CN1798987A - Redundant wire bonds for increasing transducer reliability - Google Patents
Redundant wire bonds for increasing transducer reliability Download PDFInfo
- Publication number
- CN1798987A CN1798987A CNA2004800153872A CN200480015387A CN1798987A CN 1798987 A CN1798987 A CN 1798987A CN A2004800153872 A CNA2004800153872 A CN A2004800153872A CN 200480015387 A CN200480015387 A CN 200480015387A CN 1798987 A CN1798987 A CN 1798987A
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- CN
- China
- Prior art keywords
- ultrasonic
- integrated circuit
- lead
- dimensioned
- coupling part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H3/00—Measuring characteristics of vibrations by using a detector in a fluid
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Abstract
A method and a system for using redundant wire bonds for increasing the reliability of ultrasound transducers are disclosed. An ultrasound transducer assembly having an ultrasound transducer, an integrated circuit, a plurality of wires, and a plurality of bond pads is provided. The integrated circuit includes enlarged lead pads for receiving redundant wire bonds. The ultrasound transducer includes a plurality of bond pads configured to receive the redundant wire bonds. Connecting wires, forming signal paths, connect the enlarged lead pads with the bond pads.
Description
The present invention relates generally to transducer (transducer).More particularly, the present invention relates to be used to use redundant wire to engage and increase the method and system of the reliability of transducer.
Single connection is adopted in connection between the discrete assembly usually.Usually, this connection is the single lead that utilizes copper, gold or aluminium to make.
In suffering the system of thermal cycle conditions, lead is easy to fatigure failure.In many systems, the stress that causes owing to thermal cycle conditions carries out orientation along the traverse shaft that the mismatch owing to thermal expansivity between the system component (" CTE ") causes.When switching on, system component is produced thermal stress to system.Therefore, the purpose of this invention is to provide a kind of system, be used for increasing the reliability of ultrasonic transducer by the failure rate that connects between the parts that reduce ultrasonic system.
A kind of ultrasonic system with transducer reliability of increase is disclosed hereinafter.Especially, this system comprises the ultrasonic probe with at least one ultrasonic transducer and at least one integrated circuit package.Each integrated circuit package comprises integrated circuit, a plurality of connection lead and coupling part.Along a plurality of weld zones of at least one surface arrangement (bond pad) of coupling part, and each weld zone is configured to receive at least two conductor wire end.Integrated circuit has a plurality of lead district (leadpad), and wherein each lead district is configured to receive at least two conductor wire end.Each lead in a plurality of connection leads is made by conductive material, has first and second ends, is used for each lead district is connected to corresponding weld zone.Ultrasonic probe is configured and is adapted to be at least one ultrasonic transducer of reception and at least one integrated circuit package.
In addition, disclose a kind of method that increases ultrasonic transducer reliability here, integrated circuit package and ultrasonic probe wherein are provided.Integrated circuit package comprises integrated circuit, coupling part and a plurality of leads that are connected.Integrated circuit has a plurality of lead district, and wherein each lead district is configured and is suitable for receiving at least two conductor wire end.The coupling part has a plurality of weld zones, and wherein each weld zone is configured and is suitable for receiving at least two conductor wire end.Ultrasonic probe has at least one ultrasonic transducer.Ultrasonic probe is configured and is suitable for receiving at least one ultrasonic transducer and at least one integrated circuit package.
Reference is below in conjunction with its detailed description of preferred embodiment that accompanying drawing carried out, and those skilled in the art can more easily understand above-mentioned purpose of the present invention and advantage, wherein:
Fig. 1 is the skeleton view that the prior art between integrated circuit and coupling part connects;
Fig. 2 is the skeleton view according to the embodiment of integrated circuit package of the present invention; With
Fig. 3 is the side view of ultrasonic probe, shows the position of integrated circuit package in ultrasonic probe of Fig. 2.
Therefore, following in conjunction with the accompanying drawings some embodiment of the present invention are disclosed in the description.Now, incite somebody to action the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings, the wherein similar similar or identical element of label sign.As employed in this article, term " far-end " refers to that part away from user's instrument or its parts, and term " near-end " refers to that comparison is near user's instrument or that part of its parts.
In the typical prior art system, as shown in Figure 1, integrated circuit 10 is disposed on the substrate 15 and comprises lead district 12, and described lead district 12 is dimensioned (dimension), to receive single lead 14.Each lead 14 has first and second ends, and wherein first end is connected to lead district 12, and second end is connected to weld zone 16.Printed circuit board 18 comprises a plurality of weld zones 16, is used for assembly is connected to printed circuit board 18.These single wiring systems (wiresystem) have high relatively average system failure rate usually.
The derivation of this solution needs to use " physics of failure " to infer origin mechanism and arouse the reliability engineering principle.As discussed above, in parallel with lead axle, because the displacement that positive temperature expansion coefficient (" TCE ") causes is normally maximum.When probe assembly heated, promptly when giving system power-up, the wire loop from the lead district of integrated circuit to the weld zone on printed circuit board stretched with being recycled, thereby applied the tired inducing load at break line or abutment.
The reliability of a wiring system is designated as R1.According to reliability engineering, utilize formula 1-(1-R1)
2Determine the reliability of two lead redundant systems, and usually this reliability much larger than the reliability of a lead system.Only by example, if single wiring system has reliability R=0.5, two of similar configuration wiring systems have reliability R=0.75 so.
According to one embodiment of present invention, the ultrasonic system that openly is used to increase ultrasonic transducer reliability hereinafter and therefore increases the total system reliability.Referring to Fig. 2, the part of the integrated circuit 20 on the appropriate section that is arranged in substrate 32 has been described.Although only show the part of integrated circuit, be within the scope of the present invention yet use whole " naked " integrated circuit (that is, integrated circuit is not arranged in peripheral encapsulation such as in the dual-in-line package, but is arranged on the backing material) at Fig. 2.According to the present invention, integrated circuit package 40 comprises substrate 32, integrated circuit 20, a plurality of connection lead 24,26 and coupling part 28.Integrated circuit 20 is electrically coupled to the lead district 22 of a plurality of expansions, and described lead district 22 is arranged near the neighboring that is positioned at the integrated circuit 20 on the substrate 32.A plurality of connection leads 24,26 form signal path, are used for being electrically connected on coupling part 28 each lead district 22 and corresponding weld zone 30.Connect the number of the number of lead 24,26 corresponding to lead district 22 and weld zone 30.
Advantageously, coupling part 28 will be the printed circuit board of suitable configurations, have a plurality of weld zones 30 corresponding to the lead district 22 of integrated circuit 20.Other configuration of prediction coupling part 28 comprises the weld zone of trooping (cluster) or making up that is deployed in the ultrasonic system.
Each lead 24,26 utilizes suitable conductive material such as copper, gold or aluminium to form and comprises the first end 24A, 26A and the second end 24B, 26B.Be connected to each lead district 22 by enlarging lead district 22, the first conductor wire end 24A, 26A.The size of each weld zone 30 is wherein stipulated corresponding to corresponding lead district 22 in each weld zone 30, to receive at least two second conductor wire end 24B, 26B.The second conductor wire end 24B, 26B are connected to weld zone 30 separately, thus between lead district 22 and weld zone 30 the connection signal path.Between integrated circuit 20 and coupling part 28, transmit signal data by connecting line 24,26.Utilize conventional method (for example, wire-bonded or welding) that conductor wire end 24A, 26A, 24B, 26B are connected to lead district 22 and/or weld zone 30.
Now, referring to 3, show the preferred embodiment of ultrasonic system.Ultrasonic probe shell 60 comprises cavity 50, at least one ultrasonic transducer 45 and at least one integrated circuit package 40.At least one ultrasonic transducer 45 is disposed in the remote area of ultrasonic probe shell 60.Arrange cavity 50 along the longitudinal axis of ultrasonic probe shell 60, and described cavity 50 contiguous at least one ultrasonic transducer 45 and in the location, back of this at least one ultrasonic transducer 45.At least one integrated circuit package 40 is configured and by sizing, so that be installed in the cavity 50.Prediction: ultrasonic probe shell 60 is configured and is suitable for comprising a plurality of ultrasonic transducers 45 of the integrated circuit package 40 with respective number.Can dispose a plurality of ultrasonic transducers 45 with different array structures (for example, one dimension or two-dimensional matrix array).In addition, ultrasonic probe shell 60 comprises and is used for the circuit of communicating by letter with integrated circuit package 40 and/or ultrasonic transducer 45.
Preferably, according to the present invention, the minimum detectable signal at least of ultrasonic transducer comprises that redundant wire engages.These minimum detectable signals comprise clock signal, data line, control line and power supply.
In another embodiment, disclose the ultrasonic system with increase reliability, wherein at least one integrated circuit comprises the lead district of a plurality of expansions.Each lead district is configured and is dimensioned, to receive at least two first ends that connect lead.The ultrasonic probe shell comprises the weld zone of respective number, and wherein each weld zone is configured and is dimensioned, to receive at least two second ends that connect lead.The weld zone is disposed in the ultrasonic probe shell.Connecting line is disposed in the ultrasonic probe shell, be used for to transmit signal from integrated circuit.Utilize the connection lead between lead district and the respective lands to form signal path.In addition, the number that connects lead is corresponding to being included in the lead district in the ultrasonic system and the number of weld zone.
Hereinafter openly increase the method for the reliability of ultrasound transducer assembly.According to one embodiment of present invention, provide a kind of ultrasonic probe shell, comprise at least one ultrasonic transducer.The ultrasonic probe shell is configured and is dimensioned, and has at least one integrated circuit of the lead district of expansion with reception.In addition, also comprise a plurality of connection leads, the number that wherein connects lead is corresponding to the number of the weld zone of the lead district of integrated circuit and ultrasonic assembly.Connect lead and have first and second ends.The size of each lead district of definition integrated circuit is to receive at least two first ends that connect lead.Correspondingly, the weld zone of ultrasonic assembly is configured to receive at least two second ends that connect lead.Utilize the signal path between at least two leads formation lead district and the respective lands.First end of signal path is connected to lead district.Second end of signal path is connected to the weld zone.Can utilize conventional method (for example wire-bonded or welding) to join the end of signalling channel to corresponding lead district and/or weld zone.
The above embodiment of the present invention is predefined for illustrative, rather than restrictive, and does not plan to represent each embodiment of the present invention.Not deviating from as claim hereinafter, can carry out different modifications and variations on the literal and under the situation with the marrow of the present invention that the equivalent form of value was proposed of law identification or scope.
Claims (19)
1. ultrasonic system has the transducer reliability of increase, and this ultrasonic system comprises:
Ultrasonic probe comprises ultrasonic transducer;
Article at least two, lead, every lead has first end and second end;
At least one coupling part is configured and is dimensioned, so that be installed in this ultrasonic system, this coupling part has a plurality of weld zones, and each weld zone is configured and is dimensioned, to receive corresponding first end of at least two leads; With
At least one integrated circuit is disposed in this ultrasonic system, has a plurality of lead district, and each lead district is configured and is dimensioned, to receive corresponding second end of at least two leads.
2. ultrasonic system as claimed in claim 1, wherein at least one integrated circuit is disposed in the ultrasonic probe.
3. ultrasonic system as claimed in claim 1, wherein at least one coupling part is a printed circuit board.
4. method that is used to increase ultrasonic transducer reliability may further comprise the steps:
Ultrasonic probe with ultrasonic transducer is provided;
At least two leads are provided, and every lead has first and second ends;
At least one coupling part is provided, and it is configured and is dimensioned, so that be installed in the ultrasonic probe, and has a plurality of weld zones, and each weld zone is configured and is dimensioned, to receive corresponding first end of at least two leads;
At least one integrated circuit is provided, is disposed in the ultrasonic probe, have a plurality of lead district, each lead district is configured and is dimensioned, to receive corresponding second end of at least two leads;
Second end of at least two leads is connected to a corresponding lead district of integrated circuit; With
First end of at least two leads is connected to a corresponding weld zone of coupling part.
5. method as claimed in claim 4, wherein at least one coupling part is a printed circuit board.
6. one kind has the ultrasonic system that increases reliability, comprising:
Ultrasonic probe comprises ultrasonic transducer;
At least one coupling part is configured and is dimensioned, so that be installed in the ultrasonic probe, and has a plurality of weld zones;
At least one integrated circuit is disposed in the ultrasonic probe, has a plurality of lead district; With
At least one connector is used for corresponding weld zone is connected to corresponding lead district, and this connector comprises at least two leads.
7. ultrasonic system as claimed in claim 6, wherein at least one coupling part is a printed circuit board.
8. ultrasonic system with transducer reliability of increase, this ultrasonic system comprises:
Ultrasonic probe comprises ultrasonic transducer;
Article at least two, lead, every lead has first end and second end; With
At least one integrated circuit is disposed in the ultrasonic system, has a plurality of lead district, and each lead district is configured and is dimensioned, to receive corresponding second end of at least two leads.
9. ultrasonic system as claimed in claim 8 also comprises at least one coupling part, and it is configured and is dimensioned, so that be installed in the ultrasonic system, this coupling part has a plurality of weld zones, and each weld zone is configured and is dimensioned, to receive corresponding first end of at least two leads.
10. ultrasonic system as claimed in claim 9, wherein at least one integrated circuit is disposed in the ultrasonic probe.
11. ultrasonic system as claimed in claim 8, wherein ultrasonic probe also comprises a plurality of weld zones, and each weld zone is configured and is dimensioned, to receive corresponding first end of at least two leads.
12. ultrasonic system as claimed in claim 11, wherein at least one integrated circuit is disposed in the ultrasonic probe.
13. ultrasonic system as claimed in claim 10, wherein at least one coupling part is a printed circuit board.
14. a method that increases ultrasonic transducer reliability may further comprise the steps:
Ultrasonic probe with ultrasonic transducer is provided;
At least two leads are provided, and every lead has first and second ends; With
At least one integrated circuit is provided, and it is disposed in the ultrasonic system, has a plurality of lead district, and each lead district is configured and is dimensioned, to receive corresponding second end of at least two leads.
15. method as claimed in claim 14 is further comprising the steps of:
At least one coupling part is provided, and it is configured and is dimensioned, so that be installed in the ultrasonic system, this coupling part has a plurality of weld zones, and each weld zone is configured and is dimensioned, to receive corresponding first end of at least two leads.
16. method as claimed in claim 15, wherein at least one integrated circuit is disposed in the ultrasonic probe.
17. method as claimed in claim 14, wherein ultrasonic probe also comprises a plurality of weld zones, and each weld zone is configured and is dimensioned, to receive corresponding first end of at least two leads.
18. method as claimed in claim 17, wherein at least one integrated circuit is disposed in the ultrasonic probe.
19. method as claimed in claim 16, wherein at least one coupling part is a printed circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47613903P | 2003-06-05 | 2003-06-05 | |
| US60/476,139 | 2003-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1798987A true CN1798987A (en) | 2006-07-05 |
Family
ID=33511759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004800153872A Pending CN1798987A (en) | 2003-06-05 | 2004-05-27 | Redundant wire bonds for increasing transducer reliability |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7335052B2 (en) |
| EP (1) | EP1634100A1 (en) |
| JP (1) | JP2006526930A (en) |
| CN (1) | CN1798987A (en) |
| WO (1) | WO2004109328A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010093603A1 (en) | 2009-02-11 | 2010-08-19 | Boston Scientific Scimed, Inc. | Insulated ablation catheter devices and methods of use |
| CA2766640C (en) | 2009-06-30 | 2016-01-05 | Boston Scientific Scimed, Inc. | Map and ablate open irrigated hybrid catheter |
| US9089340B2 (en) | 2010-12-30 | 2015-07-28 | Boston Scientific Scimed, Inc. | Ultrasound guided tissue ablation |
| JP2014516723A (en) | 2011-06-01 | 2014-07-17 | ボストン サイエンティフィック サイムド，インコーポレイテッド | Ablation probe with ultrasound imaging capability |
| JP6117209B2 (en) | 2011-09-14 | 2017-04-19 | ボストン サイエンティフィック サイムド，インコーポレイテッドＢｏｓｔｏｎ Ｓｃｉｅｎｔｉｆｉｃ Ｓｃｉｍｅｄ，Ｉｎｃ． | Ablation device with multiple ablation modes and system including the ablation device |
| WO2013040297A1 (en) | 2011-09-14 | 2013-03-21 | Boston Scientific Scimed, Inc. | Ablation device with ionically conductive balloon |
| EP2797536B1 (en) | 2011-12-28 | 2016-04-13 | Boston Scientific Scimed, Inc. | Ablation probe with ultrasonic imaging capability |
| EP2802282A1 (en) | 2012-01-10 | 2014-11-19 | Boston Scientific Scimed, Inc. | Electrophysiology system |
| JP5830614B2 (en) | 2012-01-31 | 2015-12-09 | ボストン サイエンティフィック サイムド，インコーポレイテッドＢｏｓｔｏｎ Ｓｃｉｅｎｔｉｆｉｃ Ｓｃｉｍｅｄ，Ｉｎｃ． | Ablation probe with fluid-based acoustic coupling for ultrasound tissue imaging and ablation and ultrasound imaging system |
| CN106793968A (en) | 2014-10-13 | 2017-05-31 | 波士顿科学医学有限公司 | Organizational diagnosis and treatment using microelectrode |
| WO2016065337A1 (en) | 2014-10-24 | 2016-04-28 | Boston Scientific Scimed Inc. | Medical devices with a flexible electrode assembly coupled to an ablation tip |
| EP3232969A1 (en) | 2014-12-18 | 2017-10-25 | Boston Scientific Scimed Inc. | Real-time morphology analysis for lesion assessment |
| CN104899423B (en) * | 2015-05-06 | 2017-12-15 | 同济大学 | A kind of EMUs subsystem critical component serviceability appraisal procedure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5030137A (en) * | 1990-01-30 | 1991-07-09 | Amphenol Interconnect Products Corporation | Flat cable jumper |
| US5857974A (en) * | 1997-01-08 | 1999-01-12 | Endosonics Corporation | High resolution intravascular ultrasound transducer assembly having a flexible substrate |
| US20030130657A1 (en) * | 1999-08-05 | 2003-07-10 | Tom Curtis P. | Devices for applying energy to tissue |
| US6881367B1 (en) * | 2000-11-06 | 2005-04-19 | Elk Composite Building Products, Inc. | Composite materials, articles of manufacture produced therefrom, and methods for their manufacture |
| US6582371B2 (en) * | 2001-07-31 | 2003-06-24 | Koninklijke Philips Electronics N.V. | Ultrasound probe wiring method and apparatus |
| US6497667B1 (en) * | 2001-07-31 | 2002-12-24 | Koninklijke Philips Electronics N.V. | Ultrasonic probe using ribbon cable attachment system |
| US20030149364A1 (en) * | 2002-02-01 | 2003-08-07 | Ajay Kapur | Methods, system and apparatus for digital imaging |
| US7022080B2 (en) * | 2002-06-27 | 2006-04-04 | Acuson Corporation | Electrical and mechanical enhancements for a modular transducer system |
-
2004
- 2004-05-27 CN CNA2004800153872A patent/CN1798987A/en active Pending
- 2004-05-27 EP EP04735070A patent/EP1634100A1/en not_active Withdrawn
- 2004-05-27 JP JP2006508471A patent/JP2006526930A/en not_active Withdrawn
- 2004-05-27 US US10/558,731 patent/US7335052B2/en not_active Expired - Fee Related
- 2004-05-27 WO PCT/IB2004/050796 patent/WO2004109328A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| US7335052B2 (en) | 2008-02-26 |
| US20060258940A1 (en) | 2006-11-16 |
| JP2006526930A (en) | 2006-11-24 |
| EP1634100A1 (en) | 2006-03-15 |
| WO2004109328A1 (en) | 2004-12-16 |
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| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |