CN1778746A - D-glass fibre - Google Patents

Abstract

D-glass fiber consists of SiO2, Al2O3, CaO, MgO, B2O3 and Fe2O3. It has a lower dielectric constant, viscosity temperature of Log3 is <1300DEG C, liquefaction temperature is <1100DEG C, the difference between the both is above 75DEG C. It can prevent fibre spinning and crystallizing, has good wetting-resistant performance and lower electricity consumption. It can be used for substrate materials for printing circuit board.

Description

A kind of D-glass fibre

Technical field

The present invention relates to a kind of glass composition of property, particularly a kind of D glass fibre is the base material of printed circuit board (PCB) first-selection.

Background technology

The main component of glass fibre is silicon-dioxide, aluminum oxide, calcium oxide, boron oxide, magnesium oxide, sodium oxide etc., according to alkali content in the glass what, can be divided into alkali free glass fibre (sodium oxide 0-2%), medium-alkali glass fibre (sodium oxide 8-12%) and high alkali glass fibre (sodium oxide is more than 13%).The cross section of glass fibre is rounded, and diameter is between several microns to 20 microns, and density approximately is 2.4-2.7 gram/cubic centimetre.Glass fibre is very tough, and tensile strength approximately is five times of same thickness steel wire, and the load that it can bear can reach 70 tons every square centimeter.Glass fibre belongs to inorganic fibre, has characteristics such as better thermotolerance, wet fastness, uninflammability, chemical resistance, anti-mildew, anti-moth, heat insulation, sound insulation, electrical insulating property on chemical property more than organic fibre.Industrial, glass fibre mainly is used as the material of filtration, protection against corrosion, protection against the tide, sound insulation, insulation, damping.Glass fibre is except that having successive macrofiber and the staple fibre that is cut into certain-length to be made for the fabric usefulness, because industrial needs develop products such as hollow fiber, wavy staple, pitted skin fiber, top coat fiber in recent years again.On special purpose, can be used as and picked up yarn, zero-twist yarn, voluminous yarn, union yarn, dyed yarn, conductive yam, strand, sewing thread, cable, tire netting twine, felt and various textile article.Glass fibre also can be as the toughener of material in addition, is used for making reinforced plastic, reinforcing rubber, reinforcement gypsum and goods such as reinforced cementitious.

Because global information and electronic industry is flourish, printed circuit board (PCB), copper clad laminate, glass cloth etc. are significantly enlarging successively all, causes the demand of electronic-grade glass to increase severely thereupon.The glass yarn of being made by the electronic-grade glass material is as the used base material of printed circuit board (PCB) .Generally speaking, the output of glass yarn is Yu produce glass cream by the kiln high temperature melt after the grating such as Gao soil with sharp sand, glass cullet, Wingdale, soda ash, through reeling off raw silk from cocoons, batch, process such as twist yarn makes glass fiber yarn, again via warping, sizing, and through, weave cotton cloth, after the processing such as destarch, make glass cloth.For meeting in the glass cloth processing procedure quality requirements to yarn, glass yarn is not only wanted superfine and is wanted successively, need to be controlled by the viscosity of careful allotment glass paste and the speed of extraction, be pumped into behind the silk again handle through above-mentioned batch, twist yarn etc. after, just become electronic-grade glass cloth available electronic-grade glass yarn.

Because that electronic product moves towards is compact, multi-functional, at a high speed and the development trend of high frequencyization, the improvement of electronic-grade glass material is obviously imperative, is that basic mode of ameliorating is the most important with optical etching technology or advanced low-k materials with chemistry especially wherein.For example, because Communication Equipment, satellite conveyor apparatus, mobile telephone or the like have the trend of digitisation, and its signal processing also has quicker demand, and the printed circuit board (PCB) that therefore requires to be used must use the composition material that hangs down dissipation loss.So glass fiber material is extensively applied to printed circuit board (PCB), wherein commonly used by the people with E-glass (E-glass) especially.

When an electric current flow through glass material, this glass can absorb the energy of this electric current with heat absorbing mode usually.The absorbed dielectric loss energy of this kind (dielectric loss energy, hereinafter to be referred as W) with specific inductivity (the dielectric constant of this glass material, hereinafter to be referred as ε or DK) and its dielectric tangent (dielectric tangent, hereinafter to be referred as tan δ) be directly proportional, it can represent it by following formula:

W＝kfv ²×εtanδ

Wherein W is the dielectric loss energy, and k is a constant, and f is a frequency, v ²Be potential gradient, ε represents specific inductivity in this, and tan δ is the dielectric tangent.

For example, be used to the E-glass of printed circuit board (PCB), under room temperature and 1MHz frequency, have specific inductivity and be 7.0 and just be cut to 12 * 10 with dielectric ^-4Characteristic.Because circuit card has the requirement of higher density, high-insulativity and high processing rate etc., so must reduce the dielectric loss energy as far as possible, therefore the character according to E-glass is not sufficient to meet this kind demand.Therefore, develop and a kind ofly have more than E-glass that the glass material of low-k and lower dielectric tangent is to become a main R﹠D direction.

For these reasons, in recent years, develop D-glass (D-glass).It consists of: 75.3% SiO ₂, 20.5% B ₂O ₃, 0.6% CaO, 0.4% MgO, 0.6% Li ₂O, 1.1% NaO ₂With 1.5% K ₂The glass component of O.D-glass under room temperature and 1Mhz frequency, have specific inductivity be 4.3 with dielectric just be cut to 10 * 10 ^-4Characteristic.Yet one of shortcoming of D-glass is that its melting is relatively poor and easily causes striped and foam to make glass fibre rupture in spinning process, thereby obviously unfavorable with processing to the manufacturing of product; In addition, another main drawback of D-glass be D-glass water tolerance with and relatively poor with the tack of resin, thereby cause this kind glass material easily on printed circuit board (PCB), to be peeled off.

And for example, U.S. patent application case publication number 20030054936 has also disclosed a kind of glass fibre with low-k, and it comprises the SiO of 50-60% ₂, 10-18% Al ₂O ₃, 14-＜20% B ₂O ₃, 1-6% CaO, the TiO of 0.5-5% of MgO, 2-5% ₂, 0-0.3% Li ₂The Na of O, 0-0.3% ₂The K of O, 0-0.5% ₂The F of O and 0-2% ₂, its Li ₂O+Na ₂O+K ₂The content of O is 0-0.6%.

Yet above-mentioned disclosed existing glass material although its specific inductivity can be reduced to about 5.0, often produce the crystalline phenomenon through reeling off raw silk from cocoons but still exist, and its moisture resistance is unsatisfactory.Therefore, this adds to the difficulties not only for the glass fibre manufacturing process, and uses in art of printed circuit boards and exist too such as unsatisfactory part such as peeling off.

Summary of the invention

The object of the present invention is to provide that a kind of specific inductivity is low, the difference of Log3 viscosity temperature and liquefaction temperature is more than 75 ℃, over-all propertieies such as tolerance wet environment obviously improve, and are beneficial to the good D glass fibre of object tack that reels off raw silk from cocoons and combine with it.

The present invention mainly is made up of following component, and its proportioning is weight %:

SiO ₂ 52.63-67.95％

Al ₂O ₃ 10-12％

CaO 5-10％

MgO 2-5％

B ₂O ₃ 15-22％

Fe ₂O ₃ 0.05-0.15％。

The present invention can also contain a kind of component in the following component at least, and its proportioning is weight %:

Na ₂O ₃ 0-0.2％

K ₂O 0-0.2％

TiO ₂ 0-2％

SrO 0-2％

F ₂ 0-2％。

The present invention compared with prior art, because shortcoming at the prior art existence, composition of raw materials and proportioning thereof are improved, and having lower specific inductivity, Log3 viscosity temperature less than 1300 ℃ with evidence after testing, liquefaction temperature is less than 1100 ℃, and both differences are more than 75 ℃, the operation that is more conducive to reel off raw silk from cocoons had both prevented the fracture of reeling off raw silk from cocoons, eliminate producing the crystalline phenomenon when reeling off raw silk from cocoons again, again because of its anti humility performance obviously improves, its alkali dissolution is less than 0.055 milligram of Na ₂O/g glass, (prior art is 0.5mg) therefore is more suitable for the base material as printed circuit board (PCB), and both electrical loss can be low, eliminates the defective of " peeling off " again.Thereby as seen, its over-all properties obviously improves, and has tangible economic benefit and social benefit.

Embodiment

Further specify content of the present invention by embodiment:

Embodiment 1: the proportioning by prescription is got 52.85%SiO ₂, 12%Al ₂O ₃, 8%CaO, 5%MgO, 22%B ₂O ₃And 0.15%Fe ₂O ₃, close material with the common process method of producing glass fibre and stir and be heated to 1600 ℃ in the kiln; Fusing is after apparatus for making pearl ball is made glass sphere (piece); Glass sphere is placed another kiln to be heated to 1600 ℃, the glass solution after the fusing flows out by the platinum bushing and is the glass yarn of 6 μ m, and can twine again.

Embodiment 2: the processing method production identical with embodiment 1, get 62.55%SiO ₂, 10%Al ₂O ₃, 10%CaO, 2%MgO, 15%B ₂O ₃And 0.05%Fe ₂O ₃, 0.2%Na ₂O, 0.2%K ₂The O batch mixing is gone into kiln heat fused, clamp dog; Reenter the kiln fusing by the flame winding-up, glass solution is blow molded into the glass fibre of 0.2 μ m.

Embodiment 3: the processing method production identical with embodiment 1, get 60.68%SiO ₂, 11%Al ₂O ₃, 5%CaO, 3%MgO, 18%B ₂O ₃And 0.10%Fe ₂O ₃, 0.10%Na ₂O, 0.12%K ₂O, 2%TiO ₂Through batch mixing, go into kiln heat fused, system ball, reel off raw silk from cocoons.

Embodiment 4: the processing method production identical with embodiment 1, get 64.88%SiO ₂, 10%Al ₂O ₃, 5%CaO, 2%MgO, 15%B ₂O ₃And 0.05%Fe ₂O ₃, 0.01%Na ₂O, 0.01%K ₂O, 0.05%TiO ₂, 1%F ₂, 2%SrO through batch mixing, the fusing clamp dog, the fusing reel off raw silk from cocoons.

The chemical constitution of product of the present invention and physical properties are as follows after testing:

Chemical ingredients	Weight %	Physical properties
			SiO 2	54.83	Density: 2.3208 gram/cm 3
Al 2O 3	11.84	Specific refractory power: 1.587
			CaO	6.49	Log3 viscosity temperature: 1298 ℃
MgO	2.37	Liquefaction temperature: 968 ℃
			B 20O 3	19.86	Specific inductivity when 1MHz: 4.6 (the KDK method of testing is according to HP AGILENT 4284A Dielectric Propertiry Meter.
Na 2O	0.14	Dielectric positive pole 0.0007 when 1MHz
			Fe 2O 3	0.05	0.0521 milligram of Na of water-repellancy (JISR3502 method of testing) 2O/ restrains glass
K 2O	0.07
		TiO 2	2
SrO	2
		F 2	1	Redox coefficient 0.47

Claims (2)

1, a kind of D glass fibre is characterized in that mainly being made up of following component, and its proportioning is weight %:

S _iO ₂ 52.63-67.95％

Al ₂O ₃ 10-12％

CaO 5-10％

MgO 2-5％

B ₂O ₃ 15-22％

Fe ₂O ₃ 0.05-0.15％。

2, glass fibre according to claim 1 is characterized in that containing at least a kind of component in the following component, and its proportioning is weight %:

Na ₂O 0-0.2％

K ₂O 0-0.2％

TiO ₂ 0-2％

SrO 0-2％

F ₂ 0-2％。