CN1803353A - Method for preparing copper powder - Google Patents
Method for preparing copper powder Download PDFInfo
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- CN1803353A CN1803353A CN 200610020164 CN200610020164A CN1803353A CN 1803353 A CN1803353 A CN 1803353A CN 200610020164 CN200610020164 CN 200610020164 CN 200610020164 A CN200610020164 A CN 200610020164A CN 1803353 A CN1803353 A CN 1803353A
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- copper powder
- copper
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- liquid
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006100201646A CN100427247C (en) | 2006-01-17 | 2006-01-17 | Method for preparing copper powder |
Applications Claiming Priority (1)
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CNB2006100201646A CN100427247C (en) | 2006-01-17 | 2006-01-17 | Method for preparing copper powder |
Publications (2)
Publication Number | Publication Date |
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CN1803353A true CN1803353A (en) | 2006-07-19 |
CN100427247C CN100427247C (en) | 2008-10-22 |
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Family Applications (1)
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CNB2006100201646A Expired - Fee Related CN100427247C (en) | 2006-01-17 | 2006-01-17 | Method for preparing copper powder |
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CN (1) | CN100427247C (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101992300A (en) * | 2010-11-04 | 2011-03-30 | 江苏大方金属粉末有限公司 | Preparation method for sintered copper powder material of heat pipe |
CN102151823A (en) * | 2011-01-26 | 2011-08-17 | 宁波广博纳米材料有限公司 | Antioxidation method of nano copper powder |
CN101835555B (en) * | 2007-11-05 | 2012-08-22 | 住友金属矿山株式会社 | Copper fine particle, method for producing the same, and copper fine particle dispersion |
CN103949653A (en) * | 2014-04-02 | 2014-07-30 | 西安交通大学 | Product separation and organic ligand recovery system of supercritical hydro-thermal synthesis system |
CN104475722A (en) * | 2014-11-12 | 2015-04-01 | 有研粉末新材料(北京)有限公司 | Low-lead, low-apparent-density high-branch-shaped electrolytic copper powder and preparation method thereof |
CN110116218A (en) * | 2019-05-29 | 2019-08-13 | 西安工程大学 | A kind of preparation method of the narrow copper powder of high-purity particle diameter distribution |
CN110144604A (en) * | 2019-06-17 | 2019-08-20 | 阳谷祥光铜业有限公司 | A kind of preparation process of electrodeposition copper powder |
CN112021334A (en) * | 2020-09-10 | 2020-12-04 | 中国有色桂林矿产地质研究院有限公司 | Porous copper powder carrier-loaded silver-based antibacterial material and preparation method thereof |
CN112692305A (en) * | 2021-03-23 | 2021-04-23 | 陕西斯瑞新材料股份有限公司 | Preparation method of batch type 3D printed CuCr composite contact |
CN113523269A (en) * | 2021-06-08 | 2021-10-22 | 五邑大学 | Copper powder and preparation method and application thereof |
CN113832500A (en) * | 2021-10-20 | 2021-12-24 | 昆明高聚科技有限公司 | Preparation method of electronic-grade high-purity low-apparent-density dendritic copper powder |
CN116673479A (en) * | 2023-04-27 | 2023-09-01 | 安徽旭晶粉体新材料科技有限公司 | Preparation method for synthesizing cuprous chloride from pure copper powder and chlorine gas |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6679937B1 (en) * | 1997-02-24 | 2004-01-20 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
CN1204042C (en) * | 2003-06-10 | 2005-06-01 | 东北师范大学 | Method for preparing nano tube of some metalloid oxides and metals with size and shape being controllable |
CN1247354C (en) * | 2004-11-23 | 2006-03-29 | 北京科技大学 | Method for preparing nanometer copper powder by chemical reduction in water solution |
-
2006
- 2006-01-17 CN CNB2006100201646A patent/CN100427247C/en not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101835555B (en) * | 2007-11-05 | 2012-08-22 | 住友金属矿山株式会社 | Copper fine particle, method for producing the same, and copper fine particle dispersion |
CN101992300A (en) * | 2010-11-04 | 2011-03-30 | 江苏大方金属粉末有限公司 | Preparation method for sintered copper powder material of heat pipe |
CN102151823A (en) * | 2011-01-26 | 2011-08-17 | 宁波广博纳米材料有限公司 | Antioxidation method of nano copper powder |
CN103949653A (en) * | 2014-04-02 | 2014-07-30 | 西安交通大学 | Product separation and organic ligand recovery system of supercritical hydro-thermal synthesis system |
CN103949653B (en) * | 2014-04-02 | 2015-10-28 | 西安交通大学 | A kind of product separation of supercritical water thermal synthesis system and organic ligand recovery system |
CN104475722A (en) * | 2014-11-12 | 2015-04-01 | 有研粉末新材料(北京)有限公司 | Low-lead, low-apparent-density high-branch-shaped electrolytic copper powder and preparation method thereof |
CN110116218A (en) * | 2019-05-29 | 2019-08-13 | 西安工程大学 | A kind of preparation method of the narrow copper powder of high-purity particle diameter distribution |
CN110116218B (en) * | 2019-05-29 | 2022-06-17 | 西安工程大学 | Preparation method of high-purity narrow-particle-size-distribution copper powder |
CN110144604A (en) * | 2019-06-17 | 2019-08-20 | 阳谷祥光铜业有限公司 | A kind of preparation process of electrodeposition copper powder |
CN112021334A (en) * | 2020-09-10 | 2020-12-04 | 中国有色桂林矿产地质研究院有限公司 | Porous copper powder carrier-loaded silver-based antibacterial material and preparation method thereof |
CN112692305A (en) * | 2021-03-23 | 2021-04-23 | 陕西斯瑞新材料股份有限公司 | Preparation method of batch type 3D printed CuCr composite contact |
CN113523269A (en) * | 2021-06-08 | 2021-10-22 | 五邑大学 | Copper powder and preparation method and application thereof |
CN113832500A (en) * | 2021-10-20 | 2021-12-24 | 昆明高聚科技有限公司 | Preparation method of electronic-grade high-purity low-apparent-density dendritic copper powder |
CN116673479A (en) * | 2023-04-27 | 2023-09-01 | 安徽旭晶粉体新材料科技有限公司 | Preparation method for synthesizing cuprous chloride from pure copper powder and chlorine gas |
Also Published As
Publication number | Publication date |
---|---|
CN100427247C (en) | 2008-10-22 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Kaiping Elec&Eltek E&E Magnetic Products Limited Assignor: University of Electronic Science and Technology of China Contract fulfillment period: 2008.11.20 to 2013.11.20 contract change Contract record no.: 2009440000918 Denomination of invention: Method for preparing copper powder Granted publication date: 20081022 License type: Exclusive license Record date: 2009.8.5 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.11.20 TO 2013.11.20; CHANGE OF CONTRACT Name of requester: KAIPING YILI ANDA ELECTRICS THIRD CO., LTD. Effective date: 20090805 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081022 Termination date: 20110117 |