CN1740830A - Optical interconnection coupling structure based on soft photoetching - Google Patents
Optical interconnection coupling structure based on soft photoetching Download PDFInfo
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- CN1740830A CN1740830A CN 200510060746 CN200510060746A CN1740830A CN 1740830 A CN1740830 A CN 1740830A CN 200510060746 CN200510060746 CN 200510060746 CN 200510060746 A CN200510060746 A CN 200510060746A CN 1740830 A CN1740830 A CN 1740830A
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- 238000002174 soft lithography Methods 0.000 claims description 4
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- 229910001369 Brass Inorganic materials 0.000 description 1
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Abstract
The optical interconnection coupled structure based on soft photoetch includes two reflecting surfaces and two intermediate coupled matching sections, they are successively connected on two sides of square waveguide tube, and formed into a symmetrically-connected connection body and mounted on the printed circuit board, on the printed circuit board the through holes are opened, its light source and light receiver are placed on another side of printed circuit board, the light source is aligned with one reflecting surface by means of first through hole, and the light receiver is aligned with another reflecting surface by means of second through hole. The square waveguide tube can be one-step formed by utilizing soft photoetching process. Said structure is applicable to internal short-distance high-speed data transmission in the computer.
Description
Technical field
The present invention relates to a kind of optical interconnection coupling structure based on soft lithographic.
Background technology
Along with the growth at full speed of global traffic amount, form of service also becomes more diverse, and the image transmission develops day by day with treatment technology, and bandwidth demand is explosive increase, requires each node on the network that higher transfer rate is provided.In the past over twenties years, light signal has extensively applied to long-range network transmission as information media, the telecommunications network system utilizes parallel optical fibre to connect photoswitch, router, the WDM terminal system is used for the network interconnection of long distance.The microelectronics industry performance that improved electronic circuit is greatly alleviated this problem on the other hand, but along with data transmission rate between the Highgrade integration of large scale integrated circuit (LSI) and plate improves, increase the intensive underaction of wiring such as pin, loss is bigger, and problems such as electromagnetic interference (EMI) and circuit package become the development bottleneck of LSI.
The printed circuit board (PCB) interconnected based on copper can't adapt to follow-on development.Being embedded in the connection of printed circuit board (PCB) superpolymer optical waveguide arises at the historic moment, optical interconnection is the whole new set of applications of Fibre Optical Communication Technology in short distance, data transmission in the high-speed computer of future generation solution is provided, and design and the making to light interconnection waveguide and coupled structure simultaneously proposed new challenge.From about 2000, begin to research and develop the optical interconnection (board to board) between the printed circuit board (PCB) in the world.In recent years, length will be constantly shortened in the development of optical interconnection, be developed rapidly by interconnection between the printed circuit board (PCB) at initial stage to be the high-speed interconnect between the chip, computer technology be pushed to one uncharted field.Can predict, present Copper Foil printed circuit board (PCB) will be had the optical interconnection layer rapidly in several years " opto-electrical printed circuit board " substitutes, and design and the making to light interconnection waveguide and coupled structure simultaneously proposed new challenge.Domestic research report aspect optical interconnection is few, still is in the starting stage.
Compare with the Copper Foil line, be embedded in the connection of printed circuit board (PCB) superpolymer optical waveguide and have following outstanding advantage: 1. overcome the restriction of Copper Foil line data transmission rate, made transfer rate rise to THz; 2. simplified circuit design; 3. low power consumption; 4. reduce electromagnetic interference (EMI) significantly.Therefore using optical interconnection on printed circuit board (PCB) is an effective workaround.Nearest research direction is how optical interconnected structure to be coupled on the common printed circuit board.Usually the high polymer material optical waveguide is coupled on light one electric substrate as optical transport layer.The need that the superpolymer optical interconnection is applied to chip chamber interconnected (on printed circuit board (PCB)) solve two key issues simultaneously: the one, how the light beam coupling of light emitted to the optical waveguide that is vertical placement with it, and make beam alignment tolerance precise decreasing to 0.1-0.3mm, make practicality become possibility.The 2nd, how to solve the effective optical delivery problem between optical transmitting set and receiver and the optical waveguide.For solving above-mentioned two problems, the scheme that proposes has at present: 45 ° of end face cuttings of optical waveguide, lenticule and column type coupled apparatus etc.Yet these several schemes have too high requirement to the installing and locating error of VCSEL/PD, usually about tens microns.It is a restriction greatly that so high quality of fit requires the practical application to optical interconnection, must be solved.The method that the coupled structure that has proposed at present adopts is utilized lenticule, low-light coupling mechanism, optical devices such as microprism.Still how more effective and optical waveguide coupled 90 degree of the signal optical path-deflecting between optical transmitter module and the photo-detector subject matter of Cun Zaiing is; Another is how to reduce because alignment error causes the reduction of light signal coupling efficiency.The complex manufacturing technology cost of several modes that proposed is too high in addition, is difficult to produce in batches.
Summary of the invention
The purpose of this invention is to provide a kind of optical interconnection coupling structure, effectively solve optical path-deflecting and make coupling efficiency higher, reduce the alignment error requirement based on soft lithographic.
The technical solution used in the present invention is as follows: comprise light source, two reflectings surface, two middle coupling establishing sections, square waveguide, optical receiver, driving circuit, receiving circuit.A reflecting surface and a middle coupling establishing section, be connected to a side of square waveguide in turn, coupling establishing section and another reflecting surface in the middle of another, be connected to the opposite side of square waveguide in turn, the connector that forms a symmetry connection is installed on the printed circuit board (PCB), have two through holes on the printed circuit board (PCB), light source and optical receiver then are placed in the opposite side of printed circuit board (PCB), light source through first through-hole alignment in a reflecting surface, optical receiver through second through-hole alignment in another reflecting surface.
The principle of work of this optical interconnection coupling structure is: data-signal becomes laser instrument through overdrive circuit control vertical cavity and sends modulated light signal, its laser beam diffusion angle is about 8-12 ℃, beam energy is an approximate Gaussian distribution, after passing printed circuit board through-hole, hot spot is spreaded to 0.2-0.3mm by several microns on surface, is projeced into the reflecting surface of connector.Light beam enters square waveguide by total internal reflection by reflecting surface, middle coupling establishing section.Light beam is handled through receiving circuit after arriving optical receiver by transmission back in connector, finishes a signal transmission thus and handles.
Compare with background technology, the useful effect that the present invention has is:
1, bigger reduction the installation accuracy requirement: require tens microns to be difficult to realize for present production process than the installation accuracy of other structures, this structure installation accuracy reaches hundreds of micron, times over the installation accuracy that proposes several structures;
2, flexible design can carry out curved surface optimization to the be coupled inclined-plane of establishing section, centre, thereby make the easier square waveguide that enters of its coupling optical path make coupling efficiency higher, reduces device power consumption;
3, this structure fabrication that utilizes soft lithography to make is simple, is easy to install, and is fit for various uses, easily the advantage of producing in enormous quantities;
4, the high precision that realizes Polymer Structure is duplicated, and surfaceness is about 10 microns;
5, coupled light beam adopts silicone molds to be integrated into the optical waveguide on the very high efficient introducing printed circuit board (PCB) plate, it is convenient to have, low-loss with a series of superiority such as the complete compatibilities of printed circuit board (PCB), is more suitable for the short distance high speed data transfer of computer-internal.
Description of drawings
Fig. 1 is the optical interconnection coupling structure synoptic diagram;
Fig. 2 be connector in the middle of the inclined-plane of the coupling establishing section size design synoptic diagram when adopting the plane;
Fig. 3 be connector in the middle of the inclined-plane of the coupling establishing section synoptic diagram when adopting curved surface.
Among the figure: 1 light source,, 2, two reflectings surface, coupling establishing sections in the middle of 3, two, 4, square waveguide, 5, optical receiver.
Embodiment
As shown in Figure 1, comprise 2, two middle coupling establishing sections 3 of 1, two reflecting surface of light source, square waveguide 4, optical receiver 5.A reflecting surface 2 and a middle coupling establishing section 3, be connected to a side of square waveguide 4 in turn, coupling establishing section 3 and another reflecting surface 2 in the middle of another, be connected to the opposite side of square waveguide 4 in turn, the connector that forms a symmetry connection is installed on the printed circuit board (PCB), have two through holes on the printed circuit board (PCB), 5 opposite sides that are placed in printed circuit board (PCB) of light source 1 and optical receiver, light source 1 through first through-hole alignment in a reflecting surface 2, optical receiver 5 through second through-hole alignment in another reflecting surface 2.
Described light source 1 is the vertical cavity surface emitting laser, and operation wavelength is 850nm, and its beam spread angle is 8-12 °, and beam energy is an approximate Gaussian distribution; Described optical receiver adopts photodiode.
As shown in Figure 2, described reflecting surface 2, middle coupling unit) and square waveguide 4 adopt the optics high polymer materials to utilize the soft lithography shaping of producing once, reflecting surface cross sectional dimensions 〉=0.1 * 0.1mm
2, the similar cross section proportional range between square waveguide 3 xsects and reflecting surface 2 xsects is at 40%-80%, and reflecting surface 2 is 30-60 ° with bottom surface angulation θ.
As described in Fig. 2, Fig. 3, the length of middle coupling establishing section 3 is 8-13 times of reflecting surface 2 length, and the inclined-plane of this centre coupling establishing section 3 adopts plane or curved surface.
Fig. 1 is the optical interconnection coupling structure synoptic diagram, thereby two reflectings surface at the optical waveguide two ends of project organization 2 reduce the coupling susceptibility for large-size so that be more prone to be coupled into light in bigger range of size, and the square waveguide 4 that mediates keeps reduced size to keep lower modulus to increase bandwidth as far as possible, and coupling establishing section 3 is coupled light path stably in the middle of increasing between reflecting surface 2 and square waveguide 4.
The scope of the reflecting surface shown in Figure 2 and the angle theta of surface level is 30-60 °, and the similar cross section proportional range between square waveguide 3 xsects and reflecting surface 2 xsects is at 40%-80%.Getting θ is 45 °, the h1=500 micron, and the h2=300 micron (h2/h1=0.6), influences coupling efficiency thereby the size of L can change the wedge angle of middle coupling establishing section.Analyze when L=6mm through ZEMAX, coupling efficiency is the highest.
The synoptic diagram of the curved design that Fig. 3 can adopt for middle coupling establishing section 3.Adopt software ZEMAX that coupling efficiency analysis is made and reach optimization.
Because this structure all has change in size in the horizontal and vertical directions, traditional photoetching technique can't reach the making requirement.Therefore adopt and to make the complex three-dimensional structure and can make this optical interconnection structure at the soft lithography that curved surface is used.In manufacturing process, at first use three little engraving machines of 0.6 micron resolution and on the brass version, scribe the model that designs, carry out the polishing of optical surface then.Further, heat under 80 ℃ of temperature with silicone elastomer and to turn over die sinking with low-shrinkage in 2 hours, this elastic body becomes suitable size, can produce the mould that reprints of optical polish face.The mould that silicone elastomer is made is covered in circuit version or the glass optical surface that scribbles low refractive index resin then, because silicone molds has ultraviolet permeability preferably, the UV cured resin is filled this mould by capillary effect, the employing ultraviolet photoetching solidifies, then silicone molds is peeled off, promptly formed the structure that this paper proposes.The shaping waveguide that is solidificated in smooth surface can become from carrying structure easily from sur-face peeling, can be installed on each position of circuit board very easily.
Claims (4)
1, a kind of optical interconnection coupling structure based on soft lithographic is characterized in that: comprise light source (1), two reflectings surface (2), two middle coupling establishing sections (3), square waveguide (4), optical receiver (5); A reflecting surface (2) and a middle coupling establishing section (3), be connected to a side of square waveguide (4) in turn, coupling establishing section (3) and another reflecting surface (2) in the middle of another, be connected to the opposite side of square waveguide (4) in turn, the connector that forms a symmetry connection is installed on the printed circuit board (PCB), have two through holes on the printed circuit board (PCB), light source (1) and optical receiver (5) then are placed in the opposite side of printed circuit board (PCB), light source (1) through first through-hole alignment in a reflecting surface (2), optical receiver (5) through second through-hole alignment in another reflecting surface (2).
2, a kind of optical interconnection coupling structure according to claim 1 based on soft lithographic, it is characterized in that: described light source (1) is the vertical cavity surface emitting laser, operation wavelength is 850nm, and its beam spread angle is 8-12 °, and beam energy is an approximate Gaussian distribution; Described optical receiver adopts photodiode.
3, a kind of optical interconnection coupling structure according to claim 1 based on soft lithographic, it is characterized in that: described reflecting surface (2), middle coupling unit (3) and square waveguide (4) employing optics high polymer material utilize the soft lithography shaping of producing once, reflecting surface cross sectional dimensions 〉=0.1 * 0.1mm
2, the similar cross section proportional range between square waveguide (3) xsect and reflecting surface (2) xsect is at 40%-80%, and reflecting surface (2) is 30-60 ° with bottom surface angulation θ.
4, a kind of optical interconnection coupling structure according to claim 1 based on soft lithographic, it is characterized in that: the length of the establishing section (3) that is coupled in the middle of described is 8-13 times of reflecting surface (2) length, and the inclined-plane of this centre coupling establishing section (3) adopts plane or curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510060746 CN1740830A (en) | 2005-09-13 | 2005-09-13 | Optical interconnection coupling structure based on soft photoetching |
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| CN 200510060746 CN1740830A (en) | 2005-09-13 | 2005-09-13 | Optical interconnection coupling structure based on soft photoetching |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048744A (en) * | 2012-11-08 | 2013-04-17 | 日月光半导体制造股份有限公司 | Optical module structure |
| WO2020088535A1 (en) * | 2018-10-30 | 2020-05-07 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
| CN112714692A (en) * | 2018-09-17 | 2021-04-27 | ams传感器新加坡私人有限公司 | Optical light guide and method of making an optical light guide |
| CN113281860A (en) * | 2021-05-24 | 2021-08-20 | 湖北工业大学 | Photoelectric integrated circuit board communication system |
-
2005
- 2005-09-13 CN CN 200510060746 patent/CN1740830A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048744A (en) * | 2012-11-08 | 2013-04-17 | 日月光半导体制造股份有限公司 | Optical module structure |
| CN112714692A (en) * | 2018-09-17 | 2021-04-27 | ams传感器新加坡私人有限公司 | Optical light guide and method of making an optical light guide |
| CN112714692B (en) * | 2018-09-17 | 2023-08-11 | ams传感器新加坡私人有限公司 | Optical light guide and method of making an optical light guide |
| US12025826B2 (en) | 2018-09-17 | 2024-07-02 | Ams Sensors Singapore Pte. Ltd. | Optical light guides and methods of manufacturing the same |
| WO2020088535A1 (en) * | 2018-10-30 | 2020-05-07 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
| WO2020088541A1 (en) * | 2018-10-30 | 2020-05-07 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure |
| CN113281860A (en) * | 2021-05-24 | 2021-08-20 | 湖北工业大学 | Photoelectric integrated circuit board communication system |
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