CN1792656A - Heat-removing device and heat-removing method of vehicle interior part - Google Patents
Heat-removing device and heat-removing method of vehicle interior part Download PDFInfo
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- CN1792656A CN1792656A CN 200510137072 CN200510137072A CN1792656A CN 1792656 A CN1792656 A CN 1792656A CN 200510137072 CN200510137072 CN 200510137072 CN 200510137072 A CN200510137072 A CN 200510137072A CN 1792656 A CN1792656 A CN 1792656A
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Abstract
A heat-removing device for a vehicle includes: an interior part having a plate portion exposed to direct sunlight including a baseboard formed of a resin or a composite material containing a resin and a skin material which covers an outer surface of the baseboard; a heat conducting plate for collecting heat from the skin material, provided on an inner side of the skin material of the plate portion and inside of an inner surface of the baseboard in a direction of a thickness of the baseboard; and a heat pipe provided on an inner side of the inner surface of the baseboard and connected in heat-conductive relationship to the heat conducting plate, which transfers heat collected by the heat conducting plate to a heat releasing device.
Description
Technical field
The present invention relates to heat is dispersed into exterior heat abstractor and heat dissipating method from automobile inner part.
Background technology
When automobile parking at the position the preceding paragraph that suffers the sunlight direct projection during time, the temperature of automobile inner part will significantly raise.Under this environment, the temperature that is set directly at the instrument carrier panel upper surface of Windshield below may surpass 90 degrees centigrade (℃).Accumulate in heat on the instrument carrier panel and will be radiated in the air in the automobile visitor railway carriage or compartment, this is considered to the major cause of temperature build-up in the objective railway carriage or compartment of automobile.
Japanese Patent Application Publication communique 2004-58943 has announced that a kind of utilization and car body and chassis bonded assembly heat pipe will accumulate in the device that the heat on the instrument carrier panel distributes.Heat pipe embeds in the instrument carrier panel, and its part is contained in the groove that forms on the instrument panel.
Summary of the invention
Instrument carrier panel is formed by the synthetic resin with high heat capacity low heat conductivity usually.But in the described in front device, because heat pipe only is embedded in the inboard of instrument carrier panel, the heat of whole instrument carrier panel just can not be collected and be conducted to heat pipe effectively, therefore, has reduced the radiating efficiency of instrument carrier panel.
The present invention creates according to this problem.The objective of the invention is provides a kind of heat abstractor and heat dissipating method to the automobile inner part that is exposed under the direct sunlight, can therefore, improve the radiating efficiency of automobile inner part effectively with the heat transferred heat pipe that accumulates on the automobile inner part.
Another object of the present invention is to provide a kind of heat abstractor and heat dissipating method to the automobile inner part that is exposed under the sunlight direct projection, can improve the mouldability (moldability) of automobile inner part.
One aspect of the present invention is the automobile heat abstractor, and this device comprises: have be exposed under the direct sunlight by resin or contain the internal part of the plate portion that the skin material of substrate that the composite material of resin forms and covered substrate outside face forms; Be arranged on collecting of the inboard of skin material of plate portion and substrate thickness direction substrate inside face the inside from the heat-conducting plate of the heat of skin material; And be arranged on inside face inboard of substrate and be connected to heat-conducting plate with heat conducting relation, the heat that heat-conducting plate is collected is delivered to the heat pipe of heat abstractor.
Description of drawings
The present invention describes with reference to the accompanying drawings, wherein:
Fig. 1 is the lateral plan that the present invention is applied to automobile visitor railway carriage or compartment wherein.
Fig. 2 is the amplification backplan of being installed to the key component on the instrument carrier panel according to the automobile heat abstractor of the first embodiment of the present invention.
Fig. 3 is the section-drawing along the line III-III of Fig. 2 and Figure 10.
Fig. 4 is the section-drawing along the line IV-IV of Fig. 2 and Figure 10.
Fig. 5 is the contrast table that shows the radiating effect of the first embodiment of the present invention and comparative example.
Fig. 6 is the section-drawing that shows corresponding to of the present invention second and the 6th embodiment of Fig. 4.
Fig. 7 is the section-drawing that shows corresponding to the of the present invention the 3rd and the 7th embodiment of Fig. 4.
Fig. 8 is the amplification backplan that the automobile heat abstractor of a fourth embodiment in accordance with the invention is installed to the key component on the instrument carrier panel.
Fig. 9 is the section-drawing along the line IX-IX of Fig. 8.
Figure 10 is the amplification backplan that according to a fifth embodiment of the invention automobile heat abstractor is installed to the key component on the instrument carrier panel.
Figure 11 is the amplification backplan of being installed to the key component on the instrument carrier panel according to the automobile heat abstractor of the eighth embodiment of the present invention.
Figure 12 is the amplification backplan of being installed to the key component on the instrument carrier panel according to the automobile heat abstractor of the ninth embodiment of the present invention.
Figure 13 is the amplification backplan of being installed to the key component on the instrument carrier panel according to the automobile heat abstractor of the tenth embodiment of the present invention.
Figure 14 is the section-drawing along the line XIV-XIV of Figure 13.
Figure 15 is the contrast table that shows the radiating effect of the five, eight, nine, ten embodiment of the present invention and comparative example.
Figure 16 is the cutaway view of comparative example.
The specific embodiment
The preferred embodiments of the present invention hereinafter will be described with reference to the drawings, and member identical among the figure is denoted by like references.
First embodiment
As shown in Figure 1, instrument carrier panel 1 is just in time to be positioned at the Windshield Gf below of automobile M and to be exposed to internal part under the direct sunlight.The automobile heat abstractor 10 of root a tree name present embodiment is installed on the instrument carrier panel 1, suppresses the instrument carrier panel excessive temperature during time and rises so that automobile M is parked in the position the preceding paragraph that suffers direct sunlight.
In automobile visitor railway carriage or compartment 20, operator's seat and the front stall 21 of passenger seat and the back seat 22 of front stall 21 back that comprises instrument carrier panel 1 back arranged.In the operator's saddle side of front stall 21, bearing circle 23 is arranged at the lower part of instrument carrier panel 1.
Be set directly at the rear seat windscreen Gr below of 20 back, automobile visitor railway carriage or compartment as the back object placing platform 24 of another automobile inner part.
The direct sunlight of incident shines on top board (or shutter) 1a of instrument carrier panel 1 by Windshield Gf.The top board 1a of instrument carrier panel is a platy structure, comprises by resin material or contains substrate 2 that the composite material of resin forms and the skin material 3 that covers substrate 2 outer/upper surfaces.In the following description, the top of the top board 1a of instrument carrier panel is outside corresponding with instrument carrier panel 1, and the bottom of top board 1a is corresponding with the inside of instrument carrier panel 1.
Heat-conducting plate 11 and the heat pipe 13 of automobile heat abstractor 10 outfits shown in Fig. 2 and 3 according to present embodiment.Heat-conducting plate 11 is arranged on the inboard (downside among Fig. 3) of skin material 3, and the inside (upside among Fig. 3 at the inside face 2a of the thickness direction substrate 2 of substrate 2, after this, this direction is called " substrate thickness direction "), that is to say, in substrate 2 inside, make and collect the heat that is gathered when absorbing direct sunlight on the skin material 3 on the heat-conducting plate 11.Heat pipe 13 is arranged on inside face 2a inboard of substrate 2 and is connected with heat conducting relation with heat-conducting plate 11, so that the heat that gathers on the skin material 3 with heat-conducting plate 11 collections is delivered to radiator 12 (see figure 1)s as hot release gear.
Heat radiation according to the instrument carrier panel 1 of present embodiment is finished by following mode.The heat that accumulates in the sunlight direct projection on the skin material 3 is collected by heat-conducting plate 11, heat-conducting plate 11 is arranged on the inboard of the skin material 3 of instrument carrier panel top board 1a, and the inside at the substrate 2 inside face 2a of the thickness direction of substrate 2, that is to say, inside at substrate 2, then, the heat on the skin material 3 of heat-conducting plate 11 collections is delivered to radiator 12 by heat pipe 13.
In the present embodiment, heat pipe 13 is formed the form of linearity/directly-heated pipe, has a part that is arranged on the linear heat-conducting plate 11 that forms.
As shown in Figure 4, heat-conducting plate 11 inserted mode system when substrate 2 injection moldings of instrument carrier panel 1 arrives in the substrate 2.
Heat-conducting plate 11 inserted mode systems are embedded in the substrate 2 it in substrate 2.
When heat-conducting plate 11 inserted mode systems are in the substrate 2, heat-conducting plate 11 is equipped with a plurality of each support 14 of all giving prominence to inwards from the inside face 2a of substrate 2.Heat pipe 13 is connected with heat conducting relation with heat-conducting plate 11 by support 14.
As shown in Figure 4, support 14 usefulness and heat-conducting plate 11 identical materials or have the material of similar heat conductivity and heat-conducting plate 11 is whole forms and outstanding above it.Heat-conducting plate 11 is together with being inserted into molded from the outstanding support 14 of the forming die of substrate 2.
Being formed in its lower end at support 14 has a semi-round dimple part 14a, is used for holding columniform heat pipe 13, as shown in Figure 4.Heat pipe 13 is installed among the dimple part 14a, and its outside is held device 14b and entangles, and heat pipe 13 removably is fixed on the support 14.
Heat-conducting plate 11 can be formed by the material that shows good heat conductivity, for example, and copper, aluminium, iron, carbon fiber or their composite material.The thickness t of heat-conducting plate 11 is set at 0.1mm or bigger, thickness t with comprise substrate 2, the ratio of the whole thickness of skin material 3 and heat-conducting plate 11 is set at 70% or lower.
The heat-conducting plate 11 of automobile heat abstractor 10 is pressed into the shape of instrument carrier panel 1.Each support 14 is separately made and is fixed on the heat-conducting plate 11 to support heat pipe 13 thereon.The forming die that heat-conducting plate 11 is put into injection molding together with support 14 carries out inserted mode system.So just produce the framework of the instrument carrier panel 1 of combination with heat-conducting plate 11 and substrate 2.
The framework of instrument carrier panel 1 is put into the forming die of injection molding, forms the skin material 3 that is attached on the framework, thereby forms the instrument carrier panel 1 according to present embodiment.
In the fitting process of automobile M, after instrument carrier panel 1 was installed in automobile M and goes up, an end of heat pipe 13 connected with the support 14 of heat-conducting plate 11.Then, the other end of heat pipe 13 be arranged on automobile visitor railway carriage or compartment 20 exterior radiatores 12 and connect, thereby form needed automobile heat abstractor 10.
According to the automobile heat abstractor 10 and the heat dissipating method of the automobile inner part of present embodiment, the top board 1a of instrument carrier panel is equipped with the heat-conducting plate 11 that is used to collect the heat that gathers on the skin material 3.Heat pipe 13 is connected with heat conducting relation with heat-conducting plate 11, makes the heat that accumulates on the skin material 3 be delivered to radiator 12 via heat-conducting plate 11.In this case, heat-conducting plate 11 is arranged on the inboard of skin material 3 and in the inside of the inside face 2a of substrate thickness direction substrate 2, that is to say, in the inside of substrate 2.Therefore, this just can be delivered to heat-conducting plate 11 with the heat that accumulates on the skin material 3 effectively, and by support 14 heat is further passed to heat pipe 13.
Therefore, the automobile heat abstractor 10 of present embodiment makes the heat that accumulates on the skin material 3 be delivered to heat-conducting plate 11 effectively.Then, the heat of heat-conducting plate 11 collections is delivered to heat pipe 13 and is discharged into the outside from radiator 12.Therefore the cooling effectiveness of the instrument carrier panel 1 of high heat capacity strengthens, and inhibition is parked in the temperature build-up in the automobile visitor railway carriage or compartment 20 of the automobile M that suffers a certain period of sunlight direct projection position effectively.
In the present embodiment, when the injection molding of the substrate 2 of instrument carrier panel 1 heat-conducting plate 11 inserted mode systems in substrate 2.Can simplify the assembly manipulation of heat-conducting plate 11 like this.Because heat-conducting plate 11 is embedded in the substrate 2, that is to say, the resin that is used as the material of substrate 2 covers, and the heat that heat-conducting plate 11 is collected can be delivered to heat pipe 13 effectively and can not leak into automobile visitor railway carriage or compartment 20.
Heat-conducting plate 11 be equipped with a plurality of each all from the inwardly outstanding support 14 of the inside face 2a of substrate 2.Heat pipe 13 is connected with heat conducting relation with heat-conducting plate 11 by support 14.Therefore, can in later process, heat pipe 13 be connected with support 14.Therefore heat pipe 13 and comprise that the substrate 2 of heat-conducting plate 11 can separately make and be installed among the automobile M in the fitting process of automobile has simplified the installation of automobile heat abstractor 10.
The heat-conducting plate 11 of present embodiment is formed by the material with good heat conductivity, for example, and copper, aluminium, iron, carbon fiber or their composite material.Accumulating in skin material 3 certain a part of heat can be transmitted on the whole heat-conducting plate 11 substantially equably.This just can increase the heat that is delivered to heat pipe 13 through heat-conducting plate 11 from skin material 3.
The thickness t of heat-conducting plate 11 is set at 0.1mm or bigger, and mouldability keeps good thus, and its thickness is kept above minimum required value simultaneously, and, can effectively obtain and pass to heat pipe 13 from the heat of skin material 3.Thickness t is to comprising substrate 2, and the ratio of the whole thickness T of skin material 3 and heat-conducting plate 11 is set at 70% or lower.This just can be complex-curved to having with heat-conducting plate 11 inserted mode systems at an easy rate, in the instrument carrier panel 1 on bent face and similar surface.Therefore, carry out the technology of this mold pressing operation or the cost of equipment and can remain on reduced levels.
Fig. 5 shows that the instrument carrier panel that obtains from the automobile heat abstractor 10 of present embodiment 1 is outside and near the air themperature of instrument carrier panel 1, the surface temperature of instrument carrier panel 1, and the radiating effect of the related data of the Inside Air Temperature of the instrument carrier panel 1 the inside contrast table of comparing with Comparative Examples as shown in figure 16.
In Comparative Examples as shown in figure 16, the heat-conducting plate P that collects heat is attached on the inside face Ka of instrument carrier panel K, and heat pipe H directly is attached on the inside face of heat-conducting plate P.As present embodiment, Comparative Examples adopts linearity/directly-heated pipe.
For the condition that makes present embodiment and Comparative Examples is the same, skin material has the surface that is formed by thermoplastic resin material.In this experiment, automobile parking is under the direct sunlight in summer, and maximum solar radiation quantity is 850W/ automobile M
2And average external air temperature is 32 ℃.
The time that measurement is carried out be from the morning 9:00 to 3:00 in afternoon, the temperature of each parts of continuous record also compares in the highest time period in temperature.
With reference to the Comparative Examples shown in Fig. 5, the instrument carrier panel that measures outside and be 70 ℃ near the air themperature of instrument carrier panel, the surface temperature that measures is 75 ℃, and the Inside Air Temperature that measures is 75 ℃.In the situation 1 and 2 of present embodiment, the instrument carrier panel that measures outside or be respectively 54 ℃ and 58 ℃ near each air themperature of instrument carrier panel, the surface temperature that measures is 57 ℃ and 63 ℃, and the Inside Air Temperature that measures is 54 ℃ and 52 ℃.This explanation, the automobile heat abstractor 10 by present embodiment has obtained significant drop in temperature.
Second embodiment
Fig. 6 represents the second embodiment of the present invention, and among Fig. 6, the parts identical with first embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
Basically, automobile heat abstractor 10A has the structure roughly the same with first embodiment, and the heat-conducting plate 11 of the heat that gathers on the skin material 3 is collected in outfit, be connected with heat conducting relation with the inboard of the inside face 2a that is arranged on substrate 2 and with heat-conducting plate 11, make the heat of the skin material 3 that heat-conducting plate 11 is collected be passed to the heat pipe 13 of radiator 12 (see figure 1)s.
In a second embodiment, substrate 2 is formed by the upper and lower, that is to say, is formed by the upper and lower that is outer substrate 2b and interior substrate 2c respectively.Heat-conducting plate 11 inserted mode systems are inserted between outer substrate 2b and the interior substrate 2c it in the inside face of outer substrate 2b.
In the present embodiment, each all is attached on the heat-conducting plate 11 from the outstanding downwards a plurality of supports 14 of interior substrate 2c, and they are connected with linearity/directly-heated pipe 13.
The same with first embodiment, the thickness t of heat-conducting plate 11 in the present embodiment is equal to or greater than 0.1 automobile M, and thickness t is to comprising substrate 2, and the ratio of the whole thickness T of skin material 3 and heat-conducting plate 11 preferably is set at 70% or lower.
Therefore, second embodiment provides the effect same with first embodiment.In the present embodiment, heat-conducting plate 11 inserts between outer substrate 2b and the interior substrate 2c, and the heat that makes heat-conducting plate 11 collect is delivered to heat pipe 13 effectively and can make heat leakage in automobile visitor railway carriage or compartment 20.
The 3rd embodiment
Fig. 7 represents the third embodiment of the present invention, among Fig. 7, implements paraphase parts together with first embodiment and second and identifies with same reference number.Therefore, the explanation to these parts will be omitted.
Basically, automobile heat abstractor 10B has the structure roughly the same with first embodiment, and the heat-conducting plate 11 of the heat that gathers on the skin material 3 is collected in outfit, be connected with heat conducting relation with the inboard of the inside face 2a that is arranged on substrate 2 and with heat-conducting plate 11, make the heat of the skin material 3 that heat-conducting plate 11 is collected be delivered to the heat pipe 13 of radiator 12 (see figure 1)s.
In the present embodiment, skin material 3 is formed by the cushion 3b of epidermal surface material 3a and its inboard, and cushion 3b is by polyethylene foam material, and the open foam materials of polyurethane foamed material etc. (the open-cell foam) forms.
The thickness of substrate 2 reduces to equal substantially the quantity of the thickness of cushion 3b.In the upper surface of the substrate 2 that heat-conducting plate 11 inserted mode systems reduce to thickness, and it is directly contacted with cushion 3b is surperficial.
Heat-conducting plate 11 is equipped with each all from the outstanding a plurality of supports 14 of the inside face 2a of substrate 2 downwards, and support 14 is connected with linearity/directly-heated pipe 13.
In the present embodiment that is equipped with cushion 3b, the thickness t of heat-conducting plate 11 is equal to or greater than 0.1mm, and thickness t is to comprising substrate 2, and the ratio of the whole thickness T of skin material 3 and heat-conducting plate 11 preferably is set at 70% or lower.
Therefore, second embodiment provides the effect same with first embodiment.In the present embodiment, heat-conducting plate 11 inserts between the cushion 3b of substrate 2 and skin material 3, like this can be so that the heat that heat-conducting plate 11 is collected is delivered to heat pipe 13 effectively and can make heat leakage in automobile visitor railway carriage or compartment 20.
In the present embodiment, skin material 3 is formed by the cushion 3b between epidermal surface material 3a and insertion epidermal surface material 3a and the heat-conducting plate 11.Cushion 3b is formed by open foam materials, makes that air can be in its inside circulation.The free convection of result in the foamed materials reduces the insulation properties from epidermal surface material 3a to heat-conducting plate 11 heat conduction paths, therefore makes heat-conducting plate 11 heat of balling-up on skin material 3 effectively.
The 4th embodiment
The Fig. 8 and the 9 expression fourth embodiment of the present invention, in the drawings, the parts identical with first embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
With reference to Fig. 8 and 9, basically, automobile heat abstractor 10C has the structure roughly the same with first embodiment, and the heat of outfit balling-up on skin material 3, be arranged on the inboard (downside among the figure) of skin material 3 and at the heat-conducting plate 11 of the inside of substrate thickness direction upper substrate 2 inside face 2a (upside among the figure), and be arranged on inside face 2a inboard of substrate 2 and be connected with heat conducting relation with heat-conducting plate 11, make the heat of skin material 3 of heat-conducting plate 11 collections be delivered to the heat pipe 13 of radiator.
The automobile heat abstractor 10C of present embodiment has two heat pipe Unit 13, and respectively along the marginal portion 11a of heat-conducting plate 11,11b extends by the heat pipe 13 of solid line.
Each heat pipe 13 in the present embodiment all is connected from a plurality of supports 14 that substrate 2 is given prominence to each.Be connected to two the marginal portion 11as of each support 14 of linearity/directly-heated pipe 13 along heat-conducting plate 11,11b arranges.
In the present embodiment, as shown in Figure 9, heat-conducting plate 11 inserted mode system when the substrate 2 of injection molding instrument carrier panel 1 arrives in the substrate 2.The process that heat-conducting plate 11 forms is not limited to above-mentioned a kind of.Second embodiment as shown in Figure 6, substrate 2 can be formed by outer substrate 2b and interior substrate 2c, and heat-conducting plate 11 is inserted between the two.The 3rd embodiment as shown in Figure 7, skin material 3 can be formed by the cushion 3b of epidermal surface material 3a and open foam materials, makes heat-conducting plate 11 insert between substrate 2 and the cushion 3b.
Therefore, the automobile heat abstractor 10C of present embodiment provides the effect identical with first embodiment.In the present embodiment, two heat pipes 13,13 are along two marginal portion 11a of heat-conducting plate 11, and 11b extends.Since each marginal portion 11a of heat-conducting plate 11, the drop in temperature of 11b, and marginal portion 11a, the thermal drop that produces between the centre portion 11C of 11b and heat-conducting plate 11 become big, promote thus heat is delivered to heat pipe 13 from heat-conducting plate 11.In this case, even only some exposes in the sun the top board 1a of instrument carrier panel 1, also make heat flow to the end with sufficient heat transfer capability.The whole lip-deep temperature of top board 1a of instrument carrier panel 1 is evenly reduced.
In the present embodiment, automobile heat abstractor 10C is equipped with two parallel heat pipes 13, and heat pipe 13 is used solid line in Fig. 8.Such structure can link together and UNICOM each end 13e of heat pipe 13,13, forms a cycling hot pipeloop.
The 5th embodiment
The Fig. 3 and the 10 expression fifth embodiment of the present invention.
With reference to Fig. 3 and 10, automobile heat abstractor 10 is equipped with the heat-conducting plate 11 and the heat pipe 13 of the heat of a plurality of balling-ups on the skin material 3 that receives the sunlight direct projection.Heat-conducting plate 11 is arranged on the inside (upside among Fig. 3) of the inside face 2a of the inboard (downside among Fig. 3) of skin material 3 and substrate thickness direction substrate 2 at vertical (Width of automobile) of instrument carrier panel 1 with predetermined interval L, just in the inside of substrate 2.Heat pipe 13 is arranged on the inboard of the inside face 2a of substrate 2, and the heat that makes it and a plurality of heat-conducting plates 11 be connected the skin material 3 that will be collected by each heat-conducting plate 11 with heat conducting relation is delivered to radiator 12 (see figure 1)s as hot release gear.
In the present embodiment, heat-conducting plate 11 is in the inside that vertically is arranged on the inside face 2a of the inboard of skin material 3 and substrate thickness direction substrate 2 with predetermined interval L of instrument carrier panel 1, make heat-conducting plate 11 be collected at the heat of the direct sunlight on the skin material 3, and the heat of the skin material 3 of heat-conducting plate 11 collections is delivered to the heat that radiator 12 comes DISSOLUTION APPARATUS dash board 1 by heat pipe 13.
In the present embodiment, heat pipe 13 is formed the form of linearity/directly-heated pipe, has the part on its heat-conducting plate 11 that is arranged on linear formation.
A plurality of heat-conducting plates 11 have the interconnected marginal portion 11a by connecting bridge 11b, the feasible pectination that forms on the whole as shown in figure 10.As shown in Figure 4, heat-conducting plate 11 inserted mode system when substrate 2 injection moldings of instrument carrier panel 1 arrives in the substrate 2.
Heat-conducting plate 11 inserted mode systems are embedded in the substrate 2 it in substrate 2.
When a plurality of heat-conducting plate 11 inserted mode systems are in substrate 2, be provided with a plurality of each all from the outstanding inwards support 14 of the inside face 2a of substrate 2, heat pipe 13 is connected with heat conducting relation with heat-conducting plate 11 by support 14.
As shown in Figure 4, support 14 use with heat-conducting plate 11 identical materials or material with similar heat conductivity with heat-conducting plate 11 whole formation and above it, give prominence to.Heat-conducting plate 11 is together with being inserted into molded from the outstanding support 14 of the forming die of substrate 2.
Heat-conducting plate 11 can be formed by the material that shows good heat conductivity, for example, and copper, aluminium, iron, carbon fiber or their composite material.The thickness t of heat-conducting plate 11 is set at 0.1mm or bigger, and thickness t is to comprising substrate 2, and the whole thickness T ratio of skin material 3 and heat-conducting plate 11 is set at 70% or lower.
The whole area of a plurality of heat-conducting plates 11 be set at the top board 1a that is in the instrument carrier panel 1 that is exposed under the direct sunlight area 20% to 80% between scope.
In the automobile heat abstractor 10 of present embodiment, each heat-conducting plate 11 is become the shape of instrument carrier panel 1 by compression molded.Each heat pipe 13 supported support 14 thereon is manufactured separately and is fixed on the heat-conducting plate 11.Result's heat-conducting plate 11 is put into inserted mode system in the forming die of injection molding of substrate 2 with support 14.Therefore make the framework of instrument carrier panel 1 with the substrate 2 that combines with heat-conducting plate 11.
The framework of instrument carrier panel 1 is put in the forming die of formation attached to the injection molding of the skin material on the framework 3, thereby forms the instrument carrier panel 1 according to present embodiment.
After being installed in instrument carrier panel 1 on the automobile M in the fitting process of automobile M, an end of heat pipe 13 connects with the support 14 of heat-conducting plate 11.Then, the other end of heat pipe 13 be arranged on automobile visitor railway carriage or compartment 20 exterior radiatores 12 and connect, thereby form the automobile heat abstractor 10 of needs.
According to the automobile heat abstractor 10 of present embodiment and the heat dissipating method of automobile inner part, the top board 1a of instrument carrier panel is equipped with the heat-conducting plate 11 that is used to collect the heat that gathers on the skin material 3.Heat pipe 13 is connected with heat conducting relation with heat-conducting plate 11, makes the heat that accumulates on the skin material 3 be delivered to radiator 12 via heat-conducting plate 11.In this case, heat-conducting plate 11 is arranged on the inboard of skin material 3 and in the inside of the inside face 2a of substrate thickness direction substrate 2, that is to say, in the inside of substrate 2.Therefore, just can effectively the heat that accumulates on the skin material 3 be delivered to heat-conducting plate 11, and heat further be passed to heat pipe 13 by support 14.
Therefore, the automobile heat abstractor 10 of present embodiment makes the heat that accumulates on the skin material 3 be delivered to heat-conducting plate 11 effectively.Then, the heat of heat-conducting plate 11 collections is delivered to heat pipe 13 and is discharged into the outside from radiator 12.Therefore the cooling effectiveness of the instrument carrier panel 1 of high heat capacity strengthens, and suppresses to be parked in the temperature build-up in objective railway carriage or compartment 20 of the automobile M of the position a period of time that suffers the sunlight direct projection effectively.
A plurality of heat-conducting plates 11 vertically are provided with the interval of stipulating instrument carrier panel 1.Even heat-conducting plate 11 has the curvature portion of comprising, bent face part and similar labyrinth, heat-conducting plate 11 still can be formed in the instrument carrier panel 1.Therefore, instrument carrier panel 1 can form the shape that needs and can be not cost with the mouldability that reduces substrate 2.
In the present embodiment, when substrate 2 injection moldings of instrument carrier panel 1 heat-conducting plate 11 inserted mode systems in substrate 2.Can simplify the assembly manipulation of heat-conducting plate 11 like this.Because heat-conducting plate 11 is embedded in the substrate 2, that is to say, the resin that is used as the material of substrate 2 covers, and the heat that heat-conducting plate 11 is collected can be delivered to heat pipe 13 effectively and can not leak into automobile visitor railway carriage or compartment 20.
Heat-conducting plate 11 be equipped with a plurality of each all from the inwardly outstanding support 14 of the inside face 2a of substrate 2.Heat pipe 13 is connected with heat conducting relation with heat-conducting plate 11 by these supports 14.Therefore, can in later process, heat pipe 13 be connected with support 14.Heat pipe 13 and comprise that the substrate 2 of heat-conducting plate 11 can separately make, and in the fitting process of automobile, be installed among the automobile M, the installation of automobile heat abstractor 10 therefore simplified.
The heat-conducting plate 11 of present embodiment is formed by the material with good heat conductivity, for example, and copper, aluminium, iron, carbon fiber or their composite material.Accumulating in skin material 3 certain a part of heat can be transmitted on the whole heat-conducting plate 11 substantially equably.This just can increase the heat that is delivered to heat pipe 13 through heat-conducting plate 11 from skin material 3.
The thickness t of heat-conducting plate 11 is set at 0.1mm or bigger, keeps good mouldability thus, simultaneously its thickness is remained on more than the minimum required value, and, can effectively obtain and pass to heat pipe 13 from the heat of skin material 3.Thickness t is to comprising substrate 2, and the ratio of the whole thickness T of skin material 3 and heat-conducting plate 11 is set at 70% or lower.So just can be easy to carry out with heat-conducting plate 11 inserted mode systems complex-curved to having, in the instrument carrier panel 1 on bent face and similar surface.Therefore, carry out the technology of this mold pressing operation or the cost of equipment and can remain on reduced levels.
As long as the area of heat-conducting plate 11 satisfies desired level with the ratio of the area of the top board 1a that is exposed to the instrument carrier panel 1 under the direct sunlight, heat-conducting plate 11 needn't be arranged to cover the part that all need transfer of heat.In the present embodiment, provide the top board 1a that the whole area of a plurality of heat-conducting plates 11 of desired heat sinking function is set at the instrument carrier panel 1 that is exposed under the direct sunlight area 20% to 80% between scope.
The 6th embodiment
Fig. 6 represents the sixth embodiment of the present invention, and among the figure, the parts identical with the 5th embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
Basically, automobile heat abstractor 10A has the structure roughly the same with the 5th embodiment, and the heat-conducting plate 11 of the heat of outfit balling-up on skin material 3, be connected with heat conducting relation with the inboard of the inside face 2a that is arranged on substrate 2 and with heat-conducting plate 11, make the heat of the skin material 3 that heat-conducting plate 11 is collected be delivered to the heat pipe 13 of radiator 12 (see figure 1)s.
In the 6th embodiment, substrate 2 is formed by the upper and lower, that is to say, is formed by the upper and lower that is outer substrate 2b and interior substrate 2c respectively.Heat-conducting plate 11 inserted mode systems are inserted between outer substrate 2b and the interior substrate 2c it in the inside face of outer substrate 2b.
In the present embodiment, each all is attached on the heat-conducting plate 11 from the outstanding downwards a plurality of supports 14 of interior substrate 2c, and they are connected with linearity/directly-heated pipe 13.
The same with the 5th embodiment, the thickness t of each heat-conducting plate 11 in the present embodiment all is equal to or greater than 0.1mm, and preferably thickness t is to comprising substrate 2, and the ratio of the whole thickness T of skin material 3 and heat-conducting plate 11 is set at 70% or lower.
Therefore, the 6th embodiment provides the effect same with the 5th embodiment.In the present embodiment, heat-conducting plate 11 inserts between outer substrate 2b and the interior substrate 2c, and the heat that makes heat-conducting plate 11 collect is delivered to heat pipe 13 effectively and can leak in the objective railway carriage or compartment 20 of automobile and go.
The 7th embodiment
Fig. 7 represents the seventh embodiment of the present invention, and among the figure, the parts identical with the 6th embodiment with the 5th embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
Basically, automobile heat abstractor 10B has the structure roughly the same with the 5th embodiment, and be equipped with the heat-conducting plate 11 of the heat of balling-up on skin material 3 as shown in Figure 7, be connected with heat conducting relation with the inboard of the inside face 2a that is arranged on substrate 2 and with heat-conducting plate 11, make the heat of the skin material 3 that heat-conducting plate 11 is collected be delivered to the heat pipe 13 of radiator 12 (see figure 1)s.
In the present embodiment, skin material 3 is formed by the cushion 3b of epidermal surface material 3a and its inboard, and cushion 3b is by polyethylene foam material, and the open foam materials of polyurethane foamed material etc. forms.
The thickness of substrate 2 reduces to equal substantially the quantity of the thickness of cushion 3b.In the upper surface of the substrate 2 that heat-conducting plate 11 inserted mode systems reduce to thickness, and it is directly contacted with cushion 3b is surperficial.
Heat-conducting plate 11 is equipped with each all from the outstanding a plurality of supports 14 of the inside face 2a of substrate 2 downwards, and support 14 is connected with linearity/directly-heated pipe 13.
In the present embodiment that has been equipped with cushion 3b, the thickness t of each heat-conducting plate 11 is equal to or greater than 0.1mm, and preferably thickness t is to comprising substrate 2, and the ratio of the whole thickness T of skin material 3 and heat-conducting plate 11 is set at 70% or lower.
Therefore, the 7th embodiment provides the effect same with the 5th embodiment.In the present embodiment, heat-conducting plate 11 inserts between the cushion 3b of substrate 2 and skin material 3.Can not leak in the automobile visitor railway carriage or compartment 20 so that the heat that heat-conducting plate 11 is collected is delivered to heat pipe 13 effectively like this and go.
In the present embodiment, skin material 3 is formed by the cushion 3b between epidermal surface material 3a and insertion epidermal surface material 3a and the heat-conducting plate 11.Cushion 3b is formed by open foam materials, makes that air can be in its inside circulation.The free convection of result in the foamed materials can make the insulation properties from epidermal surface material 3a to heat-conducting plate 11 heat conduction paths reduce, and therefore makes heat-conducting plate 11 heat of balling-up on skin material 3 effectively.
The 8th embodiment
Figure 11 represents the eighth embodiment of the present invention, and among the figure, the parts identical with the 5th embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
As shown in figure 11, basically, automobile heat abstractor 10C has the structure roughly the same with the 5th embodiment, and at the inboard of skin material 3 be equipped with the heat-conducting plate 11 of the heat of balling-up on skin material 3 in the inside of the inside face 2a of the thickness direction upper substrate 2 of substrate 2.
With reference to Figure 11, the difference of the automobile heat abstractor 10 among automobile heat abstractor 10C and the 5th embodiment is, each of a plurality of sheet heat-conducting plates 11 is all divided and is arranged and do not connect at their marginal portion 11a.
Under the situation that heat-conducting plate was arranged in 11 minutes, support 14 is provided with along the marginal portion 11a of heat-conducting plate 11, makes heat pipe 13 be connected to heat-conducting plate 11 with heat conducting relation by support 14.
In the present embodiment, the same (see figure 4) with the 5th embodiment, heat-conducting plate 11 can inserted mode system arrive in the substrate 2 when substrate 2 injection moldings of instrument carrier panel 1.Also can the same (see figure 6) with the 6th embodiment, substrate 2 can be formed by outer substrate 2b and interior substrate 2c, and heat-conducting plate 11 inserts between them.(see figure 7) described in the 3rd embodiment, skin material 3 can be formed by the cushion 3b of epidermal surface material 3a and open foam materials, makes heat-conducting plate 11 be inserted between substrate 2 and the cushion 3b.
In the present embodiment, the whole area of best a plurality of heat-conducting plate 11 be set at the top board 1a that is in the instrument carrier panel 1 of accepting direct sunlight area 20% to 80% between scope in.
Therefore, can provide the effect same at present embodiment with the 5th embodiment.Heat-conducting plate 11 is collected the heat that gathers on the skin material 3 increasingly, then with the heat transferred heat pipe of collecting 13, makes heat be discharged into the outside from radiator 12.Heat-conducting plate was arranged in 11 minutes, had so just prevented the decline of the mouldability of instrument carrier panel 1.
The 9th embodiment
Figure 11 represents the ninth embodiment of the present invention, and among the figure, the parts identical with the 5th embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
With reference to Figure 12, basically, automobile heat abstractor 10D has the structure roughly the same with the 5th embodiment, and wherein a plurality of heat-conducting plates 11 are provided with predetermined interval L at vertical (Width of automobile) of instrument carrier panel 1.
Difference at the automobile heat abstractor 10 of the automobile heat abstractor 10D of present embodiment and the 5th embodiment is, as the solid line of Figure 12 two parallel heat pipes 13 is set, and along two marginal portion 11a of heat-conducting plate 11,11c is provided with each heat pipe respectively.
A plurality of in the present embodiment heat-conducting plates 11 pass through connecting bridge 11b and connect at each marginal portion 11a, and connect by connecting bridge 11d at another marginal portion 11c, make that heat-conducting plate 11 is overall as scalariforms.
In the present embodiment, the same (see figure 4) with the 5th embodiment, heat-conducting plate 11 can inserted mode system arrive in the substrate 2 when substrate 2 injection moldings of instrument carrier panel 1.The same (see figure 6) with the 6th embodiment, substrate 2 can be formed by outer substrate 2b and interior substrate 2c, and heat-conducting plate inserts between them.The same (see figure 7) with the 7th embodiment, skin material 3 can be formed by the cushion 3b of epidermal surface material 3a and open foam materials, makes heat-conducting plate 11 insert between substrate 2 and the cushion 3b.
In the present embodiment, the whole area of best a plurality of heat-conducting plate 11 be set at the top board 1a that is in the instrument carrier panel 1 of accepting direct sunlight area 20% to 80% between scope in.
Therefore, the automobile heat abstractor 10D at present embodiment provides the effect similar to the 5th embodiment.The same with the 5th embodiment, two heat pipes 13,13 are arranged on two marginal portion 11a of heat-conducting plate 11,11c, and their core is spaced from each other.Thermal drop is towards each marginal portion 11a, and 11c produces, and promotes thus from the heat transmission of heat-conducting plate 11 to heat pipe 13.Even only some exposes in the sun the situation at the top board 1a of instrument carrier panel 1, utilize sufficient heat transfer capability also to produce heat flow towards the end.The whole lip-deep temperature of the top board 1a of instrument carrier panel 1 just can evenly reduce.
Because each heat-conducting plate was arranged in 11 minutes, just can prevent that the mouldability of instrument carrier panel 1 from descending.
At two heat pipes 13,13 of the automobile heat abstractor 10D of present embodiment outfit as the solid line of Figure 13.And each end 13e of two heat pipes 13,13 can link together and UNICOM, forms the cycling hot pipeloop shown in the long and two-short dash line among Figure 13.
The tenth embodiment
Figure 13, the 14 expression tenth embodiment of the present invention, among the figure, the parts identical with the 9th embodiment with the 5th embodiment identify with same reference number.Therefore, the explanation to these parts will be omitted.
With reference to Figure 13, basically, automobile heat abstractor 10E has the structure roughly the same with the 5th embodiment.A plurality of heat-conducting plates 11 vertically are provided with predetermined interval L instrument carrier panel 1.The same with the 9th embodiment, in the present embodiment, two heat pipes 13,13 are arranged on two marginal portion 11a of heat-conducting plate 11, on the 11c.
With reference to Figure 13,14, difference at the automobile heat abstractor 10D of the automobile heat abstractor 10E of present embodiment and the 5th embodiment is, heat-conducting plate 11 is arranged with the mode branch identical with the 8th embodiment (seeing Figure 11), at the marginal portion of each heat-conducting plate 11 11a, the core 11f between the 11c leaves each δ at interval.Therefore, heat-conducting plate 11 forms reticulation on the whole.
In the present embodiment, the same (see figure 4) with the 5th embodiment, heat-conducting plate 11 can inserted mode system arrive in the substrate 2 when substrate 2 injection moldings of instrument carrier panel 1.As (see figure 6) as described in the 6th embodiment, substrate 2 can be formed by outer substrate 2b and interior substrate 2c, and heat-conducting plate 11 inserts between them.In addition, as (see figure 7) as described in the 7th embodiment, skin material 3 can be formed by the cushion 3b of epidermal surface material 3a and open foam materials, makes heat-conducting plate 11 insert between substrates 2 and the cushion 3b.
Therefore, the automobile heat abstractor 10E at present embodiment provides the effect similar to the 5th embodiment.In the present embodiment, two heat pipes 13,13 are arranged on two marginal portion 11a of heat-conducting plate 11,11c.Since each marginal portion 11a of heat-conducting plate 11, the drop in temperature of 11c, marginal portion 11a, the thermal drop between 11c and the core 11f increases.This can promote from the heat transmission of heat-conducting plate 11 to heat pipe 13.In the part of the top board 1a of instrument carrier panel 1 is exposed to situation under the direct sunlight, utilize sufficient heat transfer capability to make heat flow to the end, the whole lip-deep temperature of the top board 1a of instrument carrier panel 1 just can evenly reduce thus.
In the present embodiment, heat-conducting plate was arranged in 11 minutes, prevented that the mouldability of instrument carrier panel 1 from descending.
In the automobile heat abstractor 10E of present embodiment, connect together and UNICOM as each end of the heat pipe that long and two-short dash line identified 13,13 of Figure 13, form the cycling hot pipeloop.
Hereinafter with reference to the contrast table among Figure 15, by narrate the heat abstractor 10 among first to the 6th embodiment with reference to Comparative Examples shown in Figure 16,10A is to the radiating effect and the mouldability of the representative automobile heat abstractor of 10E.
" internal part " in the contrast table of Figure 15 represented the described instrument carrier panel 1 of each embodiment.The situation of embodiment situation 1 expression pectination (the 5th embodiment) heat-conducting plate 11, the situation of situation 2 expression scalariform (the 9th embodiment) heat-conducting plates 11, the situation of situation 3 expression sheet (the 8th embodiment) heat-conducting plates 11, and the situation of situation 4 expression reticulation (the tenth embodiment) heat-conducting plates 11.
Comparative Examples as shown in figure 16 has such structure, and wherein heat-conducting plate P is attached on the inside face Ka of instrument carrier panel K and is used to collect heat, and heat pipe H directly is attached on the inside face of heat-conducting plate P.The situation of the banded heat-conducting plate P of Comparative Examples situation 1 expression, and the situation of the heat-conducting plate P that forms by veneer of situation 2 expressions.As the mode of present embodiment, each Comparative Examples all adopts linearity/directly-heated pipe.
For the condition that makes present embodiment and Comparative Examples is the same, skin material has the surface that is formed by thermoplastic resin material.In this experiment, automobile parking is under the direct sunlight in summer, and maximum solar radiation quantity is 850W/m
2And average external air temperature is 32 ℃.
The time that measurement is carried out be from the morning 9:00 to 3:00 in afternoon, the temperature of each parts of continuous record also compares in the highest time period in temperature.
Thereby as shown in figure 15, under the situation of Comparative Examples situation 1 and situation 2, the instrument carrier panel that measures outside or be respectively 68 ℃ near the air themperature of instrument carrier panel, 70 ℃, the surface temperature that measures is respectively 72 ℃, 75 ℃, and the Inside Air Temperature in the instrument carrier panel that measures is respectively 72 ℃, 75 ℃.Simultaneously, in the situation 1 of present embodiment, situation 2, in situation 3 and the situation 4, the instrument carrier panel that measures outside or be respectively 55 ℃, 54 ℃ near the air themperature of instrument carrier panel, 55 ℃, 54 ℃, the surface temperature that measures is respectively 58 ℃, 57 ℃, 59 ℃, 57 ℃, and the Inside Air Temperature that measures is respectively 56 ℃, 55 ℃, 56 ℃, 56 ℃.This explanation all has very big contribution according to the automobile heat abstractor of arbitrary routine embodiment to drop in temperature.
For mouldability, the result of Comparative Examples situation 1 is good (zero), and the result of situation 2 is bad (*), and the result of embodiment situation 1,3 and 4 is good (zero) and the result of situation 2 can accept (△).
Preferred embodiment described herein is illustrative and not restrictive, and the present invention can not deviate from realization or enforcement under other modes of its spirit or inner characteristic.For example, in these embodiments, automobile heat abstractor 10 and 10A are applied to instrument carrier panel 1 to 10E.But be appreciated that the present invention can be applied to for example be applied to back object placing platform 24 on other internal part in the automobile visitor railway carriage or compartment.By claim scope of the present invention will be described, and all variations that come from the claim meaning will be included in wherein.
The present invention relates to be included in and submitted on December 24th, 2004, Japanese patent application No. 2004-374900 and on December 24th, 2004 submit to, theme among the Japanese patent application No. 2004-374906, the content that these patent applications disclose is combined in herein by quoting in full definitely.
Claims (10)
1, a kind of automobile heat abstractor is characterized in that, comprising:
Have the internal part that is exposed to the plate portion under the direct sunlight, plate portion comprises by resin or comprises substrate that the composite material of resin forms and the skin material of covered substrate outside face;
Be arranged on the heat-conducting plate of the inside of the inboard of skin material of plate portion and substrate thickness direction substrate inside face; And
Be arranged on substrate inside face inboard and with heat-conducting plate with the heat conducting bonded assembly heat pipe that concerns, the heat that heat pipe is collected heat-conducting plate is delivered to hot release gear.
2, heat abstractor as claimed in claim 1 is characterized in that, wherein the heat-conducting plate inserted mode system is in the substrate of internal part.
3, heat abstractor as claimed in claim 1 is characterized in that, wherein heat-conducting plate has each all from the outstanding a plurality of supports of substrate inside face, and heat pipe is connected with heat conducting relation with heat-conducting plate by support.
4, heat abstractor as claimed in claim 1 is characterized in that, wherein heat pipe is connected at a plurality of point of connection of arranging along the marginal portion of heat-conducting plate with heat-conducting plate.
5, heat abstractor as claimed in claim 1 is characterized in that, wherein heat-conducting plate is by comprising copper, aluminium, iron, the heat conducting material formation of any material in carbon fiber and their composite material.
6, heat abstractor as claimed in claim 1 is characterized in that, wherein the thickness of heat-conducting plate is equal to or greater than 0.1mm, and the thickness setting of heat-conducting plate be substrate, skin material and heat-conducting plate gross thickness 70% or below.
7, heat abstractor as claimed in claim 1 is characterized in that, wherein the skin material cushion that has the epidermal surface material and formed by open foam materials in its inboard.
8, heat abstractor as claimed in claim 1 is characterized in that, wherein a plurality of heat-conducting plates vertically are provided with predetermined interval internal part, and heat pipe is connected with heat conducting relation with each heat-conducting plate.
9, heat abstractor as claimed in claim 8 is characterized in that, wherein the gross area of a plurality of heat-conducting plates be set at the area that is in the plate portion that absorbs direct sunlight 20% and 80% between scope.
10, a kind of heat dissipating method of automobile inner part, this internal part has the plate portion that is exposed under the direct sunlight, plate portion comprises by resin or comprises substrate that the composite material of resin forms and the skin material of covered substrate outside face that this heat dissipating method comprises:
Heat-conducting plate with the inside of inboard that is arranged on skin material and substrate thickness direction substrate inside face is collected from the heat of skin material; And
The heat of heat-conducting plate being collected via heat pipe is delivered to the heat release gear.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004374900A JP2006182066A (en) | 2004-12-24 | 2004-12-24 | Heat radiator for vehicle and heat radiating method for interior component of vehicle |
| JP2004374900 | 2004-12-24 | ||
| JP2004374906 | 2004-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1792656A true CN1792656A (en) | 2006-06-28 |
Family
ID=36735502
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510137072 Pending CN1792656A (en) | 2004-12-24 | 2005-12-20 | Heat-removing device and heat-removing method of vehicle interior part |
| CN 200520132186 Expired - Fee Related CN2933934Y (en) | 2004-12-24 | 2005-12-20 | Heat sink for automobile inner decoration parts |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520132186 Expired - Fee Related CN2933934Y (en) | 2004-12-24 | 2005-12-20 | Heat sink for automobile inner decoration parts |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006182066A (en) |
| CN (2) | CN1792656A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896998A (en) * | 2012-10-26 | 2013-01-30 | 张八宝 | Automatic cooling system in car |
| CN105599612A (en) * | 2015-12-25 | 2016-05-25 | 重庆德科电子仪表有限公司 | Assembly of instrument rear cover and liquid crystal support |
-
2004
- 2004-12-24 JP JP2004374900A patent/JP2006182066A/en active Pending
-
2005
- 2005-12-20 CN CN 200510137072 patent/CN1792656A/en active Pending
- 2005-12-20 CN CN 200520132186 patent/CN2933934Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896998A (en) * | 2012-10-26 | 2013-01-30 | 张八宝 | Automatic cooling system in car |
| CN105599612A (en) * | 2015-12-25 | 2016-05-25 | 重庆德科电子仪表有限公司 | Assembly of instrument rear cover and liquid crystal support |
Also Published As
| Publication number | Publication date |
|---|---|
| CN2933934Y (en) | 2007-08-15 |
| JP2006182066A (en) | 2006-07-13 |
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