CN1749118A - Packaging container for large diameter silicon wafer storage and transport - Google Patents
Packaging container for large diameter silicon wafer storage and transport Download PDFInfo
- Publication number
- CN1749118A CN1749118A CN 200510088968 CN200510088968A CN1749118A CN 1749118 A CN1749118 A CN 1749118A CN 200510088968 CN200510088968 CN 200510088968 CN 200510088968 A CN200510088968 A CN 200510088968A CN 1749118 A CN1749118 A CN 1749118A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- packing container
- casing
- chip packing
- open front
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The packaging container for large diameter silicon wafer storage and transport includes one case with front opening, back panel with opening, two plate end walls including one with Y-shaped positioning bayonet, two opposite side walls with racks in equal interval, one front cover for sealing the case, one back cover for sealing the back opening, two silicon wafer lining pads, and three case locating clamps. The packaging container is used in silicon wafer producing process for raising production efficiency and facilitating wafer access.
Description
Affiliated technical field
The present invention relates to develop a kind of storage and the transportation of packing container to be used for this silicon chip of silicon chip, particularly large diameter silicon chip is as 12 inches silicon chips.Require the container of splendid attire silicon chip can guarantee in the silicon chip production process, no matter run into bump, topple over still vibration, its inner cargo-carring silicon chip can not damage, and to require this container be leak free, is not polluted by the external pollution source with the assurance silicon chip.
Background technology
Silicon materials are bases of semi-conducting material development, also are the bases of integrated circuit (IC) industry development.The development of IC reaches by enhancing product performance and reducing production costs.The silicon chip of down feature sizes and use larger diameter is main means.Therefore major diameter is the trend of silicon materials development from now on.
In the silicon chip production process, often run into silicon chip from one procedure, be transported to the problem of another procedure.Previously used silicon chip packing container all is storage and the transportation that is used for than the silicon chip of minor diameter, and for large-diameter silicon wafer, because volume and weight is all bigger, the Traditional Packing container can not satisfy its accumulating requirement.And existing large-diameter silicon wafer packing container, comprise FOSB (Front Opening Shipping Box) and FOUP (Front Opening UnifieldPod), be to be equipped with for automatic production line, at U.S. Patent No. 95197880.2 (pig), on the books among No.99110001.8 (wafer transport container and capsule) and the No.95197881.0 (there are 300 mm microenvironment pods of door the side), this class silicon chip packaging container structure complexity, cost an arm and a leg, for some only need manual occasion in the silicon chip production process, need not electronic recognition system and mechanical connection system, only need position fixing system according to semiconductor equipment and materials association (SEMI) standard code, use these packing containers before, also can be referred to as midget plant, be a kind of serious waste.
In addition, employed packing container in the silicon chip production process in order to enhance productivity, also requires silicon chip to pick and place conveniently.
Summary of the invention
For solving the problems of the technologies described above, the present invention has designed a kind of packing container that the large-diameter silicon wafer production process stores and transports that is used for, it is firm in structure durable, and reduce volume as far as possible, its design is convenient to artificial or machinery is packed into and take out silicon chip, and can guarantee that the inner space is airtight relatively, prevents outside contamination, and then the design of this packing container, the forming work of being more convenient for.
Therefore, an object of the present invention is to provide a kind of packing container, it can store large-diameter silicon wafer, such as 12 inches silicon chips.
Another object of the present invention provides a kind of packing container, and it can be used to transport large-diameter silicon wafer, and the silicon chip of protection in the container is being subjected to that impact, vibration, extruding and friction etc. do that the time spent can not scratch or cracked in transportation.
A further object of the invention is that the container that provided can make things convenient for silicon chip to pack into and take out.
A further object of the invention is that the internal tank that is provided is a confined space, prevents that the outside contamination source from entering.
More above and other purposes all reach by a kind of container, and this container has following a few part-structure:
A casing, its front and rear has opening, and the front portion is used for putting into and taking out of silicon chip, and rear aperture is convenient to silicon chip is released; Two dull and stereotyped end walls, one of them end wall outside forms Y type limited bayonet; The opposed sidewall in two sides comprises a plurality of tooth bars that constant spacing is arranged on the sidewall;
A protecgulum that is used for the seal case open front;
A bonnet that is used for the seal case rear aperture;
Two liners that are used to hold in the palm the lining silicon chip;
Three fasteners that are used to locate casing.
Silicon chip packing container of the present invention, silicon chip appreciiable requirement when storing, transporting and producing for satisfying can be adopted polycarbonate (PC), polyethylene (PE), polypropylene (PP), polyetheretherketone thermoplastic materials such as (PEEK) injection machine-shaping.
By below in conjunction with the accompanying drawing description of a preferred embodiment, can better understand the present invention.
Description of drawings:
The decomposition view of Fig. 1 silicon chip packing container of the present invention each several part.
The block diagram of the casing of Fig. 2 silicon chip packing container of the present invention.
The upward view of the casing of Fig. 3 silicon chip packing container of the present invention.
The block diagram of the casing front panel location fastener pros and cons of Fig. 4 silicon chip packing container of the present invention.
The block diagram of the protecgulum of Fig. 5 silicon chip packing container of the present invention.
The block diagram of the bonnet of Fig. 6 silicon chip packing container of the present invention.
The block diagram of the silicon chip liner in Fig. 7 silicon chip packing container of the present invention protecgulum.
The block diagram of the liner in Fig. 8 silicon chip packing container of the present invention casing front panel.
Fig. 9 is according to the cutaway view of the liner sawtooth in Fig. 8 silicon chip packing container of the present invention casing front panel.
Embodiment
With reference to Fig. 1-5, describe in detail with the following Examples according to silicon chip packing container of the present invention.As previously mentioned, this packing container each several part is with the moulding of thermoplastic plastic integral molded plastic.
As shown in Figure 1, silicon chip packing container according to the present invention comprises 5 major parts, and wherein: 1 is the casing of packing container; 2 is the protecgulum of packing container; 3 is the bonnet of packing container; 4 is the silicon chip liner in the packing container protecgulum; 5 is the liner in the packing container casing front panel.Wherein dashed circle 0 is represented silicon chip.It below is detailed description to the various piece of entity.
State when the block diagram of packing container casing 1 as shown in Figure 2, its placement location are packing container work, the end wall that promptly has Y type location fastener is downward, and is corresponding with relevant position on the silicon chip production facilities.Casing 1 is made up of six major parts: open front 11 and the front panel 12 that has opening, and the front portion is used for putting into and taking out of silicon chip, and rear aperture is convenient to silicon chip is released; Be connected the base platform end wall 13 and the upper flat plate end wall 14 on front panel both sides about in the of 12; Be connected the opposed sidewall 15 in two sides and 16 of front panel 12 the right and lefts.
Casing open front 11 is made up of the narrow limit 114 at two symmetric position places on ring 111, reinforced rib 112, fin 113 and the ring 111, and the effect of these four component parts is to be connected with relevant position on the packing container protecgulum, and is that the packing container sealing is tight.
Be furnished with the leg 124 of opening 120 and 4 rectangular distributions on the casing front panel 12, opening 120 is made up of " ︻ " shape plate 123 of notch board 121, breach 122 and band groove, wherein 120～123 act as and be connected with bonnet and seal.
The dull and stereotyped end wall 13 of bottom half as shown in Figure 3, primary member be three be down that " Y " shape distributes three hexagon fences 131 of locating 7 fasteners are housed respectively, play the circular knock hole 132 that is positioned at these flat board end wall 13 central protuberance in addition of positioning action simultaneously.Criss-cross concave surface 133 is to be out of shape in dull and stereotyped end wall 13 long-term uses in order to prevent.
The thin portion of location fastener 6 is shown among Fig. 4.The front of location fastener (i.e. one side outside end wall) is the continuous clinohedral 64 that can engage with relevant position on the silicon chip production facilities that has in the recessed moulding in 61 places of flat ring, its reverse side (promptly the one side of end wall outside) dorsad be concentration ellipsis ring body 62 and the six rib ring bodies 63 that encircle 61 place's projectioies flat, wherein six rib ring bodies 63 match with hexagon fence 131 sizes of dull and stereotyped end wall 13, be stuck in the inside of hexagon fence 131,62 outsides that just in time are enclosed within hexagon fence 131 of oval ring body, seal, in case it is when packing container cleans, contaminated and be difficult to clean.
Comprise the flat board 141 of projection and the riglet 142 of depression on the casing upper flat plate end wall 14, the effect of this two member all is to be convenient to moulding, and prevents the distortion of the dull and stereotyped end wall 14 of this larger area in use.
Casing is connected the opposed sidewall 15 in two sides and 16 of front panel 12 the right and lefts, be through to the tooth bar 151,161 that the outside is used to support and fixedly silicon chip has constant spacing by portion's moulding within it and fraction, and form at the strip shape flange 152,162 that its outside convenience near the 14 places moulding of upper flat plate end wall is manually extracted this casing.
The protecgulum 2 that is connected with casing open front 11 as shown in Figure 5.When protecgulum 2 is connected with casing, the flange 21 of its outmost turns matches with the ring 111 of casing open front 11, the block tongue 24 of both sides enters in the narrow limit 114 of casing open front 11 simultaneously, by its " it " font inclined-plane chucking, and a circle groove 23 of protecgulum 2 inner faces just in time entangles the fin 113 of casing open front 11, cooperatively interacting of the ring 111 of the flange 21 by protecgulum 2, block tongue 24, groove 23 and casing open front 11, narrow limit 114, fin 113 just formed two layer sealing surfaces that seal this packing container open front like this.
The bonnet 3 that is connected with opening 120 on the casing front panel 12 as shown in Figure 6.The chief component of bonnet 3 is arc 31 and sliding door body 32.Form rectangle twill plate 33 in sliding door body 32 outsides near arc 31 places, with easily with the bonnet folding.The flange 34 of sliding door body 32 inner face moulding is stuck in notch board 121 inside of the opening 120 on the casing front panel 12, and this is to finish by the bayonet socket on the flange 34 35,36,37.
The present invention can implement by other form under the situation that does not break away from its purport, and therefore, illustrated embodiment is explanation of the present invention rather than restriction, and relating to what show the scope of the invention is appending claims rather than above-mentioned explanation.
Claims (6)
1. silicon chip packing container is characterized in that:
A casing comprises open front and the front panel that has opening; Two dull and stereotyped end walls, one of them end wall outside forms Y type limited bayonet; The opposed sidewall in two sides comprises a plurality of tooth bars that constant spacing is arranged on the sidewall;
A protecgulum that is used for the seal case open front;
A bonnet that is used for seal case front panel opening;
Two liners that are used to set off silicon chip;
Three fasteners that are used to locate casing.
2. silicon chip packing container according to claim 1, the bonnet that it is characterized in that this silicon chip packing container is a push-pull door.
3. silicon chip packing container according to claim 1 and 2, it is characterized in that this silicon chip packing container protecgulum (2) and casing (1) are when being connected, the flange of its outmost turns (21) matches with the ring (111) of casing open front (11), the block tongue of both sides (24) is by narrow limit (114) chucking of its " it " font inclined-plane and casing open front (11), and a circle groove (23) of protecgulum (2) inner face entangles two layer sealing surfaces of formation with the fin (113) of casing open front (11).
4. silicon chip packing container according to claim 3 is characterized in that having the corresponding deep-slotted chip breaker of same silicon chip diameter that separates fully mutually on the liner of this silicon chip packing container loam cake.
5. silicon chip packing container according to claim 1 and 2 is characterized in that this silicon chip packing container rear cushion is useful on the sawtooth (53) of supporting silicon chip, and the sawtooth bottom is and the corresponding cambered surface of silicon chip diameter.
6. silicon chip packing container according to claim 1, location fastener (6) reverse side that it is characterized in that this silicon chip packing container is for locating the concentration ellipsis ring body (62) and the six rib ring bodies (63) of projection at flat ring (61), wherein six rib ring bodies (63) match with hexagon fence (131) size of dull and stereotyped end wall (13), be stuck in the inside of hexagon fence (131), oval ring body (62) then is enclosed within the outside of hexagon fence 131.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100889685A CN100431930C (en) | 2005-08-04 | 2005-08-04 | Packaging container for large diameter silicon wafer storage and transport |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100889685A CN100431930C (en) | 2005-08-04 | 2005-08-04 | Packaging container for large diameter silicon wafer storage and transport |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1749118A true CN1749118A (en) | 2006-03-22 |
| CN100431930C CN100431930C (en) | 2008-11-12 |
Family
ID=36604814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100889685A Expired - Fee Related CN100431930C (en) | 2005-08-04 | 2005-08-04 | Packaging container for large diameter silicon wafer storage and transport |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100431930C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI727795B (en) * | 2019-07-13 | 2021-05-11 | 家登精密工業股份有限公司 | Substrate container system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996002069A1 (en) * | 1994-07-08 | 1996-01-25 | Shin-Etsu Handotai Co., Ltd. | Storage container for semiconductor crystal |
| US5575394A (en) * | 1994-07-15 | 1996-11-19 | Fluoroware, Inc. | Wafer shipper and package |
| KR20040019264A (en) * | 2000-12-04 | 2004-03-05 | 인티그리스, 인코포레이티드 | Wafer carrier with stacking adaptor plate |
-
2005
- 2005-08-04 CN CNB2005100889685A patent/CN100431930C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI727795B (en) * | 2019-07-13 | 2021-05-11 | 家登精密工業股份有限公司 | Substrate container system |
| US11508594B2 (en) | 2019-07-13 | 2022-11-22 | Gudeng Precision Industrial Co., Ltd | Substrate container system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100431930C (en) | 2008-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1062233C (en) | Wafer shipper and package | |
| USRE42402E1 (en) | 300 mm microenvironment pod with door on side | |
| JP4324585B2 (en) | Wafer transfer module | |
| US20060201958A1 (en) | Mask container | |
| JP3370279B2 (en) | Precision substrate storage container | |
| US5713711A (en) | Multiple interface door for wafer storage and handling container | |
| JP3998354B2 (en) | Transport container, lid opening / closing method and lid opening / closing device | |
| TWI250959B (en) | Shipper for semiconductor wafers and combination of shipper for semiconductor wafers and a stack of wafers | |
| TWI269400B (en) | Wafer enclosure sealing arrangement for wafer containers | |
| CN1149279A (en) | Reinforced semiconductor wafer holder | |
| TW448531B (en) | Thin-plate accommodating/transporting container | |
| US7347329B2 (en) | Substrate carrier | |
| TWI526377B (en) | Wafer transport pod | |
| US6454515B2 (en) | Semiconductor wafer accommodating jig, handling method and production system | |
| CN1298598C (en) | Modular carrier for semiconductor wafer disks and similar inventory | |
| CN100431930C (en) | Packaging container for large diameter silicon wafer storage and transport | |
| CN1845860B (en) | Low cost wafer box improvements | |
| CN101546115A (en) | Photomask storage apparatus | |
| JP2008085025A (en) | Device and method for handling substrate | |
| US20040262187A1 (en) | Clean room transportation package for process chamber kit | |
| JP3827021B2 (en) | Substrate container and loader | |
| CN1805889A (en) | Reduced movement wafer box | |
| JP2004304122A (en) | Precision board storing vessel | |
| US20210292083A1 (en) | Reticle pod and wear parts thereof | |
| JPH11154699A (en) | Sealing structure for receptacle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20180804 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |