CN1788931A - Highly effective deep-grinding process for engineering ceramic material - Google Patents
Highly effective deep-grinding process for engineering ceramic material Download PDFInfo
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Abstract
The technological process of deeply grinding engineering ceramic material in high efficiency includes: 1. trimming with resin combined super high speed diamond grinding wheel to outer circle jitter not greater than 5 microns and dressing with a dynamic balance system to make the grinding wheel possess dynamic unbalance amount less than 0.1 micron; 2. adopting water base cooling liquid with liquid pressure of 6-10 MPa; 3. grinding in the technological conditions of grinding off rate per unit grinding wheel width 20-120 cu mm/mm.s, grinding wheel linear speed 40-160 m/s, grinding depth 1-6 mm and workpiece feeding speed 0.5-6 mmin. The present invention has high structure ceramic machining efficiency, low ceramic part cost, improved ceramic part surface quality and greatly raised part reliability.
Description
Technical field
The present invention relates to the grinding process of engineering ceramic material high efficiency deep grinding.
Background technology
Engineering ceramics is widely used in the engineering fields such as machinery, metallurgy, chemical industry with its high strength, low thermal expansion, the wear-resisting superior functions such as high chemical stability that undermine.Because the inevitably requirement of blank sintering amount of contraction and special shape, the structural ceramics part is revolving part, sliding part and counterpart especially, all needs could satisfy through machining the required precision and the surface roughness requirement of size shape.Present ceramic processing method is to adopt the plain grinding of skive mostly, and efficient is low, and the cost height tends to cause workpiece to produce surface damage and increase grinding dosage, and crudy is difficult to reach requirement.Engineering ceramics has following main feature in the grinding process of existing method:
1. grinding ratio is little, and the emery wheel abrasion loss is big, processing cost is high.The grinding ratio of grinding simple glass is more than 30 times of grinding engineering ceramics under the same conditions.Grinding ratio is little, must cause the abrasion of superhard abrasive material grinding tool serious, and the price of superhard abrasive material grinding tool is generally expensive at present, and this makes the processing charges of structural ceramics part all very high, generally accounts for the 65%-90% of ceramic part totle drilling cost.Therefore, reducing the emery wheel abrasion, reduce the processing cost of pottery, is the basic premise of implementation structure pottery extensive use.
2. the grinding surface quality of structural ceramics is wayward.The poor toughness of structural ceramics, the same with other hard brittle material, very responsive to surface state, therefore, the mechanical property of ceramic part depends on the finished surface state.In grinding process, between abrasive particle and workpiece by extremely complicated friction, distortion even fracture and follow the power heat effect to remove the machined layer material.The grinding process of structural ceramics and grinding surface quality both be different from plastic metal material, also were different from common fragile material, had special regularity.Because it is limited that people understand the grinding rule of structural ceramics, the grinding surface quality of structural ceramics is difficult to accurate control, thereby has had a strong impact on the practical application of ceramic part.
3. the productivity ratio of high-temperature structural ceramics is low.Because the toughness deficiency of structural ceramics, and the drag during ceramic grinding is very big, make the thickness of grinding layer of structural ceramics be subjected to the constraint of specified conditions, the good wearability of structural ceramics in addition, thereby cause the machinability of structural ceramic material very poor, production efficiency is low, and present processing method is about 2-3mm than material removal rate
3/ mms.
At present, manage to improve the structural ceramics working (machining) efficiency, reduce the ceramic part cost, improve the surface quality of ceramic part, increase substantially the reliability of part, become the primary study content in the structural ceramics processing.
High efficiency deep grinding is with big cutting-in (0.1-30mm), and high grinding speed (80-200m/s) does not reduce the condition of workpiece feed speed (0.5-10m/min) and carries out grinding, can realize high resection rate, can reach high machined surface quality again.Research to high efficiency deep grinding was at plastic material mostly in the past, and still nobody studies the engineering ceramics high efficiency deep grinding at home, therefore going deep into systematically research and how to adopt the high efficiency deep grinding technology to realize the low-cost and high-quality processing of engineering ceramics, is an important technological problems that is worth discussion in the ceramic grinding working research.
Summary of the invention
The technical problem to be solved in the present invention is, deficiency at the prior art existence, a kind of highly effective deep-grinding process for engineering ceramic material is proposed, use this technology and can improve the structural ceramics working (machining) efficiency, reduce the ceramic part cost, improve the surface quality of ceramic part, increase substantially the reliability of part.
Technical solution of the present invention is that described highly effective deep-grinding process for engineering ceramic material comprises:
(1) adopt ultrahigh speed resinoid bond skive, be trimmed to cylindrical and beat and be not more than 5 μ m, and to its dressing;
(2) adopt the grinding wheel dynamic balance system emery wheel to be carried out real-time dynamic balancing, grinding wheel dynamic balance amount of unbalance＜0.1 μ m;
(3) adopt water base cooling fluid, liquid supply pressure is 6-10MPa;
(4) grinding process condition:
A. unit grinding wheel width material removal rate: 20mm
3/ mms-120mm
3/ mms;
B. grinding speed: 40m/s-160m/s;
C. grinding depth: 1mm-6mm;
D. workpiece feed speed: 0.5m/min-6m/min.
Below the present invention made further specify.
Because ceramic material property has bigger influence to grinding principle, the present invention selected for use be widely used and these three kinds of materials of 99.5% aluminium oxide, silicon nitride and yittrium oxide PSZ that mechanical property and chemical property differ greatly as test material.
Aluminium oxide ceramics is a kind of that chemical property is the most stable in the refractory oxide, mechanical strength is the highest, has excellent chemical stability.The aluminium oxide ceramics that alumina content is higher than more than 95% has excellent electrical insulation capability and lower dielectric loss characteristics.
The thermal coefficient of expansion of silicon nitride ceramic material is little, therefore has thermal shock resistance preferably.In ceramic material, its bending strength ratio is higher, and hardness is also very high, has self lubricity simultaneously, and coefficient of friction little (having only 0.1) is similar to the metal surface of refueling, and uses as mechanical high-abrasive material to have bigger potentiality.Simultaneously, the resistivity at room temperature of silicon nitride material is than higher (10
13-10
14Ω cm), can be used as the good insulation material; Chemical stability is fine; The oxide-film that material surface forms during high-temperature oxydation can hinder further oxidation, and oxidation resistance temperature reaches 1400 ℃; Maximum operation (service) temperature can reach 1800 ℃ in reducing atmosphere.
Partial stabilization zirconium oxide ceramic has very high intensity, fracture toughness and thermal shock resistance.People call " ceramic steel " to this intensity and the very excellent pottery of toughness.And its coefficient of heat conduction is little, good heat-insulation effect, and thermal coefficient of expansion is bigger, mates with metal parts than being easier to.
Grinding process test of the present invention (part) is carried out on the ultrahigh speed flat surface grinding experimental bench that country of Hunan University high efficient grinding Engineering Technical Research Centre is developed voluntarily.This experimental bench spindle power reaches 40KW, and maximum speed is 20000rpm.Workbench motor-driven power is 5KW, adopts SBS4500 grinding wheel dynamic balance system emery wheel to be carried out real-time dynamic balancing, amount of unbalance＜0.1 μ m.The cooling system pressure limit is 0-25Mpa, and grinding process adopts water base cooling fluid, and liquid supply pressure is 6-10Mpa.Device as shown in Figure 8.
Ultrahigh speed resinoid bond skive is adopted in described test, and its parameter is as shown in table 1.At first with reference to the listed parameter of table 2 emery wheel is repaired, beating until the emery wheel cylindrical is not more than 5 μ m, uses the aluminium oxide emery stick to its dressing then.
Table 1 emery wheel parameter
| Abrasive material | External diameter (mm) | Width (mm) | Granularity | Concentration | Bond |
| Diamond | 348 | 6 | 120/140# | 100 | B |
2 crushing parameters
| The finishing parameter | Pre-shaping step |
| Trimmer | 80# carborundum brake type trimmer |
| Grinding speed (m/s) | 4.5 |
| Finishing roller linear velocity (m/s) | (0.4 fixed value) |
| The speed of table (mm/min) | 200 |
| The amount of feeding (μ m) | 5,3,2 (take turns feeding) from the emery wheel both sides |
| The feeding number of | 60 |
| Dressing | 200# aluminium oxide emery stick, 2-3cm 3/ time |
The down grinding mode is selected in this test for use, adopts three groups of testing programs, has investigated different workpieces feed speed under different grinding speeds, different grinding depth and the same material removal rate and the influence to the engineering ceramic material grinding performance of different cutting-in respectively.The grinding parameter that is adopted is as shown in table 4.
Table 4 grinding parameter
| Sequence number | Grinding speed ν s(m/s) | Workpiece feed speed ν w(mm/s) | Grinding depth α e (mm) | The grinding wheel width material removal rate z ' of unit w(mm 3/mm·s) |
| 1 | 40， 60， 90， 120，160 | 20 | 2 | 40 |
| 2 | 120，160 | 20 | 1，2，4，6 | 20，40，80，120 |
| 3 | 120 | 10，20，40， 60，80，100 | 6，3，1.5，1， 0.75，0.6 | 60 |
The present invention has all carried out the research of above testing program to described three kinds of ceramic materials, has obtained lot of data, and analysis, comparison and arrangement by to data have drawn following result of the test.
Workpiece grinding skin form:
1) surface topography observation:
Fig. 1,2,3 is respectively the type looks of the grinding skin of these three kinds of materials of yittrium oxide PSZ, silicon nitride and aluminium oxide under certain experimental condition.
By Fig. 1 and 2 as can be known, the zirconia grinding skin mainly is made of smooth domain, plasticity groove, coating region and brittle fracture district under this grinding condition, and the silicon nitride grinding skin mainly is made of plasticity groove, coating region and brittle fracture district.The aluminium oxide grinding skin mainly is made of the brittle fracture district as shown in Figure 3.This performance with ceramic material is relevant, and in three kinds of materials, zirconic toughness is the strongest, and the toughness of aluminium oxide is the most weak, and fragility is the strongest.
Observation by result of the test, we find that grinding speed increases, grinding depth reduces grinding force is reduced, increase than grinding energy, finished surface plasticity is removed vestige and is increased, and this is that maximum undeformed chip thickness reduces to become big cause with contact arc length.But when grinding speed reached very high, more splitting traces appearred in finished surface on the contrary, and this is to increase the cause that speed of grinding wheel causes the vibration aggravation of whole grinding system, and the result has caused the finished surface deterioration.Test finds that the grinding skin pattern when grinding speed is 110m/s-130m/s is the most smooth under the identical situation of other condition, and the finished surface situation when grinding depth is 1mm-1.2mm is best.If increase grinding depth simultaneously and reduce the workpiece feed speed, can guarantee that not only material removal rate is constant, and can more help the plasticity removal of material that finished surface plasticity removal ratio increases, and is more smooth.Under the identical situation of material removal rate, the workpiece feed speed is 0.6m/min, and the grinding skin pattern when grinding depth is 4mm-6mm is the most smooth.
2) surface roughness
Fig. 4 is the grinding surface roughness value of three kinds of ceramic materials under the different grinding conditions, and as can be seen, roughness value is in the scope of 0.6-1.1 μ m.Do not have clear regularity by analyze finding that in entire test, surface roughness value is not subjected to the appreciable impact of grinding condition, changing, and the roughness value excursion is little under every group of experimental condition.And under same operating condition of test, the surface roughness value of aluminium oxide always is slightly larger than the surface roughness value of zirconia and silicon nitride.
3) grinding force
What Fig. 5 showed is the situation of change of unit are grinding force with grinding speed.By Fig. 5 (a) and (b) as can be known, all dullness reduces along with the raising of grinding speed for the unit are normal direction of three kinds of materials and tangential grinding force, and the variation tendency of unit are grinding force slows down when grinding speed is higher than 120m/s.Silicon nitride is close with zirconic unit are grinding force, and the unit are grinding force minimum and the variation tendency of aluminium oxide are the mildest.
Fig. 6 reflection be unit are grinding force under the different grinding depths.By Fig. 6 (a) and (b) as can be known, the unit are normal direction of three kinds of materials and tangential grinding force dull increasing all along with the raising of grinding depth.Equally, silicon nitride is close with zirconic unit are grinding force, and the unit are grinding force minimum and the variation tendency of aluminium oxide are the mildest.
Unit are grinding force when Fig. 7 is same scarcely workpiece feed speed of material removal rate and grinding depth.By Fig. 7 (a) and (b) as can be known, material removal rate one regularly, along with the reduction of workpiece feed speed, the increase of grinding depth, the unit are grinding force reduces gradually, and tends towards stability after the degree of depth reaches 3mm.
Based on the above results, the present invention draws to draw a conclusion:
1, the processing that the high efficiency deep grinding technology is applied to ceramic material is a kind of practicable processing method, can greatly improve ceramic material working (machining) efficiency, cut down finished cost, and can obtain high surface quality;
2, grinding speed increases, and grinding depth reduces, and maximum is not out of shape thickness of cutting and is reduced, and causes the unit are grinding force to reduce, and increases than grinding energy, and finished surface plasticity is removed vestige and increased.But when grinding speed reached very high, more splitting traces appearred in finished surface on the contrary.Test finds that the grinding force when grinding speed is 110m/s-130m/s is little under the identical situation of other condition, and the grinding skin pattern is the most smooth, and the finished surface situation when grinding depth is 1mm-1.2mm is best.
3, increase grinding depth and reduce the workpiece feed speed, can guarantee that not only material removal rate is constant, and can more help the plasticity removal of material, finished surface plasticity removal ratio increases, and is more smooth.Under the identical situation of material removal rate, the workpiece feed speed is 0.6m/min, and the grinding skin pattern when grinding depth is 5mm-6mm is the most smooth.
Description of drawings
Fig. 1 is yittrium oxide PSZ grinding skin type looks figure;
Fig. 2 is silicon nitride grinding skin type looks figure;
Fig. 3 is that aluminium oxide is cut surface type looks figure;
Fig. 4 (a) (b) (c) is a grinding surface roughness value under the different grinding conditions;
Fig. 5 (a) is the situation that grinding force changes with grinding speed (b);
Fig. 6 (a) is the situation that grinding force changes with grinding depth (b);
Fig. 7 (a) is that material removal rate is certain (b), the situation that grinding force changes with table feed speed and cutting-in;
Fig. 8 is the grinding attachment schematic diagram, wherein: 1-emery wheel, 2-nozzle, 3-workpiece, 4-dynamometer.
The specific embodiment
Select for use 99.5% aluminium oxide, silicon nitride and yittrium oxide PSZ as the grinding ceramic material respectively, and adopt device shown in Figure 8 to implement described grinding, the experimental bench spindle power reaches 40KW, and maximum speed is 20000rpm.Workbench motor-driven power is 5KW, adopts SBS4500 grinding wheel dynamic balance system emery wheel to be carried out real-time dynamic balancing, amount of unbalance＜0.1 μ m.
Adopt ultrahigh speed resinoid bond skive, its parameter is seen before and is stated table 1;
Emery wheel is repaired, and the finishing parameter is seen before and is stated table 2;
Adopt water base cooling fluid, liquid supply pressure is 8MPa;
The grinding process condition:
A. unit grinding wheel width material removal rate: 20mm
3/ mms-120mm
3/ mms;
B. grinding speed: 40m/s-160m/s;
C. grinding depth: 1mm-6mm;
D. workpiece feed speed: 0.5m/min-6m/min.
Three groups of best grinding process conditions:
1) grinding speed: 120m/s, grinding depth: 2mm, workpiece feed speed: 1.2m/min, unit grinding wheel width material removal rate: 40mm
3/ mms;
2) grinding speed: 120m/s, grinding depth: 1mm, workpiece feed speed: 1.2m/min, unit grinding wheel width material removal rate: 20mm
3/ mms;
3) grinding speed: 120m/s, grinding depth: 6mm, workpiece feed speed: 0.6m/min, unit grinding wheel width material removal rate: 60mm
3/ mms.
Claims (4)
1, a kind of highly effective deep-grinding process for engineering ceramic material is characterized in that, it comprises:
(1) adopts ultrahigh speed resinoid bond skive, be trimmed to cylindrical and beat and be not more than 5 μ m, and, adopt the grinding wheel dynamic balance system to make grinding wheel dynamic balance amount of unbalance＜0.1 μ m its dressing;
(2) adopt water base cooling fluid, liquid supply pressure is 6-10Mpa;
(3) grinding process condition:
A. unit grinding wheel width material removal rate: 20mm
3/ mms-120mm
3/ mms;
B. grinding speed: 40m/s-160m/s;
C. grinding depth: 1mm-6mm;
D. workpiece feed speed: 0.5m/min-6m/min.
According to the described highly effective deep-grinding process for engineering ceramic material of claim 1, it is characterized in that 2, described grinding process condition is: grinding speed: 120m/s, grinding depth: 2mm, workpiece feed speed: 1.2m/min, unit grinding wheel width material removal rate: 40mm
3/ mms.
According to the described highly effective deep-grinding process for engineering ceramic material of claim 1, it is characterized in that 3, described grinding process condition is: grinding speed: 120m/s, grinding depth: 1mm, workpiece feed speed: 1.2m/min, unit grinding wheel width material removal rate: 20mm
3/ mms.
According to the described highly effective deep-grinding process for engineering ceramic material of claim 1, it is characterized in that 4, described grinding process condition is: grinding speed: 120m/s, grinding depth: 6mm, workpiece feed speed: 0.6m/min, unit grinding wheel width material removal rate: 60mm
3/ mms.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107376A (en) * | 2010-12-16 | 2011-06-29 | 湖南大学 | Process chain method for realizing optimal grinding efficiency and quality |
| CN101564826B (en) * | 2009-05-11 | 2012-05-02 | 湘潭大学 | Prestress grinding processing method of ceramic material |
| CN103707133A (en) * | 2013-12-17 | 2014-04-09 | 湘潭大学 | Efficient and low-damage high-static hydraulic pressure grinding method for engineering ceramics |
| CN103781596A (en) * | 2011-07-22 | 2014-05-07 | 斯利浦纳克索斯有限公司 | A grinding tool for machining brittle materials and a method of making a grinding tool |
| CN106378495A (en) * | 2016-09-22 | 2017-02-08 | 北京航空航天大学 | Gear precision machining method based on tooth surface low stress control |
| CN106424967A (en) * | 2016-09-22 | 2017-02-22 | 北京航空航天大学 | Grinding parameter optimizing method based on aviation gear tooth face grinding burns |
| CN111390655A (en) * | 2020-03-31 | 2020-07-10 | 中国航发动力股份有限公司 | High-speed large-cutting-depth grinding method for mounting end face of high-pressure turbine disc |
| CN112548686A (en) * | 2020-12-01 | 2021-03-26 | 常州晶业液态金属有限公司 | Material removing processing method of amorphous alloy product |
-
2005
- 2005-12-23 CN CN 200510136602 patent/CN1788931A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101564826B (en) * | 2009-05-11 | 2012-05-02 | 湘潭大学 | Prestress grinding processing method of ceramic material |
| CN102107376A (en) * | 2010-12-16 | 2011-06-29 | 湖南大学 | Process chain method for realizing optimal grinding efficiency and quality |
| CN102107376B (en) * | 2010-12-16 | 2012-05-30 | 湖南大学 | Process chain method for realizing optimal grinding efficiency and quality |
| CN103781596A (en) * | 2011-07-22 | 2014-05-07 | 斯利浦纳克索斯有限公司 | A grinding tool for machining brittle materials and a method of making a grinding tool |
| CN103781596B (en) * | 2011-07-22 | 2016-10-19 | 斯利浦纳克索斯有限公司 | For processing the grinding tool of fragile material and preparing the method for grinding tool |
| CN103707133A (en) * | 2013-12-17 | 2014-04-09 | 湘潭大学 | Efficient and low-damage high-static hydraulic pressure grinding method for engineering ceramics |
| CN106378495A (en) * | 2016-09-22 | 2017-02-08 | 北京航空航天大学 | Gear precision machining method based on tooth surface low stress control |
| CN106424967A (en) * | 2016-09-22 | 2017-02-22 | 北京航空航天大学 | Grinding parameter optimizing method based on aviation gear tooth face grinding burns |
| CN106424967B (en) * | 2016-09-22 | 2018-08-10 | 北京航空航天大学 | A kind of development of grinding parameter optimization model method based on Aeronautical Gears flank of tooth grinding burn control |
| CN111390655A (en) * | 2020-03-31 | 2020-07-10 | 中国航发动力股份有限公司 | High-speed large-cutting-depth grinding method for mounting end face of high-pressure turbine disc |
| CN111390655B (en) * | 2020-03-31 | 2021-11-09 | 中国航发动力股份有限公司 | High-speed large-cutting-depth grinding method for mounting end face of high-pressure turbine disc |
| CN112548686A (en) * | 2020-12-01 | 2021-03-26 | 常州晶业液态金属有限公司 | Material removing processing method of amorphous alloy product |
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