CN1763924A - Electronic circuit packaging process - Google Patents
Electronic circuit packaging process Download PDFInfo
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- CN1763924A CN1763924A CN 200510028716 CN200510028716A CN1763924A CN 1763924 A CN1763924 A CN 1763924A CN 200510028716 CN200510028716 CN 200510028716 CN 200510028716 A CN200510028716 A CN 200510028716A CN 1763924 A CN1763924 A CN 1763924A
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- circuit
- printing forme
- packaging technology
- discrete
- electronic
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Abstract
The invention relates to package technology for electronic circuit, which comprises: first, preparing electronic component array or discrete circuit of combined circuit with electrical characteristics output by location frame; second, laying a metal sheath or nonmetal case to the discrete circuit; third, pouring epoxy resin inside shell to package; fourth, drying the resin, inverting the poured component to fix on large print board by screw and supporting hole; finally, fixing a plurality of discrete modules on substrate to form a circuit integer by interconnection with wire. This invention cuts device volume, improves reliability, and has some economical benefit.
Description
Technical field
The present invention relates to a kind of packaging technology of electronic circuit, relate to a kind of packaging technology of array or combinational circuit of electronic devices and components or rather, belong to technical field of electronic encapsulation.
Background technology
Array or combinational circuit for various electronic devices and components, for considering confidentiality and installation, easy to maintenance, its module can adopt metal or non-metal shell to encapsulate then, improves the electromagnetic compatibility characteristic of product, improves the confidentiality and the market competitiveness of electronic building brick or combinational circuit.
Present electronic devices and components are only relating under the secret situation, simply certain or a constituent element device are placed in special metal or the nonmetal box, and the inner epoxy resin of irritating encapsulates it.This is a process commonplace and commonly used.
But, for electronic devices and components array or combinational circuit, adopt above-mentioned packaging technology, the low and very difficult qualified products that encapsulate out of the efficient that just seems.
Therefore, the packaging technology of a kind of electronic circuit of just necessary research and development adapts to the development of electronic devices and components technology.
Summary of the invention
The object of the present invention is to provide a kind of packaging technology of array or combinational circuit of electronic devices and components, the process form of this process using one pedestal and the combination of polylith package module, the inner epoxy of irritating only exposes fixedly connected feet and is used for the electrical property output of separate module and fixedlys connected.
For achieving the above object, technical scheme of the present invention is: the array of electronic devices and components or the integral body of combinational circuit are carried out distinguishing on the structure according to functional characteristics, be divided into the discrete package module of main substrate and polylith, be respectively equipped with the location and installation hole on main substrate and the package module, locating support is used for connecting, wherein locating support had both been done the fixedly connected feet of package module, be again the electrical property leading foot of discrete circuit in the package module, it is to be noted that main substrate also can connect into an effect that realizes array or combined electrical function integral body by the printed wire above it or other electrical connection forms package module that each is discrete.
In other words, the step of this process is: the discrete circuit of at first carrying out electronic devices and components array or combinational circuit, the electrical characteristics of this circuit are by its locating support output, second step is with above-mentioned discrete circuit outer cover one metal or non-metal shell, the 3rd step irritated epoxy resin in enclosure interior and encapsulates, the 4th step was after the epoxy resin drying, will water part and turn around by the feet hole the first device assembly of electronics printing forme, was installed on the big printing forme with screw.
Beneficial effect of the present invention: the polylith separate module is fixed on the pedestal at last, and pedestal constitutes a circuit integral body, array or combinational circuit that this integral body equivalence is various electronic devices and components by module exit and mutual electric connection line.Reach the reduction of device volume, reliable maintaining secrecy, economical and practical, have certain economic benefits.
Description of drawings
Fig. 1 is a printing forme electronic component module plate schematic diagram of the present invention;
Fig. 2 is printing forme electronic component module sleeve-board dress metal of the present invention or nonmetal box schematic diagram;
Fig. 3 is that printing forme electronic component module plate of the present invention is through encapsulating and be installed in the schematic diagram on the pedestal;
Fig. 4 is a packaging technology flow chart of steps of the present invention.
Embodiment
Below in conjunction with drawings and Examples packaging technology of the present invention is further specified.
With reference to Fig. 1, this is a printing forme electronic component module plate schematic diagram of the present invention.
As shown in the figure, 1 is feet, is used for fixing the printing forme outer jacket member and is installed on the big printing forme (pedestal), and 2 is reference column, is used for fixing between the polylith printing forme outer jacket member to keep spacing, and 3 is printing forme overcoat electronic devices and components.
With reference to Fig. 2, this is printing forme electronic component module sleeve-board dress metal of the present invention or nonmetal box schematic diagram.
As shown in the figure, this is a kind of rectangular box of making of metal, and an opening is pulled outer jacket member in order to place seal, and adopting metal material is in order to shield, effective.Also can adopt the rectangular box of nonmetal making.
With reference to Fig. 3, this is that printing forme electronic component module plate of the present invention is through encapsulating and be installed in the schematic diagram on the pedestal.
As shown in the figure, 5 for the big printing forme (pedestal) of polylith printing forme assembly is installed, and with 1 feet printing forme overcoat electronic devices and components 3 is fixed on the big printing forme 5.
With reference to Fig. 4, this is a packaging technology flow chart of steps of the present invention.
As shown in the figure, the step of this process is: the discrete circuit of at first carrying out electronic devices and components array or combinational circuit, the electrical characteristics of this circuit are by its locating support output, second step is with above-mentioned discrete circuit outer cover one metal or non-metal shell, the 3rd step irritated epoxy resin in enclosure interior and encapsulates, the 4th step was after the epoxy resin drying, will water part and turn around by the feet hole the first device assembly of electronics printing forme, was installed on the big printing forme with screw.Described feet 1 is a L type hardware; Described reference column 2 is cylinder type metal members; Described housing case is a metal or non-metallic member.
To describe process in detail below.
Adopt the process form of a pedestal and polylith package module combination, be about to the array of electronic devices and components or the integral body of combinational circuit, carry out distinguishing on the structure according to functional characteristics, be divided into the discrete package module of main substrate and polylith, being respectively equipped with location and installation hole, locating support on main substrate and the package module is used for connecting, wherein locating support had both been done the fixedly connected feet of package module, was again the electrical property leading foot of discrete circuit in the package module.
The main array of electronic devices and components or the discrete circuit of combinational circuit installed in the package module, the electrical characteristics of this circuit are by its locating support output, and with this discrete circuit outer cover one metal or non-metal shell, the inner epoxy resin of irritating only exposes fixedly connected feet and is used for the electrical property output of separation module and is connected.
Pedestal is then made by the circuit printing plate with certain bearing capacity, is the supporting body of separate module, by the electrical interconnection of drawing on it each separate module is connected into the array of the various electronic devices and components of realization or an integral body of combination function.
The polylith separate module is fixed on the pedestal at last, and pedestal constitutes a circuit integral body by module exit and mutual electric connection line, and this integral body equivalence is the array circuit of various electronic devices and components.
Second embodiment is that the polylith separate module is fixed on the pedestal at last, and pedestal constitutes a circuit integral body by module exit and mutual electric connection line, and this integral body equivalence is a combined electrical electronic circuit.
Claims (5)
1, a kind of packaging technology of electronic circuit is used for the encapsulation of electronic devices and components, comprises with the epoxy resin pouring, it is characterized in that:
The step of this process is: the first step is to carry out the discrete circuit of electronic devices and components array or combinational circuit, the electrical characteristics of this circuit are by its locating support output, second step placed above-mentioned discrete circuit in the one outer cover metal shell, the 3rd step irritated epoxy resin in enclosure interior and encapsulates, the 4th step was after the epoxy resin drying, to water part and turn around by the feet hole, be installed on the big printing forme with screw with electronics unit device assembly printing forme.
2, the packaging technology of electronic circuit as claimed in claim 1 is characterized in that:
The discrete circuit of described electronic devices and components array or combinational circuit is made into holistic printing forme 3, and feet 1 is arranged at the top of printing forme, and a reference column 2. is arranged down
3, the packaging technology of electronic circuit as claimed in claim 1 is characterized in that:
Described feet 1 is a L type hardware, and locating support had both been done the fixedly connected feet of package module, is again the electrical property leading foot of discrete circuit in the package module, and the electrical characteristics of this circuit are by its locating support output.
4, the packaging technology of electronic circuit as claimed in claim 1 is characterized in that:
Described reference column 2 is cylinder type metal members.
5, the packaging technology of electronic circuit as claimed in claim 1 is characterized in that:
Described housing case is a metal or non-metallic member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510028716 CN1763924A (en) | 2005-11-28 | 2005-11-28 | Electronic circuit packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510028716 CN1763924A (en) | 2005-11-28 | 2005-11-28 | Electronic circuit packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1763924A true CN1763924A (en) | 2006-04-26 |
Family
ID=36747978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510028716 Pending CN1763924A (en) | 2005-11-28 | 2005-11-28 | Electronic circuit packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1763924A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102884619A (en) * | 2010-07-30 | 2013-01-16 | 京瓷株式会社 | Component for accommodating electronic component, electronic module, and electronic device |
-
2005
- 2005-11-28 CN CN 200510028716 patent/CN1763924A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102884619A (en) * | 2010-07-30 | 2013-01-16 | 京瓷株式会社 | Component for accommodating electronic component, electronic module, and electronic device |
| US9078347B2 (en) | 2010-07-30 | 2015-07-07 | Kyocera Corporation | Electronic component housing unit, electronic module, and electronic device |
| CN102884619B (en) * | 2010-07-30 | 2016-08-17 | 京瓷株式会社 | Electronic unit storage parts, electronic module and electronic installation |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |