CN1750143A - Laser diode module multi-layer board and laser diode module - Google Patents
Laser diode module multi-layer board and laser diode module Download PDFInfo
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- CN1750143A CN1750143A CN 200510093400 CN200510093400A CN1750143A CN 1750143 A CN1750143 A CN 1750143A CN 200510093400 CN200510093400 CN 200510093400 CN 200510093400 A CN200510093400 A CN 200510093400A CN 1750143 A CN1750143 A CN 1750143A
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Abstract
A light emitting/receiving unit including a laser diode (LD) and a light receiving element, and an LD protection component for protecting the LD from electric damages are mounted on a multi-layer board for integration into a single module. A circuit for superposing a high-frequency current on an LD driving signal, and an anti-EMC circuit for reducing electromagnetic noise produced from this circuit may be included in the module, where at least some of elements making up these circuits may be incorporated into the board. In this structure, in order to reduce the distance between a coil and a capacitor included in the anti-EMC circuit, the capacitor is arranged within the board at a position substantially beneath the coil mounted on a surface of the board.
Description
Technical field
The present invention relates to a kind of laser diode module multilayer circuit board and laser diode module, be particularly related to a kind of semiconductor laser diode module that in optical pickup, uses such as the disc drive unit of DVD, CD, MO device (below, laser diode simply is abbreviated as " LD "), and the structure that is suitable for installing the circuit board of this module thereon.
Background technology
Disc drive unit uses CD such as DVD, CD, MO etc. as recording medium, comprises comprising to generate exposing to the optical pickup that is used to write down with the semiconductor LD of the light of the CD of regenerated signal.
Except above-mentioned LD, such optical pickup can comprise and is used to protect LD not to be subjected to because the LD guard block of the electrical lesion that damage of electrostatic discharge, dash current etc. cause; Be used for the high frequency supercircuit of overlapped high-frequency electric current to the drive current of LD; With the anti-EMC circuit that is used to reduce the electromagnetic noise that produces from the high frequency supercircuit as its parts.Optical pickup further comprises and is used to install and the flexible printed wiring board of the above-mentioned parts that interconnects, and optics as the framework of the skeleton of optical pickup, is used to keep the sheet metal of shape, screw or the like.
Optical pickup has disclosed among JP-A-2000-138411 and the JP-A-2001-014720 for example at JP-A-2002-184013.
Summary of the invention
In recent years, the same with various electronic installations, the size of strong request disc drive unit and thickness reduce, superior performance and lower price, and these requirements are strict to mancarried device especially.Yet current situation is: though each parts are reduced in size year by year, conventional light pick-up header structure requires more and more difficult satisfying these fully.
In order to solve foregoing problems, the inventor has studied the structure of optical pickup, and its purpose is to realize size, and thickness and cost further reduce, and the higher performance of optical pickup, and has found improvement.
Especially, conventional optical pickup uses a kind of structure, and wherein flexible printed wiring board is equipped with the LD parts (comprise the semiconductor laser that is used to produce the light that exposes to the storage medium medium and be used to receive from the light transmitter/receiver unit parts of the light receiving element of the light of this storage medium dieletric reflection) of common encapsulation; The LD guard block; With high frequency supercircuit parts and anti-EMC parts, these parts all are to provide as required.Then, flexible printed wiring board and these parts are combined in the framework that has combined optics together.
Yet when each parts were installed on the flexible printed wiring board that will be combined in thereafter in the framework individually, parts were combined in and often stay untapped space in the framework in frameworks, thereby cause difficulty reduced in size.And in the structure of routine, the combination singly of each parts is difficult to reduce the length of the connecting line between LD and the high frequency supercircuit, thereby causes the other problem that is vulnerable to harmful radiation.
In addition, the life cycle of electronic installation shortens day by day, thus the time cycle and the reduced in size and raising performance that need minimizing research and development and deisgn product to need.Yet conventional mating type light pick-up header structure relates to the long-time and effort of the design, adjusting, operation acknowledgement of LD and each circuit (parts) etc., and therefore unfavorable for cost.
Foregoing problems can not fully be solved by the invention of describing in the aforementioned patent document that discloses optical pick-up device.
Thereby, the object of the present invention is to provide the high-performance optics pick-up head of a kind of further reduced in size, cost and harmful radiation.
For the above-mentioned purpose that realizes addressing this problem, a LD of the present invention (laser diode) module multilayer circuit board comprises: light transmitter/receiver unit installation region, be used for installing light transmitter/receiver unit parts thereon, these light transmitter/receiver unit parts comprise the semiconductor laser diode and the catoptrical light receiving element that is used to receive from this storage medium medium that is used to produce the light that shines the storage medium medium; With laser diode guard block installation region, be used for installing the laser diode guard block thereon, this laser diode guard block is used to protect semiconductor laser diode not to be subjected to electrical lesion.
Recorded information is to such as medium memory media such as DVD, CD, the MO/light transmitter/receiver unit is housed (for example from the optical pickup of this storage medium regenerating information, the holographic laser diode), it comprises LD that is used to produce the light that incides the storage medium medium and the catoptrical light receiving element that is used to receive from this storage medium medium.
Multilayer circuit board of the present invention comprises: light transmitter/receiver unit installation region is used for installing light transmitter/receiver unit parts thereon; With LD guard block installation region, be used for installing the LD guard block thereon, this LD guard block is used to protect LD not to be subjected to electrical lesion.At this, " electrical lesion " refers to damage of electrostatic discharge (because infringement that Electrostatic Discharge causes) or because the infringement that dash current causes etc.Therefore, LD and LD guard block can integrally be installed on the circuit board, so that the LD that comprises the LD guard block to be provided module, thereby to make and compare the size that has reduced optical pickup with prior art, and simplify its design and number of assembling steps.
Multilayer circuit board of the present invention can be: ceramic multilayer circuit board for example, and LTCC (LTCC) multilayer circuit board that constitutes by aluminium oxide and glass ingredient, or use the organic multilayer circuit board of resin material as insulating substrate.This organic multilayer circuit board comprises the composite panel of being made by the potpourri of resin material and inorganic material.
The 2nd LD module multilayer circuit board of the present invention comprises at least some circuit components of high frequency supercircuit and at least some circuit components of anti-EMC circuit (circuit that is used for EMC (electromagnetic compatibility)) in a LD module multilayer circuit board, this high frequency supercircuit is used for high-frequency current is superimposed upon the electric current that drives described semiconductor laser diode, this anti-EMC circuit is used to reduce the electromagnetic noise that is produced by described high frequency supercircuit, thereby can further reduce the size of optical pickup.
The 3rd LD module multilayer circuit board of the present invention further comprises the coil installation region in the 2nd LD module multilayer circuit board, be used for installing the coil of a part that forms described anti-EMC circuit thereon, wherein said anti-EMC circuit comprises the electric capacity that is combined in the circuit board, and described electric capacity is arranged in the position below described coil installation region basically.
In optical pickup, for example by forming the wave filter of coil and electric capacity, and this wave filter is inserted in the anti-EMC circuit that is provided for reducing the electromagnetic noise that produces by the high frequency supercircuit between the terminal that LD driving circuit and high frequency supercircuit use, wherein, because constituting the coil and the electric capacity of this wave filter is installed separately mutually further, stray reactance increases, and causes the reduction of filter characteristic.
On the contrary, the tertiary circuit plate structure according to the present invention, the coil and the electric capacity that form wave filter can closely be installed mutually with the wiring between minimizing coil and the electric capacity, thereby make that it is little can keeping stray reactance, the resonance frequency of wave filter is moved to upper side, and form lower trap.Therefore, the LD module that obtains can provide high-performance, and superior in the EMC antagonism.
The 4th LD module multilayer circuit board of the present invention further comprises the thermal dissipating path hole that extends through this laser diode module multilayer circuit board (below be called " diffusion path ") in first to the 3rd LD module multilayer circuit board, it is formed in the zone that described smooth transmitter/receiver unit parts are installed, the facing surfaces side of the described circuit board of the circuit board surface that the heat diffusion that is used for that described semiconductor laser diode is produced limits to light transmitter/receiver unit installation region.
According to aforesaid the 4th board structure of circuit, by in this zone of light transmitter/receiver unit parts installation region, providing the diffusion path, the heat that is produced by LD can directly diffuse to the back side (passing through bee-line) of circuit board, improves the good heat-sinking capability of LD module.
The thermal dissipating path hole for example can be the electroplating ventilating hole that is filled with Heat Conduction Material (for example electroconductive resin slurry).And from the viewpoint of radiating efficiency, in the time will guaranteeing higher heat-sinking capability, the thermal dissipating path hole is preferably implemented by so-called filling vias, and this filling vias relates to the deposition plated metal and fills this through hole, to form plated metal in cylindrical shape.
The 5th LD module multilayer circuit board of the present invention further comprises the connection pattern of flexible printed wiring board in first to fourth LD module multilayer circuit board, wherein said smooth transmitter/receiver unit installation region is limited on the surface of described laser diode module multilayer circuit board, and the connection pattern of described flexible printed wiring board is limited on another surface of described laser diode module multilayer circuit board.
Be limited to when light transmitter/receiver unit installation region on the surface of circuit board, and the connection pattern of flexible printed wiring board is when being arranged on another surface and going up, the surface of this circuit board can be effectively utilized, thereby reduces to form the circuit board of LD module, further reduces the size of LD module.And, light transmitter/receiver unit parts for example wait by the lead-in wire connection and are installed on the circuit board, in this case, as mentioned above, lip-deep smooth transmitter/receiver unit installation region by will being limited to this circuit board be arranged on another lip-deep flexible printed wiring board be connected pattern separately, flexible printed wiring board can be by only the execution attended operation is connected to the LD module on the surface of this connections pattern being provided with.Thereby, because do not need to contact the surface of the circuit board that light transmitter/receiver unit parts are installed, reduced and during the processing of attended operation, damaged light transmitter/receiver unit parts, or contact connects and cause unexpected the disconnection, therefore feasiblely can increase yield rate.
In the 6th LD module multilayer circuit board of the present invention, the connection pattern of flexible printed wiring board is arranged along the edge of described laser diode module multilayer circuit board and is formed, thereby is convenient to flexible printed wiring board is connected to the operation of LD module multilayer circuit board.
In addition, the 7th LD module multilayer circuit board of the present invention further comprises the thermal dissipating path hole that extends through the laser diode module multilayer circuit board, and be formed in the zone that light transmitter/receiver unit parts are installed, the facing surfaces side of the described circuit board of the circuit board surface that the heat diffusion that is used for that semiconductor laser diode is produced limits to light transmitter/receiver unit installation region, wherein the connection pattern of flexible printed wiring board is arranged on the both sides in the zone that forms described thermal dissipating path hole.
Be connected pattern by such peace arrangement with respect to thermal dissipating path and flexible printed wiring board, with the same in the 6th circuit board, can guarantee the good high heat-sinking capability of LD module simultaneously so that connect the operation of flexible printed wiring board to LD module multilayer circuit board.And by connecting the both sides that pattern is arranged in thermal dissipating path, the size of this circuit board can reduce.
The 8th LD module multilayer circuit board of the present invention further comprises the active component installation region, be used for installing semiconducter active component thereon, it forms a part that high-frequency current is superimposed upon the high frequency supercircuit on the electric current that drives described semiconductor laser diode, wherein said smooth transmitter/receiver unit installation region is limited on the surface of described laser diode module multilayer circuit board, and described active component installation region is limited on another surface of described laser diode module multilayer circuit board.
In addition, the 9th LD module multilayer circuit board of the present invention further comprises the reference potential layer that is arranged between described smooth transmitter/receiver unit installation region and the described active component installation region.
In addition, the tenth LD module multilayer circuit board of the present invention comprises two or more reference potential layers.
When LD and high frequency supercircuit were integrated in the module, LD was subjected to and the coupling of high frequency supercircuit, particularly with the pierce circuit of this circuit in the electromagnetism injurious effects of the semiconducter active component coupling that comprises increase.On the other hand, in the 8th board structure of circuit of the present invention, light transmitter/receiver unit installation region is limited to a surface of LD module multilayer circuit board, and the active component installation region is limited to another surface, and in the 9th board structure of circuit of the present invention, the reference potential layer is inserted between these light transmitter/receiver unit installation regions (LD) and active component installation region (semiconducter active component), thereby destroys such coupling, to reduce or eliminate the influence to LD.Preferably provide two or more reference potential layers, in order to prevent as shown in the tenth circuit board of the present invention owing to having the influence that higher deterministic coupling causes in addition.
On the other hand, first laser diode module of the present invention comprises: light transmitter/receiver unit parts, and it comprises the semiconductor laser diode and the catoptrical light receiving element that is used to receive from this storage medium that is used to produce the light that shines the storage medium medium; With the laser diode guard block, be used to protect semiconductor laser diode not to be subjected to electrical lesion, described smooth transmitter/receiver unit parts and described laser diode guard block are integrated in the individual module.
According to aforesaid module, similar with multilayer circuit board according to the present invention, with former comparing, can reduce the size of optical pickup, and facility its design and number of assembling steps.
In second laser diode module of the present invention, semiconductor laser diode is the single mode semiconductor laser diodes in first module, and this module also comprises the high frequency supercircuit that is integrated in wherein, and this high frequency supercircuit is superimposed upon high-frequency current on the electric current that drives described single mode semiconductor laser diodes.
The high frequency supercircuit is integrated in the size that can reduce optical pickup in this module.In addition, assembler/fabricator does not need design separately to be applicable to the high frequency supercircuit of the various LD that use in various products, or between LD and high frequency supercircuit, carry out complicated adjusting operation etc., thereby height light pick-up head member easily can be provided, and is more user-friendly for assembler/fabricator.
Single mode semiconductor LD has a plurality of advantages: for example with the ability of low power consumption steady operation in wide operating temperature range, high mass productivity, reduce the cost of optical pickup etc., though need the high frequency supercircuit to eliminate the noise that the back light from CD causes usually.On the other hand, multimode (autoexcitation) is not though LD needs the high frequency supercircuit, it has the difficulty of producing in batches such as with high finished product rate, than single mode LD temperature range narrower, that can guarantee stable oscillation, big power consumption, thereby the shortcoming of a large amount of hot and lower reliability that produces.Especially, at shorter wavelength, the higher energy density that obtains (for example for the DVD relevant with shorter wavelength etc.) causes the increase of the heat of generation, and this makes stable control become very difficult.In addition, require extensive radiator structure make reduced in size become the difficulty.
Because second module of the present invention is used single mode LD, and the high frequency supercircuit that will be fit to this LD is integrated in this module, this module can not need to carry out somewhat complex design, adjusting etc. separately for each high frequency supercircuit, and keep each advantageous properties of presenting by single mode LD, thereby handle easily than multimode LD during being provided at research and development, design and the manufacturing of optical pickup.
The 3rd laser diode module of the present invention also comprises the anti-EMC circuit that is integrated in wherein, and this anti-EMC circuit is used to reduce the electromagnetic noise that is produced by described high frequency supercircuit.
According to aforesaid three module, the assembling/fabricator of optical pickup or disc drive unit can be in conjunction with this module when making optical pickup, and not only high frequency supercircuit but also antagonism EMC circuit is not needed complex circuit design, adjusting etc.
Though do not point out especially: because following factor, can be according to the type of the special LD of specific use (for example input impedance) and the element or the circuit structure of the suitable designing optimal of characteristic, anti-EMC circuit is for example by passive element, inductance (coil) for example, electric capacity, formations such as resistance, perhaps constituting by a plurality of these passive elements.
In the 4th LD module of the present invention, light transmitter/receiver unit parts are installed on the surface of multilayer circuit board, and constitute described high frequency supercircuit and described anti-EMC circuit one or both at least one circuit components and be integrated in the described multilayer circuit board, thereby can further reduce the size of optical pickup.The multilayer circuit board that is used for installing light transmitter/receiver unit parts and LD guard block can be and any one of the similar various circuit boards of aforesaid multilayer circuit board of the present invention.
In the 5th LD module according to the present invention, anti-EMC circuit comprises a coil and an electric capacity, wherein this coil is installed on the surface of multilayer circuit board, and this capacitive junctions is combined in the described multilayer circuit board and be arranged in the position below described coil basically.
According to aforesaid module,, form the coil and the approaching mutually arrangement of electric capacity of wave filter, thereby the LD module that obtains presents high-performance and outstanding EMC antagonism with identical according to the situation of the 3rd multilayer circuit board of the present invention.
In the 6th LD module of the present invention, LD module multilayer circuit board comprises the thermal dissipating path hole that extends through this LD module multilayer circuit board in the 4th or the 5th module, it is formed in the zone that described smooth transmitter/receiver unit parts are installed, and is used for heat diffusion that described semiconductor laser diode the is produced facing surfaces side to the described circuit board of the circuit board surface that the light transmitter/receiver unit is installed.
Therefore, aforesaid the 6th module can improve the heat-sinking capability of LD module, and it is similar to the 4th multilayer circuit board.Thermal dissipating path can be the electroplating ventilating hole or the filling vias of filling Heat Conduction Material (for example conductive paste).
The 7th LD module of the present invention also comprises the connection pattern of flexible printed wiring board, wherein said smooth transmitter/receiver unit parts are installed on the surface of described multilayer circuit board, and the connection pattern of described flexible printed wiring board is arranged on another surface of described multilayer circuit board.
In the 8th LD module of the present invention, the connection pattern of wherein said flexible printed wiring board is arranged along the edge of described multilayer circuit board and is formed, thereby makes connection flexible printed wiring board to the operation of LD module become convenient.
The 9th LD module of the present invention is included in the thermal dissipating path hole that extends through described multilayer circuit board in the 8th module, it is formed in the zone that described smooth transmitter/receiver unit parts are installed, be used for heat diffusion that described semiconductor laser diode the is produced apparent surface's side to the described circuit board of the circuit board surface that the light transmitter/receiver unit is installed, the connection pattern of described flexible printed wiring board is arranged in the both sides in the zone that forms described thermal dissipating path hole.
In the tenth LD module of the present invention, semiconductor laser diode is a single mode semiconductor laser diodes, described module also comprises the high frequency supercircuit that is integrated in wherein, this high frequency supercircuit is used for high-frequency current is superimposed upon the electric current that drives described single mode semiconductor laser diodes, described smooth transmitter/receiver unit parts are installed on the surface of described multilayer circuit board, and the semiconducter active component that is included in the described high frequency supercircuit is installed on another surface of described multilayer circuit board.
The 11 LD module of the present invention also comprises the described smooth transmitter/receiver unit parts that are arranged in the tenth LD module and the reference potential layer between the described semiconducter active component, and the 12 LD module of the present invention comprises two or more reference potential layers.
Therefore, in the of the present invention the 9th mode similar with the tenth circuit board, these modules can prevent that LD is not subjected to and is included in the negative effect of the electromagnetism of the semiconducter active component coupling in the oscillatory circuit of high frequency supercircuit.
The 13 LD module of the present invention further is included in according to the IC that is integrated in any module of the present invention wherein, this IC can control from the regenerated signal of described smooth transmitter/receiver unit parts output, or exports/import regenerated signal and tracer signal from described smooth transmitter/receiver unit parts to.
According to the tenth three module, when this control IC also is installed on the multilayer circuit board, this multilayer circuit board has for example been installed light transmitter/receiver unit parts, do not need connection between the IC in light transmitter/receiver unit parts and control by flexible printed wiring board etc., thereby the optical pickup that obtains can be reduced in size, as first situation to three module.
In the tenth three module, when the connection pattern that provides for flexible printed wiring board, preferred flash of light preceding an earthquake transmitter/receiver unit parts and control IC are installed on the surface of multilayer circuit board, and the connection pattern of flexible printed wiring board is arranged on another surface of multilayer circuit board.As the situation in the 7th module, this facility connect the operation of flexible printed wiring board and prevent that the accident of the connection lead-in wire of control IC during the flexible printed wiring board Connection Step from disconnecting.
When control IC electric treatment and control regenerated signal (when relevant) or regenerated signal and tracer signal with the disc drive unit of only regeneration (when with can write down when being correlated with the disc drive unit of regenerated signal), control IC do not limit especially comprising function (particular electrical circuit).For example, control IC can comprise the high frequency supercircuit, the servo signal processing circuit that is used to follow the tracks of, A/D change-over circuit, D/A change-over circuit, signal amplification circuit etc.
Can be used as at disc drive unit according to multilayer circuit board of the present invention and LD module and (to comprise the combination driving device that can write down and regenerate and form the plurality of types of records medium, the LD module of the optical pickup that uses the many drive units of DVD etc.), and conduct forms the circuit board of the part of this module, this disc drive unit uses various CDs as recording medium, this CD comprises DVD (DVD-ROM, DVD-RAM, DVD-R, DVD-RW etc.), CD (CD-ROM, CD-R, CD-RW etc.), MD (Mini Disk), MO (magneto-optic disk), video disc, optics pcm audio dish etc.
According to the present invention, high performance optical pickup can be provided, its size is less, and manufacturing cost is lower, and has reduced harmful radiation.Other purpose of the present invention, feature and advantage are from becoming obviously the description to embodiments of the invention with reference to the accompanying drawings, and 9 identical in the accompanying drawings marks are represented identical or corresponding part.
Description of drawings
Fig. 1 is the block scheme of expression according to the LD module of the first embodiment of the present invention;
Fig. 2 is the circuit diagram of expression according to the LD module of the first embodiment of the present invention;
Fig. 3 is the planimetric map of expression according to the LD module of first embodiment of the present invention mode;
Fig. 4 is the side view of expression according to the LD module of the first embodiment of the present invention;
Fig. 5 is the backplan of expression according to the LD module of the first embodiment of the present invention;
Fig. 6 A to 6T is respectively the first to the 20 layer a skeleton view of the multilayer circuit board of the expression LD module that forms first embodiment;
Fig. 7 is a block scheme of representing LD module according to a second embodiment of the present invention;
Fig. 8 is a circuit diagram of representing LD module according to a second embodiment of the present invention;
Fig. 9 is a planimetric map of representing LD module according to a second embodiment of the present invention;
Figure 10 is a side view of representing LD module according to a second embodiment of the present invention;
Figure 11 is a backplan of representing LD module according to a second embodiment of the present invention;
Figure 12 is the planimetric map of the LD module of expression a third embodiment in accordance with the invention;
Figure 13 is the side view of the LD module of expression a third embodiment in accordance with the invention;
Figure 14 is the backplan of the LD module of expression a third embodiment in accordance with the invention;
Figure 15 is the block scheme of the LD module of expression a fourth embodiment in accordance with the invention;
Figure 16 is the planimetric map of the LD module of expression a fourth embodiment in accordance with the invention;
Figure 17 is the side view of the LD module of expression a fourth embodiment in accordance with the invention;
Figure 18 is the backplan of the LD module of expression a fourth embodiment in accordance with the invention.
Embodiment
[first embodiment]
LD module according to first embodiment of the invention is described with reference to Fig. 1 to 6T.
As illustrated in fig. 1 and 2, this LD module 11 comprises holographic laser apparatus 15 (light transmitter/receiver unit parts); Be used for the high frequency supercircuit 14 of overlapped high-frequency electric current to the drive current of the LD 15a that is included in holographic laser apparatus 15; Be used to reduce anti-EMC circuit 13 from the electromagnetic noise of high frequency supercircuit 14 generations; LD holding circuit 16 with the infringement that is used to protect holographic laser apparatus 15 (LD 15a) not to be subjected to damage of electrostatic discharge (infringement that causes by Electrostatic Discharge) and causes by dash current.These parts 15,14,13,16 are installed in (from Fig. 3) on the multilayer circuit board, to be integrated in the module.These parts and circuit component are installed on the circuit board (mark 21 of appointment in Fig. 3), and this is based on of the invention process, is used for being integrated in the LD module.
This holographic laser apparatus 15 is connected to signal wire, the signal by this signal wire recording/reproducing provide/read to/from from holographic laser apparatus 15; LD holding circuit (parts) 16 with the infringement that is used to protect LD 15a not to be subjected to damage of electrostatic discharge (infringement that causes by Electrostatic Discharge) and causes by dash current.This signal wire can be by flexible printed wiring board (below be called " EPC ").Use therein LD holding circuit (parts) 16 for example can be a variohm.
In the passive element that constitutes high frequency supercircuit 14 and anti-EMC circuit 13, capacitor C 1, C2, C3, C4, C5, C6 and coil L3 are built in multilayer circuit board 21, this describes in the back with reference to Fig. 6 A to 6T, however capacitor C 7 and coil L1, and L2 is to use separating component to be installed on the surface of multilayer circuit board 21.
The outward appearance of Fig. 3 to 5 expression LD module 11, wherein Fig. 3 represents a surface (being appointed as upper surface for convenience of description) of multilayer circuit board 21; Fig. 4 represents the side surface of multilayer circuit board 21; Fig. 5 represents another surface (being appointed as lower surface for convenience of description) of multilayer circuit board 21.As shown in these figures, have holographic laser apparatus 15 with planimetric map multilayer circuit board 21 that show, that be essentially rectangle, form anti-EMC circuit 13 a part some passive elements and be surface mounted in LD holding circuit or parts 16 on its upper surface.
These thermal dissipating paths 23 are substantially perpendicularly by multilayer circuit board 21, directly the heat dissipation conductor pattern 24 that forms from the upper surface of the multilayer circuit board the installation region of holographic laser apparatus 15 21 extends to the heat absorption that the lower surface at multilayer circuit board 21 forms and connects pattern 25 (will be described below), and be connected to heat absorption and connect pattern 25, thereby heat can conduct to it.As previously described, thermal dissipating path 23 can form with the plated metal filling vias by for example using the electroconductive resin slurry to fill electroplating ventilating hole or fill up path by deposition plated metal in cylindrical shape.
On the other hand, multilayer circuit board 21 is contained in triode Q1 and resistance R 1 in the high frequency supercircuit 14, R2 at its lower surface upper surface installation kit.Corresponding to the position that holographic laser apparatus 15 is installed, heat absorption connects the center that pattern 25 forms multilayer circuit board 21 in a longitudinal direction basically.Aforesaid thermal dissipating path 23 is connected pattern 25 with heat absorption and links to each other, thereby the heat that LD 15a produces directly is sent to the lower surface of multilayer circuit board 21 basically by the shortest distance, and diffuses to the outside effectively by heat absorption connection pattern 25.
Longitudinal direction about multilayer circuit board 21, conductive pattern 26 is arranged to form along the edge (shorter side) of circuit board 21 in the both sides (two end regions of the multilayer circuit board 21 of longitudinal direction) that heat absorption connects pattern 25 (forming the zone of thermal dissipating path 23), and every side all is used to connect flexible printed wiring board (FPC).The pattern 26 that is arranged in the end regions of circuit board 21 like this can help FPC and be connected to LD module 11.From the viewpoint of the size that reduces circuit board 21, forming the terminal that FPC connects the part of pattern 26 is identical or essentially identical number in the left side of circuit board 21 with the right side preferably.
Fig. 6 A to 6T is the figure that represents each layer of seeing from top to bottom, and in the following description, these layers are called " ground floor " to " the 20 layer " with the order from the circuit board upper surface to lower surface.Wiring layer in the circuit board that similar Fig. 6 A to 6S, Fig. 6 T represent to see from top to bottom successively, thereby with the lowermost layer (the 20 layer) of perspective form display circuit board.
As shown in these figures, the low-temp, co-fired ceramic multi-layer circuit board that this multilayer circuit board is made up of 20 wiring layers, the upper and lower surface that comprises circuit board, wherein ground floor (upper surface of circuit board) 21a is equipped with pericentral, the holographic laser apparatus installation region 31 that is used to install holographic laser apparatus 15 at circuit board 21.Holographic laser apparatus installation region 31 is formed by conductive pattern 24, and this conductive pattern 24 is connected to thermal dissipating path 23, and it extends through circuit board 21 and connects pattern 25 to the heat absorption on the lower surface of circuit board.And ground floor 21a is equipped with and connects weld tabs 32a-32e, is used to connect each mounted on surface part 13,16 shown in Figure 3.Connect in the weld tabs at these, the connection weld tabs 32e that is positioned at circuit board 21 bights is provided for installing the coil L2 of a part that forms anti-EMC circuit 13.
On the other hand, the capacitor C 1 that forms the part of anti-EMC circuit 13 forms by being arranged on the 4th layer of conductive pattern on the 21d and the grounding pattern that is arranged on the 3rd layer of 21c and the layer 5 21e.
At this, the position that select to form capacitor C 1 be located substantially on coil L2 (the connection weld tabs 32e that is used for coil L2) below, this capacitor C 1 is surface mounted on upper surface (ground floor) 21a of circuit board, and selects to install the position of coil L2 as far as possible.If anti-EMC circuit 13 comprises coil L2 and the capacitor C of opening very much the space 1, stray reactance increases and has reduced the performance of the wave filter that is formed by coil L2 and capacitor C 1.Place near capacitor C 1 more as coil L2 in the present embodiment, between coil L2 and electric capacity, need short wiring, thereby make and to reduce stray reactance, make the resonance frequency of wave filter move to upper side, and the lower trap of formation wave filter is with further minimizing noise.
It should be noted that: (using equally in the claims) " position below basically " of using above not only refer to strictness vertically below (below) the position, and refer to the position that is shifted a little in the horizontal direction.This is because can realize the purpose that coil L2 and capacitor C 1 is more close.Equally, because similar reason, for vertical direction, capacitor C 1 does not need to be formed directly into lower level, still can be formed on the layer away from two-layer or multilayer.
The capacitor C 2 that forms the part of high frequency supercircuit 14 is formed by the conductive pattern that is arranged on 18 layers of 21r of the 13 layer of 21m to the; And capacitor C 3 is respectively by being arranged on the grounding pattern on the 9th layer of 21i and the eleventh floor 21k and being arranged on the tenth layer of 21j and Floor 12 21l conductive pattern forms.Similarly, the capacitor C 4 that is included in the high frequency supercircuit 14 is formed by the conductive pattern on the grounding pattern on the 9th layer of 21i and the tenth layer of 21j; Capacitor C 5 is formed by each conductive pattern that is arranged on 13 layers of 21m of the tenth layer of 21j to the; And capacitor C 6 is formed by the conductive pattern and the grounding pattern that are arranged on nine layers of 21i of layer 5 21e to the.In addition, the coil L3 that is included in the high frequency supercircuit 14 is formed by the ring-shaped conductor pattern that is arranged on 18 layers of 21r of the 15 layer of 21o to the.
The bottom of circuit board (the 20 layer) 21t is equipped with and is used for mounted on surface and is included in high frequency supercircuit 14 triode Q1 and resistance R 1, the connection weld tabs 33a of R2, and 33b, 33c, and heat absorption connects pattern 25 and is connected pattern 26 with FPC.
Connection between the connection weld tabs on conductive pattern and each layer for example can be undertaken by electroplating ventilating hole.On the other hand, FPC connects pattern 26, is used for the connection weld tabs 32,33 of mounted on surface part and can for example utilizes the thick-film methods that relates to printing conductive slurry on circuit board or form such as the film process of sputter such as each conductive pattern in circuit board.
In the circuit of aforesaid Fig. 2, the high frequency superimposed current by matched element C4-C6 from the Q1 the high frequency supercircuit, C2, the pierce circuit of formations such as L3 offers LD 15a, and by return path () turn back to pierce circuit.Loop as the high-frequency current of antenna causes harmful radiation, and high-frequency current is from pierce circuit output and return.How harmful radiation produces impedance and the length that depends primarily on loop, and harmful radiation especially with the proportional increase of length, though wavelength is same relevant with it.And high-frequency current is also revealed from other circuit that connects LD 15a and high frequency supercircuit 14, causes the generation of harmful radiation.In addition, normally used LD encapsulates, and Feng Zhuan wiring (terminal etc.) plays a part antenna equally in this case, thereby harmful radiation is produced the opposite effect.
On the other hand, module according to previous embodiment, high frequency supercircuit 14 is installed in the surface or circuit board of circuit board, the LD 15a that comprises external component is directly installed on the circuit board, be used for being integrated in module, thereby make the path that the length of the loop can reduce high-frequency current and shape and high-frequency current the reveal part of antenna (that is, as).Therefore, the LD module of first embodiment can reduce harmful radiation, need be such as the countermeasure that prevents radiation that shielding box is provided, thus also reduced the size and the cost of optical pickup.
[second embodiment]
LD module according to second embodiment of the invention is described with reference to Fig. 7 to 11.
Shown in Fig. 7 and 8; this LD module 41 comprises the holographic laser apparatus (light transmitter/receiver unit parts) 15 that is similar to according to the module of first embodiment; LD holding circuit 16 and anti-EMC circuit 13; but also comprise the control IC 42 that is installed on the multilayer circuit board 45; be used to control and offer holographic laser apparatus 15/, be used for being integrated in module from the recording/reproducing signal that holographic laser apparatus 15 reads.Equally, the high frequency supercircuit is included among the control IC 42.
As shown in Figure 9, holographic laser apparatus 15 and control IC 42 are mounted on the upper surface of multilayer circuit board 45 by lead-in wire.Represented as the mark among Figure 11 46, constitute the separating component of LD holding circuit 16 and anti-EMC circuit 13 and the peripheral components of control IC 42 and be surface mounted on the lower surface of multilayer circuit board 45.Heat absorption connects pattern 25 and is formed in the end regions of circuit board 45, with the position alignment of holographic laser apparatus 15 in the installation of circuit board upper surface.And FPC connects the three sides formation of pattern along the circuit board 45 of the remaining neighboring area of the circuit board except an end regions that forms heat absorption connection pattern 25, and FPC47 is connected to this connection pattern.
[the 3rd embodiment]
In addition, the LD module according to third embodiment of the invention is described with reference to Figure 12 to 14.
As shown in these figures; be similar to the module according to second embodiment, this module 51 integrally is included in the holographic laser apparatus 15 in the module, LD holding circuit; anti-EMC circuit and control IC 42 with and periphery, but be to use two-sided FPC 53 as the signal wire that connects these modules.
As shown in figure 12; this holographic laser apparatus 15 and control IC 42 are the upper surfaces that are surface mounted in multilayer circuit board 52; and the peripheral components of IC 42; constituting the element of LD holding circuit and the element of the anti-EMC circuit of formation also is to be surface mounted in respectively on the upper surface of this multilayer circuit board 52, shown in the mark 55 of Figure 12.And to be similar to the mode of first embodiment, some elements of anti-EMC circuit (for example electric capacity) are combined in the multilayer circuit board 52.On the other hand, the FPC that is used to connect FPC53 connects pattern 54 is formed on this multilayer circuit board 52 in arranged mode shown in Figure 14 lower surface.Equally, heat absorption connects pattern 25 and is formed on an end regions of circuit board in the mode of the module that is similar to second embodiment, and this end regions is with respect to forming the other end zone that FPC connects the circuit board of pattern.
[the 4th embodiment]
LD module according to fourth embodiment of the invention is described with reference to Figure 15 to 18.
As shown in figure 15; to be similar to mode according to the module of first embodiment; this module 61 comprises and is installed in holographic laser apparatus 62 and the LD holding circuit 16 that is used for being integrated in module on the multilayer circuit board 63, but uses the LD (for example multimode LD) that does not need the high frequency supercircuit.Therefore, module 61 does not comprise high frequency supercircuit or anti-EMC circuit.
As shown in figure 16, holographic laser apparatus 62 and LD holding circuit 16 are to be surface mounted on the upper surface of multilayer circuit board 63.Heat absorption connects pattern 25 and is formed on the lower surface of multilayer circuit board 63, on the identical position overleaf with hololaser 62 position alignment of installing.Equally, conductive pattern is formed in the end regions of lower surface of circuit board, is used to connect FPC65.
Those skilled in the art it is also understood that: foregoing description carries out according to embodiments of the invention, and can make various changes and change to the present invention in the scope that does not break away from spirit of the present invention and claim.
Claims (23)
1. laser diode module multilayer circuit board comprises:
Light transmitter/receiver unit installation region, be used for installing light transmitter/receiver unit parts thereon, these light transmitter/receiver unit parts comprise the semiconductor laser diode and the catoptrical light receiving element that is used to receive from this storage medium that is used to produce the light that shines storage medium; With
Laser diode guard block installation region is used for installing the laser diode guard block thereon, and this laser diode guard block is used to protect described semiconductor laser diode not to be subjected to electrical lesion.
2. laser diode module multilayer circuit board according to claim 1, wherein:
Described circuit board comprises at least some circuit components of high frequency supercircuit and at least some circuit components of anti-EMC circuit, this high frequency supercircuit is used for high-frequency current is superimposed upon the electric current that drives described semiconductor laser diode, and this anti-EMC circuit is used to reduce the electromagnetic noise that is produced by described high frequency supercircuit.
3. laser diode module multilayer circuit board according to claim 2 further comprises the coil installation region, is used for installing the coil of a part that forms described anti-EMC circuit thereon, wherein:
Described anti-EMC circuit comprise the electric capacity that is combined in the described circuit board and
Described electric capacity is arranged in the position that is essentially below the described coil installation region.
4. laser diode module multilayer circuit board according to claim 1, further comprise the thermal dissipating path hole that extends through described laser diode module multilayer circuit board, this thermal dissipating path hole is formed in the zone that described smooth transmitter/receiver unit parts are installed, and is used for heat diffusion that described semiconductor laser diode the is produced facing surfaces side to the described circuit board of the circuit board surface that limits with light transmitter/receiver unit installation region.
5. laser diode module multilayer circuit board according to claim 1 further comprises the connection pattern of flexible printed wiring board, wherein:
Described smooth transmitter/receiver unit installation region is limited on the surface of described laser diode module multilayer circuit board, and
The connection pattern of described flexible printed wiring board is limited on another surface of described laser diode module multilayer circuit board.
6. laser diode module multilayer circuit board according to claim 5, wherein:
The connection pattern of described flexible printed wiring board is arranged along the edge of described laser diode module multilayer circuit board and is formed.
7. laser diode module multilayer circuit board according to claim 6, further comprise the thermal dissipating path hole that extends through described laser diode module multilayer circuit board, this thermal dissipating path hole is formed in the zone that described smooth transmitter/receiver unit parts are installed, be used for heat diffusion that described semiconductor laser diode is produced facing surfaces side to the described circuit board of the circuit board surface that limits with light transmitter/receiver unit installation region
The connection pattern of wherein said flexible printed wiring board is arranged on the one or both sides in the zone that forms described thermal dissipating path hole.
8. laser diode module multilayer circuit board according to claim 1, further comprise the active component installation region, be used for installing semiconducter active component thereon, this semiconducter active component forms a part that high-frequency current is superimposed upon the high frequency supercircuit on the electric current that drives described semiconductor laser diode, wherein:
Described smooth transmitter/receiver unit installation region is limited on the surface of described laser diode module multilayer circuit board, and
Described active component installation region is limited on another surface of described laser diode module multilayer circuit board.
9. laser diode module multilayer circuit board according to claim 8 further comprises the reference potential layer that is arranged between described smooth transmitter/receiver unit installation region and the described active component installation region.
10. laser diode module multilayer circuit board according to claim 9, wherein said circuit board comprise two or more reference potential layers.
11. a laser diode module comprises:
Light transmitter/receiver unit parts comprise the semiconductor laser diode and the catoptrical light receiving element that is used to receive from this storage medium that are used to produce the light that shines storage medium; With
The laser diode guard block is used to protect semiconductor laser diode not to be subjected to electrical lesion,
Described smooth transmitter/receiver unit parts and described laser diode guard block are integrated in the individual module.
12. laser diode module according to claim 11, wherein:
Described semiconductor laser diode is a single mode semiconductor laser diodes, and
Described module further comprises the high frequency supercircuit that is integrated in wherein, and this high frequency supercircuit is used for high-frequency current is superimposed upon the electric current that drives described single mode semiconductor laser diodes.
13. laser diode module according to claim 12 further comprises the anti-EMC circuit that is integrated in wherein, this anti-EMC circuit is used to reduce the electromagnetic noise that is produced by described high frequency supercircuit.
14. laser diode module according to claim 13, wherein:
Described smooth transmitter/receiver unit parts be installed on the surface of multilayer circuit board and
One or two at least one circuit component that constitutes described high frequency supercircuit and described anti-EMC circuit is integrated in the described multilayer circuit board.
15. laser diode module according to claim 13, wherein:
Described smooth transmitter/receiver unit parts are installed on the surface of multilayer circuit board;
Described anti-EMC circuit comprises coil and electric capacity;
Described coil is installed on this surface of described multilayer circuit board; With
Described capacitive junctions is combined in the described multilayer circuit board and is arranged in the position below described coil basically.
16. laser diode module according to claim 14, wherein:
Described laser diode module multilayer circuit board comprises and extends through this laser diode module multilayer circuit board and be formed on thermal dissipating path hole in the zone that described smooth transmitter/receiver unit parts install, be used for heat diffusion that described semiconductor laser diode is produced to the facing surfaces side of the described circuit board of the circuit board surface that the light transmitter/receiver unit is installed.
17. laser diode module according to claim 14 further comprises the connection pattern of flexible printed wiring board, wherein:
Described smooth transmitter/receiver unit parts are installed on the surface of described multilayer circuit board, and
The connection pattern of described flexible printed wiring board is arranged on another surface of described multilayer circuit board.
18. laser diode module according to claim 17, wherein:
The connection pattern of described flexible printed wiring board is arranged along the edge of described multilayer circuit board and is formed.
19. laser diode module according to claim 18, wherein:
Described laser diode module multilayer circuit board comprises the thermal dissipating path hole that extends through described multilayer circuit board, this thermal dissipating path hole is formed in the zone that described smooth transmitter/receiver unit parts are installed, be used for heat diffusion that described semiconductor laser diode is produced to the facing surfaces side of the described circuit board of the circuit board surface that the light transmitter/receiver unit is installed and
The connection pattern of described flexible printed wiring board is arranged in the one or both sides in the zone that forms described thermal dissipating path hole.
20. laser diode module according to claim 14, wherein:
Described semiconductor laser diode is a single mode semiconductor laser diodes;
Described module further comprises the high frequency supercircuit that is integrated in wherein, and this high frequency supercircuit is used for high-frequency current is superimposed upon the electric current that drives described single mode semiconductor laser diodes;
Described smooth transmitter/receiver unit parts are installed on the surface of described multilayer circuit board; And
The semiconducter active component that is included in the described high frequency supercircuit is installed on another surface of described multilayer circuit board.
21. laser diode module according to claim 20 further comprises the reference potential layer that is arranged between described smooth transmitter/receiver unit parts and the described semiconducter active component.
22. laser diode module according to claim 21, wherein:
Described module comprises two or more described reference potential layers.
23. laser diode module according to claim 11, further comprise the IC that is integrated in wherein, this IC can control from the regenerated signal of described smooth transmitter/receiver unit parts output, or exports/import regenerated signal and tracer signal from described smooth transmitter/receiver unit parts to.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004244271A JP2006066466A (en) | 2004-08-24 | 2004-08-24 | Laser diode module |
| JP2004244272 | 2004-08-24 | ||
| JP2004244271 | 2004-08-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1750143A true CN1750143A (en) | 2006-03-22 |
| CN100334629C CN100334629C (en) | 2007-08-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100934002A Expired - Fee Related CN100334629C (en) | 2004-08-24 | 2005-08-23 | Laser diode module multi-layer board and laser diode module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006066466A (en) |
| CN (1) | CN100334629C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103888649A (en) * | 2014-03-07 | 2014-06-25 | 海特光电有限责任公司 | Low-cost laser camera |
| CN104080247A (en) * | 2009-11-09 | 2014-10-01 | 东芝照明技术株式会社 | Integrated circuit, power supply device and illuminating device |
| CN107117059A (en) * | 2017-06-05 | 2017-09-01 | 上海蔚来汽车有限公司 | The vehicle-mounted end charging device of electric automobile, electric automobile |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5094277B2 (en) * | 2007-08-23 | 2012-12-12 | 独立行政法人産業技術総合研究所 | Optical module |
| JP2012118516A (en) * | 2010-11-11 | 2012-06-21 | Konica Minolta Business Technologies Inc | Method for forming hologram image, toner for electrostatic charge image development and hologram image forming apparatus |
| WO2020079118A1 (en) * | 2018-10-17 | 2020-04-23 | Osram Opto Semiconductors Gmbh | Laser device and process for manufacturing a laser device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08136575A (en) * | 1994-11-04 | 1996-05-31 | Murata Mfg Co Ltd | Acceleration detection device |
| JPH11112036A (en) * | 1997-09-30 | 1999-04-23 | Sharp Corp | Surface mounting semiconductor device |
| JP2001014720A (en) * | 1999-06-29 | 2001-01-19 | Toshiba Corp | Optical pickup device |
| GB2358466A (en) * | 2000-01-18 | 2001-07-25 | Cindy Maria Marcella Motmans | Testing interconnections in an electronic circuit assembly by thermal conduction detection. |
-
2004
- 2004-08-24 JP JP2004244271A patent/JP2006066466A/en active Pending
-
2005
- 2005-08-23 CN CNB2005100934002A patent/CN100334629C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104080247A (en) * | 2009-11-09 | 2014-10-01 | 东芝照明技术株式会社 | Integrated circuit, power supply device and illuminating device |
| CN103888649A (en) * | 2014-03-07 | 2014-06-25 | 海特光电有限责任公司 | Low-cost laser camera |
| CN107117059A (en) * | 2017-06-05 | 2017-09-01 | 上海蔚来汽车有限公司 | The vehicle-mounted end charging device of electric automobile, electric automobile |
| CN107117059B (en) * | 2017-06-05 | 2020-10-23 | 上海蔚来汽车有限公司 | Vehicle-mounted end charging device of electric automobile and electric automobile |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100334629C (en) | 2007-08-29 |
| JP2006066466A (en) | 2006-03-09 |
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