CN1770359A - Plasma display device and manufacturing method thereof - Google Patents

Plasma display device and manufacturing method thereof Download PDF

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Publication number
CN1770359A
CN1770359A CN 200410067882 CN200410067882A CN1770359A CN 1770359 A CN1770359 A CN 1770359A CN 200410067882 CN200410067882 CN 200410067882 CN 200410067882 A CN200410067882 A CN 200410067882A CN 1770359 A CN1770359 A CN 1770359A
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China
Prior art keywords
plasma display
spaced walls
decomposition layer
organic decomposition
panel
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CN 200410067882
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Chinese (zh)
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CN100377279C (en
Inventor
林钟来
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LG Electronics Nanjing Display Co Ltd
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LG Electronics Nanjing Display Co Ltd
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Priority to CNB200410067882XA priority Critical patent/CN100377279C/en
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Publication of CN100377279C publication Critical patent/CN100377279C/en
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Abstract

This invention relates to plasma display and its process method to clear discharging organism in discharging space. The plasma display is characterized by the following: dividing the discharging isolation wall by upper and down parts panel set; the said isolation wall surface and inside make the organism oxidation analyze organic layer on the wall.

Description

Plasma display and preparation method thereof
[technical field]
The invention relates to plasma display.Specifically, remain in organic plasma display in the discharge space and preparation method thereof about removing.
[background technology]
Plasma display (Plasma Display Panel: hereinafter to be referred as: " PDP ") be by He+Xe, Ne+Xe, and the 147nm ultraviolet ray that produces during gas discharge such as He+Ne+Xe makes light-emitting phosphor, and shows picture and the mobile image that comprises literal, picture.This plasma display can not only be easy to become ultra-thinization and maximization, and by means of the exploitation of technology recently, it can also increase substantially image quality.
Original plasma display shown in Figure 1 is made of following several parts: be equipped with and keep electrode group 4 Y, the upper panel 16 of 4Z; The lower panel 14 of data electrode 2X is installed.
Keep electrode group 4Y in formation, form upper dielectric layer 12 and diaphragm 10 on the upper panel 16 of 4Z successively.Upper dielectric layer 12 is being carried out plasma discharge gathering wall electric charge, and electrode group 4Y is kept in diaphragm 10 protections, and the ion that 4Z and upper dielectric layer 12 produce when not being subjected to plasma discharge swashs the influence of penetrating, and has the effect of the emission efficiency that improves 2 electronics simultaneously.
On the lower panel 14 that forms data electrode 2X, form the spaced walls 8 of separating lower dielectric layer 18 and discharge cell body.Surface coated fluorescent material 6 in lower dielectric layer 18 and spaced walls 8.The ultraviolet irradiation that fluorophor 6 produces by by plasma discharge time the and luminous, and produce visible light.
Below, the manufacture method of the lower plate that comprises original data electrode 2X, lower dielectric layer 18, spaced walls 8 and fluorophor 6 is described.
At first, shown in Fig. 2 a, the data metallics on the lower panel 14 is all carried out finalizing the design behind the plated film, thereby form data electrode 2X.Shown in Fig. 2 b, the dielectric substance that will be positioned on the lower panel 14 that forms data electrode 2X is printed comprehensively, thereby forms lower dielectric layer 18.Behind pressroom next door paint on the lower panel 14 that forms lower dielectric layer 18, under sintering temperature, carry out roasting, shown in Fig. 2 c, form spaced walls 8.Then, after printing the fluorescence paint on spaced walls 8 lower dielectric layer 18, under sintering temperature, carry out roasting, shown in Fig. 2 d, form fluorophor 6.
By making the original PDP spaced walls 8 and the roasting process of fluorophor 6, remove spaced walls paint and fluorophor paint.But by the surface of the inexpungible organic substance residues of described roasting process at spaced walls 8 and fluorophor 6, these organic substances are discharged to discharge space, can exert an influence to discharge gas.That is to say that the discharging efficiency when residual organic reduces discharge in discharge space reduces brightness.Simultaneously, can shorten the useful life of PDP.This is its existing problem.
[summary of the invention]
Therefore, the object of the present invention is to provide a kind of plasma display that can remove the inner residual organic of discharge space and preparation method thereof.
In order to realize described purpose, has the feature that constitutes by following several parts: the spaced walls of distinguishing the discharge space that is provided with according to last/lower panel according to plasma display of the present invention; Be arranged in the surface of described spaced walls and inside on any one, the organic decomposition layer that the oxidation operation that remains on the described spaced walls is decomposed.
Described organic decomposition layer has following feature: promptly contain Tio 2(being anatase (anatase) shape).
Described organic decomposition layer has following feature: promptly it is a kind of at the ultraviolet material that reacts down of penetrating.
Described organic decomposition layer has following feature: promptly it is a kind of material that reacts under the irradiation of 380nm light that is approximately at wavelength.
Has following feature according to plasma display of the present invention: promptly also comprise the fluorophor that forms the organic decomposition layer at least one that is arranged in described spaced walls surface and inside.
In order to realize described purpose, has the feature that constitutes by following step: the step that in panel surface and inside, forms the spaced walls that has the organic decomposition layer on any one according to the manufacture method of plasma display of the present invention; To form the panel of described spaced walls attached to the step on the cavity (chamber); Form the panel of described spaced walls with ultraviolet irradiation, remain in organic step on the described spaced walls with removing.
Described organic decomposition layer has following feature: promptly contain Tio 2(being the anatase shape).
Described organic decomposition layer has following feature: promptly it is the material that reacts under a kind of irradiation of the light that is approximately 380nm at wavelength.
Described plasma display manufacture method has following feature: promptly also be included in described spaced walls surface and the inside step that forms the fluorophor that constitutes organic decomposition layer at least one.
In order to realize described purpose, has the feature that constitutes by following step: will form the lower panel of the spaced walls that has the organic decomposition layer and upper panel attached to the step on any one in panel surface and the inside according to plasma display manufacture method of the present invention; With ultraviolet irradiation described on/inside of lower panel remains in organic substance on the described spaced walls and the step of carrying out exhaust with removing.
Described organic decomposition layer has following feature: promptly contain Tio 2(being the anatase shape).
Described organic decomposition layer has following feature: promptly it is a kind of material that reacts under the irradiation of 380nm light that is approximately at wavelength.
Described plasma display manufacture method has following feature: promptly also be included in described spaced walls surface and the inside step that forms the fluorophor that constitutes organic decomposition layer at least one.
Except described purpose,, can understand other purpose of the present invention and feature by of the explanation of reference accompanying drawing to the foundation embodiment of the invention.
As mentioned above, according to plasma display of the present invention and preparation method thereof, surface of at least one and inner formation comprise Anatase state Tio in fluorophor and spaced walls 2The organic decomposition layer.Therefore, after fluorophor and spaced walls formation, also can dispose remaining in its surperficial organic substance, can prevent the reduction of the instability and the flash-over characteristic of discharge like this by the organic decomposition layer.
[description of drawings]
Fig. 1 is the oblique view of the surface discharge type plasma display of expression AC driving mode.
Diagram 2a to Fig. 2 d is the sectional view of the following board manufacturing method of expression plasma display shown in Figure 1.
Fig. 3 is the sectional view of expression according to plasma display of the present invention.
Fig. 4 is the sectional view that is illustrated in the organic decomposition layer of spaced walls surface formation.
Fig. 5 is expressed as the sectional view that the organic process on spaced walls and the fluorophor that remains in is removed in explanation.
Fig. 6 is expressed as the sectional view that other embodiment of the organic process on spaced walls and the fluorophor that remains in is removed in explanation.
[embodiment]
Below, with reference to Fig. 3 to Fig. 6 foundation desirable embodiment of the present invention is elaborated.
Fig. 3 is the sectional view of expression according to the PDP of invention.
With reference to Fig. 3 as can be seen, according to plasma display of the present invention by constituting with next part: what form successively on upper panel 46 keeps electrode group 34Y, 34Z; The top panel that has upper dielectric layer 42 and diaphragm 40; Have the addressing electrode 32X that on lower panel 44, forms successively, lower dielectric layer 48, the lower panel of spaced walls 38 and luminescent coating 36.Spaced walls 38 is with upper panel 46 and 44 parallel separating of lower panel.
Keep electrode group 34Y, 34Z is by scan electrode 34Y and keep electrode 34Z and constitute.Mainly supply with for the sweep signal of carrying out substrate (panel) scanning with for keeping the signal of keeping of discharge to scan electrode 34Y, mainly supply with and keep signal to keeping electrode 34Z.
Keep electrode group 34Y, 34Z is respectively by the amplitude with relative broad, and light transmittance is more than 90%, the transparency electrode 50a that the better conductivity material forms, and 52a and bus electrode 50b with relative narrower amplitude, 52b constitutes.Here, transparency electrode 50a, 52a does not have resistance, and volume is bigger, so transferring electric power effectively.Therefore, at transparency electrode 50a, 52a is last to form bus electrode 50b with metallicses such as better conductivity silver, copper, and 52b is to strengthen transparency electrode 50a, the resistance of 52a.
Diaphragm 40 not only can protect upper dielectric layer 42 not to be subjected to the infringement of sputter, prolongs the useful life of PDP.And can improve the emission efficiency of 2 electronics.Diaphragm 40 normally uses magnesium oxide (MgO) to constitute.
Data electrode 32X with keep electrode group 34Y, 34Z intersects to form, for the cell body of selecting to show is supplied with data-signal to data electrode 32X.
Spaced walls 38 is arranged side by side with data electrode 32X, can prevent to be leaked on adjacent cell body by the discharge generation ultraviolet ray.This spaced walls 38 is added organic analyte 60 to the spaced walls material as shown in Figure 3, perhaps as shown in Figure 4, forms organic decomposition layer 60 on the surface of spaced walls 38, and the organic substance that remains in discharge space inside is carried out oxidation Decomposition.For example, organic decomposition layer and organic decomposition material 60 comprise the Tio of Anatase state 2
Form the organic decomposition thing of organic decomposition layer, i.e. the Tio of Anatase state 2Be the semiconductor substance that is made of transparent minuteness particle powder, its acidity or alkalescence are stronger.In addition, even under the photocatalysis, itself can not change or reduce yet.
The Tio of this Anatase state 2Wavelength (photon energy of about 36000K) with about 380nm bandwidth.In contrast to this, if with the short near ultraviolet ray light irradiation surface of wavelength, will be with light absorption, and produced the activate oxygen of strong oxidation.That is to say, if with the Tio of the ultraviolet light irradiation Anatase state that is comprised in relatively more weak illumination light or the natural daylight 2The surface, the photochemical reaction of carrying out with 36000K on its surface is with Tio 2Particle unit carries out.Here, the Tio of irradiation Anatase state 2Light and light intensity irrelevant, if light wavelength is identical, then photon energy is also identical.Therefore, can be with the ultraviolet that contains in relatively more weak illumination light or the natural daylight.
In view of the above, with the Tio of Anatase state 2Surface contact all burned decomposition of all organic substances and become oxide (CO, the Co of carbon 2).
Luminescent coating 36 is distributed in the surface of lower dielectric layer 48 and spaced walls 38, and it produces red, green, perhaps any one visible light in the blue light.Simultaneously, to the discharge space inert gas injecting of inside to produce gas discharge.Form organic decomposition layer on the surface of this luminescent coating 36 or in the material of fluorophor 36, add organic analyte, thereby the oxidation operation that remains in discharge space inside can be decomposed.
Fig. 5 is the sectional view of expression according to the organic substance decomposable process of PDP of the present invention.
With reference to Fig. 5 as can be seen, the lower panel 44 that forms spaced walls 38, organic decomposition layer 60, fluorophor 36 is inserted to vacuum cavity (chamber) 80.Then, if the organic decomposition layer 60 that forms on lower panel 44 with ultraviolet irradiation, so after spaced walls 38 or fluorophor 36 form, the organic substance that remains in its inner and surface also can oxidized burning and become and contain CO, Co 2Oxide in carbon.The oxide of carbon is discharged to the outside by the exhaust outlet 82 of vacuum cavity (chamber) 80.
Fig. 6 is the sectional view of expression according to other form of the organic substance decomposable process of PDP of the present invention.
With reference to Fig. 6 as can be seen, forming the upper panel 46 of keeping electrode and the lower panel 44 that forms organic decomposition layer and spaced walls 38 contacts.Then, carry out the exhaust process of substrate.At this moment,, substrate is carried out exhaust/heating, after spaced walls 38 or fluorophor 36 formation, rely on ultraviolet ray also can decompose, contain CO and become, Co remaining in its inner or surperficial organic compound combustion with ultraviolet irradiation substrate inside 2Oxide in carbon.The oxide of carbon is discharged to the outside by the exhaust outlet 72 of lower panel.
By described description, the related work personnel can carry out various change and modification fully in the scope that does not depart from this invention technological thought.
Therefore, the technical scope of this invention is not limited to the content on the specification, must determine its technical scope according to interest field.

Claims (9)

1, plasma display comprises:
Differentiation is according to the spaced walls of the discharge space of last/lower panel setting;
Be arranged at least one of the surface of described spaced walls and inside the organic decomposition layer that the oxidation operation that remains on the described spaced walls is decomposed.
2, plasma display as claimed in claim 1 is characterized in that,
Described organic decomposition layer contains the Tio that is the anatase shape 2
3, plasma display as claimed in claim 1 is characterized in that,
Described organic decomposition layer is a kind of material that reacts under ultraviolet irradiation.
4, plasma display as claimed in claim 1 is characterized in that,
Described organic decomposition layer is the material that reacts under a kind of irradiation of the light that is approximately 380nm at wavelength.
5, plasma display as claimed in claim 1 is characterized in that,
Also comprise and form the fluorophor be arranged in described spaced walls surface and the inside organic decomposition layer at least one.
6, the manufacture method of plasma display comprises:
In panel surface and inside, form the step of the spaced walls that has the organic decomposition layer on any one;
To form the panel of described spaced walls attached to the step on the cavity;
Form the panel of described spaced walls with ultraviolet irradiation, remain in organic step on the described spaced walls with removing.
7, plasma display manufacture method as claimed in claim 6 is characterized in that,
Described organic decomposition layer contains the Tio that is the anatase shape 2
8, plasma display manufacture method as claimed in claim 6 is characterized in that,
Described organic decomposition layer is a kind ofly to comprise that wavelength is approximately the material that reacts under the ultraviolet irradiation of 380nm.
9, plasma display manufacture method as claimed in claim 6 is characterized in that,
Described method also is included in described spaced walls surface and the inside step that forms the fluorophor that constitutes described organic decomposition layer at least one.
CNB200410067882XA 2004-11-05 2004-11-05 Plasma display device and manufacturing method thereof Expired - Fee Related CN100377279C (en)

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CN100377279C CN100377279C (en) 2008-03-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219209A (en) * 2013-05-04 2013-07-24 四川虹欧显示器件有限公司 Method for determining and optimizing manufacturing process parameter values of plasma display panel
CN103236383A (en) * 2013-05-04 2013-08-07 四川虹欧显示器件有限公司 Method for dynamically determining and optimizing parameter importance in manufacturing process of plasma display screen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3196665B2 (en) * 1996-10-23 2001-08-06 日本電気株式会社 Method for manufacturing color plasma display panel
EP1119015A4 (en) * 1998-09-29 2007-08-22 Hitachi Hppl Method of manufacturing plasma display and substrate structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219209A (en) * 2013-05-04 2013-07-24 四川虹欧显示器件有限公司 Method for determining and optimizing manufacturing process parameter values of plasma display panel
CN103236383A (en) * 2013-05-04 2013-08-07 四川虹欧显示器件有限公司 Method for dynamically determining and optimizing parameter importance in manufacturing process of plasma display screen
CN103219209B (en) * 2013-05-04 2015-06-10 四川虹欧显示器件有限公司 Method for determining and optimizing manufacturing process parameter values of plasma display panel
CN103236383B (en) * 2013-05-04 2015-08-05 四川虹欧显示器件有限公司 Dynamically determining and optimization method of plasma panel process parameters importance

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