CN1811302A - Composite cold wind generator - Google Patents

Composite cold wind generator Download PDF

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Publication number
CN1811302A
CN1811302A CNA2006100378383A CN200610037838A CN1811302A CN 1811302 A CN1811302 A CN 1811302A CN A2006100378383 A CNA2006100378383 A CN A2006100378383A CN 200610037838 A CN200610037838 A CN 200610037838A CN 1811302 A CN1811302 A CN 1811302A
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CN
China
Prior art keywords
semiconductor
cooler
water tank
cold wind
water
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Granted
Application number
CNA2006100378383A
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Chinese (zh)
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CN100395493C (en
Inventor
何宁
李亮
苏宇
李新龙
徐胜
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Nanjing University of Aeronautics and Astronautics
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Nanjing University of Aeronautics and Astronautics
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Priority to CNB2006100378383A priority Critical patent/CN100395493C/en
Publication of CN1811302A publication Critical patent/CN1811302A/en
Application granted granted Critical
Publication of CN100395493C publication Critical patent/CN100395493C/en
Expired - Fee Related legal-status Critical Current
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Abstract

The composite cold wind generator is used for cooling metal material under cutting, and features its composite refrigerating mode comprising steam compressing refrigeration and semiconductor refrigeration. It consists of filter, air drier, gas-liquid heat exchanger, single-stage steam compressing refrigeration system, water tank, water pump, rectifier circuit, semiconductor refrigerator, heat insulating pipe and nozzle. The evaporator of the single-stage steam compressing refrigeration system is set inside the water tank to cool water; the water pump conveys cold water to the heat radiator to reinforce the heat dissipation in the hot end of the semiconductor thermoelectric pile; compressed air performs heat exchange with cold water in the gas-liquid heat exchanger before entering to the semiconductor refrigerator; the semiconductor refrigerator further cools the compressed air by means of Peltier effect; and the nozzle jets low temperature air to cool the machining area.

Description

Composite cold wind generator
One, technical field
Composite cold wind generator of the present invention belongs in the metal cutting processing and implements subcooled cold wind generator.
Two, background technology
In metal cutting processing, the high temperature that cutting region produces has quickened the wearing and tearing of cutter, has reduced the quality of machined surface, and is all the more so during High-speed machining.Therefore, mostly adopt mode to reduce the cutting region temperature in the machining, to reach the purpose that prolongs cutter life and improve machined surface quality to cutting region cast cutting fluid.Yet the use of cutting fluid can bring a series of negative effect: the manufacturing cost of (1) part increases substantially; (2) cause severe contamination to environment; (3) the harm workman's is healthy.Along with the raising of the consciousness of social environment protection and sustainable development, world many countries has all been formulated more strict industrial discharge standard, has further limited the use of cutting fluid.Reduce the negative effect in the cutting fluid use, it is imperative to explore new machined cooling and lubricating method.
The low-temperature cold wind cutting is to adopt the cold wind below-10 ℃ to wash away cutting region with mode of jet, to reach a kind of processing method of reinforcement to the cutting region cooling, is proposed the earliest by Japanese horizontal river of Mingzhi university and a professor man of virtue and ability.It has the temperature that significantly evenly reduces cutting region, cutter and workpiece, prolong cutter life, improve characteristics such as machined surface quality, especially be fit to the processing of hard-cutting material such as titanium, magnesium, stainless steel, silumin and thin-walled material, obtained abroad at present using widely.Application of cold temperature cold wind cutting technology the most important thing is to develop corresponding low-temperature cold wind generating means.
Three, summary of the invention
The purpose of this invention is to provide a kind of all adjustable cold wind of temperature, pressure, flow that produces that cutting region is implemented subcooled cold wind generator.Can reach by this invention and to prolong cutter life, improve the purpose of crudy and efficient, improve the cleannes of process equipments such as lathe simultaneously, reduce environmental pollution.
Composite cold wind generator of the present invention, comprise water tank, the one-stage steam compressing refrigeration system that interrelates by evaporimeter and water tank, the water pump that links to each other with water tank, compressed air hose is connected in air dryer through stop valve and filter, the output of air dryer is connected in cooler in the semiconductor cooler by gas-liquid heat-exchange, the output of water pump is connected in the input of gas-liquid heat-exchange, the output of gas-liquid heat-exchange links to each other with radiator in the semiconductor cooler, by insulating tube, be connected in nozzle by the output of the semiconductor cooler of rectifier power source power supply through flowmeter and Pressure gauge.
This invention also possesses following advantage except that the saving cutting fluid with prior art, minimizing environmental pollution and advantages such as raising cutter life and crudy:
(1) refrigerating speed is fast.This invention can make outlet cold wind temperature reach the setting requirement at 3~4 minutes.
(2) the load adjustability is strong, is easy to realize controlling continuously and accurately of cold wind temperature, can adapt to rapidoprint and machining dosage changeable under the modern mixed flow production model.This invention can realize the convenient adjusting of cold wind temperature by the operating current of regulating semiconductor cooler, and the adjusting time is short.
(3) simple in structure, be easy to safeguard.
Four, description of drawings
Fig. 1 is the composite cold wind generator structural representation.
The number in the figure title:
1. water tank 2. compressors 3. condensers 4. expansion valves 5. evaporimeters 6. one-stage steam compressing refrigeration systems 7. water pumps 8. compressed air hoses 9. stop valves 10. filters 11. air dryers 12. gas-liquid heat-exchanges 13. rectifier power sources 14. semiconductor coolers 15. flowmeters 16. Pressure gauges 17. nozzles 18. semiconductor thermoelectric modules 19. radiators 20. coolers 21. insulating tubes.
Five, the specific embodiment
This invention is by being core with the semiconductor refrigerating, realizes goal of the invention in conjunction with the compound-refrigerating method of vapor compression refrigeration, as shown in Figure 1, it is by filter 10, air dryer 11, gas-liquid heat-exchange 12, water tank 1, one-stage steam compressing refrigeration system 6, water pump 7, rectifier power source 13, semiconductor cooler 14, insulating tube 21, nozzle 17 is formed.Nozzle 17 connects and is installed in the position that can implement cooling to the processing district by insulating tube 21 and semiconductor cooler 14.
One-stage steam compressing refrigeration system 6 mainly comprises compressor 2, condenser 3, and expansion valve 4, parts such as evaporimeter 5, wherein evaporimeter 5 places water tank 1, and it mainly plays the water in the cooling water tank 1 and makes it keep the effect of steady temperature.
Semiconductor cooler 14 is by the semiconductor thermoelectric module 18 of series connection, cooler 20, radiator 19 is formed, wherein two radiator 19 usefulness screws are fastening up and down, fit tightly with the outer wall of cooler 20 and radiator 19 respectively with the cold junction that keeps semiconductor thermoelectric module 18 and hot junction, connect with lead between the semiconductor thermoelectric module 18.Semiconductor cooler 14 all insulation is handled.
The embodiment of 1 pair of this invention is made a detailed description with reference to the accompanying drawings:
One, one of cooling circuit: during 6 work of one-stage steam compressing refrigeration system, refrigerant gas is constantly by after the compressor 2 suction compressions, liquefaction in condenser 3, after expansion valve 4 throttling step-downs, enter evaporimeter 5, water in the evaporation heat absorption cooling water tank 1, become gas again and get back to compressor 2, thereby finish the closed cycle of refrigeration working medium.Introduced temperature controller in one-stage steam compressing refrigeration system 6, the temperature-sensing element of temperature controller places water tank 1, is used to measure water temperature, and when water temperature reached the temperature of setting, it is out of service that temperature controller is just controlled compressor 2; In case when water temperature was higher than design temperature, temperature controller just made compressor 2 start, and reduces water temperature.In water tank 1, set up a fluid space that temperature is low and stable like this, thereby realized semiconductor thermoelectric module 18 hot junctions are stablized and heat radiation effectively.
Two, two of cooling circuit: water pump 7 constantly is transported to gas-liquid heat-exchange 12 with the cold water of temperature constant in the water tank 1, in gas-liquid heat-exchange 12 after cold water and the compressed air heat exchange, enter the radiator 19 in the semiconductor cooler 14, strengthen semiconductor thermoelectric module 18 hot-side heat dissipations, and then improve semiconductor refrigerating efficient.
Three, semiconductor cooler: during semiconductor cooler 14 work, rectifier power source 13 changes the alternating current of 220V into stable low-voltage DC semiconductor supply thermoelectric pile 18, and semiconductor thermoelectric module 18 produces Peltier effects and forms cold junction and hot junction at this moment.The heat that semiconductor thermoelectric module 18 hot junctions produce is constantly taken away by the cold water of radiator 19, and cold junction then makes the inwall of cooler 20 remain on extremely low temperature.
Four, compressed air loop: compressed air is respectively through entering gas-liquid heat-exchange 12 after filter 10 and air dryer 11 filtrations and the dehumidifying, enter in the cooler 20 after the cooling again, by with the heat exchange of cooler 20, semiconductor thermoelectric module 18 cold junctions have absorbed compressed-air actuated heat, further reduce compressed air temperature.Compressed air after the cooling (10~-30 ℃) through nozzle 17 with certain pressure injection to cutting region, reach the cooling cutting region purpose.

Claims (3)

1, a kind of composite cold wind generator, it is characterized in that, comprise water tank (1), the one-stage steam compressing refrigeration system (6) that interrelates by evaporimeter (5) and water tank (1), the water pump (7) that links to each other with water tank (1), compressed air hose (8) is connected in air dryer (11) through stop valve (9) and filter (10), the output of air dryer (11) is connected in cooler (20) in the semiconductor cooler (14) by gas-liquid heat-exchange (12), the output of water pump (7) is connected in the input of gas-liquid heat-exchange (12), the output of gas-liquid heat-exchange (12) links to each other with radiator (19) in the semiconductor cooler (14), is connected in nozzle (17) by insulating tube (21) through flowmeter (15) and Pressure gauge (16) by the output of the semiconductor cooler (14) of rectifier power source (13) power supply.
2, composite cold wind generator according to claim 1 is characterized in that, one-stage steam compressing refrigeration system (6) constitutes the loop by the evaporimeter that places water tank (1) (5), compressed machine (2), condenser (3) and expansion valve (4).
3, composite cold wind generator according to claim 1 and 2, it is characterized in that, semiconductor cooler (14) comprises the cooler (20) that places the centre position, the radiator (19) that is installed in the series connection semiconductor thermoelectric module (18) on upper and lower two surfaces of cooler (20) and is installed on upper and lower two semiconductor thermoelectric modules (18) outer surface respectively.
CNB2006100378383A 2006-01-17 2006-01-17 Composite cold wind generator Expired - Fee Related CN100395493C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2006100378383A CN100395493C (en) 2006-01-17 2006-01-17 Composite cold wind generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006100378383A CN100395493C (en) 2006-01-17 2006-01-17 Composite cold wind generator

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CN1811302A true CN1811302A (en) 2006-08-02
CN100395493C CN100395493C (en) 2008-06-18

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102921818A (en) * 2012-10-31 2013-02-13 南京航空航天大学 High speed stamping die with low temperature lubricating structure
CN106196364A (en) * 2016-07-13 2016-12-07 东南大学 A kind of Cryogenic air feeding mechanism
CN108555644A (en) * 2018-04-28 2018-09-21 中国工程物理研究院机械制造工艺研究所 A kind of combined type frost clamping device
CN109227977A (en) * 2018-10-25 2019-01-18 天津职业技术师范大学 Semiconductor cooling flushing system
CN114893925A (en) * 2021-12-11 2022-08-12 上海精密计量测试研究所 Integrated circuit refrigerating system based on semiconductor refrigerating sheet

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3088000B2 (en) * 1997-09-02 2000-09-18 ダイキン工業株式会社 Fluid temperature and humidity controller
CN2336289Y (en) * 1998-02-12 1999-09-01 童明伟 Low-temp. air cooling device
JP2000283500A (en) * 1999-03-29 2000-10-13 Canon Inc Environment controller, semiconductor production system and inspecting/measuring apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102921818A (en) * 2012-10-31 2013-02-13 南京航空航天大学 High speed stamping die with low temperature lubricating structure
CN106196364A (en) * 2016-07-13 2016-12-07 东南大学 A kind of Cryogenic air feeding mechanism
CN108555644A (en) * 2018-04-28 2018-09-21 中国工程物理研究院机械制造工艺研究所 A kind of combined type frost clamping device
CN109227977A (en) * 2018-10-25 2019-01-18 天津职业技术师范大学 Semiconductor cooling flushing system
CN114893925A (en) * 2021-12-11 2022-08-12 上海精密计量测试研究所 Integrated circuit refrigerating system based on semiconductor refrigerating sheet

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