Background technology
Sensor all is crucial feedback device in a lot of Mechatronic Systems.Existing a lot of different sensor can be used, and new sensor technology is also in continuous development.Optical encoder is one of the most frequently used position transducer that is used for the measurement mechanical system moving component.Optical encoder is to close feedback device, and it will move or positional information is converted into the digital signal that can be used by electric machine control system.
Optical encoder is based on passing or producing numeral output through the encoded medium of optical encoder (for example code-disc or sign indicating number band).Generally speaking, this encoded medium utilizes the lip-deep bright area that replaces of encoded medium and dark areas (or groove) and is encoded.When encoded medium works together therewith, optical encoder will rotate or linear movement is converted to the output of two-way numeral.
Usually, optical encoder is linear optical encoders or rotary optical encoder.Linear optical encoders can utilize linear graduation to determine speed, acceleration and the position of read head with respect to encoded medium (for example liner code band), and rotary optical encoder can utilize circular scale to determine tangential velocity, acceleration and the angle position of read head with respect to encoded medium (for example code-disc).Usually, linear and rotary optical encoder can be embodied as transmission-type, reflection-type or imaging-type optical encoders.
In Fig. 1, show typical transmissive optical encoder 100 and encoded medium (for example sign indicating number band or code-disc) 102 side cross-sectional, view that combine.Optical encoder 100 can comprise read head 104, and wherein read head 104 can comprise transmitter module 106 and detector module 108.According to transmissive optical encoder 100 is linearity or rotary optical encoder, and read head 104 and encoded medium 102 can be with the mode motions relative to each other freely of linear or rotation.
Transmitter module 106 and detector module 108 can comprise respectively can be launched and detect by the optical device of transmitter module 106 to the optical radiation 110 of detector module 108.Optical radiation 110 can be visible, infrared and/or ultraviolet radiation.Transmitter module 106 can comprise the light source (not shown) as diode, light emitting diode (" LED "), photocathode (photo-cathode) and/or bulb and so on, and detector module 108 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
In Fig. 2, show the side cross-sectional, view that typical reflective optical encoder 200 combines with encoded medium 202.Reflective optical encoder 200 can comprise read head 204, and this read head 204 can comprise transmitter module 206 and detector module 208.Being similar to Fig. 1, is linearity or rotary optical encoder according to reflective optical encoder 200, and read head 204 can be with the mode motion relative to each other freely of linear or rotation with encoded medium 202.
Transmitter module 206 and detector module 208 can comprise respectively can be launched and detect by the optical device of transmitter module 206 to the optical radiation of detector module 208.This optical radiation can comprise optical radiation 210 that is issued and the optical radiation 212 that is reflected, and the former is issued on the encoded medium 202 by transmitter module 206, and the latter reflexes to detector module 208 by encoded medium 202.
It should be appreciated by those skilled in the art that this optical radiation can be visible, infrared and/or ultraviolet radiation equally.Transmitter module 206 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 208 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Similarly, in Fig. 3, show the side cross-sectional, view that typical imaging-type optical encoders 300 combines with encoded medium 302.Imaging-type optical encoders 300 can comprise read head 304, and this read head 304 can comprise transmitter module 306 and detector module 308.Being similar to Fig. 1 and 2, is linearity or rotary optical encoder according to imaging-type optical encoders 300, and read head 304 can be with the mode motion relative to each other freely of linear or rotation with encoded medium 302.
Transmitter module 306 and detector module 308 can comprise respectively can be launched and detect by the optical device of transmitter module 306 to the optical radiation of detector module 308.This optical radiation can comprise optical radiation 310 that is issued and the optical radiation 312 that is reflected, and the former is issued on the encoded medium 302 by transmitter module 306, and the latter reflexes to detector module 308 by encoded medium 302.
It should be appreciated by those skilled in the art that this optical radiation can be visible, infrared and/or ultraviolet radiation equally.Transmitter module 306 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 308 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
In Fig. 4, show by the linear optical encoders (not shown) as the typical transmission-type of sign indicating number band or the vertical view of reflection type linear encoded medium 400.As shown in Figure 4, encoded medium 400 can comprise the alternating pattern of bright area (being bright wisp 402) and dark areas (being the filaments of sun 404).Utilize encoded medium 400, linear optical encoders can be determined speed and the acceleration of read head (not shown) with respect to encoded medium 400.
Similarly, in Fig. 5, show by the rotary optical encoder (not shown) as the typical transmission-type of the code-disc on the wheel shaft 502 or the vertical view of reflection-type rotary coding medium 500.As shown in Figure 5, encoded medium 500 can comprise the alternating pattern of bright area (being bright wisp 504) and dark areas (being the filaments of sun 506).Utilize encoded medium 500, rotary optical encoder can be determined rotational speed and the acceleration of read head (not shown) with respect to encoded medium 500.
Bright and dark zone in the Figure 4 and 5 can comprise opaque respectively and transparent part, is used for blocking by the optical radiation of transmitter module to the detector module of fluorescence detector.Under the situation of transmissive optical encoder, directly the optical radiation that transfers to detector module by transmitter module is blocked by encoded medium, and under the situation of reflection-type or imaging-type optical encoders, be encoded dieletric reflection to detector module or pass the encoded medium transmission and leave detector module from the optical radiation of transmitter module.
According to optical encoder in transmissive optical encoder on the bright area of encoded medium still is dark areas or optical radiation whether be reflected onto detector module, optical encoder is output as " ON " or " OFF " of binaryzation.The electronic signal that is produced by optical encoder is passed to controller then, and this controller can be determined the position and the speed of fluorescence detector based on the signal that receives.
Usually, because its good contrast ability, transmissive optical encoder can be with high speed and high resolving power operation.But it's a pity, because transmitter module and detector module need be arranged opposite to each other around encoded medium, so transmissive optical encoder needs the package design of higher profile.
Because transmitter module is located substantially on identical plane with detector module and can be integrated in the single Semiconductor substrate in the integrated circuit, so reflective optical encoder has the package design that is better than transmissive optical encoder.This causes Comparatively speaking having package design than low profile with transmissive optical encoder, and consumptive material is less and the assembling complexity is lower.It's a pity that typical reflective optical encoder is relatively poor compared to its contrast ability of transmissive optical encoder, and compares on speed and resolution restricted thus with transmissive optical encoder.
Imaging-type optical encoders has the advantage identical with reflective optical encoder aspect profile, material and the assembling complexity usually.But imaging-type optical encoders needs the encoded medium of diffusive, and this also is not a proven technique at present.In addition, imaging-type optical encoders has irreflexive disadvantage, and compares also restricted on speed and resolution with transmissive optical encoder.
In Fig. 6, show the side cross-sectional, view that typical reflective optical encoder 600 combines with encoded medium 602.Reflective optical encoder 600 can comprise read head 604, and this read head 604 can comprise transmitter module 606 and detector module 608.Being similar to Fig. 1,2 and 3, is linearity or rotary optical encoder according to reflective optical encoder 600, and read head 604 can be with the mode motion relative to each other freely of linear or rotation with encoded medium 602.
Transmitter module 606 and detector module 608 can comprise respectively can be launched and detect by the optical device of transmitter module 606 to the optical radiation of detector module 608.This optical radiation can comprise optical radiation 610 that is issued and the optical radiation 612 that is reflected, and the former is issued on the encoded medium 602 by transmitter module 606, and the latter reflexes to detector module 608 by encoded medium 602.In addition, transmitter module 606 and detector module 608 can be mounted to common substrate 614.Substrate can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, printed circuit board (PCB) (" PCB "), flexible circuit, ceramic substrate or little interconnect equipment (" MID ") of insertion moulding.
Should be appreciated that this optical radiation can be visible, infrared and/or ultraviolet radiation equally.Transmitter module 606 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 608 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise can cover both transmission layers 616 of transmitter module 606 and detector module 608, and this transmission layer 616 can comprise and optical radiation 610 collimations that are issued can be any transmittance moulding material by the optical radiation parallel beam of transmitter module 606 guiding encoded mediums 602.Transmission layer 616 can be an epoxy layer.
It's a pity, a problem of this class reflective optical encoder 600 is that the optical radiation of not expecting 618 from transmitter module 606 transfers to detector module 608 by epoxide, and in detector module 608, producing noise, this causes the loss of the picture contrast in zone bright and dark on the encoded medium 602 (i.e. " bar ").This loss of picture contrast has limited the speed and the resolution of typical known reflective optical encoder 600.Thus, need compare with known reflective optical encoder the more improved reflective optical encoder of hi-vision contrast and resolution can be provided.
Embodiment
With reference to forming its a part of accompanying drawing, it illustrates as example can realize specific embodiments of the invention in the following description.Without departing from the scope of the invention, can use other implementation example and can change structure.
As mentioned above, a problem of the reflective optical encoder of known type is that the optical radiation of not expecting from transmitter module transfers to detector module by epoxide, produce noise thus in detector module, this causes the loss of the picture contrast in zone bright and dark on the encoded medium (i.e. " bar ").This loss of picture contrast has limited the speed and the resolution of typical known reflective optical encoder.So, a kind of reflective optical encoder (" EROE ") of enhancing has been described, it is compared with known reflective optical encoder, and higher picture contrast and resolution can be provided.EROE can use the light isolated component that is arranged in transmission layer, and this light isolated component can comprise the transmission layer ditch shown in Fig. 7,8 and 9, or the light clapboard parts shown in Figure 12,13 and 14.This light isolated component also can be positioned at the top of transmission layer as shown in figure 11.
In Fig. 7, show side cross-sectional, view in conjunction with a kind of implementation example of the EROE 700 of encoded medium 702, wherein the light isolated component is a transmission layer ditch 720, it can comprise the bottom of trench 728 that is positioned on the substrate 714.EROE 700 can comprise read head 704, and this read head 704 can comprise transmitter module 706 and detector module 708.Being similar to Fig. 1,2,3 and 6, is linearity or rotary optical encoder according to EROE700, and read head 704 can freely move relative to each other in mode linear or rotation respectively with encoded medium 702.
Transmitter module 706 and detector module 708 can have respectively can be launched and detect by the optical device of transmitter module 706 to the optical radiation of detector module 708.This optical radiation can comprise: the optical radiation 710 that is issued, and it is issued on the encoded medium 702 by transmitter module 706; And the optical radiation 712 that is reflected, it reflexes to detector module 708 by encoded medium 702.In addition, transmitter module 706 and detector module 708 can be mounted on the common substrate 714.This common substrate 714 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, printed circuit board (PCB) (" PCB "), flexible circuit, ceramic substrate or little interconnect equipment (" MID ") of insertion moulding.
Should be appreciated that this optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 706 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 708 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise transmission layer, it has first epoxy layer 716 that can cover transmitter module 706 and second epoxy layer 718 that covers detector module 708, wherein first epoxy layer 716 and second epoxy layer 718 can comprise any such transmittance moulding material, it can be the parallel beam by the optical radiation of transmitter module 706 guiding encoded mediums 702 with the optical radiation that is issued 710 collimations respectively, and can concentrate the optical radiation 712 of reflection to become a branch of optical radiation of direct detection device module 708.
Transmission layer can be used to make optical radiation 710 bendings of sending and be used for encapsulation.If transmitter module 706 sends visible light, then the color of transmission layer can be clear transparent.But, if transmitter module 706 sends infrared radiation, then because infrared radiation can penetrate the black dyes epoxide, so transmission layer can be painted by black dyes.In addition, transmission layer comprises any painted epoxide (as redness, yellow etc.).
Be different from reflective optical encoder shown in Figure 6 600, EROE 700 can comprise the transmission layer ditch 720 (as air gap) that is between first epoxy layer 716 and second epoxy layer 718.The surface 722 of transmission layer ditch 720 can attenuate at a predetermined angle and make with convenient.Transmission layer ditch 720 makes optical radiation 724 refractions of not expecting leave detector module 708, and this has reduced the noise that is brought by the optical radiation of not expecting 724 on the detector module 708.
In Fig. 7, transmission layer ditch 720 extends to substrate 714 alternatively; But, it should be appreciated by those skilled in the art that transmission layer ditch 720 or can not extend to substrate 714.As example, in Fig. 7, transmission layer ditch 720 can comprise the bottom of trench 728 that is located substantially on the substrate 714.Those skilled in the art be also to be understood that if bottom of trench 728 is located substantially on the substrate 714 then first epoxy layer 716 and second epoxy layer 718 can not intersect at bottom of trench 728 places, but intersect at other position (not shown).
In Fig. 8, show side cross-sectional, view in conjunction with another implementation example of the EROE 800 of encoded medium 802, wherein the light isolated component is a transmission layer ditch 820, it can have the bottom of trench 822 that is not positioned on the substrate 814.Be similar to Fig. 7, EROE 800 can comprise read head 804, and this read head 804 can comprise transmitter module 806 and detector module 808.Being similar to Fig. 1,2,3,6 and 7, is linearity or rotary optical encoder according to EROE 800, and read head 804 can freely move relative to each other in mode linear or rotation respectively with encoded medium 802.
Transmitter module 806 and detector module 808 can have respectively can be launched and detect by the optical device of transmitter module 806 to the optical radiation of detector module 808.This optical radiation can comprise: the optical radiation 810 that is issued, and it is issued on the encoded medium 802 by transmitter module 806; And the optical radiation 812 that is reflected, it reflexes to detector module 808 by encoded medium 802.In addition, transmitter module 806 and detector module 808 can be mounted on the common substrate 814.This common substrate 814 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
Should be appreciated that this optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 806 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 808 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise transmission layer, it has first epoxy layer 816 that can cover transmitter module 806 and second epoxy layer 818 that covers detector module 808, wherein first epoxy layer 816 and second epoxy layer 818 can comprise any such transmittance moulding material, it can be the parallel beam by the optical radiation of transmitter module 806 guiding encoded mediums 802 with the optical radiation that is issued 810 collimations respectively, and can concentrate the optical radiation 812 of reflection to become a branch of optical radiation of direct detection device module 808.
Be similar to EROE shown in Figure 7 700, EROE 800 can comprise the transmission layer ditch 820 (as air gap) that is between first epoxy layer 816 and second epoxy layer 818.The surface 824 of transmission layer ditch 820 can attenuate at a predetermined angle and make with convenient.Transmission layer ditch 820 makes optical radiation 826 refractions of not expecting leave detector module 808, and this has reduced the noise that is brought by the optical radiation of not expecting 826 on the detector module 808.In Fig. 8, bottom of trench 822 does not extend to common substrate 814.
The degree of depth 828 that it should be appreciated by those skilled in the art that transmission layer ditch 820 can be by transmitter module 806 and the lens arrangement by first epoxy layer 816, and detector module 808 and determine by the lens arrangement of second epoxy layer 818.Generally speaking, performance improves along with the increase of the degree of depth 828, and the optical radiation of not expecting up to major part 826 is all stoped by transmission layer ditch 820.In addition, transmission layer ditch 820 can be designed as has on the ditch width 832 under the width 830 and ditch, and it has and prevents that the optical radiation of not expecting from being leaked out to the optical effect of detector module 808 by transmitter module 806.
For example, width 830 can be 0.5 millimeter (" mm ") on the ditch, and width 832 can be 0.3mm under the ditch, and ditch depth 828 can be 0.3mm.But the detector surface zone (not shown) of the profile of position between the size of the lens that width 832 and ditch depth 828 is made of epoxy layer 816 and 818 usually under width 830, the ditch on the ditch, transmitter light-emitting zone (not shown), transmitter module 806 and the detector module 808 on the transmitter module 806 and the lens that constitute to epoxy layer 818 is determined.
In Fig. 9, show side cross-sectional, view in conjunction with another implementation example of the EROE 900 of encoded medium 902, wherein the light isolated component is a transmission layer ditch 920, it can have the bottom of trench 928 that is positioned on the substrate 914.In this example, EROE 900 can comprise read head 904, and this read head 904 can comprise transmitter module 906 and detector module 908.Being similar to Fig. 1,2,3,6,7 and 8, is linearity or rotary optical encoder according to EROE 900, and read head 904 can freely move relative to each other in mode linear or rotation respectively with encoded medium 902.
Transmitter module 906 and detector module 908 can have respectively can be launched and detect by the optical device of transmitter module 906 to the optical radiation of detector module 908.This optical radiation can comprise: the optical radiation 910 that is issued, and it is issued on the encoded medium 902 by transmitter module 906; And the optical radiation 912 that is reflected, it reflexes to detector module 908 by encoded medium 902.In addition, transmitter module 906 and detector module 908 can be mounted on the common substrate 914.This common substrate 914 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
Should be appreciated that this optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 906 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 908 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise first epoxy layer 916 that can cover transmitter module 906 and second epoxy layer 918 that covers detector module 908, wherein first epoxy layer 916 and second epoxy layer 918 can comprise any so transparent moulding material, it can be the parallel beam by the optical radiation of transmitter module 906 guiding encoded mediums 902 with the optical radiation that is issued 910 collimations respectively, and can concentrate the optical radiation 912 of reflection to become a branch of optical radiation of direct detection device module 908.
Be similar to EROE 700 shown in Fig. 7 and 8 and EROE 800, the EROE 900 among Fig. 9 can comprise the transmission layer ditch 920 (as air gap) that is between first epoxy layer 916 and second epoxy layer 918.The surface 922 of transmission layer ditch 920 can attenuate at a predetermined angle and make with convenient.Be different from the EROE 700 among Fig. 7, the surface 922 of the EROE 900 among Fig. 9 can scribble the black absorption material, and it absorbs the optical radiation 924 that a part is not expected, and the optical radiation 926 that another part is not expected is refracted and leaves detector module 908.The black absorption material of surface on 922 also helps to reduce the noise that caused by the optical radiation of not expecting 924 and 926 on the detector module 908.The black absorption material of surface on 922 can comprise and anyly prevent that optical radiation 924 from passing the material of this material.The material that the example of black absorption material can comprise pseudo-black electronic unit, anodized metallization, independent black plastic piece, black absorption epoxide, black polymer, fills carbon polymer, black resin, black ink blok, epoxide coating, laser calcination surface and other similarly can the absorbing light radiation.
Equally, transmission layer ditch 920 can extend to substrate 914 alternatively; But should be appreciated that transmission layer ditch 920 also can not extend to substrate 914.As example, in Fig. 9, transmission layer ditch 920 can comprise the bottom of trench 928 that is located substantially on the substrate 914.It will further be appreciated by those skilled in the art that if bottom of trench 928 is located substantially on the substrate 914 then first epoxy layer 916 and second epoxy layer 918 can not intersect at bottom of trench 928 places, but intersect at other position (not shown).
In Figure 10, show side cross-sectional, view in conjunction with another implementation example of the EROE 1000 of encoded medium 1002, wherein the light isolated component is a transmission layer ditch 1020.In this example, EROE 1000 can comprise read head 1004, and this read head 1004 can comprise transmitter module 1006 and detector module 1008.Being similar to Fig. 1,2,3,6,7,8 and 9, is linearity or rotary optical encoder according to EROE1000, and read head 1004 can freely move relative to each other in mode linear or rotation respectively with encoded medium 1002.
Transmitter module 1006 and detector module 1008 can have respectively can be launched and detect by the optical device of transmitter module 1006 to the optical radiation of detector module 1008.This optical radiation can comprise: the optical radiation 1010 that is issued, and it is issued on the encoded medium 1002 by transmitter module 1006; And the optical radiation 1012 that is reflected, it reflexes to detector module 1008 by encoded medium 1002.In addition, transmitter module 1006 and detector module 1008 can be mounted on the common substrate 1014.Common substrate 1014 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
This optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 1006 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 1008 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise first epoxy layer 1016 that can cover transmitter module 1006 and second epoxy layer 1018 that covers detector module 1008, wherein first epoxy layer 1016 and second epoxy layer 1018 can comprise any so transparent moulding material, it can be a branch of directional light radiation by transmitter module 1006 guiding encoded mediums 1002 with the optical radiation that is issued 1010 collimations respectively, and can concentrate the optical radiation 1012 of reflection to become a branch of optical radiation of direct detection device module 1008.
Be similar to the EROE 900 among Fig. 9, the EROE 1000 among Figure 10 can comprise the transmission layer ditch 1020 (as air gap) that is between first epoxy layer 1016 and second epoxy layer 1018.The surface 1022 of transmission layer ditch 1020 can attenuate at a predetermined angle and make with convenient.Be different from the EROE 900 among Fig. 9, the surface 1022 of EROE 1000 among Figure 10 can be filled with black absorption material 1024, it absorbs the optical radiation 1026 that a part is not expected, and the optical radiation 1028 that another part is not expected is refracted and leaves detector module 1008.Black absorption material 1024 also helps to reduce the noise that produced by the optical radiation of not expecting 1026 and 1028 on detector module 1008.The black absorption material of surface on 1022 can comprise and anyly prevent that optical radiation 1026 from passing the material of this material.The material that the example of black absorption material can comprise pseudo-black electronic unit, anodized metallization, independent black plastic piece, black absorption epoxide, black polymer, fills carbon polymer, black resin, black ink blok, epoxide coating, laser calcination surface and other similarly can the absorbing light radiation.And transmission layer ditch 1020 can extend to substrate 1014 alternatively: still, it should be understood that transmission layer ditch 1020 also can not extend to substrate 1014.
In Figure 11, show side cross-sectional, view in conjunction with another implementation example of the EROE 1100 of encoded medium 1102, wherein the light isolated component is a top surface 1120, can scribble the black absorption material on it.In this example, EROE 1100 can comprise read head 1104, and this read head 1104 can comprise transmitter module 1106 and detector module 1108.Being similar to Fig. 1,2,3,6,7,8,9 and 10, is linearity or rotary optical encoder according to EROE 1100, and read head 1104 can freely move relative to each other in mode linear or rotation respectively with encoded medium 1102.
Transmitter module 1106 and detector module 1108 can have respectively can be launched and detect by the optical device of transmitter module 1106 to the optical radiation of detector module 1108.This optical radiation can comprise: the optical radiation 1110 that is issued, and it is issued on the encoded medium 1102 by transmitter module 1106; And the optical radiation 1112 that is reflected, it reflexes to detector module 1108 by encoded medium 1102.In addition, transmitter module 1106 and detector module 1108 can be mounted on the common substrate 1114.Common substrate 1114 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
This optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 1106 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 1108 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise first epoxy layer 1116 that can cover transmitter module 1106 and second epoxy layer 1118 that covers detector module 1108, wherein first epoxy layer 1116 and second epoxy layer 1118 can comprise any so transparent moulding material, it can be a branch of directional light radiation by transmitter module 1106 guiding encoded mediums 1102 with optical radiation 1110 collimations that are issued respectively, and can concentrate reflected light radiation 1112 to become a branch of optical radiation of direct detection device module 1108.
EROE 1100 can comprise the top surface 1120 that is between first epoxy layer 1116 and second epoxy layer 1118.Top surface 1120 can scribble the black absorption material, and it absorbs the optical radiation 1122 that a part is not expected, and the optical radiation 1124 that another part is not expected is refracted and leaves detector module 1108.Top surface 1120 also helps to reduce the noise that produced by the optical radiation of not expecting 1122 and 1124 on detector module 1108.Black absorption material on the top surface 1120 can comprise any material that absorbs the optical radiation of not expecting 1122.The example of black absorption material can comprise black polymer, fills carbon polymer, black resin, ink blok, epoxide coating and laser calcination surface.
In Figure 12, show side cross-sectional, view in conjunction with another implementation example of the EROE 1200 of encoded medium 1202, wherein the light isolated component is light clapboard parts 1220.In this example, EROE 1200 can comprise read head 1204, and this read head 1204 can comprise transmitter module 1206 and detector module 1208.Being similar to Fig. 1,2,3,6,7,8,9,10 and 11, is linearity or rotary optical encoder according to EROE 1200, and read head 1204 can freely move relative to each other in mode linear or rotation respectively with encoded medium 1202.
Transmitter module 1206 and detector module 1208 can have respectively can be launched and detect by the optical device of transmitter module 1206 to the optical radiation of detector module 1208.This optical radiation can comprise: the optical radiation 1210 that is issued, and it is issued on the encoded medium 1202 by transmitter module 1206: and the optical radiation 1212 that is reflected, it reflexes to detector module 1208 by encoded medium 1202.In addition, transmitter module 1206 and detector module 1208 can be mounted on the common substrate 1214.Common substrate 1214 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
This optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 1206 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 1208 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise first epoxy layer 1216 that can cover transmitter module 1206 and second epoxy layer 1218 that covers detector module 1208, wherein first epoxy layer 1216 and second epoxy layer 1218 can comprise any so transparent moulding material, it can be a branch of directional light radiation by transmitter module 1206 guiding encoded mediums 1202 with the optical radiation that is issued 1210 collimations respectively, and can concentrate the optical radiation 1212 of reflection to become a branch of optical radiation of direct detection device module 1208.
EROE 1200 can comprise the light clapboard parts 1220 that are between first epoxy layer 1216 and second epoxy layer 1218.Light clapboard parts 1220 can scribble the black absorption material, and it absorbs the optical radiation 1222 that a part is not expected, and the optical radiation 1224 that another part is not expected is refracted and leaves detector module 1208.Light clapboard parts 1220 also help to reduce by optical radiation of not expecting 1222 and 1224 noises that cause on detector module 1208.Light clapboard parts 1220 can be rectangles.Black absorption material on the light clapboard parts 1220 can comprise the black absorption parts, for example pseudo-black electronic unit, anodized metallization, independent black plastic piece, black absorption epoxide, black polymer, fills the material that carbon polymer, black resin, black ink blok, epoxide coating, laser calcination surface and other similarly can the absorbing light radiation.
In Figure 13, show side cross-sectional, view in conjunction with another implementation example of the EROE 1300 of encoded medium 1302, the light isolated component is light clapboard parts 1320.In this example, EROE1300 can comprise read head 1304, and this read head 1304 can comprise transmitter module 1306 and detector module 1308.Being similar to Fig. 1,2,3,6,7,8,9,10,11 and 12, is linearity or rotary optical encoder according to EROE 1300, and read head 1304 can freely move relative to each other in mode linear or rotation respectively with encoded medium 1302.
Transmitter module 1306 and detector module 1308 can have respectively can be launched and detect by the optical device of transmitter module 1306 to the optical radiation of detector module 1308.This optical radiation can comprise: the optical radiation 1310 that is issued, and it is issued on the encoded medium 1302 by transmitter module 1306; And the optical radiation 1312 that is reflected, it reflexes to detector module 1308 by encoded medium 1302.In addition, transmitter module 1306 and detector module 1308 can be mounted on the common substrate 1314.Common substrate 1314 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
This optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 1306 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 1308 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise first epoxy layer 1316 that can cover transmitter module 1306 and second epoxy layer 1318 that covers detector module 1308, wherein first epoxy layer 1316 and second epoxy layer 1318 can comprise any so transparent moulding material, it can be a branch of directional light radiation by transmitter module 1306 guiding encoded mediums 1302 with optical radiation 1310 collimations that are issued respectively, and can concentrate reflected light radiation 1312 to become a branch of optical radiation of direct detection device module 1308.
Be similar to the EROE 1200 among Figure 12, the EROE 1300 among Figure 13 can comprise the light clapboard parts 1320 that are between first epoxy layer 1316 and second epoxy layer 1318.Light clapboard parts 1320 can scribble the black absorption material, and it absorbs the optical radiation 1322 that a part is not expected, and the optical radiation 1324 that another part is not expected is refracted and leaves detector module 1308.Light clapboard parts 1320 also help to reduce the noise that produced by the optical radiation of not expecting 1322 and 1324 on detector module 1308.Light clapboard parts 1320 can be downward trapezoidal shapes.Black absorption material on the light clapboard parts 1320 can comprise the black absorption parts, for example pseudo-black electronic unit, anodized metallization, independent black plastic piece, black absorption epoxide, black polymer, fills the material that carbon polymer, black resin, black ink blok, epoxide coating, laser calcination surface and other similarly can the absorbing light radiation.
It should be appreciated by those skilled in the art that light clapboard parts 1320 can extend to common substrate 1314 as shown in figure 13; But should be appreciated that also light clapboard parts 1320 also can not extend to common substrate 1314.Be also to be understood that light clapboard parts 1320 can be by at first forming ditch as shown in Figure 8, the black absorption parts that re-use selection are filled this ditch and are constituted.
In Figure 14, show side cross-sectional, view in conjunction with another implementation example of the EROE 1400 of encoded medium 1402.In this example, EROE 1400 can comprise read head 1404, and this read head 1404 can comprise transmitter module 1406 and detector module 1408.Being similar to Fig. 1,2,3,6,7,8,9,10,11,12 and 13, is linearity or rotary optical encoder according to EROE 1400, and read head 1404 can freely move relative to each other in mode linear or rotation respectively with encoded medium 1402.
Transmitter module 1406 and detector module 1408 can have respectively can be launched and detect by the optical device of transmitter module 1406 to the optical radiation of detector module 1408.This optical radiation can comprise: the optical radiation 1410 that is issued, and it is issued on the encoded medium 1402 by transmitter module 1406; And the optical radiation 1412 that is reflected, it reflexes to detector module 1408 by encoded medium 1402.In addition, transmitter module 1406 and detector module 1408 can be mounted on the common substrate 1414.Common substrate 1414 can be single Semiconductor substrate, the lead frame in the integrated circuit, lead frame, PCB, flexible circuit, ceramic substrate or the MID of insertion moulding.
This optical radiation can be visible, infrared and/or ultraviolet radiation.Transmitter module 1406 can comprise the light source (not shown) as diode, LED, photocathode and/or bulb and so on, and detector module 1408 can comprise the photodetector array (not shown) as photodiode, photocathode and/or photomultiplier cell and so on.
Optical device can comprise first epoxy layer 1416 that can cover transmitter module 1406 and second epoxy layer 1418 that covers detector module 1408, wherein first epoxy layer 1416 and second epoxy layer 1418 can comprise any so transparent moulding material, it can be a branch of directional light radiation by transmitter module 1406 guiding encoded mediums 1402 with optical radiation 1410 collimations that are issued respectively, and can concentrate reflected light radiation 1412 to become a branch of optical radiation of direct detection device module 1408.
Be similar to the EROE 1300 among Figure 13, the EROE 1400 among Figure 14 can comprise the light clapboard parts 1420 that are between first epoxy layer 1416 and second epoxy layer 1418.Light clapboard parts 1420 can scribble the black absorption material, and it absorbs the optical radiation 1422 that a part is not expected, and the optical radiation 1424 that another part is not expected is refracted and leaves detector module 1408.Light clapboard parts 1420 also help to reduce the noise that produced by the optical radiation of not expecting 1422 and 1424 on detector module 1408.Light clapboard parts 1420 can be trapezoidal shapes upwards.Black absorption material on the light clapboard parts 1420 can comprise the black absorption parts, for example pseudo-black electronic unit, anodized metallization, independent black plastic piece, black absorption epoxide, black polymer, fills the material that carbon polymer, black resin, black ink blok, epoxide coating, laser calcination surface and other similarly can the absorbing light radiation.
It should be appreciated by those skilled in the art that light clapboard parts 1420 can extend to common substrate 1414 as shown in figure 14; But should be appreciated that also light clapboard parts 1420 also can not extend to common substrate 1414.Be also to be understood that light clapboard parts 1420 can be by at first forming ditch as shown in Figure 8, the black absorption parts that re-use selection are filled this ditch and are constituted.
In Figure 15, show the diagrammatic representation of Figure 150 0 that the picture contrast 1502 of the different implementations of the EROE among Fig. 6,7,10 and 11 changes with code-bar resolution 1504.Drawing curve 1506 shows the variation of the picture contrast of typical known reflective optical encoder 600 shown in Figure 6 with code-bar resolution.Drawing curve 1508 shows the picture contrast of EROE 1000 of the top surface 1020 that utilizes the laser calcination as shown in figure 10 or ink blok is arranged with the variation of code-bar resolution.Drawing curve 1510 shows the variation of the picture contrast of the EROE 700 that utilizes transmission layer ditch 720 as shown in Figure 7 with code-bar resolution.Drawing curve 1512 shows the picture contrast of EROE 1200 utilizing the side to scribble the EROE 800 of the transmission layer ditch 820 of black absorption material as shown in Figure 8, utilize the EROE 900 of the transmission layer ditch 920 be filled with the black absorption material as shown in Figure 9, utilize the EROE 1100 of light clapboard parts 1120 and utilize light clapboard parts 1220 shown in Figure 12 and 14 as shown in figure 11 with the variation of code-bar resolution.
The explanation that will appreciate that above-mentioned implementation only is in order to explain and to describe.This is not exhaustive and does not limit the invention to disclosed precise forms.It is possible revising or changing based on foregoing description, maybe can obtain from implementing the present invention.Appended claim and equivalent thereof have defined scope of the present invention.