CN1784512A - Electrodeposition of aluminum and refractory metals from non-aromatic organic solvents - Google Patents
Electrodeposition of aluminum and refractory metals from non-aromatic organic solvents Download PDFInfo
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- CN1784512A CN1784512A CN 200480012257 CN200480012257A CN1784512A CN 1784512 A CN1784512 A CN 1784512A CN 200480012257 CN200480012257 CN 200480012257 CN 200480012257 A CN200480012257 A CN 200480012257A CN 1784512 A CN1784512 A CN 1784512A
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Abstract
An electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives dissolved in the non-aqueous or non-aromatic organic solvent. Electrodeposition of a metal from the electroplating solution includes preparing an electroplating solution and electrodepositing the metal from the electroplating solution onto a conductive substrate under a cathodic current. An electroplating system has a plating chamber containing an electroplating solution, an entry point to the electroplating system, and a transporting system to convey a part to be electroplated from the entry point to the plating chamber. The electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives, the mixture dissolved in the non-aqueous non-aromatic organic solvent.
Description
The cross reference of related application
[0001] the application requires the U.S. Provisional Patent Application No.60/451 of on March 5th, 2003 at U. S. application, and 631 rights and interests are included its full content by reference at this.
Background technology
Invention field:
[0002] present method is usually directed to electrodeposited coating.More specifically, present method relates to the metallic coating of aluminium, magnesium and refractory metal such as titanium, tantalum, zirconium and alloy thereof, and this metallic coating obtains from non-aromatic organic solvents by galvanic deposit.
Background of invention:
[0003] in the explanation of background of the present invention below,, still, will this reference not think to admit that these equipment and method performance are prior aries with reference to some equipment and method.The applicant keeps the right that the theme that proves the reference of any institute does not constitute prior art of the present invention.
[0004] surface protections anticorrosive and wearing and tearing can be applied to iron class and non-ferrous metal parts.A kind of proper method that obtains this protection is a coating.For example, in Aeronautics and Astronautics industry, the cadmium coating is used for guard block such as landing gear or fastening piece to stop corrosion.This cadmium coating is as sacrificial coatings, even this coating also provides protection by scraping the time.But cadmium is served as reasons based on the toxic metal of the plating bath galvanic deposit of prussiate, its influence operation and processing sfgd..Need the suitable metallic coating that is used for cadmium.
[0005] aspect of the protection that provides by this coating salt solution electrochemical potential that is the cadmium coating the result that will bear with respect to following material.Therefore, the suitable coating material that is used to replace cadmium comprises those with respect to following material, has the similar for example material of negative salt solution electrochemical potential.For example comprise zinc, manganese, beryllium and magnesium in the candidate material, thereby substitute the cadmium in the coating.But, these candidate material defectiveness.Zinc is being easy to the galvanized while, suffers the embrittlement that produces because of environment, therefore is not suitable for being used for high-strength steel.Can electroplate manganese by aqueous methods, but its exposure can cause to lung and neural influence.Similarly, beryllium also has the defective on the environment, and in not being blended in coating in the time, magnesium is active at this application camber.
[0006] aluminium and refractory metal for example titanium be the replacement candidates that is used for supercoat and is used for substituting the cadmium coating.Aluminum coating can provide and stop ferrous metal parts corrosive sacrifice property protection blocking layer.Refractory metal coatings can provide the protection blocking layer, this protection blocking layer stop by as burn into erosion, wearing and tearing, abrasion and embrittlement etc. machine-processed to for example infringement of iron class and non-ferrous metal parts of following metal.
[0007] aluminium and refractory metal such as titanium be usually by as those molten salt bath chemical substances based on lithium chloride, or by as those poisonous organic solvents based on benzene and toluene, perhaps by the acquisition of electrophoresis electrochemical ground.These known methods have negative drawbacks on coating quality and cost.For example, molten slat bath methods can be avoided embrittlement during electroplating, but the salt of holding back can be the source of subsequent corrosion and embrittlement.
[0008] metallic coating of aluminium and refractory metal also can obtain by other method.For example, can use physical technique, as arc spraying, physical gas phase deposition technology, as the ion vacuum moulding machine (perhaps being called ivadizing) and the chemical technology of aluminium, as sol-gel, perhaps by deleterious organic solvent or form the coating of aluminium and refractory metal by the galvanic deposit of fused salt.
[0009] U.S. Patent No. 4,145, and 261 disclose a kind of plating bath, and it is toluene, comprise the organism of benzene and the mixture of aluminum halide.U.S. Patent No. 4,759, electrolyte liquor chamber is isolated in 831 carryings (load-lock) that disclose the galvanic deposit that is used for aluminium.The characteristic of this plating bath is environmental problem and when being exposed to air for example, is easy to contaminatedly to cause this disclosed solution and technology costliness, efficient is low and may endanger environment and health.
[0010] Japanese Patent 55-158289 discloses the multiple lower molecular weight organic solvent that wherein is dissolved with synthetic aluminium salt.But, concrete coating performance is not provided.
[0011] therefore, especially in high-strength steel and Aeronautics and Astronautics application, still there are needs to the coating technology of alternative present cadmium layer.In addition, also need environmentally safe and clean, simultaneously cost and the also high Aliminuium electrodeposition technology of time efficiency.
Summary of the invention
[0012] a kind of exemplary process of metal electrodeposition comprises preparation electroplate liquid and under cathodic current, with metal from this electroplate liquid galvanic deposit on conductive substrates.This electroplate liquid comprises soluble metal salt and is dissolved in the mixture of the organic additive in anhydrous, the non-aromatic organic solvents.
[0013] a kind of representative electroplate liquid comprises anhydrous, non-aromatic organic solvents and comprises soluble metal salt and the mixture of organic additive, and this mixture is dissolved in that this is anhydrous, in the non-aromatic organic solvents.
[0014] a kind of representative embodiment of electroplating system comprises the plating chamber of containing electroplate liquid, the inlet that enters electroplating system and the delivery system that the parts of electroplated is transported to the plating chamber from inlet.That this electroplate liquid comprises is anhydrous, non-aromatic organic solvents and comprise soluble metal salt and the mixture of organic additive, and this mixture is dissolved in that this is anhydrous, in the non-aromatic organic solvents.
Description of drawings
[0015] can understand the preferred embodiment that describes in detail below in conjunction with the accompanying drawings, the parts that wherein identical numeral is identical, wherein:
[0016] Fig. 1 is the sketch map of electroplating system.
Detailed description of preferred embodiments
[0017] galvanic deposit from non-aromatic organic solvents (NAOS) can deposit the metal and the alloy that can not obtain by conventional (moisture) plating.Owing to almost do not have or do not have water to exist in solution (as in the water of aqueous solution), so can reduce or minimize the hydrogen embrittlement of high tensile strength material.In addition, with regard to parts processing, some equipment and method, NAOS technology has similar or identical characteristic with conventional the plating, thereby in conventional electrodeposition apparatus, allows the effective of NAOS to substitute.
[0018] exemplary process of metal electrodeposition comprises preparation electroplate liquid and under cathodic current, with metal from this electroplate liquid galvanic deposit on conductive substrates.This electroplate liquid comprises the soluble metal salt that is dissolved in anhydrous, the non-aromatic organic solvents and the mixture of organic additive.
[0019] this anhydrous, that non-aromatic organic solvents can be any suitable solvent.For example, a kind of The suitable solvent comprises the lower molecular weight non-aromatic organic solvents.In this article, lower molecular weight means 200g/mole or lower.Such solvent comprise alcohols such as ethanol, propyl alcohol, Virahol, butanols, 2-butanols and corresponding, have the alcohol more than an OH functional group, thanomin and amine.Carboxylic acid such as oxalic acid, citric acid and ammonium citrate can be used as supporting electrolyte (supportelectrolyte) or also can be used as solvent.In addition, plating bath can have two or more combination of these suitable solvent.In addition, although also can use other organic solvent, as ketone, aldehyde, alkene, alkynes, ether, acid amides and deleterious aromatics, the toxicity of these solvents makes them be out of favour.
[0020] soluble metallic salt is dissolved in these solvents.These metal-salts comprise that metal alkoxide such as ethylate, propylate, isopropoxide, butanolate and corresponding halogenide thereof, phosphoric acid salt, carbonate and other during galvanic deposit, can provide the reduced metal ionic inorganic and organic compound at negative electrode.But this metal-salt Individual existence maybe can use other salt and their mixture.
[0021] in exemplary process, the metal target that is used for galvanic deposit is not easy from the aqueous solution electroplated metal for those.The example of metal target comprises the alloy of the arbitrary combination of aluminium, titanium, tantalum, zirconium, molybdenum, tungsten, niobium, osmium, hafnium, magnesium and these metals, perhaps comes from other metal of the salt that is dissolved in the above-mentioned solvent.
[0022] in electroplate liquid, the concentration of metal-salt can be the 5%-100% of the saturation concentration of each metal-salt in solvent under the service temperature of galvanic deposit.Also conductive additive such as oxalic acid, phosphoric acid and other low molecular weight organic acid can be added in this plating bath.In this article, lower molecular weight means 200g/mol or lower.Can add alone or in combination increases solvent conductivity and may be dissolved in any organic or inorganic compound in such solvent.For example, in ethanol, following by product is soluble: sodium hydroxide, boric acid, ammonium chloride, lime carbonate, sodium iodide, Neutral ammonium fluoride, aluminum nitrate, stearate or hydrogen chlorate, aluminum chloride, aluminum phosphate and aluminum phosphate potassium.
[0023] minimum electrolysis liquid pollutes and can improve adhesive power and coating performance.The pollution of plating bath can cause that settling is inhomogeneous, porous, bonding (galling), spot corrosion, foaming and even cause not depositing.Have multiple mode to suppress or minimum electrolysis liquid by air, water or solution or galvanic deposit by-product contamination.Can utilize electrolyte filtering and controlled atmosphere (for example at encapsulation plating bath place) to assist to keep the proper operation of electrodeposition bath.For example, can be on molecular sieve the continuous filtration plating bath to minimize the pollution of water.Suitable molecular sieve is 3 dust molecular sieves to be used for this application.In another embodiment, power between depositional stage in substrate at metal at least, on electroplate liquid, keep inert atmosphere.This inert atmosphere can be for example by keeping with the atmosphere of electroplate liquid contact anaerobic and anhydrous minimizing basically by the pollution of oxygen and water.For example, oxygen level can be 1-10ppm, preferably is less than 5ppm, and water-content can be 1-10ppm, preferably is less than 5ppm, but physical condition can be dependent on by the metal of galvanic deposit and changes.Preferably, when using inert atmosphere, on electroplate liquid, keep inert atmosphere continuously.A kind of example of inert atmosphere comprise with nitrogen blast by electrolytic solution and/or on plating bath the gas regulation nitrogen atmosphere.
[0024] in another embodiment, reduce pollution in the indoor malleation of using of plating.Preferably, malleation is remained on 1 normal atmosphere, but depend on the sensitivity of technology and the design of plating chamber, this atmosphere can be below or above 1 normal atmosphere.
[0025] in another embodiment, can will be full of with rare gas element such as nitrogen, and filter out the gloves box of water and oxygen or the chamber of closed double-compartment is used for NAOS with suitable catalyzer.Indoor electroplate liquid in this gloves box or closed double-compartment can be arranged to single electrolysis bath of liquid, maybe can make it to be divided into isolated catholyte and anolyte chamber.Make it to be divided into catholyte and anolyte chamber is chosen wantonly, wherein may take place because the decomposition of the solution that electrolysis causes.When catholyte and anolyte chamber are separated, can by for example between the chamber, suitable ion permeable membrane obtain possible decomposition.For the electroplating chemical that needs separate electrolytic solution, although can use full infiltration of a variety of commercializations or semipermeable partition, suitable ion permeable membrane is a polymeric membrane.Between electrode, also can use film to isolate, to use different anodes and catholyte.
[0026] in exemplary method of electrodeposition, suitable anode material comprises and is equal to or similar metal by plated metal electrochemistry, as long as they do not form insulation barrier, perhaps no matter solvable or soluble, compatible with this electrolytic solution metal on the surface.For avoiding electrolyte contamination, can use suitable soluble anode or the soluble anode that forms by the material that contains the electroplated metal.In addition, can use other anode material such as platinized titanium, DSA type anode or other material soluble but conduction.
[0027] depend on that electrolytic solution is formed and the metal of electroplated, cathode current density suitable on conductive substrates can be at 0.05 to 1000 ampere/dm
2Between change.In each NAOS process, determine the electrode surface ratio, so that reach balance from the metal of anode dissolution with by the amount between the plated metal, thus keep the chemical equilibrium of electrolytic solution.
[0028] conductive substrates is chosen wantonly and have the surface that prepared before galvanic deposit.For example, can be with surface sand-blasting, shelter (masked), before electroplating, clean then with alkali or acid.After cleaning with alkali and acid, with this conductive substrates with the alcohol dipping or spray to remove any moisture cleaning agent.In some cases, available reverse etching (reverse etch) improves adhesive power.
[0029] stirring of any type of electroplate liquid or part solution can be combined in this technology.For example, can use and move or vibration sink streamline (bus-bar), nitrogen or other rare gas element blasts or ultrasonic device.
[0030] adjustable saving in the temperature of electroplating solution of each NAOS technology, thus make the solvent surface tension be no more than about 50% (± 10%) that its vaporization is pressed, improve plating condition and efficient thereby perhaps make electroplate liquid turn cold.For example, can regulate electroplate liquid by using heat exchanger or water cooler.
[0031] can stop evaporation but allow parts to enter the evaporation that floatation device in the bath such as polymerization ball or compound reduce electrolytic solution by adding on fluid surface portion top.
[0032] Fig. 1 is the sketch map of electroplating system.A kind of representative embodiment of electroplating system 100 comprises the plating chamber 102 of containing electroplate liquid, the inlet 104 of electroplating system 100 and electroplated parts 108 104 are transported to the delivery systems 106 of plating the chamber 102 from entering the mouth.
[0033] electroplating chamber 102 comprises single electroplating chamber, perhaps as in this discussion, is used for the chamber that separates of anolyte and catholyte.As shown in FIG. 1, this chamber 102 comprises the chamber that separates with two anodes 110,112, and these two anodes are positioned opposite to each other basically, have catholyte therebetween.Each anode 110,112 separates with catholyte by film 114,116.
[0034] takes the continuously stirring electroplate liquid, this scavenge water molecules by cycling through the mistress 118 who holds molecular sieve.An associated pump (not shown) helps circulation and recirculation electrolytic solution between plating chamber 102 and mistress 118, thereby assists the purity and the composition of control electrolytic solution.
[0035] in addition, by gas regulation at least the plating chamber 102 in, preferably in electroplating system 100, keep inert atmosphere.In Fig. 1, gas regulation is shown as the nitrogen pot 120 of adjusting.But, can use the inert atmosphere of any suitable and the regulation system of any suitable.Generally in plating chamber 102, for example keep the approximately malleation of 1atm.
[0036] inlet 104 of electroplating system 100 can be the inlet of any suitable, and when keeping suitable pollution and bathing steam control, this inlet holds parts 108 and can dock with plating chamber 102.For example, Fig. 1 shows that inlet 104 is gas lock type transition point, and it has first external door 122 and second inside door 124.Usually, the operation of external door 120 and inside door 122 is coordinated mutually with vacuum pump and rare gas element backfill valve, thereby the air that is incorporated into the plating chamber 102 from the outside of electroplating system 100 is minimized.
[0037] delivery system 106 is placed parts 108 and is entered to plate the position that is used for galvanic deposit in the chamber 102.For example as shown in Figure 1, delivery system 106 places parts 108 advance in the catholyte, and is electrically connected with power supply 126.Depend on electrochemical conditions, power supply 126 can be gravimetric analysis (gravimetric) or permanent electromotive force power supply.Power supply 126 also is electrically connected with each anode 110,112.
[0038] delivery system 106 can comprise delivery system any suitable, that be used for parts 108.Suitable delivery system example comprises hydraulic lift, chain lifter, travelling belt, elevator system, last moving system (rack-up system), rotational system etc.For example, big parts can be pushed upwardly, and electroplate from promoting the position, and widget can barrel plating be electroplated.In barrel plating, parts are placed in the cylinder, this cylinder rotates in electroplate liquid, thereby makes parts all be immersed in the plating bath.In barrel plating, will come from promote step, the remaining point of electroplating reduces to minimum value, thereby electroplates whole parts.
[0039] illustrated among the embodiment below (embodiment 1-embodiment 3) and can make the solution of electroplated aluminum based on NAOS:
Embodiment 1:
| Composition | Chemical name | Concentration | Remarks |
| Solvent | Ethanol | - | |
| Aluminium source #1 | Aluminum isopropylate | 0-5g/L | |
| Conductive additive #1 | Oxalic acid | 0-100g/L | |
| Aluminium source #2 | Aluminum chloride | 0-900g/L | |
| Conductive additive #2 | Boric acid | 0-50g/L | |
| Temperature | Room temperature | ||
| Anode material | Aluminium |
Embodiment 2:
| Composition | Chemical name | Concentration | Remarks |
| Solvent | Ethanol-Virahol | 0-50V/V | |
| Aluminium source #1 | Aluminum isopropylate | 0-5g/L | |
| Conductive additive #1 | Oxalic acid | 0-100g/L | |
| Aluminium source #2 | Aluminum chloride | 0-900g/L | |
| Temperature | Room temperature | ||
| Anode material | Aluminium |
Embodiment 3:
| Composition | Chemical name | Concentration | Remarks |
| Solvent | Butanols | - | |
| Aluminium source #1 | Aluminium butoxide | 0-10g/L | |
| Conductive additive #1 | Oxalic acid | 0-100g/L | |
| Aluminium source #2 | Aluminum chloride | 0-500g/L | |
| Temperature | Room temperature | ||
| Anode material | Aluminium |
[0040] illustrated in the following examples (embodiment 4) and can make titanium electroplate solution based on NAOS:
Embodiment 4:
| Composition | Chemical name | Concentration | Remarks |
| Solvent | Ethanol | - | |
| Titanium source #1 | Titanium ethanolate | 0-10g/L | |
| Conductive additive #1 | Boric acid | 0-50g/L | |
| Titanium salt #2 | Titanium chloride | 0-50g/L | |
| Temperature | Room temperature | ||
| Anode material | Titanium |
[0041] illustrated in the following examples (embodiment 5) and can make tantalum electroplate solution based on NAOS:
Embodiment 5:
| Composition | Chemical name | Concentration | Remarks |
| Solvent | Ethanol | - | |
| Tantalum source #1 | The Virahol tantalum | 0-100g/L | |
| Conductive additive #1 | Oxalic acid | 90±15g/L | |
| Tantalum source #2 | Tantalum pentachloride | 0-5000g/L | |
| Temperature | Room temperature | ||
| Anode material | Tantalum |
[0042] illustrated in the following examples (embodiment 6) and can make zirconium electroplate solution based on NAOS:
Embodiment 6:
| Composition | Chemical name | Concentration | Remarks |
| Solvent | Ethanol | - | |
| Zirconium source #1 | The ethanol zirconium | 0-50g/L | |
| Conductive additive #1 | Oxalic acid | 0-100g/L | |
| Zirconium source #2 | Zirconium tetrachloride | 0-500g/L | |
| Temperature | Room temperature | ||
| Anode material | Zirconium |
[0043] although in metal deposition process, can use multiple anode, negative electrode and solution chemistry to form, the preferred electrodeposition technology that is used for aluminium uses aluminum anode, gentle, organic and inorganic aluminate and other specific conductivity promotion chemical agent.But, can obtain other metal and refractory metal from the organic solvent of same functional group by galvanic deposit.
[0044] analyzed the characteristic of this electro-deposition method and come from the performance of the Electroplating Aluminum of this technology.Find that covering power approximately equates that with the sedimentary covering power of cadmium this covering power is important on complex construction and internal diameter for evenly applying.Because this electroplated aluminum technology is anhydrous, this technology is not released in the free hydrogen that can cause hydrogen embrittlement in the high-strength steel at negative electrode.In addition, not as traditional cadmium, galvanized aluminium can be by anodic oxidation, thereby hardness can be increased to the hardness of about 500 Vickers of electroplated coating like this (in this durometer level from general 10-25 Vickers' hardness (Hv), use is used for the ASTM standard testing rules of Vickers' hardness), thus help in making and using, to reduce scratch and damage.
[0045] one of application of the present invention is electric deposition aluminum on the high-strength steel parts that use in Aeronautics and Astronautics.As long as substrate is not subject to the influence of the chemical erosion that brought by the chemical property of plating bath, can be on conductive substrates arbitrarily with this NAOS process application.
[0046] although discloses the present invention in conjunction with its representative embodiment, but be appreciated that, without prejudice to the present invention spirit and as in the scope of the invention defined in the appended claims, those skilled in the art can carry out not concrete disclosed interpolation, delete, revise and substitute.
Claims (34)
1. the electro-deposition method of metal, this method comprises:
Preparation electroplate liquid, this electroplate liquid comprise the soluble metal salt that is dissolved in anhydrous, the non-aromatic organic solvents and the mixture of organic additive; And
Under cathodic current, on conductive substrates from this this metal of electroplate liquid galvanic deposit.
2. the process of claim 1 wherein that this soluble metal salt is a metal alkoxide.
3. the method for claim 2, wherein this metal alkoxide is selected from metal ethylate, propylate, isopropoxide, butanolate, corresponding halogenide, phosphoric acid salt and carbonate and composition thereof.
4. the process of claim 1 wherein that this metal is selected from aluminium, titanium, tantalum, zirconium, molybdenum, tungsten, niobium, osmium, hafnium, magnesium and alloy thereof and combination.
5. the process of claim 1 wherein that this is anhydrous, non-aromatic organic solvents is the non-aromatic solvent of lower molecular weight.
6. the process of claim 1 wherein that this is anhydrous, non-aromatic organic solvents is alcohol or amine.
7. the method for claim 6, wherein this alcohol has more than an OH functional group.
8. the process of claim 1 wherein that this is anhydrous, non-aromatic organic solvents is selected from ethanol, propyl alcohol, Virahol, butanols, 2-butanols and thanomin.
9. the process of claim 1 wherein the concentration of soluble metal salt in electroplate liquid under the service temperature of galvanic deposit, the 5%-100% of the saturation concentration of this metal-salt in anhydrous, non-aromatic organic solvents.
10. the method for claim 1 comprises conductive additive is joined in the electroplate liquid to improve the specific conductivity of solvent.
11. the method for claim 10, wherein conductive additive is low-molecular-weight organic solid.
12. the method for claim 10, wherein conductive additive is muriate, pentachloride, tetrachloride or the soluble organic or inorganic compound in electroplate liquid of oxalic acid, citric acid, ammonium citrate or metal.
13. the method for claim 1 is included in this electroplate liquid of continuous filtration on the molecular sieve, and at least during galvanic deposit, keeps inert atmosphere on electroplate liquid.
14. the method for claim 13, wherein inert atmosphere makes the atmosphere that contacts with electroplate liquid keep anaerobic and anhydrous basically.
15. the method for claim 1 comprises making electroplate liquid be divided into isolating catholyte liquid chamber and anolyte chamber that this catholyte liquid chamber and anolyte chamber are separated by film.
16. the method for claim 1 comprises that this electroplate liquid of stirring or stirring are by galvanized parts.
17. the method for claim 1 comprises by sand blasted surface, masked surface, uses alkalescence or the cleaning of acid cleaning solution and pass through the alcohol immersion or spraying removal cleaning solution, prepares the conductive substrates surface that is used for galvanic deposit.
18. an electroplate liquid comprises:
Anhydrous, non-aromatic organic solvents; And
That the mixture that comprises soluble metal salt and organic additive, this mixture are dissolved in is anhydrous, in the non-aromatic organic solvents.
19. the electroplate liquid of claim 18, wherein this soluble metal salt comprises the aluminium salt that can make Aliminuium electrodeposition.
20. the electroplate liquid of claim 18, wherein this soluble metal salt comprises the titanium salt that can make the titanium galvanic deposit.
21. the electroplate liquid of claim 18, wherein this soluble metal salt comprises the tantalum salt that can make the tantalum galvanic deposit.
22. the electroplate liquid of claim 18, wherein this soluble metal salt comprises the zirconates that can make the zirconium galvanic deposit.
23. the electroplate liquid of claim 18, wherein this soluble metal salt comprises at least a refractory metal salt that makes the refractory metal galvanic deposit.
24. the electroplate liquid of claim 23, wherein this refractory metal is molybdenum, tungsten, niobium, osmium, hafnium, its alloy or its combination.
25. the electroplate liquid of claim 18, wherein this soluble metal salt is a metal alkoxide.
26. the electroplate liquid of claim 18, wherein this is anhydrous, non-aromatic organic solvents is the non-aromatic solvent of lower molecular weight.
27. an electroplating system comprises:
The plating chamber of containing electroplate liquid;
The inlet of electroplating system; And
The electroplated parts are transported to the delivery system of plating the chamber from this inlet,
Wherein this electroplate liquid comprises anhydrous, non-aromatic organic solvents and comprises soluble metallic salt and the mixture of organic solvent, and this mixture is dissolved in that this is anhydrous, in the non-aromatic organic solvents.
28. the electroplating system of claim 27, wherein this plating chamber comprises single electroplating chamber, perhaps is used for the electroplating chamber that separates of anolyte and catholyte.
29. the electroplating system of claim 27, wherein this electroplating chamber comprises having the electroplating chamber that two anodic separate, and these two anodes are positioned opposite to each other basically, have catholyte therebetween, and each anode separates with catholyte by film.
30. the electroplating system of claim 27 comprises the mistress who holds molecular sieve, wherein takes this electroplate liquid of continuously stirring by circulation through the mistress.
31. the electroplating system of claim 27 comprises inert gas source, and the gas regulation by inert gas source that inert atmosphere is remained on this plating at least is indoor.
32. the electroplating system of claim 31 wherein remains on malleation with this inert atmosphere.
33. the electroplate liquid of claim 27, wherein this soluble metallic salt is a metal alkoxide.
34. the electroplate liquid of claim 27, wherein this is anhydrous, non-aromatic organic solvents is the non-aromatic solvent of lower molecular weight.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US45163103P | 2003-03-05 | 2003-03-05 | |
| US60/451,631 | 2003-03-05 | ||
| US10/791,835 | 2004-03-04 |
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| Publication Number | Publication Date |
|---|---|
| CN1784512A true CN1784512A (en) | 2006-06-07 |
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|---|---|---|---|
| CN 200480012257 Pending CN1784512A (en) | 2003-03-05 | 2004-03-05 | Electrodeposition of aluminum and refractory metals from non-aromatic organic solvents |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101289753B (en) * | 2007-04-19 | 2011-03-09 | 英飞凌科技股份公司 | Electric deposition aluminum |
| CN102449204A (en) * | 2009-05-29 | 2012-05-09 | 阿斯特恩先进材料有限公司 | Electrodeposition of elemental zinrconium |
| CN104894610A (en) * | 2015-06-10 | 2015-09-09 | 陈新棠 | Electroplate liquid |
| CN105229825A (en) * | 2013-07-30 | 2016-01-06 | 株式会社Lg化学 | Comprise the electrode for preventing the coating of reacting with electrolyte |
| CN106435706A (en) * | 2015-08-04 | 2017-02-22 | 张无量 | Electrochemical polishing method for magnesium metal component |
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2004
- 2004-03-05 CN CN 200480012257 patent/CN1784512A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101289753B (en) * | 2007-04-19 | 2011-03-09 | 英飞凌科技股份公司 | Electric deposition aluminum |
| CN102449204A (en) * | 2009-05-29 | 2012-05-09 | 阿斯特恩先进材料有限公司 | Electrodeposition of elemental zinrconium |
| CN105229825A (en) * | 2013-07-30 | 2016-01-06 | 株式会社Lg化学 | Comprise the electrode for preventing the coating of reacting with electrolyte |
| US9899682B2 (en) | 2013-07-30 | 2018-02-20 | Lg Chem, Ltd. | Electrode including coating layer for preventing reaction with electrolyte solution |
| CN104894610A (en) * | 2015-06-10 | 2015-09-09 | 陈新棠 | Electroplate liquid |
| CN106435706A (en) * | 2015-08-04 | 2017-02-22 | 张无量 | Electrochemical polishing method for magnesium metal component |
| CN106435706B (en) * | 2015-08-04 | 2019-02-26 | 张无量 | The electrochemical polishing method of magnesium intravascular stent |
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