the direction of motion of measuring terminals device, with the position of sensing or measuring terminals device.A plurality of sensor chips that the representative instance that is used for the sensor of sensing physical quantity can include but not limited to incline towards each other and place such as magnetic sensor chips.This modes of emplacement of sensor chip helps to reduce size sensor and reduces sensor thickness.
Sensor with sensor chip of inclination has high sensitivity on the axial direction perpendicular to the plane that comprises inclination sensor, have muting sensitivity on other axial direction such as the axial direction that is parallel to substrate surface.Such sensor will be a future main tendency.
Figure 24 shows the planimetric map of the traditional sensors that is used for the sensing physical quantity.Figure 25 is the cross-sectional view of the sensor of Figure 24.Figure 26 is the planimetric map that is used to form the lead frame of sensor shown in Figure 24.The sensor 1 that is used for the sensing physical quantity comprises pair of sensors chip 2 and 3, and this inclines towards each other to sensor chip, so that the direction and the size of sensing or measurement external magnetic field.The sensor 1 of Figure 24 can use the lead frame 4 of Figure 26 to form.Lead frame 4 can form by the pressure processing and/or the etch process of sheet metal.
The lead frame 4 of Figure 26 comprises framework 5 and a pair of 6 and 7 of being supported by framework 5.Framework 5 further comprises rectangular frame part 5a, a plurality of lead-in wire 5b and the 5d that goes between that is connected that revises.Rectangular frame part 5a limits the rectangle interior zone.The 5a of rectangular frame portion has four bight 5c, two long limits and two minor faces.A plurality of lead-in wire 5b extend into described interior zone from rectangular frame part 5a.The connection lead-in wire 5d that revises extends into described interior zone from the bight 5c of rectangular frame part 5a.Platform 6 and 7 is arranged in the described interior zone, and is supported by the connection lead-in wire 5d of first pair of modification and the lead-in wire 5d that is connected of second pair of modification.
Lead frame 4 has first center line on two long limits that are parallel to rectangular frame part 5a and is parallel to second center line of two minor faces of rectangular frame part 5a.First and second center lines are perpendicular to one another. Platform 6 and 7 has rectangular shape.Second center line is divided into two sub regions with described interior zone.Platform 6 and 7 is separately positioned in two sub regions, so that away from second center line.Platform 6 and 7 is located axisymmetrically with respect to the reflective symmetry of second center line.Platform 6 and 7 each all extend axisymmetrically with respect to another reflective symmetry of first center line.Framework 5 is with respect to the reflective symmetry rotational symmetry of first and second center lines.Platform 6 have first surface and with the first surface opposing second surface, wherein sensor chip 2 is installed on the described first surface.Platform 7 have first surface and with the first surface opposing second surface, wherein sensor chip 3 is installed on the described first surface.Platform 6 has a pair of teat 8, and this gives prominence to towards corresponding platform 7 teat, and tilts towards the space that second surface is faced from the plane that comprises platform 6.Teat 8 is away from second center line.Platform 7 has a pair of teat 9, and this is outstanding towards corresponding platform 6 to teat, and from the plane that comprises platform 7 towards second surface towards the space tilt.Teat 9 is away from second center line.
The connection lead-in wire 5d that revises comprises the suspension lead-in wire that hangs platform 6 and 7 from rectangular frame part 5a.But the connection of each modification lead-in wire 5d has wreath piece 5e, but the lateral edges 6b of described wreath piece 5e and platform 6 or 7 or 7b are adjacent and link to each other.But wreath piece 5e comprises the narrow part that is limited by recess side.But distortion wreath piece 5e makes platform 6 or 7 from comprising the plane inclination of framework 5.
Figure 24 and the sensor 1 shown in 25 comprise a plurality of lead-in wire 5b, have wreath piece 5e being connected lead-in wire 5d, having the sensor chip 2 of inclination and 3 tilting table 6 and 7 of modification, the sensor chip 2 and 3 that tilts is electrically connected to the wiring 10 of lead-in wire 5b and encapsulated sensor chip 2 and 3 and the resin mold 11 of a plurality of lead-in wire 5b.Resin mold 11 forms by molding process.When molding process was finished, the lead-in wire 5d that is connected of lead-in wire 5b and modification had the Outboard Sections that is positioned at resin mold 11 and rectangular frame part 5a outside.Cut the part that is connected the 5d that goes between of lead-in wire 5b and modification,, thereby finish sensor 1 with removal Outboard Sections and rectangular frame part 5a.This announces first in Japanese Unexamined Patent Application and has done disclosure among the No.2004-128473.
Dotted line among Figure 24,25 and 26 is represented the periphery of resin mold 11.Resin mold 11 has rectangular shape in planimetric map, have trapezoidal shape in sectional view.Resin mold 11 have first surface and with first surface opposing second surface 11a.Described first surface is a top surface, and described second surface 11a is a basal surface.Lead frame 4 have first surface and with first surface opposing second surface 4a.Lead frame 5 have first surface and with first surface opposing second surface 5g.Second surface 4a comprises second surface 5g.The second surface 5g of lead frame 5 appears among the second surface 11a of resin mold 11.That is, second surface 5g exposes from second surface 11a.Teat 8 and 9 has top 8a and the 9a on the second surface 11a that is positioned at resin mold 11.Platform 6 and the 7 second surface 11a from resin mold 11 with sensor chip 2 and 3 tilt.Platform 6 is extending in first plane of second plane inclination, and described second plane comprises the second surface 11a of resin mold 11.Platform 7 extends in the 3rd plane, and described the 3rd plane is from second plane inclination, also from first plane inclination.Intersect with acute angle each other on first plane and the 3rd plane.Sensor chip 2 and 3 is installed on the platform 6 and 7 of inclination.Have the sensor chip 2 of inclination and the platform 6 and 7 of 3 inclination and be fixed to resin mold 11, and by resin mold 11 encapsulation.
To the classic method that form sensor 1 be described.Figure 27 A is the partial section that is in the lead frame 4 of the Figure 26 in the related step of the method for the sensor 1 that forms Figure 24 and 25.Figure 27 B is the partial section that is in the lead frame 4 in another related step of the method for the sensor 1 that forms Figure 24 and 25.Figure 27 C is the partial section that is in the lead frame 4 in the related another step of the method for the sensor 1 that forms Figure 24 and 25.
As shown in Figure 26 and 27A, prepare sheet metal with predetermined interior areas.The described predetermined interior areas of sheet metal stands light etching process, reducing the thickness of half, and forms the plate that thickness reduces.The plate that thickness reduces is followed withstanding pressure processing and/or etch process, and to form lead frame 4, described lead frame comprises framework 5 and has the platform 6 and 7 of teat 8 and 9.Platform 6 supports with the 7 lead-in wire 5d that are connected by the modification that is connected to rectangular frame part 5a.But the connection of each modification lead-in wire 5d has wreath piece 5e, but described wreath piece comprises the narrow part that is limited by recess side.Teat 8 extends to corresponding platform 7 from platform 6, and from comprising the plane inclination of platform 6.Teat 9 extends to corresponding platform 6 from platform 7, and from comprising the plane inclination of platform 7.
Sensor chip 2 and 3 is attached to respectively on platform 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Wiring 10 is flexible, and loosely extends, and has the platform 6 and 7 of sensor chip 2 and 3 from comprising the plane inclination of framework 5 in subsequent technique so that allow.Each wiring 10 all has the first bound fraction 10a and the second bound fraction 10b, and described first bound fraction combines with sensor chip 2 or 3, and described second bound fraction combines with lead-in wire 5b.The platform 6 and 7 that tilts to have sensor chip 2 and 3 has increased connect up 10 the first and second bound fraction 10a and the distance between the 10b.The lax permission platform 6 and 7 of wiring 10 is tilted.
As shown in Figure 27 B, lead frame 4 is put between first and second moulds " D " and " E ".First mould " D " has concave portion and ridge part, and second mould " E " has flat surfaces " E1 ".Second mould " E " moves to first mould " D ", thereby flat surfaces " E1 " is gone up and is pressed jut 8 and 9, clamp the square frame part 5a of framework 5 up to first and second moulds " D " and " E ", but wreath piece 5e is twisted thus, and platform 6 and 7 is from comprising the plane inclination of framework 5.
As shown in Figure 27 C, platform 6 and 7 is from comprising the plane inclination of framework 5.The magnetic sensor chips 2 and 3 that is installed in respectively on platform 6 and 7 also tilts with platform 6 and 7.The magnetic sensor chips 2 and 3 that tilts has predetermined inclination with respect to square frame part 5a and flat surfaces " E1 ".But described predetermined inclination is determined by the top 8a or the distance between the 9a of twist part 5e and teat 8 or 9.
The resin of fusion is injected in the cavity of mould " D " and " E ", makes simultaneously on second mould " E " and pushes away teat 8 and 9, thereby form resin mold 11, the sensor chip 2 of described resin mold encapsulation and constant tilt and 3 and the platform 6 and 7 of inclination.The lead-in wire 5d that is connected of the Outboard Sections of square frame part 5a and lead-in wire 5b and modification is positioned at resin mold 11 outsides.The Outboard Sections that is connected the 5d that goes between of the second surface that is connected the 5d that goes between of lead-in wire 5b and modification, square frame part 5a, lead-in wire 5b and modification exposes from resin mold 11.
Then will have in the lead frame 4 immersion plating liquid of resin mold 11, on the surface that exposes, to form coating.The lead-in wire 5d that is connected of lead-in wire 5b and modification is cut a part, to remove the Outboard Sections that is connected the 5d that goes between of square frame part 5a and lead-in wire 5b and modification, simultaneously on the second surface of the remainder that is connected the 5d that goes between of the remainder of lead-in wire 5b and modification, stay coating, thereby finish sensor 1.
Sensor 1 is installed on the circuit board, thereby the coating on the second surface that is connected the 5d that goes between of residue lead-in wire 5b and remaining modification is electrically connected with circuit board.
Figure 28 is the backplan of the sensor that obtains of the A-A line along Figure 24.Carry out molding process, teat 8 contacts with the flat surfaces " E1 " of mould " E " with 9a with 9 top 8a simultaneously.Like this, the resin of fusion can not cover the top 8a and the 9a of teat 8 and 9 when injection molding, thereby top 8a and 9a are from the second surface 11a exposure of resin mold 11.When sensor 1 was installed on the circuit board, the top 8a of exposure and the conductive pattern of 9a and circuit board electrically contacted, thereby formed short circuit.
Figure 29 is a sectional view of putting into the traditional lead frame between mould " D " and " E ".As shown in Figure 29, use paired mould " D " and " E ".The ridge part that mould " D " has concave portion " D1 " and covers with tablet " S ", and mould " E " has the flat surfaces " E1 " that covers with tablet " S ".Tablet " S " is flexible.When mould " D " and " E " closure, top 8a closely contacts with tablet " S " with 9a.In molding process, the resin cavity filling of fusion, but blow-by or covering top 8a and 9a, top 8a and 9a are not covered by resin mold 11 thus, and outstanding from the basal surface 11a of resin mold 11.Sensor 1 has basal surface, and described basal surface comprises the flat bottom of resin mold 11, basal surface and outstanding top 8a and the 9a of lead-in wire 5b.The flat bottom of basal surface and the resin mold 11 of lead-in wire 5b is on identical level height.The level height of the basal surface of outstanding top 8a and 9a and lead-in wire 5b and the flat bottom of resin mold 11 is different.Outstanding top 8a and the 9a 5b that prevents to go between contacts with the conductive pattern of circuit board, and the 5b that goes between thus can not be electrically connected to circuit board.Outstanding top 8a and 9a further stop sensor to be installed on the circuit board satisfactorily.
Discharge from mould " D " and " E " have the sensor of resin mold 11 after, alternatively with in the sensor immersion plating liquid, not only be formed on the basal surface of exposure of lead-in wire 5b such as the coating of solder layer thus, and be formed on outstanding the top 8a and 9a.It is unnecessary covering outstanding top 8a and the coating of 9a.When sensor was installed on the circuit board, the unnecessary coating that covers top 8a and 9a was put between sensor and the circuit board.Described unnecessary coating stops lead-in wire 5b to contact with the conductive pattern of circuit board, and the 5b that goes between thus can not be electrically connected to circuit board.Unnecessary coating further stops sensor to be installed on the circuit board satisfactorily.
In view of above-mentioned, those skilled in the art easily knows according to this disclosure, need a kind of improved lead frame, comprise described improved lead frame sensor, form the method for lead frame and use described lead frame to form the method for sensor.These needs and those skilled in the art that the present invention is devoted in this area disclose other needs easy to know according to this.
Summary of the invention
Therefore, a fundamental purpose of the present invention provides a kind of sensing physical quantity and comprises the sensor of lead frame.
Another object of the present invention provides a kind of method that forms the sensing physical quantity and comprise the sensor of lead frame.
According to first aspect present invention, a kind of sensor comprises: a plurality of lead-in wires, and described a plurality of lead-in wires have the basal surface that extends in first plane; The platform that in second plane, extends, described second plane is from described first plane inclination; Be supported on the sensor chip on the described platform; Support the connection pin configuration of described modification; And at least one teat, from described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has top higher than described basal surface on level height on first direction for described at least one teat.
According to second aspect present invention, a kind of sensor comprises: a plurality of lead-in wires, and described a plurality of lead-in wires have the basal surface that extends in first plane; The platform that in second plane, extends, described second plane is from described first plane inclination; Be supported on the sensor chip on the described platform; Support the connection pin configuration of described modification; And at least one teat, from described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top on first direction for described at least one teat; First insulation course, described first insulation course covers the top of described at least one teat; And the coating on the basal surface of described a plurality of lead-in wires, described coating is lower than described insulation course on level height.
According to third aspect present invention, a kind of sensor comprises: a plurality of lead-in wires, and described a plurality of lead-in wires have the basal surface that extends in first plane; The platform that in second plane, extends, described second plane is from described first plane inclination; Be supported on the sensor chip on the described platform; Support the connection pin configuration of described modification; And at least one teat, described at least one teat be included on the direction of described first and second plane inclinations from the principal part of described extension and on the second direction of the basal surface that is parallel to described lead-in wire from the top that described principal part extends, described top is equal to or higher than described basal surface on level height.
According to fourth aspect present invention, a kind of sensor comprises: a plurality of lead-in wires, and described a plurality of lead-in wires have the basal surface that extends in first plane; The platform that in second plane, extends, described second plane is from described first plane inclination; Be supported on the sensor chip on the described platform; Support the connection pin configuration of described modification, the connection pin configuration of described modification and described a plurality of lead-in wire electricity disconnect; And at least one teat, described at least one teat on first direction from described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top that is equal to or higher than described basal surface on level height.
According to fifth aspect present invention, a kind of sensor comprises: a plurality of lead-in wires, and described a plurality of lead-in wires have the basal surface that extends in first plane; The platform that in second plane, extends, described second plane is from described first plane inclination; Be supported on the sensor chip on the described platform; Support the connection pin configuration of described modification; From described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top on first direction at least one teat, described at least one teat; And the coating on the basal surface of described a plurality of lead-in wires, described coating is lower than described top on level height.
According to sixth aspect present invention, a kind of method that forms sensor comprises: the preparation lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first and second plane inclinations, and described at least one teat has the top; Form resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, and described first flat surfaces and described basal surface are on same level height; And in described bottom, form depressed part, described depressed part has second flat surfaces, described second flat surfaces on the level height than described first flat surfaces high and with described top on same level height.
According to seventh aspect present invention, a kind of method that forms sensor comprises: the preparation lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on the sensor chip on the described platform, support the connection pin configuration of described modification, with on first direction from least one teat of described extension, described first direction is from described first plane inclination, and described at least one teat has the top, and described top is lower than described basal surface on level height; And described top is moved to first higher than described basal surface on the level height level height, simultaneously from described of described first plane inclination.
According to eighth aspect present invention, a kind of method that forms sensor comprises: the preparation lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top; Form resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires basal surface and the top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, and described bottom has and first flat surfaces of described basal surface in same level height; And described basal surface is exposed to electroplate liquid, simultaneously described top and described electroplate liquid are isolated.
According to ninth aspect present invention, a kind of method that forms sensor comprises: the preparation lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top; Reach the first and the second portion that the connection pin configuration of described modification are divided into electricity disconnection each other, described first is electrically connected to described at least one teat, and described second portion is electrically connected to described a plurality of lead-in wire.
According to tenth aspect present invention, a kind of method that is formed for the sensor of sensing physical quantity comprises: the preparation lead frame, the lead-in wire that described lead frame comprises rectangular frame part, partly extends internally from described rectangular frame, the connection lead-in wire of the modification that partly extends internally from described rectangular frame, the platform that supports by the connection lead-in wire of described modification and outstanding downwards and from the teat of described inclination from described; The sensor chip that will be used for the described physical quantity of sensing is fastened on described platform; Upwards push away described teat, so that partly tilt to have the platform of described sensor chip from described rectangular frame; In cavity, form resin mold, described of described resin mold encapsulation, described sensor chip, described teat, described lead-in wire and described modification be connected lead-in wire; The top that reaches described teat is positioned at first level height, and described first level height is than the second level height height of the basal surface of described lead-in wire.
The tenth on the one hand according to the present invention, a kind of method that is formed for the sensor of sensing physical quantity comprises: the preparation lead frame, the lead-in wire that described lead frame comprises rectangular frame part, partly extends internally from described rectangular frame, the connection lead-in wire of the modification that partly extends internally from described rectangular frame, the platform that supports by the connection lead-in wire of described modification and outstanding downwards and from the teat of described inclination from described; The sensor chip that will be used for the described physical quantity of sensing is fastened on described platform; Upwards push away described teat, so that partly tilt to have the platform of described sensor chip from described rectangular frame; In cavity, form resin mold, described of described resin mold encapsulation, described sensor chip, described teat, described lead-in wire and described modification be connected lead-in wire; And will have in the lead frame immersion plating liquid of resin mold, to form coating on the basal surface of described lead-in wire and on each of the top of described teat, not form coating.
The 12 aspect according to the present invention, a kind of sensor that is used for the sensing physical quantity comprises: the rectangular frame part; The lead-in wire that partly extends internally from described rectangular frame; The connection lead-in wire of the modification that partly extends internally from described rectangular frame; By connection lead-in wire support of revising and the platform that partly tilts from described rectangular frame; The sensor chip that is used for the sensing physical quantity, described sensor chip is fastened on the platform and from rectangular frame partly to tilt; Teat, described teat is outstanding downwards and from described inclination from described; Described lead-in wire except that the top of the basal surface of described lead-in wire and described teat of resin mold, the encapsulation of described resin mold, described modification be connected lead-in wire, described, described sensor chip and described teat; And coating, described coating covers the basal surface of described lead-in wire.
In conjunction with the accompanying drawings embodiments of the invention are described in detail below, these and other objects of the present invention, characteristic, aspect and advantage will be more obvious for a person skilled in the art.
Description of drawings
With reference now to constituting the originally accompanying drawing of original disclosed part:
Fig. 1 illustrates the partial section according to the sensor that is used for the sensing physical quantity of first preferred embodiment of the invention;
Fig. 2 is the backplan of the sensor of Fig. 1;
Fig. 3 illustrates the partial section according to the sensor that is used for the sensing physical quantity of the modification of first preferred embodiment of the invention;
Fig. 4 illustrates the partial section according to the sensor that is used for the sensing physical quantity of another modification of first preferred embodiment of the invention;
Fig. 5 A illustrates the partial section of the teat of revising according to the sensor of the another modification of first preferred embodiment of the invention;
Fig. 5 B is the partial plan layout of the teat of Fig. 5 A;
Fig. 6 illustrates the partial section according to the teat of the modification of the sensor of the another modification of first preferred embodiment of the invention;
Fig. 7 illustrates the partial plan layout according to the sensor that is used for the sensing physical quantity of the another modification of first preferred embodiment of the invention;
Fig. 8 illustrates the partial section of the sensor of Fig. 7;
Fig. 9 A is the partial section according to the lead frame of second embodiment of the invention, and described lead frame is in the related step of the method for the sensor that forms Fig. 1 and 2;
Fig. 9 B is the partial section according to the lead frame of second embodiment of the invention, and described lead frame is in another related step of the method for the sensor that forms Fig. 1 and 2;
Figure 10 A is the partial section according to the lead frame of third embodiment of the invention, and described lead frame is in the related step of the method for the sensor that forms Fig. 1 and 2;
Figure 10 B is the partial section according to the lead frame of third embodiment of the invention, and described lead frame is in another related step of the method for the sensor that forms Fig. 1 and 2;
Figure 11 illustrates the partial plan layout according to the sensor that is used for the sensing physical quantity of four preferred embodiment of the invention;
Figure 12 illustrates the partial section according to the sensor that is used for the sensing physical quantity of four preferred embodiment of the invention;
Figure 13 is the backplan of the sensor of Figure 11 and 12;
Figure 14 A is the partial section according to the lead frame of fourth embodiment of the invention, and described lead frame is in the related step of the method for the sensor that forms Figure 11 and 12;
Figure 14 B is the partial section according to the lead frame of fourth embodiment of the invention, and described lead frame is in another related step of the method for the sensor that forms Figure 11 and 12;
Figure 14 C is the partial section according to the lead frame of fourth embodiment of the invention, and described lead frame is in another related step of the method for the sensor that forms Figure 11 and 12;
Figure 15 is the partial section according to the sensor that is used for the sensing physical quantity of the modification of fourth embodiment of the invention;
Figure 16 illustrates the partial section according to the sensor that is used for the sensing physical quantity of fifth preferred embodiment of the invention;
Figure 17 illustrates the partial plan layout of the sensor of Figure 16;
Figure 18 is the partial section that is illustrated in the Separation between connection lead-in wire inside and outside of the modification in the modification of fifth embodiment of the invention;
Figure 19 illustrates the partial section according to the sensor that is used for the sensing physical quantity of sixth preferred embodiment of the invention;
Figure 20 illustrates the partial bottom view of the sensor of Figure 19;
Figure 21 is the partial section according to the lead frame with resin mold of sixth embodiment of the invention, and described lead frame is in the related step of the method for the sensor that forms Figure 19 and 20;
Figure 22 is the partial section according to the lead frame with resin mold of seventh embodiment of the invention, and described lead frame is in the related step of the method that forms described sensor;
Figure 23 is the partial section according to the lead frame with resin mold of the modification of seventh embodiment of the invention, and described lead frame is in the related step of the other method that forms described sensor;
Figure 24 illustrates the planimetric map of the traditional sensors that is used for the sensing physical quantity;
Figure 25 is the sectional view of the sensor of Figure 24;
Figure 26 is the planimetric map of lead frame that is used to form the sensor of Figure 24;
Figure 27 A is the partial section of the lead frame 4 of Figure 26, and described lead frame is in the related step of the method for the sensor that forms Figure 24 and 25;
Figure 27 B is the partial section of lead frame 4, and described lead frame is in another related step of the method for the sensor that forms Figure 24 and 25;
Figure 27 C is the partial section of lead frame 4, and described lead frame is in the related another step of the method for the sensor that forms Figure 24 and 25;
Figure 28 is the backplan of the sensor that obtains of the A-A line along Figure 24; And
Figure 29 is a sectional view of putting into the conventional lead frame between mould " D " and " E ".
Embodiment
Referring now to accompanying drawing selecteed embodiment of the present invention is described.Those skilled in the art will know easily that according to the disclosure description to the embodiment of the invention only is exemplary below, rather than is used to limit the present invention who is limited by appended claims and equivalent thereof.
First embodiment:
Fig. 1 illustrates the partial section according to the sensor that is used for the sensing physical quantity of first preferred embodiment of the invention.Fig. 2 is the backplan of the sensor of Fig. 1.Below description will be at the difference of sensor and the above-mentioned traditional sensors of first embodiment.
The sensor 1 that is used for the sensing physical quantity is shown in Figure 1.Sensor 1 comprises the sensor chip of pair of angled, direction and size that this is used for sensing or measures the external magnetic field sensor chip.Sensor 1 uses the lead frame 4 shown in Figure 26 to form.Sensor 1 can be the mounted on surface encapsulated type such as QFN (it is flat that four sides do not have pin) encapsulation and SON (little external form does not have pin) encapsulation.
Sensor 1 shown in Fig. 1 and 2 comprises connection lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9, wiring 10 and the resin mold 11 of a plurality of lead-in wire 5b, modification.Lead frame 4 with teat 8 and 9 is made by the conductive material such as metal.Tilting table 6 is supported by the lead-in wire 5d that is connected that revises with 7. Sensor chip 2 and 3 is installed in respectively on tilting table 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Teat 8 and 9 extends from platform 6 and 7 respectively.The connection of resin mold 11 package lead 5b, modification lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9 and connect up 10.
The cross section of resin mold 11 is roughly trapezoidal shape, and described trapezoidal shape is limited by flat top, sloped sidewall and bottom.The bottom further comprises bottom 11a and depressed part 11b.Bottom 11a has flat surfaces.Depressed part 11b is limited by flat surfaces 11c and sidewall 11d.Flat surfaces 11c is different with the residing level height of the flat surfaces of bottom 11a.That is, flat surfaces 11c has the high level height of level height than the flat surfaces of bottom 11a.Depressed part 11b has round-shaped in planimetric map.Teat 8 and 9 has flat surfaces 11c with depressed part 11b at the top of same level height 8a and 9a.Like this, top 8a is different with the residing level height of the flat surfaces of bottom 11a with 9a.That is, top 8a and 9a have the level height of the level height of the flat surfaces that is higher than bottom 11a.Lead-in wire 5b has the second surface 5g of the basal surface 4a that limits lead frame 4.Top 8a is different with the residing level height of second surface 5g of lead-in wire 5 with 9a.That is, top 8a and 9a have the level height of the level height of the second surface 5g that is higher than lead-in wire 5.
Depressed part 11b can form by the part of recessed or cutting resin mould 11 bottoms.
To the method that form the sensor 1 be described.The used for lead frame known method preparation of describing with reference to Figure 26 above.Sensor chip 2 and 3 is installed in respectively on the surperficial 6c and 7c of platform 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.
Refer again to Figure 27 A, 27B and 27C, preparation lead frame 4.Lead frame 4 is placed between paired mould " D " and " E ".Mould " D " moves towards pairing mould " E ", and the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9, but the twist part 5e of the connection of revising thus lead-in wire 5d is twisted, and the platform 6 and 7 with magnetic sensor chips 2 and 3 is tilted, and simultaneously teat 8 still closely contacts with flat surfaces " E1 " with 9a with 9 top 8a.
Carry out molding process, inject the cavity that limits by the mould " D " that makes up and " E " with resin with fusion, so that form resin mold 11, the connection lead-in wire 5d of described resin mold package lead 5b, modification, tilting table 6 and 7, and the sensor chip 2 and 3 that tilts.
Figure 28 is the backplan that the resin mold 11 of encapsulating lead 4 is shown.Lead-in wire 5b has the surface that exposes from the basal surface 11a of resin mold 11. Teat 8 and 9 top 8a and 9a also expose from the basal surface 11a of resin mold 11.
Lead frame 4 with resin mold 11 is discharged from mould " D " and " E ", then in the immersion plating liquid, so that form coating on the exposed surface of the top 8a of lead-in wire 5b and teat 8 and 9 and 9a.Described coating can be solder layer, but is not limited to solder layer.
When finishing molding process, the cross section of resin mold 11 is roughly trapezoidal shape, and described trapezoidal shape is limited by flat top, sloped sidewall and flat bottom 11a.Bottom 11a has the presumptive area that comprises top 8a and 9a.The presumptive area of bottom 11a is removed by using such as the known technology of laser beam or sandblast, so that form the depressed part 11b that centers on by no concave bottom 11a, cut the part of teat 8 and 9 simultaneously, and form the teat 8 cut and 9 new top 8a and 9a.This removal can be carried out after mould " D " and " E " release and before being dipped into electroplate liquid at the lead frame 4 with resin mold 11.Alternatively, described removal can be carried out after the lead frame 4 with resin mold 11 is dipped into electroplate liquid.The bottom of resin mold 11 comprises bottom 11a and depressed part 11b.Bottom 11a has flat surfaces.Depressed part 11b is limited by flat surfaces 11c and sidewall 11d.Flat surfaces 11c is different with the residing level height of the flat surfaces of bottom 11a.That is, flat surfaces 11c has the high level height of level height than the flat surfaces of bottom 11a.Depressed part 11b has round-shaped in planimetric map.The flat surfaces 11c of teat 8 and 9 top 8a and 9a and depressed part 11b is in same level height.Like this, top 8a is different with the residing level height of the flat surfaces of bottom 11a with 9a.The flat surfaces of bottom 11a with go between 5 second surface 5g on identical level height.That is, top 8a and 9a have the high level height of level height than flat surfaces with the second surface 5g of lead-in wire 5 of bottom 11a.
The lead-in wire 5b that is connected of lead-in wire 5b and modification has the Outboard Sections that extends in resin mold 11 outsides.Rectangular frame part 5a also is positioned at resin mold 11 outsides.Then cut away and remove rectangular frame part 5a from resin mold 11.The Outboard Sections that is connected the 5d that goes between of lead-in wire 5b and modification is cut a part and is removed from resin mold 11, thereby finishes sensor 1.
Sensor 1 has lead-in wire 5b, and described lead-in wire has the second surface 5g that covers with metal level.Coating is by forming in the lead frame 4 immersion plating liquid that will have resin mold 11.Sensor 1 is installed on the circuit board, thereby the coating that covers second surface 5g contacts with the conductive pattern of circuit board, teat of being cut simultaneously 8 and 9 top 8a and 9a are away from circuit board, and the flat surfaces 11c of described top 8a and 9a and depressed part 11b is in same level height.This 5b that guarantees to go between contacts with the conductive pattern of circuit board, and the 5b that goes between thus is electrically connected to circuit board, and sensor can be installed on the circuit board reliably.
According to the said method that forms sensor 1, after finishing molding process or before the resin mold 11 immersion plating liquid that will have lead frame 4, cut the part of teat 8 and 9, remove the presumptive area of bottom 11a simultaneously, thereby form depressed part 11b.By the flat surfaces 11c of the top 8a of the teat 8 cut and 9 and 9a and depressed part 11b in same level height, and on level height than the second surface 5g height of the 5b that goes between.This 5b that guarantees to go between contacts with the conductive pattern of circuit board, and the 5b that goes between thus is electrically connected to circuit board, and sensor 1 can be installed on the circuit board reliably.
According to first embodiment, teat 8 and 9 is cut a part, removes the presumptive area of the bottom 11a of resin mold 11 simultaneously.As modification to first embodiment, may cut the part of teat 8 and 9, but do not remove any part of the bottom 11a of resin mold 11, thereby by the top 8a of the teat 8 cut and 9 and 9a flat surfaces height on level height than the bottom 11a of resin mold 11.
According to first embodiment, teat 8 and 9 is configured as thin rod.Platform 6 has the nearside 6a of close platform 7.Platform 7 has the nearside 7a of close platform 6. Teat 8 and 9 extends to platform 7 and 6 from nearside 6a and 7a respectively.As modification, alternatively, a plurality of teats 8 and 9 may be aimed on the Width of platform 6 and 7. Teat 8 and 9 positions from its extension should not be limited to nearside 6a and 7a.Teat 8 and 9 shape should not be limited to thin rod.
Fig. 3 illustrates the partial section according to the sensor that is used for the sensing physical quantity of a modification of first preferred embodiment of the invention.As shown in Figure 3, teat 8 and 9 has the sweep 8b and the 9b of the flat surfaces extension of the bottom 11a that is parallel to resin mold 11. Teat 8 and 9 is embedded in the resin mold 11.Sweep 8b and 9b have from the exposed surface shown in the flat surfaces of the bottom surface 11a of resin mold 11.The exposed surface of sweep 8b and 9b can be used on the metal level that forms when being immersed in the electroplate liquid and covers.Advantageously further revise described sweep 8b and 9b,, or make easily from the surface removal metal level of sweep 8b and 9b so that reduce to cover the area of metal level on the surface of sweep 8b and 9b.
Fig. 4 illustrates the partial section according to the teat of the modification of the sensor of another modification of first preferred embodiment of the invention.Teat 8 and 9 has the sweep 8b and the 9b of modification, and the sweep of described modification has one or more groove 8c and 9c.Groove 8c and 9c have reduced the area of the exposed surface of sweep 8b and 9b, thereby have reduced to cover the area of the metal level on sweep 8b and 9b surface, and also feasible easy surface removal metal level from sweep 8b and 9b.
Fig. 5 A illustrates the partial section according to the teat of the modification of the sensor of the another modification of first preferred embodiment of the invention.Fig. 5 B is the partial plan layout of the teat of Fig. 5 A.Teat 8 and 9 has the sweep 8b and the 9b of further modification, and described sweep has a plurality of through hole 8d and 9d.Through hole 8d and 9d reduced the area of the exposed surface of sweep 8b and 9b, thereby reduced to cover the area of metal level on the surface of sweep 8b and 9b, and also make easily from the surface removal metal level of sweep 8b and 9b.
Fig. 6 illustrates the partial section according to the teat of the modification of the sensor of the another modification of first preferred embodiment of the invention.Teat 8 and 9 has the sweep 8b and the 9b of modification, and described sweep has the protruding 8e and the 9e of downward protrusion.Projection 8e and 9e are exposed, and sweep 8b of Xiu Gaiing and 9b are embedded in the resin mold 11 simultaneously, thereby have reduced to cover the area of metal level on the surface of sweep 8b and 9b, and also make easy surface removal metal level from sweep 8b and 9b.
According to first embodiment of the invention, but the connection of modification lead-in wire 5d has the twist part 5e as shown in Figure 24-27C, and as the modification of first embodiment, the connection of modification lead-in wire can have flexible part and can not wreath piece.The flexible part of the crooked lead-in wire 5d that revises and non-warping can not wreath piece, make platform be tilted.Fig. 7 illustrates the partial plan layout according to the sensor that is used for the sensing physical quantity of the another modification of first preferred embodiment of the invention.Fig. 8 illustrates the partial section of the sensor of Fig. 7.Flexible part 5f width is narrower than the other parts of the connection lead-in wire 5d that revises.The flexible part 5f of the crooked lead-in wire 5d that revises and non-warping can not wreath piece 5e, make platform 6 or 7 be tilted.
As shown in Fig. 7 and 8, sensor chip 2 and 3 has first side 2a and the 3a, described first side 2a and 3a near the lead-in wire 5b, and be positioned at the lead-in wire 5b inner and upper and platform 6 and 7 outsides.The sensor chip 2 and 3 the first side 2a and 3a 10 are electrically connected to lead-in wire 5b by connecting up.The internal mechanical of lead-in wire 5b supports first side 2a and the 3a of sensor chip 2 and 3.The sensor chip 2 and 3 the first side 2a and 3a can be connected to the inside of lead-in wire 5b.Described inner remainder than lead-in wire 5b is thin, thereby described inside is flexible.The representative instance of the thickness of described inside can be half of thickness of lead-in wire 5b, but is not limited thereto.Another modification as first embodiment, but the inside mechanical support of lead-in wire 5b is extended at the first side 2a of sensor chip 2 and 3 and 3a and below the first side 2a of sensor chip 2 and 3 and 3a, and the inside of lead-in wire 5b is not attached to first side 2a and the 3a of sensor chip 2 and 3.That is, the sensor chip 2 and 3 the first side 2a and 3a can be positioned on the inner and upper of lead-in wire 5b.
Mould " E " moves towards pairing mould " D ", flat surfaces " E1 " pushes away teat 8 and 9 simultaneously, so that the flexible part 5f of the crooked connection lead-in wire 5d that revises and the thin inside of lead-in wire 5d, thereby make platform 6 and 7 tilt, and non-warping can not wreath piece 5e.
Second embodiment:
Second embodiment of the invention will be described.Following description will be at the difference of second embodiment and above-mentioned first embodiment.Second embodiment provides the sensor 1 that has same structure with first embodiment.That is, sensor 1 have with Fig. 1,2 and 24-28 shown in identical structure.To the method that form sensor 1 be described.Lead frame 4 shown in Figure 24 with first embodiment in the same way as preparation described.Fig. 9 A is the partial section of lead frame 4, and described lead frame is in the related step of the method for the sensor that forms Fig. 1 and 2.Fig. 9 B is the partial section of lead frame 4, and described lead frame is in another related step of the method for the sensor that forms Fig. 1 and 2.
As shown in Fig. 9 A, lead frame 4 is put between first mould " D " and second mould " E ".First mould " D " has concave portion and ridge part, and second mould " E " has peripheral part and outshot, and described peripheral part has first flat surfaces " E1 ", and described outshot has second flat surfaces " E2 ".Second flat surfaces " E2 " is higher than first flat surfaces " E1 " on level height.Described outshot has apart from the predetermined altitude of first flat surfaces " E1 ".Teat 8 and 9 is positioned at second flat surfaces " E2 " top of the outshot of second mould " E ".
As shown in Fig. 9 B, second mould " E " moves towards first mould " D ", thereby push away teat 8 and 9 on second flat surfaces " E2 ", clamp the square frame part 5a of framework 5 up to first mould " D " and second mould " E ", but wreath piece 5e is twisted thus, and platform 6 and 7 is from comprising the plane inclination of framework 5.And the magnetic sensor chips 2 and 3 that is installed in respectively on platform 6 and 7 tilts with platform 6 and 7.The magnetic sensor chips 2 and 3 that tilts has predetermined inclination with respect to the plane that comprises square frame part 5a.Teat 8 and 9 has top 8a and the 9a that closely contacts with second flat surfaces " E2 " of the teat of second mould " E ".Lead-in wire 5b has the second surface 5g that closely contacts with first flat surfaces " E1 " of the peripheral part of second mould " E ".The height of the outshot of corresponding second mould of difference " E " between the level height of second surface 5g of the level height of top 8a and 9a and lead-in wire 5b.The difference of the level height between the second surface 5g of top 8a and 9b and lead-in wire 5d is corresponding to the height of the outshot of second mould " E ".
The resin of fusion injects in the cavity of first mould " D " and second mould " E ", and simultaneously second mould " E " pushes away teat 8 and 9 on continuing, thereby forms the sensor chip 2 and 3 and the resin mold 11 of tilting table 6 and 7 of encapsulation and constant tilt.Rectangular frame part 5a is positioned at resin mold 11 outsides.Lead-in wire 5b and modification be connected lead-in wire 5d each all have the Outboard Sections that extends in resin mold 11 outsides.Lead-in wire 5 has the second surface that illustrates on the second surface of resin mold 11.
Teat with second flat surfaces " E2 " of Fig. 9 A and 9B limits the depressed part 11b of the resin mold 11 of Fig. 1 and 2.The degree of depth of depressed part 11b is corresponding to the height of teat.Teat with second flat surfaces " E2 " of Fig. 9 A and 9B also limits the top 8a of teat 8 and 9 and the level height of 9a.Therefore, the flat surfaces 11c of top 8a and 9a and depressed part 11b on identical level height, but on level height, be higher than the flat surfaces of the bottom 11a of resin mold 11.The flat surfaces of bottom 11a with go between 5 second surface 5g on identical level height.Therefore, top 8a and 9a are higher than the flat surfaces of bottom 11a and the second surface 5g of lead-in wire 5 on level height.
The lead-in wire 5d that is connected of lead-in wire 5b and modification is cut a part, with the Outboard Sections of 5d that goes between that is connected of removal rectangular frame part 5a and lead-in wire 5b and modification, thereby finishes sensor 1.
According to second embodiment, first mould " D " and second mould " E " closure, push away the top 8a and the 9a of first and second teats 8 and 9 simultaneously on second flat surfaces " E2 " of the teat of second mould " E ", the platform 6 and 7 that has sensor chip 2 and 3 thus tilts.Carry out molding process, to form resin mold 11, ejection part 8a and 9a in while second flat surfaces " E2 " continuation.Like this, the flat surfaces 11c of top 8a and 9a and depressed part 11b on identical level height, but on level height, be higher than the flat surfaces of the bottom 11a of resin mold 11.The difference of the level height of the second surface 5g of top 8a and 9a and lead-in wire 5 allows sensor 1 to be installed on the circuit board, and can not form any problem or shortcoming.
According to second embodiment, teat 8 and 9 is configured as thin rod.Teat 8 and 9 extends to platform 7 and 6 from nearside 6a and 7a respectively.As modification, alternatively, a plurality of teats 8 and 9 may be aimed on the Width of platform 6 and 7. Teat 8 and 9 positions from its extension should not be limited to nearside 6a and 7a.Teat 8 and 9 shape should not be limited to thin rod.
According to second embodiment of the invention, but the connection of modification lead-in wire 5d has wreath piece 5e.As the modification of second embodiment, the connection of modification lead-in wire can have flexible part and can not wreath piece.The crooked flexible part of revising lead-in wire 5d but non-warpingly can not make platform tilt by wreath piece.
The 3rd embodiment
Third embodiment of the invention will be described.Following description will be at the difference of the 3rd embodiment and above-mentioned first and second embodiment.The 3rd embodiment provides the sensor 1 that has same structure with first embodiment.That is, sensor 1 have with Fig. 1,2 and 24-28 shown in identical structure.To the method that form sensor 1 be described.Lead frame 4 shown in Figure 26 with first embodiment in the same way as preparation described.Figure 10 A is the partial section of lead frame 4, and described lead frame is in the related step of the method for the sensor that forms Fig. 1 and 2.Figure 10 B is the partial section of lead frame 4, and described lead frame is in another related step of the method for the sensor that forms Fig. 1 and 2.
As shown in Figure 10 A, lead frame 4 is put between first mould " D " and second mould " E ".First mould " D " has concave portion and ridge part, and second mould " E " has peripheral part and the opening " E3 " that is used to hold stripper pin " E4 ", described peripheral part has first flat surfaces " E1 ", and described opening has second flat surfaces " E5 ".Opening " E3 " has the inwall that contacts with stripper pin " E4 ", so that allow stripper pin " E4 " along sliding on inwall perpendicular to the direction of first and second flat surfaces " E1 " and " E5 ".Stripper pin " E4 " slides between first and second positions in opening " E3 ".When stripper pin " E4 " when having primary importance, second flat surfaces " E5 " of stripper pin " E4 " and first flat surfaces " E1 " of peripheral part are on identical level height.When stripper pin " E4 " when having the second place, second flat surfaces " E5 " of stripper pin " E4 " is higher than first flat surfaces " E1 " of peripheral part on level height.Teat 8 and 9 is positioned at second flat surfaces " E5 " top of stripper pin " E4 ".
Have with second mould " E " that first flat surfaces " E1 " has second flat surfaces " E5 " of identical level height and move towards first mould " D ", thereby push away teat 8 and 9 on second flat surfaces " E5 ", clamp the square frame part 5a of framework 5 up to first and second moulds " D " and " E ", but wreath piece 5e is twisted thus, and platform 6 and 7 is from comprising the plane inclination of framework 5.And the magnetic sensor chips 2 and 3 that is installed in respectively on platform 6 and 7 also tilts with platform 6 and 7.The magnetic sensor chips 2 and 3 that tilts has the first predetermined inclination angle with respect to the surface that comprises square frame part 5a.Teat 8 and 9 has top 8a and 9a, and described top closely contacts with second flat surfaces " E5 ", and described second flat surfaces and first flat surfaces " E1 " are on identical level height.Lead-in wire 5b has second surface 5g, and described second surface closely contacts with first flat surfaces " E1 " of the peripheral part of second mould " E ".The second surface 5g of top 8a and 9a and lead-in wire 5b is on identical level height.
As shown in Figure 10 B, stripper pin " E4 " moves to first mould " D ", so that enter the cavity that limits by between first mould " D " and second mould " E ".Second flat surfaces " E5 " raises, and becomes be higher than first flat surfaces " E1 " on level height, push away teat 8 and 9 on further simultaneously, but wreath piece 5e is twisted further thus, and tilting table 6 and 7 tilts further.And the magnetic sensor chips 2 and 3 that is installed in respectively on platform 6 and 7 also further tilts with platform 6 and 7.The magnetic sensor chips 2 and 3 that tilts has predetermined second inclination angle bigger than first inclination angle.Teat 8 and 9 has top 8a and 9a, and described top 8a closely contacts with second flat surfaces " E5 " of rising with 9a, and described second flat surfaces is higher than first flat surfaces " E1 " on level height.Lead-in wire 5b has second surface 5g, and described second surface closely contacts with first flat surfaces " E1 " of the peripheral part of second mould " E ".Top 8a and 9a are higher than the second surface 5g of the 5b that goes between on level height.The difference of the level height between the second surface 5g of top 8a and 9a and lead-in wire 5d is corresponding to the amount of movement of stripper pin " E4 ".
The resin of fusion injects in the cavity between first mould " D " and second mould " E ", simultaneously second flat surfaces " E5 " of stripper pin " E4 " pushes away teat 8 and 9 on continuing, thereby forms the sensor chip 2 and 3 and the resin mold 11 of tilting table 6 and 7 of encapsulation and constant tilt.Rectangular frame part 5a is positioned at resin mold 11 outsides.Lead-in wire 5b and modification be connected lead-in wire 5d each all have the Outboard Sections that extends in resin mold 11 outsides.Lead-in wire 5 has the second surface that illustrates on the second surface of resin mold 11.
Stripper pin " E4 " with second flat surfaces " E5 " of Figure 10 B limits the depressed part 11b of the resin mold 11 of Fig. 1 and 2.The degree of depth of depressed part 11b is corresponding to the difference in level between second flat surfaces " E5 " and first flat surfaces " E1 ".Stripper pin " E4 " with second flat surfaces " E2 " of Figure 10 B also limits the top 8a of teat 8 and 9 and the level height of 9a.Therefore, the flat surfaces 11c of top 8a and 9a and depressed part 11b but is higher than the flat surfaces of the bottom 11a of resin mold 11 on level height on identical level height.The flat surfaces of bottom 11a with go between 5 second surface 5g on identical level height.Therefore, top 8a and 9a are higher than the second surface 5g of lead-in wire 5 on level height.
Lead frame 4 with resin mold 11 is discharged from mould " D " and " E " with stripper pin " E4 ".The lead-in wire 5d that is connected of lead-in wire 5b and modification is cut a part, with the Outboard Sections of 5d that goes between that is connected of removal frame part 5a and lead-in wire 5b and modification, thereby finishes sensor 1.
According to the 3rd embodiment, between first mould " D " and second mould " E " after the closure, stripper pin " E4 " enters described cavity, push away the top 8a and the 9a of first and second teats 8 and 9 on while second flat surfaces " E5 " is further, the platform 6 and 7 that has sensor chip 2 and 3 thus further tilts.Carry out molding process, to form resin mold 11, ejection part 8a and 9a in while second flat surfaces " E5 " continuation.Like this, the flat surfaces 11c of top 8a and 9a and depressed part 11b on identical level height, but on level height, be higher than the flat surfaces of the bottom 11a of resin mold 11.The flat surfaces of bottom 11a with go between 5 second surface 5g on identical level height.The difference of the level height between the second surface 5g of top 8a and 9a and lead-in wire 5 allows sensor 1 to be installed on the circuit board, and can not form any problem or shortcoming.
According to the 3rd embodiment, teat 8 and 9 is configured as thin rod.Teat 8 and 9 extends to platform 7 and 6 from nearside 6a and 7a respectively.As modification, alternatively, a plurality of teats 8 and 9 may be aimed on the Width of platform 6 and 7. Teat 8 and 9 positions from its extension should not be limited to nearside 6a and 7a.Teat 8 and 9 shape should not be limited to thin rod.
According to third embodiment of the invention, but the connection of modification lead-in wire 5d has wreath piece 5e.As the modification of the 3rd embodiment, the connection of modification lead-in wire can have flexible part and can not wreath piece.The crooked flexible part of revising lead-in wire 5d but non-warping can not wreath piece, make platform tilt.
The 4th embodiment
Figure 11 is the partial plan layout that illustrates according to the sensor that is used for the sensing physical quantity of four preferred embodiment of the invention.Figure 12 illustrates the partial section according to the sensor that is used for the sensing physical quantity of four preferred embodiment of the invention.Figure 13 is the backplan of the sensor of Figure 11 and 12.Below description will be at the difference of sensor and the above-mentioned traditional sensors of the 4th embodiment.
Sensor 1 comprises the sensor chip of pair of angled, direction and size that this is used for sensing or measures the external magnetic field sensor chip.Sensor 1 uses the lead frame 4 shown in Figure 26 to form.Sensor 1 can be the mounted on surface encapsulated type such as QFN (it is flat that four sides do not have pin) encapsulation and SON (little external form does not have pin) encapsulation.
Figure 11 comprises go between being connected of a plurality of 5b of lead-in wire, modification 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9, wiring 10 and resin mold 11 with the sensor 1 shown in 12.Tilting table 6 is supported by the lead-in wire 5d that is connected that revises with 7. Sensor chip 2 and 3 is installed in respectively on tilting table 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Teat 8 and 9 extends from platform 6 and 7 respectively.The connection of resin mold 11 package lead 5b, modification lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9 and connect up 10.
The cross section of resin mold 11 is roughly trapezoidal shape, and described trapezoidal shape is limited by flat top, sloped sidewall and bottom.
Teat 8 and 9 has top 8a and the 9a that covers with insulation course 12.The representative instance of insulation course 12 can include but not limited to epoxy resin layer and tetrafluoroethylene resin layer.
As shown in Figure 12, the lead-in wire 5b have first surface and with first surface opposing second surface 5g.Second surface 5g covers with coating 5h, and described coating can form by second surface 5g being exposed to electroplate liquid.Coating 5h on the second surface 5g of lead-in wire 5b illustrates on the flat bottom of resin mold 11.Covering the top 8a of teat 8 and 9 and the insulation course 12 of 9a illustrates on the flat bottom of resin mold 11.
To the method that form the sensor 1 be described.The used for lead frame known method preparation of describing with reference to Figure 26 above.Figure 14 A is the partial section according to the lead frame of fourth embodiment of the invention, and described lead frame is in the related step of the method for the sensor that forms Figure 11 and 12.Figure 14 B is the partial section according to the lead frame of fourth embodiment of the invention, and described lead frame is in another related step of the method for the sensor that forms Figure 11 and 12.Figure 14 C is the partial section according to the lead frame of fourth embodiment of the invention, and described lead frame is in another related step of the method for the sensor that forms Figure 11 and 12.
As shown in Figure 14 A, sensor chip 2 and 3 is installed in respectively on the surperficial 6c and 7c of platform 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Insulating material is applied to the top 8a and the 9a of teat 8 and 9 selectively, so that the insulation course 12 of each of the top 8a of formation covering teat 8 and 9 and 9a.Described insulating material is nonconducting, for example epoxy resin or tetrafluoroethylene resin.
As shown in Figure 14 B and 14C, lead frame 4 is placed between paired mould " D " and " E ".Mould " D " has concave portion and centers on the ridge part of concave portion.Mould " E " has flat surfaces " E1 ".Mould " D " moves towards pairing mould " E ", and the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9, but the wreath piece 5e of the connection of revising thus lead-in wire 5d is twisted, and the platform 6 and 7 with magnetic sensor chips 2 and 3 tilts, and teat 8 still closely contacts with flat surfaces " E1 " with 9a with 9 top 8a simultaneously.
Carry out molding process, the resin of fusion is injected in the cavity 11e that is limited by the mould " D " that makes up and " E ", so that form resin mold 11, the connection lead-in wire 5d of described resin mold package lead 5b, modification, tilting table 6 and 7, and the sensor chip 2 and 3 that tilts.The resin of fusion is injected in the cavity 11e, so that fill described cavity, second surface 5g closely contacts with flat surfaces " E1 " with the part of the insulation course 12 that covers top 8a and 9a simultaneously, and the resin of fusion does not cover the part of the insulation course 12 of second surface 5g and covering top 8a and 9a thus.
The lead frame 4 that will have resin mold 11 discharges from mould " D " and " E ".The part of the insulation course 12 of second surface 5g and covering top 8a and 9a illustrates on the emerge of resin mold 11.
Then will have in the electroplate liquid that lead frame 4 immerses with the negative electrode of DC power supply is connected of resin mold 11, so as on each of the second surface 5g of the 5b that goes between formation coating 5h.When resin mold 11 is exposed to electroplate liquid, between electroplate liquid and second surface 5g, form electric current, on each second surface 5g of lead-in wire 5b, form coating 5h thus.Lead frame 4 usefulness resin molds 11 except that the second surface 5g of lead-in wire 5b and insulation course 12 cover.Teat 8 and 9 top 8a and 9a isolate by insulation course 12 and electroplate liquid.Because resin mold 11 and insulation course 12 are nonconducting,, there is not coating to be formed on resin mold 11 and the insulation course 12 thus so between electroplate liquid and resin mold 11 or insulation course 12, do not produce electric current.
Pick up lead frame 4 with resin mold 11 and coating 5h from electroplate liquid.The lead-in wire 5d that is connected of lead-in wire 5b and modification has the Outboard Sections that extends in resin mold 11 outsides.Rectangular frame part 5a also is positioned at resin mold 11 outsides.Then cut away and remove rectangular frame part 5a from resin mold 11.The Outboard Sections that is connected the 5d that goes between of lead-in wire 5b and modification is cut a part, and removes from resin mold 31, thereby finishes sensor 1.
Sensor 1 is installed on the circuit board, thereby the coating 5h that covers second surface 5g contacts with the conductive pattern of circuit board, and the insulation course 12 that covers top 8a and 9a simultaneously is away from circuit board.Do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely on the insulation course 12 that covers teat 8 and 9 top 8a and 9a with the conductive pattern of circuit board, lead 5b is electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board reliably.
According to fourth embodiment of the invention, before forming resin mold 11, form the top 8a of covering teat 8 and 9 and the insulation course 12 of 9a, thereby lead frame 4 usefulness resin molds 11 except that the second surface 5g of lead-in wire 5b and insulation course 12 cover.When the lead frame 4 with resin mold 11 and insulation course 12 enters in the electroplate liquid, lead frame 4 except that the second surface 5g of lead-in wire 5b is not exposed to electroplate liquid, second surface 5g is exposed to electroplate liquid simultaneously, thereby forms coating 5h on the second surface 5g of lead-in wire 5b.That is, teat 8 and 9 top 8a and 9a isolate by insulation course 12 and electroplate liquid, thereby do not form coating on the insulation course 12 that covers top 8a and 9a.
Do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely with the conductive pattern of circuit board on the insulation course 12, lead 5b can be electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board satisfactorily.Do not exist on the insulation course 12 any coating prevent any short circuit be formed on teat 8 and 9 and the conductive pattern of circuit board between.
According to the 4th embodiment, will be applied to such as nonconducting insulating material of epoxy resin and tetrafluoroethylene resin on the top 8a and 9a of teat 8 and 9, so that form the insulation course 12 that covers top 8a and 9a.As modification, the nonconducting insulating part such as polyimide seal thing or tetrafluoroethene sealer may be adhered on top 8a and the 9a, so that form insulation course 12.As another modification, also may carry out embedding, dipping or coating processes, insulating material is applied to top 8a and 9a, thereby forms insulation course 12.As the modification of the 4th embodiment, teat 8 and 9 also may be made by the electrically non-conductive material such as insulating material.
According to the 4th embodiment, insulation course 12 formed before resin mold 11 forms.As further modification, possible is, after forming resin mold 11, insulation course 12 is formed on the exposed surface of top 8a and 9a, and the exposed surface of setting illustrates on the basal surface of resin mold 11.
According to the 4th embodiment, teat 8 and 9 is configured as thin rod.Platform 6 has the nearside 6a of close platform 7.Platform 7 has the nearside 7a of close platform 6. Teat 8 and 9 extends to platform 7 and 6 from nearside 6a and 7a respectively.As modification, alternatively, a plurality of teats 8 and 9 may be aimed on the Width of platform 6 and 7. Teat 8 and 9 positions from its extension should not be limited to nearside 6a and 7a.Teat 8 and 9 shape should not be limited to thin rod.
Figure 15 is the partial section according to the sensor that is used for the sensing physical quantity of the modification of four preferred embodiment of the invention.As shown in Figure 15, teat 8 and 9 has the sweep 8b and the 9b of the flat surfaces extension of the bottom 11a that is parallel to resin mold 11.Sweep 8b and 9b have from the exposed surface shown in the flat surfaces of the bottom surface 11a of resin mold 11.Sweep 8b and 9b cover with insulation course 12. Teat 8 and 9 is embedded in the resin mold 11.The insulation course 12 of covering sweep 8b and 9b illustrates from the flat surfaces of the bottom 11a of resin mold 11.That is, teat 8 and 9 usefulness resin molds 11 and insulation course 12 cover.In other words, except the established part that covers with insulation course 12, teat 8 and 9 usefulness resin molds 11 cover.
The 5th embodiment:
Fifth embodiment of the invention will be described.Figure 16 illustrates the partial section according to the sensor that is used for the sensing physical quantity of fifth preferred embodiment of the invention.Figure 17 illustrates the partial plan layout of the sensor 1 of Figure 16.Following description will be at the difference of the 5th embodiment and above-mentioned four-sensor.
Figure 16 comprises go between being connected of a plurality of 5b of lead-in wire, modification 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9, wiring 10 and resin mold 11 with the sensor 1 shown in 17.Tilting table 6 is supported by the lead-in wire 5d that is connected that revises with 7. Sensor chip 2 and 3 is installed in respectively on tilting table 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Teat 8 and 9 extends from platform 6 and 7 respectively.The connection of resin mold 11 package lead 5b, modification lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9 and connect up 10.
Each lead 5b has the second surface 5g that covers with coating 5h.Teat 8 and 9 is made by conductive materials such as for example metals.Teat 8 and 9 has top 8a and the 9a on the basal surface 11a that exposes and be illustrated in resin mold 11. Teat 8 and 9 top 8a and 9a are exposed, and do not cover with any insulation course or coating.That is, top 8a and 9a are without any overlayer (for example insulation course and coating etc.).The connection lead 5d of each modification further comprises inner 5j and the outside 5i that disconnects via one or more Separations 13 and inner 5j.Inner 5j disconnects by Separation 13 and outside 5i electricity.Yet, but inner 5j is connected to platform 6 or 7 via wreath piece 5e.
Teat 8 or 9 extends from platform 6 or 7.The inside 5j of the connection lead-in wire 5d that revises is electrically connected to platform 6 or 7 and teat 8 or 9.The connection lead-in wire 5d that revises is electrically connected to lead-in wire 5b.Lead-in wire 5b and outside 5i internally 5j, platform 6 or 7 and teat 8 or 9 electricity disconnect.
Top 8a and 9a on level height than the thickness of the high coating 5h of basal surface of coating 5h.That is, coating is not present in the difference in level between the basal surface of coating 5h that the top 8a of teat 8 and 9 and 9a go up the second surface 5g that forms top 8a and 9a and covering lead-in wire 5b.The thickness of coating 5h is corresponding to described difference in level.
To the method that form the sensor 1 be described.The used for lead frame known method preparation of describing with reference to Figure 26 above.
Sensor chip 2 and 3 is installed in respectively on the surperficial 6c and 7c of platform 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.
Be similar to the technology of the 4th embodiment that describes with reference to figure 14B, lead frame 4 is placed between paired mould " D " and " E ".Mould " D " has concave portion and centers on the ridge part of concave portion.Mould " E " has flat surfaces " E1 ".Mould " D " moves towards pairing mould " E ", and the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9, but the wreath piece 5e of the connection of revising thus lead-in wire 5d is twisted, and the platform 6 and 7 with magnetic sensor chips 2 and 3 tilts, and teat 8 still closely contacts with flat surfaces " E1 " with 9a with 9 top 8a simultaneously.
Be similar to the technology of the 4th embodiment that describes with reference to figure 14C, carry out molding process, the resin of fusion is injected in the cavity 11e that is limited by the mould " D " that makes up and " E ", so that form resin mold 11, the connection lead-in wire 5d of described resin mold package lead 5b, modification, tilting table 6 and 7, and the sensor chip 2 and 3 that tilts.The resin of fusion is injected in the cavity 11e, so that fill described cavity, the part of second surface 5g and top 8a and 9a closely contacts with flat surfaces " E1 " simultaneously, and the resin of fusion does not cover the part of second surface 5g and top 8a and 9a thus.
Carry out another technology,, make the connection lead-in wire 5d of each modification all comprise inside 5j and the outside 5i that separates by Separation 13 with the connection lead-in wire 5d of separately each modification.The representative instance of described another technology can include but not limited to bombardment with laser beams or sandblast.Can carry out described another technology from the basal surface 11a of resin mold 11.The 5b that will go between is attached to rectangular frame part 5a.During process resin mould 11 is with the connection lead-in wire of separately revising, do not separate resin mold 11. Teat 8 and 9, platform 6 are electrically connected to each other with the inside 5j that is connected the 5d that goes between that revises with 7, but disconnect via Separation 13 and outside 5i and lead-in wire 5b electricity.
Then will have in the lead frame 4 immersion plating liquid of resin mold 11, so that form coating 5h on each second surface 5g of lead-in wire 5b, wherein the negative electrode of DC power supply is connected to described electroplate liquid.When resin mold 11 is exposed to electroplate liquid, between electroplate liquid and second surface 5g, produce electric current, on each second surface 5g of lead-in wire 5b, form coating 5h thus.Teat 8 and 9 top 8a and 9a are exposed to electroplate liquid.Yet, because teat 8 and 9, platform 6 disconnect via Separation 13 and outside 5i and lead-in wire 5b electricity with the inside 5j that is connected the 5d that goes between that revises with 7, so between the top 8a of electroplate liquid and teat 8 and 9 and 9a, do not produce electric current, do not have coating to be formed on top 8a and the 9a thus.
Pick up lead frame 4 with resin mold 11 and coating 5h from electroplate liquid.The lead-in wire 5d that is connected of lead-in wire 5b and modification has the Outboard Sections that extends in resin mold 11 outsides.Rectangular frame part 5a also is positioned at resin mold 11 outsides.Then cut away and remove rectangular frame part 5a from resin mold 11.The Outboard Sections that is connected the 5d that go between of lead-in wire 5b and modification is by brachymemma, and from resin mold 31 removals, thereby finish sensor 1.
Sensor 1 is installed on the circuit board, thereby the coating 5h that covers second surface 5g contacts with the conductive pattern of circuit board, and while teat 8 and 9 top 8a and 9a are away from circuit board.On teat 8 and 9 top 8a and 9a, do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely with the conductive pattern of circuit board, lead 5b can be electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board reliably.
The connection lead-in wire 5d of each modification is divided into inner 5j and outside 5i, thereby before the lead frame 4 immersion plating liquid with resin mold 11, top 8a that illustrates on the basal surface 11a of resin mold 11 and 9a electricity float.Produce electric current between the lead-in wire second surface 5g of 5b and electroplate liquid, and do not have electric current to produce between top 8a and 9a and electroplate liquid, coating 5h is formed on the second surface 5g of lead-in wire 5b thus, and top 8a and 9a are with any coating covering.On teat 8 and 9 top 8a and 9a, do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely with the conductive pattern of circuit board, lead 5b can be electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board satisfactorily.
According to the 5th embodiment, the connection of each modification lead-in wire 5d is divided into inner 5e and outside 5i in the position in resin mold 11.That is, the inside 5j with the connection lead-in wire 5d that revises is positioned in the resin mold 11 with the Separation 13 that its outside 5i separates.As modification, the connection lead-in wire that can separately revise in the another location of resin mold 11 outsides, thus the inside 5j of the connection that will revise lead-in wire 5d is positioned in the resin mold 11 with the Separation 13 that its outside 5i separates.That is, the inside 5j of the connection of modification lead-in wire 5d extends to its outside from the inside of resin mold 11.In this case, can carry out separately or separating technology, and not handle or etching resin mold 11.
According to the 5th embodiment, separately or separating technology can use bombardment with laser beams or sandblast to carry out.As the modification of the 5th embodiment, carving technology or bore process are carried out separately or separating technology in the time of can using.When the connection of separately revising in the position of resin mold 11 outsides goes between 5d, can utilize pressure processing to carry out separately or separating technology.In any case, without limits to the method for the connection lead-in wire 5d that separately revises.
According to the 5th embodiment, after forming resin mold 11, the connection lead-in wire 5d that revises is divided into inner 5j and outside 5i.As the further modification of the 5th embodiment, the connection lead-in wire 5d that can before forming resin mold 11, separately revise.Figure 18 is illustrated in the inside 5j of connection lead-in wire 5d of modification and the partial section of the Separation 13 between the outside 5i.The connection lead-in wire 5d that revises is divided into inner 5j and outside 5i, described inside and outsidely separate each other via Separation 13.And nonconducting insulating part 14 is formed on Separation 13 places, thereby insulating part 14 is put between the inside 5j and outside 5i of connection lead-in wire 5d of modification, thus mechanical connection they, they are electrically insulated from each other.Lead frame 4 is placed between paired mould " D " and " E ".Mould " D " moves towards pairing mould " E ", and the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9, but the twist part 5e of the connection of revising thus lead-in wire 5d is twisted, and the platform 6 and 7 with magnetic sensor chips 2 and 3 is tilted, and simultaneously teat 8 still closely contacts with flat surfaces " E1 " with 9a with 9 top 8a.Advantageously, insulating part 14 can have high flexibility, but allows insulating part 14 bendings but non-warping wreath piece 5e, so that tilt to have the platform 8 and 9 of sensor chip 2 boxes 3, the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9 simultaneously.
The 6th embodiment:
Sixth embodiment of the invention will be described.Figure 19 illustrates the partial section according to the sensor that is used for the sensing physical quantity of sixth preferred embodiment of the invention.Figure 20 illustrates the partial bottom view of the sensor of Figure 19.Figure 21 is the partial section according to the lead frame with resin mold of sixth embodiment of the invention, and described lead frame is in the related step of the method for the sensor that forms Figure 19 and 20.Below description will be at the 6th embodiment and the above-mentioned the 4th and the difference of the 5th embodiment.
Figure 19 comprises go between being connected of a plurality of 5b of lead-in wire, modification 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9, wiring 10 and resin mold 11 with the sensor 1 shown in 20.
Tilting table 6 is supported by the lead-in wire 5d that is connected that revises with 7. Sensor chip 2 and 3 is installed in respectively on tilting table 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Teat 8 and 9 extends from platform 6 and 7 respectively.The connection of resin mold 11 package lead 5b, modification lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9 and connect up 10.
Each lead 5b has the second surface 5g that covers with coating 5h.Teat 8 and 9 is made by conductive materials such as for example metals.Teat 8 and 9 has top 8a and the 9a on the basal surface 11a that exposes and be illustrated in resin mold 11. Teat 8 and 9 top 8a and 9a are exposed, and do not cover with any insulation course or any coating.That is, top 8a and 9a are without any overlayer (for example insulation course and coating etc.).
Top 8a and 9a on level height than the thickness of the high coating 5h of basal surface of coating 5h.That is, coating is not present in the difference in level between the basal surface of coating 5h that the top 8a of teat 8 and 9 and 9a go up the second surface 5g that forms top 8a and 9a and covering lead-in wire 5b.The thickness of coating 5h is corresponding to described difference in level.
To the method that form the sensor 1 be described.The used for lead frame known method preparation of describing with reference to Figure 26 above.
Sensor chip 2 and 3 is installed in respectively on the surperficial 6c and 7c of platform 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.
Be similar to the technology of the 4th embodiment that describes with reference to figure 14B, lead frame 4 is placed between paired mould " D " and " E ".Mould " D " has concave portion and centers on the ridge part of concave portion.Mould " E " has flat surfaces " E1 ".Mould " D " moves towards pairing mould " E ", and the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9, but the wreath piece 5e of the connection of revising thus lead-in wire 5d is twisted, and the platform 6 and 7 with magnetic sensor chips 2 and 3 tilts, and teat 8 still closely contacts with flat surfaces " E1 " with 9a with 9 top 8a simultaneously.
Be similar to the technology of the 4th embodiment that describes with reference to figure 14C, carry out molding process, the resin of fusion is injected in the cavity 11e that is limited by the mould " D " that makes up and " E ", so that form resin mold 11, the connection lead-in wire 5d of described resin mold package lead 5b, modification, tilting table 6 and 7, and the sensor chip 2 and 3 that tilts.The resin of fusion is injected in the cavity 11e, so that fill described cavity, the part of second surface 5g and top 8a and 9a closely contacts with flat surfaces " E1 " simultaneously, and the resin of fusion does not cover the part of second surface 5g and top 8a and 9a thus.
Carry out another technology, on the presumptive area of the basal surface 11a of resin mold 11, to form non-conductive sealer 20.Described presumptive area comprises top 8a and the 9a in the backplan.Non-conductive sealer 20 covers the top 8a of teat 8 and 9 and the expose portion of 9a.Non-conductive sealer 20 is the insulated enclosure thing normally, for example epoxy sealing thing and tetrafluoroethylene resin sealer etc.
Then will have in the lead frame 4 immersion plating liquid of resin mold 11 and non-conductive sealer 20, so that form coating 5h on each second surface 5g of lead-in wire 5b, wherein the negative electrode of DC power supply is connected to described electroplate liquid.When resin mold 11 is exposed to electroplate liquid, between electroplate liquid and second surface 5g, form electric current, on each second surface 5g of lead-in wire 5b, form coating 5h thus.Because the top 8a of teat 8 and 9 and 9a separate with electroplate liquid by non-conductive sealer 20, so not electroplate liquid and cover the top 8a of teat 8 and 9 and the non-conductive sealer 20 of 9a between produce electric current, do not have coating to be formed on top 8a and the 9a thus.
Pick up lead frame 4 with resin mold 11 from electroplate liquid.Remove non-conductive sealer 20 from the basal surface 11a of resin mold 11.The lead-in wire 5d that is connected of lead-in wire 5b and modification has the Outboard Sections that extends in resin mold 11 outsides.Rectangular frame part 5a also is positioned at resin mold 11 outsides.Then cut away and remove rectangular frame part 5a from resin mold 11.The Outboard Sections that is connected the 5d that goes between of lead-in wire 5b and modification is cut a part, and removes from resin mold 31, thereby finishes sensor 1.
Sensor 1 is installed on the circuit board, thereby the coating 5h that covers second surface 5g contacts with the conductive pattern of circuit board, and while teat 8 and 9 top 8a and 9a are away from circuit board.On teat 8 and 9 top 8a and 9a, do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely with the conductive pattern of circuit board, lead 5b can be electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board satisfactorily.Do not exist on top 8a and the 9a any coating prevent any short circuit be formed on teat 8 and 9 and the conductive pattern of circuit board between.
According to the 6th embodiment, non-conductive sealer 20 comprises insulating material, for example epoxy sealing thing and tetrafluoroethylene resin sealer etc.As the modification of the 6th embodiment, can form the top 8a of covering teat 8 and 9 and the conductive seal thing of 9a.When in the lead frame 4 immersion plating liquid with resin mold 11 and conductive seal thing, between conductive seal thing and electroplate liquid, produce electric current, thereby on the conductive seal thing, form coating.Pick up lead frame 4 from electroplate liquid after, has the conductive seal thing of coating from the basal surface 11a removal of resin mold 11 with resin mold 11.Then sensor is installed on the circuit board, thereby the coating 5h that covers second surface 5g contacts with the conductive pattern of circuit board, while teat 8 and 9 top 8a and 9a are away from circuit board.On teat 8 and 9 top 8a and 9a, do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely with the conductive pattern of circuit board, lead 5b can be electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board satisfactorily.Do not exist on top 8a and the 9a any coating prevent any short circuit be formed on teat 8 and 9 and the conductive pattern of circuit board between.
Can use any other cover to replace non-conductive sealer 20, cover the top 8a of teat 8 and the expose portion of 9a when being used in the lead frame 4 immersion plating liquid that will have resin mold 11.Cover can be to be used to solid or liquid parts that top 8a and 9a are separated with electroplate liquid.Described cover can form by the solidified liquid material.Described cover can be liquid phase.
The 7th embodiment
Seventh embodiment of the invention will be described.Figure 22 is the partial section according to the lead frame with resin mold of seventh embodiment of the invention, and described lead frame is in the related step of the method that forms described sensor.Below description will be at the 7th embodiment and the above-mentioned the 4th and the difference of the 5th embodiment.
Be similar to reference to Figure 19 and 20 the 6th embodiment that describe, sensor 1 comprises connection lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9, wiring 10 and the resin mold 11 of a plurality of lead-in wire 5b, modification.Tilting table 6 is supported by the lead-in wire 5d that is connected that revises with 7. Sensor chip 2 and 3 is installed in respectively on tilting table 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.Teat 8 and 9 extends from platform 6 and 7 respectively.The connection of resin mold 11 package lead 5b, modification lead-in wire 5d, tilting table 6 and 7, sensor chip 2 and 3, teat 8 and 9 and connect up 10.
Each lead 5b has the second surface 5g that covers with coating 5h.Teat 8 and 9 is made by conductive materials such as for example metals.Teat 8 and 9 has top 8a and the 9a on the basal surface 11a that exposes and be illustrated in resin mold 11. Teat 8 and 9 top 8a and 9a are exposed, and do not cover with any insulation course or any coating.That is, top 8a and 9a are without any overlayer (for example insulation course and coating etc.).
Top 8a and 9a on level height than the thickness of the high coating 5h of basal surface of coating 5h.That is, coating is not present in the difference in level between the basal surface of coating 5h that the top 8a of teat 8 and 9 and 9a go up the second surface 5g that forms top 8a and 9a and covering lead-in wire 5b.The thickness of coating 5h is corresponding to described difference in level.
To the method that form the sensor 1 be described.The used for lead frame known method preparation of describing with reference to Figure 26 above.
Sensor chip 2 and 3 is installed in respectively on the surperficial 6c and 7c of platform 6 and 7. Sensor chip 2 and 3 by connect up 10 be electrically connected to the lead-in wire 5b.
Be similar to the technology of the 4th embodiment that describes with reference to figure 14B, lead frame 4 is placed between paired mould " D " and " E ".Mould " D " has concave portion and centers on the ridge part of concave portion.Mould " E " has flat surfaces " E1 ".Mould " D " moves towards pairing mould " E ", and the flat surfaces " E1 " of mould " E " pushes away teat 8 and 9, but the wreath piece 5e of the connection of revising thus lead-in wire 5d is twisted, and the platform 6 and 7 with magnetic sensor chips 2 and 3 tilts, and teat 8 still closely contacts with flat surfaces " E1 " with 9a with 9 top 8a simultaneously.
Be similar to the technology of the 4th embodiment that describes with reference to figure 14C, carry out molding process, the resin of fusion is injected in the cavity 11e that is limited by the mould " D " that makes up and " E ", so that form resin mold 11, the connection lead-in wire 5d of described resin mold package lead 5b, modification, tilting table 6 and 7, and the sensor chip 2 and 3 that tilts.The resin of fusion is injected in the cavity 11e, so that fill described cavity, the part of second surface 5g and top 8a and 9a closely contacts with flat surfaces " E1 " simultaneously, and the resin of fusion does not cover the part of second surface 5g and top 8a and 9a thus.
In the lead frame 4 immersion plating liquid that a pair of 21-1 anchor clamps and the second anchor clamps 21-2 are used to keep having the lead frame 4 of resin mold 11 and will having resin mold 11, wherein the negative electrode of DC power supply is connected to described electroplate liquid.The first anchor clamps 21-1 has the first surface in contact 21a that closely contacts with the presumptive area of the basal surface 11a of resin mold 11.The first surface in contact 21a and teat 8 closely contact with 9 top 8a and the expose portion of 9a.The second anchor clamps 21-2 has second surface in contact that closely contacts with the presumptive area of the top surface of resin mold 11.The second surface of lead-in wire 5b is exposed, and the first surface in contact 21a with the first anchor clamps 21-1 does not cover.The one 21-1 anchor clamps and the second anchor clamps 21-2 can be made by insulating material.
In the lead frame 4 immersion plating liquid that the one 21-1 anchor clamps and the second anchor clamps 21-2 are used to keep having the lead frame 4 of resin mold 11 and will having resin mold 11, thereby the second surface 5g of lead-in wire 5b is exposed to electroplate liquid, and simultaneously teat 8 separates with electroplate liquid by the first surface in contact 21a with 9a with 9 top 8a.Between electroplate liquid and second surface 5g, form electric current, thereby on each second surface 5g of lead-in wire 5b, form coating 5h.Because the top 8a of teat 8 and 9 and 9a separate from electroplate liquid by the first surface in contact 21a of the first anchor clamps 21-1,, there is not coating to be formed on top 8a and the 9a thus so between electroplate liquid and top 8a and 9a, do not produce electric current.
According to the 7th embodiment, to have in the lead frame 4 immersion plating liquid of resin mold 11, second surface 5g with the 5b that will go between is exposed to electroplate liquid, simultaneously the expose portion of teat 8 and 9 top 8a and 9a is with the first surface in contact 21a covering of the first anchor clamps 21-1, and separates by the first anchor clamps 21-1 and the first surface in contact 21a.Coating 5h is formed on the second surface 5g of lead-in wire 5b, and does not have on the top 8a and 9a that coating is formed on teat 8 and 9.
Sensor 1 is installed on the circuit board, thereby the coating 5h that covers second surface 5g contacts with the conductive pattern of circuit board, and while teat 8 and 9 top 8a and 9a are away from circuit board.On teat 8 and 9 top 8a and 9a, do not exist any coating to allow the coating 5h on the second surface 5g of lead-in wire 5b to contact securely with the conductive pattern of circuit board, lead 5b can be electrically connected to circuit board thus, and sensor 1 can be installed on the circuit board satisfactorily.Do not exist on top 8a and the 9a any coating prevent any short circuit be formed on teat 8 and 9 and the conductive pattern of circuit board between.
According to the 7th embodiment, to have in the lead frame 4 immersion plating liquid of resin mold 11, the first surface in contact 21a of the first anchor clamps 21-1 is closely contacted with the presumptive area of the basal surface 11a of resin mold 11, so that teat 8 is separated from electroplate liquid with 9 top 8a and the exposed surface of 9a, and the second surface 5g of exposed leads 5b is in electroplate liquid, thereby on the second surface 5g of lead-in wire 5b, form coating 5h, and on the expose portion of the top of teat 8 and 9 8a and 9a, do not form any coating.
As the modification of the 7th embodiment, the first anchor clamps 21-1 can have the surface in contact of modification.Figure 23 is the partial section according to the lead frame with resin mold of the modification of seventh embodiment of the invention, and described lead frame is in the related step of the other method that forms described sensor.The first anchor clamps 21-1 has the first surface in contact 21a, and described first surface in contact has groove 21b.The first surface in contact 21a centers on groove 21b in backplan.Groove 21b is centered on by the protuberance with first surface in contact 21a (ridge).The first surface in contact 21a closely contacts with the predetermined annular region of the basal surface 11a of resin mold 11.Described predetermined annular region centers on or surrounds the top 8a and the 9a of teat 8 and 9.Groove 21b is in the face of the top 8a and the 9a of teat 8 and 9.
To have in the lead frame 4 immersion plating liquid of resin mold 11, the first surface in contact 21a of the first anchor clamps 21-1 is closely contacted with the predetermined annular region of the basal surface 11a of resin mold 11, and the top 8a of teat 8 and 9 and 9a are in the face of groove 21b, so that teat 8 is separated from electroplate liquid with 9 top 8a and the exposed surface of 9a, and the second surface 5g of exposed leads 5b is in electroplate liquid, thereby on the second surface 5g of lead-in wire 5b, form coating 5h, and on the expose portion of the top of teat 8 and 9 8a and 9a, do not form any coating.
As used herein, the direction term " upper and lower, inside, outwards, forward, backward, the top, upwards, downwards, quadrature, vertical, level, below and laterally " and any other similar terms be meant the direction that is equipped with equipment of the present invention.Therefore, describing term used in the present invention should just be equipped with equipment of the present invention and understand.
As used herein, term " rectangle " is meant the shape with four straight flanges and four right angles.The employed here term of art " square " is meant to have the identical limit of four length and the shape at four right angles.Term " rectangle " is meant the shape with two long limits and two minor faces and four right angles.Therefore, term " rectangle " comprises term " square " and term " rectangle ".
As used herein, term " physical quantity " is often referred to vector.Term " physical quantity " can comprise scalar, vector and tensor.
As used herein, for example " substantially ", " roughly ", " pact " and degree terms such as " approximately " are meant the rational bias of the term of modification, make net result not have bigger change.
Although described above and illustration the preferred embodiments of the present invention should be understood that these are examples of the present invention, should not think restriction.Can increase, omit, replace and other modification, and not depart from the spirit or scope of the present invention.Therefore, the present invention should not think that the description by the front is limited, but only by the scope restriction of appended claims.

Claims (48)

1, a kind of sensor comprises:
A plurality of lead-in wires, described a plurality of lead-in wires have the basal surface that extends in first plane;
The platform that in second plane, extends, described second plane is from described first plane inclination;
Be supported on the sensor chip on the described platform;
Support the connection pin configuration of described modification; And
From described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has top higher than described basal surface on level height on first direction at least one teat, described at least one teat.
2, sensor according to claim 1 further comprises:
Resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has bottom and depressed part, described bottom has first flat surfaces and described depressed part has second higher than described first flat surfaces on the level height flat surfaces, described first flat surfaces and described basal surface are on same level height, and described second flat surfaces and described top are on same level height.
3, a kind of sensor comprises:
A plurality of lead-in wires, described a plurality of lead-in wires have the basal surface that extends in first plane;
The platform that in second plane, extends, described second plane is from described first plane inclination;
Be supported on the sensor chip on the described platform;
Support the connection pin configuration structure of described modification; And
From described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top on first direction at least one teat, described at least one teat;
First insulation course, described first insulation course covers the top of described at least one teat; And
Coating on the basal surface of described a plurality of lead-in wires, described coating are lower than described insulation course on level height.
4, sensor according to claim 3, wherein said at least one teat be included on the described first direction from the principal part of described extension and on the second direction of the basal surface that is parallel to described lead-in wire from top that described principal part extends.
5, sensor according to claim 3 further comprises:
Resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, described first flat surfaces and described basal surface on same level height and on level height than described coating height.
6, a kind of sensor comprises:
A plurality of lead-in wires, described a plurality of lead-in wires have the basal surface that extends in first plane;
The platform that in second plane, extends, described second plane is from described first plane inclination;
Be supported on the sensor chip on the described platform;
Support the connection pin configuration of described modification; And
At least one teat, described at least one teat be included in from the first direction of described first and second plane inclinations from the principal part of described extension and on the second direction of the basal surface that is parallel to described lead-in wire from the top that described principal part extends, described top is equal to or higher than described basal surface on level height.
7, sensor according to claim 6, wherein said top have at least one groove under shed.
8, sensor according to claim 6, wherein said top has at least one through hole.
9, sensor according to claim 6, wherein said top have at least one projection of protruding downwards, and the second surface of described projection and described a plurality of lead-in wires is on same level height.
10, sensor according to claim 6 further comprises the insulation course that covers described top.
11, sensor according to claim 6 further comprises:
Resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, and described first flat surfaces and described basal surface are on same level height.
12, a kind of sensor comprises:
A plurality of lead-in wires, described a plurality of lead-in wires have the basal surface that extends in first plane;
The platform that in second plane, extends, described second plane is from described first plane inclination;
Be supported on the sensor chip on the described platform;
Support the connection pin configuration of described modification, the connection pin configuration of described modification and described a plurality of lead-in wire electricity disconnect; And
At least one teat, described at least one teat on first direction from described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top that is equal to or higher than described basal surface on level height.
13, sensor according to claim 12, the connection pin configuration of wherein said modification comprise from the first of described extension and the second portion that is electrically connected to described a plurality of lead-in wire and disconnects with described first electricity.
14, sensor according to claim 13, wherein said first and described second portion by the gap divide each other away from.
15, sensor according to claim 13, the connection pin configuration of wherein said modification further comprise with described first and described second portion divide each other away from insulating element.
16, sensor according to claim 12 further comprises:
Resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, and described first flat surfaces and described basal surface are on same level height.
17, sensor according to claim 16 further comprises:
Coating on the basal surface of described a plurality of lead-in wires, described coating first flat surfaces than described top and described resin mold on level height is low.
18, a kind of sensor comprises:
A plurality of lead-in wires, described a plurality of lead-in wires have the basal surface that extends in first plane;
The platform that in second plane, extends, described second plane is from described first plane inclination;
Be supported on the sensor chip on the described platform;
Support the connection pin configuration of described modification;
From described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top on first direction at least one teat, described at least one teat; And
Coating on the basal surface of described a plurality of lead-in wires, described coating are lower than described top on level height.
19, sensor according to claim 18 further comprises:
Resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, described first flat surfaces and described basal surface on same level height and on level height than described coating height.
20, a kind of method that forms sensor, described method comprises:
Prepare lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first and second plane inclinations, and described at least one teat has the top;
Form resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the described top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, and described first flat surfaces and described basal surface are on same level height; And
Form depressed part in described bottom, described depressed part has second flat surfaces, described second flat surfaces on the level height than described first flat surfaces high and with described top on same level height.
21, method according to claim 20 wherein forms described depressed part and includes bottom and described at least one teat of selectively removing described resin mold.
22, a kind of method that forms sensor, described method comprises:
Prepare lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first plane inclination, and described at least one teat has the top, and described top is lower than described basal surface on level height; And
Described top is moved to first higher than described basal surface on the level height level height, simultaneously from described of described first plane inclination.
23, method according to claim 22 wherein moves described top and comprises that the teat with mould pushes away described top.
24, method according to claim 22 wherein moves described top and comprises that the stripper pin of using in the hole that is bonded on mould pushes away described top.
25, a kind of method that forms sensor, described method comprises:
Prepare lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top;
Form resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires basal surface and the top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, and described bottom has and first flat surfaces of described basal surface in same level height; And
Described basal surface is exposed to electroplate liquid, simultaneously described top and described electroplate liquid is isolated.
26, method according to claim 25 wherein is exposed to described basal surface electroplate liquid and simultaneously described top and the isolation of described electroplate liquid is comprised:
The lead frame that will have described resin mold immerses in the described electroplate liquid, with cover described top and described electroplate liquid is isolated simultaneously.
27, method according to claim 26, wherein said cover comprises the insulation course that covers described top.
28, method according to claim 26, wherein said cover comprise the cover plate on the presumptive area of first flat surfaces that is bonded in resin mold bottom, and described presumptive area comprises the expose portion at described top and do not comprise the basal surface of described lead-in wire.
29, method according to claim 26, wherein said cover comprises the anchor clamps with projection, contacting of the presumptive area of described projection and first flat surfaces of described resin mold bottom, and described presumptive area comprises the expose portion at described top and does not comprise the basal surface of described lead-in wire.
30, method according to claim 26, wherein said cover comprises the anchor clamps that have depression and center on the projection of depression, described concave face is to described top, described projection contacts with the predetermined annular region of first flat surfaces of described resin mold bottom simultaneously, and described predetermined annular region is around the expose portion at described top, and the basal surface of described lead-in wire is positioned at described predetermined annular region outside simultaneously.
31, a kind of method that forms sensor, described method comprises:
Prepare lead frame, described lead frame comprises a plurality of lead-in wires with the basal surface that extends in first plane, at the platform that in second plane of described first plane inclination, extends, be supported on sensor chip on the described platform, support described modification the connection pin configuration and on first direction from least one teat of described extension, described first direction is from described first plane and second plane inclination, and described at least one teat has the top; And
The connection pin configuration of described modification is divided into electric each other first and the second portion that disconnects, and described first is electrically connected to described at least one teat, and described second portion is electrically connected to described a plurality of lead-in wire.
32, method according to claim 31 further comprises:
Before separating the connection pin configuration of described modification, form resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the top, described, described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, and described first flat surfaces and described basal surface are in same level height; And
The basal surface of described lead-in wire and the top of described at least one teat are exposed to electroplate liquid, so that forming coating on the described basal surface and on described top, do not forming any coating.
33, method according to claim 31 further comprises:
Form insulating element after separating the connection pin configuration of described modification, described first and second parts of described insulating element mechanical connection and electricity disconnect described first and second portion;
After forming described insulating element, form resin mold, the encapsulation of described resin mold except that the described a plurality of lead-in wires described basal surface and the top, described, have insulating element described modification be connected pin configuration and described at least one teat, described resin mold further has the bottom, described bottom has first flat surfaces, and described first flat surfaces and described basal surface are in same level height; And
The basal surface of described lead-in wire and the top of described at least one teat are exposed to electroplate liquid, so that forming coating on the described basal surface and on described top, do not forming any coating.
34, a kind of method that is formed for the sensor of sensing physical quantity, described method comprises:
Prepare lead frame, the lead-in wire that described lead frame comprises rectangular frame part, partly extends internally from described rectangular frame, the connection lead-in wire of the modification that partly extends internally from described rectangular frame, the platform that supports by the connection lead-in wire of described modification and outstanding downwards and from the teat of described inclination from described;
The sensor chip that will be used for the described physical quantity of sensing is fastened on described platform;
Upwards push away described teat, so that partly tilt to have the platform of described sensor chip from described rectangular frame;
In cavity, form resin mold, described of described resin mold encapsulation, described sensor chip, described teat, described lead-in wire and described modification be connected lead-in wire; And
The top of described teat is positioned at first level height, and described first level height is than the second level height height of the basal surface of described lead-in wire.
35, method according to claim 34, described teat is partly removed after being included in and forming described resin mold in the top of wherein locating described teat, thus described teat has the top that is positioned at described first level height.
36, method according to claim 35 is wherein partly removed described teat and is carried out by using laser beam.
37, method according to claim 35 is wherein partly removed described teat by the use execution of sandblasting.
38, method according to claim 34, the top of wherein locating described teat comprises:
After forming resin mold, will have in the lead frame immersion plating liquid of resin mold, to form coating on the basal surface of described lead-in wire and on the top of described teat; And
Remove coating from the top of teat, on described basal surface, stay described coating simultaneously.
39, method according to claim 34, the top of wherein locating described teat comprises and utilizes mould upwards to push away described teat, wherein said mould has first flat surfaces that contacts with the second surface of described lead-in wire and second flat surfaces that contacts with the top of described teat, and described second flat surfaces on level height than the described first flat surfaces height.
40, method according to claim 34, the top of wherein locating described teat comprises:
By moving described stripper pin, utilize the 3rd flat surfaces of the stripper pin in the opening that is bonded on mould upwards to push away described teat towards described teat.
41, a kind of method that is formed for the sensor of sensing physical quantity, described method comprises:
Prepare lead frame, the lead-in wire that described lead frame comprises rectangular frame part, partly extends internally from described rectangular frame, the connection lead-in wire of the modification that partly extends internally from described rectangular frame, the platform that supports by the connection lead-in wire of described modification and outstanding downwards and from the teat of described inclination from described;
The sensor chip that will be used for the described physical quantity of sensing is fastened on described platform;
Upwards push away described teat, so that partly tilt to have the platform of described sensor chip from described rectangular frame;
In cavity, form resin mold, described of described resin mold encapsulation, described sensor chip, described teat, described lead-in wire and described modification be connected lead-in wire; And
To have in the lead frame immersion plating liquid of resin mold, to form coating on the basal surface of described lead-in wire and on each of the top of described teat, not form coating.
42, according to the described method of claim 41, further comprise: before forming resin mold, on each of the top of described teat, form insulation course, thereby cover described teat with described resin mold and described insulation course.
43, according to the described method of claim 41, further comprise: before will having the lead frame immersion plating liquid of resin mold, on each of the top of described teat, form insulation course, cover teat with resin mold and insulation course simultaneously.
44, according to the described method of claim 41, further comprise: before will having the lead frame immersion plating liquid of resin mold, with each of the connection lead-in wire revised be divided into by Separation be separated from each other inside and outside, describedly be connected internally to described teat, and described outside is connected to described lead-in wire.
45, according to the described method of claim 41, further comprise: after forming resin mold, form cover, described cover covers the exposed surface at the top of described teat, thereby when the lead frame with resin mold was dipped in the electroplate liquid, teat and electroplate liquid were isolated by resin mold and cover.
46, a kind of sensor that is used for the sensing physical quantity comprises:
The rectangular frame part;
The lead-in wire that partly extends internally from described rectangular frame;
The connection lead-in wire of the modification that partly extends internally from described rectangular frame;
The platform that supports and tilt from described rectangular frame portion by the connection lead-in wire of revising;
The sensor chip that is used for the sensing physical quantity, described sensor chip is fastened on the platform and from rectangular frame partly to tilt;
Teat, described teat is outstanding downwards and from described inclination from described;
Described lead-in wire except that the top of the basal surface of described lead-in wire and described teat of resin mold, the encapsulation of described resin mold, described modification be connected lead-in wire, described, described sensor chip and described teat; And
Coating, described coating covers the basal surface of described lead-in wire.
47, according to the described sensor of claim 46, further comprise: the insulation course that covers the top of described teat.
48, according to the described sensor of claim 46, each of the connection of wherein said modification lead-in wire all comprises a plurality of parts, and described a plurality of parts disconnect each other so that described teat and described lead-in wire are disconnected by electricity.
CNA2006100094589A 2005-02-25 2006-02-23 Sensor including lead frame and method of forming sensor including lead frame Pending CN1825133A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101447441B (en) * 2007-10-04 2013-08-21 星科金朋有限公司 Integrated circuit package system including die having relieved active region
CN103743798A (en) * 2013-12-12 2014-04-23 香港应用科技研究院有限公司 Device and method for quick evaluation of performance of electroplating method for micropore filling
CN104051391B (en) * 2013-03-12 2017-04-05 英飞凌科技股份有限公司 There are the chip package and its manufacture method of pin, pad or the chip carrier of isolation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101447441B (en) * 2007-10-04 2013-08-21 星科金朋有限公司 Integrated circuit package system including die having relieved active region
CN104051391B (en) * 2013-03-12 2017-04-05 英飞凌科技股份有限公司 There are the chip package and its manufacture method of pin, pad or the chip carrier of isolation
CN103743798A (en) * 2013-12-12 2014-04-23 香港应用科技研究院有限公司 Device and method for quick evaluation of performance of electroplating method for micropore filling
CN103743798B (en) * 2013-12-12 2015-11-25 香港应用科技研究院有限公司 The rapid evaluation micropore filling apparatus and method of plating performance formula

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